JP2012227412A - Fixing structure and fixing method of heating element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fixing structure and a fixing method of a heating element capable of fixing even a heating element, generating heat at a temperature above the heatproof temperature of a substrate, to a heated body in contact therewith accurately.SOLUTION: The fixing structure of a heating element 3 comprises a base plate 1, and the heating element 3 having a leg 3b connected with the base plate 1 and fixed thereto, and generating heat based on an electric signal applied through the leg 3b. The heating element 3 further includes a heated body 4 located in a hole formed after removing a partial region of the base plate 1 as a waste base plate, and fixed to the base plate 1 while supporting the heating element 3 in contact with the principal surface thereof, thereby being heated by the heating element 3.

Description

  The present invention relates to a fixing structure and a fixing method for a heating element that is disposed on a substrate and is fixed in contact with an object to be heated.

  For example, when configuring a control circuit of an electrical product, it is extremely important to control the heat generation of circuit elements mounted on the control circuit in order to ensure the performance of the product.

  When controlling light emission of a laser element as a circuit element, it is necessary to set not only an upper limit but also a lower limit for the control temperature of the laser element. Therefore, in order to ensure the performance of the laser, it is necessary to cool the heat generated by the laser element at a high temperature and to heat the laser element by bringing a heating element such as a heater close to the laser element at a low temperature.

  When the heating element is disposed on the substrate, the heating element is brought into contact with a heated body that receives the heat of the heating element in order to cool the heat of the heating element or to heat the heating element using the heat of the heating element. It arrange | positions as follows. Further, in order to cool the heat of the heating element, the heat of the heating element may be radiated by air conduction. When placing the heating element in contact with the heated body, it is necessary to place and fix it with high precision in order to maintain contact with the heated body. It is necessary to arrange and fix the heating element stably.

  Conventionally, as a structure for fixing the heating element to the substrate for the purpose of radiating the heat of the heating element, a structure in which the heating element is held in a floating state from the substrate surface by a component support member formed of a discarded substrate (For example, refer to Patent Document 1).

Utility Model Registration No. 3117684

  In Patent Document 1, since the heating element is held by the discarded substrate, there is a problem that the heating element that generates heat at a temperature equal to or higher than the heat resistance temperature of the substrate (throwing board) cannot be held.

  In addition, for example, when the heating element of Patent Document 1 is brought into contact with the heated body, there are many portions where the heated body is not directly fixed to the substrate, so that the positional accuracy between the heating body and the heated body is difficult to maintain. There was a problem.

  The present invention has been made to solve these problems, and even a heating element that generates heat at a temperature higher than the heat-resistant temperature of the substrate can be fixed in contact with the object to be heated with high accuracy. It is an object to provide a fixing structure and a fixing method for a heating element.

  In order to solve the above-described problems, a heating element fixing structure according to the present invention includes a substrate and a foot portion fixed in connection with the substrate, and is based on an electrical signal applied from the substrate through the foot portion. The heating element is located in the hole after discarding a part of the substrate as a substrate and contacting the main surface of the heating element to support the heating element. And a heated object that is heated by the heat generated by the heating element.

  According to the present invention, the apparatus includes a substrate and a heating element that has a foot portion connected and fixed to the substrate, and generates heat based on an electric signal applied from the substrate through the foot portion. Positioned in the hole after discarding a part of the substrate as a substrate, contacting the main surface of the heating element and supporting the heating element, fixed to the substrate and heated by the heat generated by the heating element Since the body is further provided, even a heating element that generates heat at a temperature equal to or higher than the heat resistance temperature of the substrate can be accurately contacted and fixed to the object to be heated.

It is a figure which shows an example of the fixing structure of the heat generating body by embodiment of this invention. It is a side view of the fixing structure of the heat generating body by embodiment of this invention. It is a figure which shows the state which mounted the heat generating body by embodiment of this invention on the board | substrate. It is a disassembled block diagram of the fixing structure of the heat generating body by embodiment of this invention. It is a block diagram of the fixing structure of the heat generating body by the base technology. It is a longitudinal cross-sectional view of the fixing structure of the heating element according to the base technology.

  Embodiments of the present invention will be described below with reference to the drawings. Hereinafter, the fixing structure of the heating element according to the present embodiment will be described, but the present invention is not limited to the present embodiment.

<Prerequisite technology>
First, a technique (a prerequisite technique) which is a premise of the present invention will be described.

  FIG. 5 is a configuration diagram of a heating element fixing structure according to the base technology, and FIG. 6 is a longitudinal sectional view of FIG. As shown in FIGS. 5 and 6, the foot 30 b of the heating element 30 is fixed to the substrate 10 by soldering. The main body 30 a of the heating element 30 is held by a component support member 60. The component holding member 60 is penetrated from the lower side (back side) of the through hole 10a formed in the substrate 10, and is fixed to the substrate 10 by soldering at the attachment piece 60a. The component support member 60 is formed of a discarded substrate, and supports the bottom surface of the heating element 30 by the component receiving portion 60b.

  The structure in which the heating element 30 according to the base technology is fixed to the substrate 10 has a problem that the heating element that generates heat at a temperature equal to or higher than the heat resistance temperature of the substrate (throwing substrate) cannot be held as described above. Further, when the heating element is brought into contact with the heated body, there are many portions where the heated body is not directly fixed to the substrate, so that there is a problem that it is difficult to maintain the positional accuracy between the heating body and the heated body.

  The present invention has been made to solve these problems, and will be described in detail below.

<Embodiment>
FIG. 1 is a view showing an example of a fixing structure of a heating element 3 according to an embodiment of the present invention, and FIG. 2 is a side view of FIG. 3 is a diagram showing a state where the heating element 3 is placed on the substrate 1, and FIG. 4 is an exploded configuration diagram of FIG.

  As shown in FIGS. 1 to 4, the heating element 3 has a foot portion 3 b that is connected and fixed to the substrate 1, and generates heat based on an electrical signal applied from the substrate 1 through the foot portion 3 b. The block 4 (heated body) is fixed to the substrate 1 while being in contact with the main surface of the heating element 3 and supporting the heating element 3, and is heated by the heat generated by the heating element 3. For example, a laser element (not shown) as a temperature controlled element is fixed on the block 4, and the block 4 also functions as a base. The holding member 5 is disposed between the substrate 1 and the block 4 and is temporarily fixed on the substrate 1 by a claw shape or the like. The screw 6 is a fastening part, and is used for fixing (screwing) the substrate 1 and the block 4 via the holding member 5 and the screw 6a used for fixing (heating) the heating element 3 and the block 4. And a screw 6b.

  Next, details of holding the heating element 3 will be described. As shown in FIG. 3, the foot 3 b of the heating element 3 is soldered to the substrate 1. Here, a portion of the foot 3b that contacts the solder is a soldering portion 3c. Since the main body 3a of the heating element 3 is disposed in contact with the discarded substrate 2, which is a partial area of the substrate 1, the position in the in-plane vertical direction of the main body 3a is kept constant (highly accurate). Be drunk. The heating element 3 generates heat when an electrical signal (for example, current) from the substrate 1 is applied to the main body 3a via the foot 3b.

  As shown in FIG. 3, after the soldering of the heating element 3 to the substrate 1 is completed, the perforation 21 of the discarded substrate 2 is cut with a nipper or the like to separate the discarded substrate 2 from the substrate 1. As shown in FIG. 4, the heating element 3 after separating the discarded substrate 2 is in a state where the main body 3 a is floated from the substrate 1 (that is, the heating element 3 has a hole portion after the discarded substrate 2 is removed). However, since the foot 3b of the heating element 3 is soldered to the substrate 1, the fixing state of the heating element 3 with respect to the substrate 1 is maintained.

  After separating the discarded substrate 2 from the substrate 1, the holding member 5 is temporarily fixed to the substrate 1 by a claw shape or the like. The block 4 is placed on the temporarily fixed holding member 5, and the substrate 1, the holding member 5, and the block 4 are fixed (screwed) by screws 6b. At this time, the main body 3 a of the heating element 3 is in contact with the block 4. The main body 3a of the heating element 3 has a screw hole, and the main body 3a and the block 4 are contacted and fixed (screwed) by a screw 6a.

  In addition, fixing the main body 3a to the other part and the screw 6a after soldering the foot 3b of the heating element 3 to the substrate 1 inherently applies a permanent load to the soldering part 3c. It is not preferable in terms of reliability. However, as shown in FIG. 3, the dimension p, which is the length of the foot portion 3b of the heating element 3, is usually about 3 to 5 mm, whereas the length p is about 15 to 20 mm. Is set. Therefore, even if the main body portion 3a of the heating element 3 is fixed to the block 4 with the screws 6a, the load on the soldering portion 3c is reduced to a level at which there is no problem, and no unnecessary load is applied to the soldering portion 3c.

  For example, if the foot 3b of the heating element 3 is regarded as a cantilever with the main body 3a fixed, the load applied to the soldering portion 3c (that is, the load) is inversely proportional to the cube of the dimension p shown in FIG. To do. Therefore, if the dimension p is set to a length three times or more than the normal length, the load applied to the soldering portion 3c is reduced to 1/27 or less, and there is no problem. That is, specifically, by setting the normal dimension p to 15 mm or more with respect to 5 mm which is the maximum value of 3 to 5 mm, an unnecessary load is not applied to the soldering portion 3c.

  From the above, when the assembly of the fixing structure of the heating element 3 is completed (see FIGS. 1 and 2), the operation of the substrate 1 becomes possible. The heating element 3 generates heat by controlling the substrate 1 to heat the block 4.

  In practice, in order to minimize the loss of heat conduction, a heat conductor such as a thermal sheet or grease may be disposed between the heating element 3 and the block 4, but in this embodiment, The illustration is omitted.

  From the above, when fixing the foot 3b of the heating element 3 to the substrate 1 by soldering, the body portion 3a of the heating element 3 is disposed in contact with the substrate 2, so that the body portion 3a The position in the in-plane vertical direction is kept constant (with high accuracy), and the heating element 3 can be fixed in close contact with the block 4 with high accuracy even after the discarded substrate 2 is separated. Even a heating element that generates heat at a temperature equal to or higher than the heat resistance temperature of the substrate can be fixed in contact with the object to be heated with high accuracy.

  Even if the main body 3a of the heating element 3 is fixed to the block 4 by setting the length of the foot 3b (dimension p in FIG. 4) to a sufficient length of 15 mm or more, the soldering portion 3c Is not subject to unnecessary load.

  In the present embodiment, the block 4 has been described as a heated body, but the block 4 may be configured as a coolant for cooling the heating element 3.

  INDUSTRIAL APPLICABILITY The present invention can be applied to a fixing structure for a heating element that is arranged on a substrate and configured to be fixed in contact with a heated object.

  DESCRIPTION OF SYMBOLS 1 Board | substrate, 2 Discarded board | substrate, 3 Heating body, 3a Main body part, 3b Foot | foot part, 3c Soldering part, 4 Block, 5 Holding member, 6 Screw, 10 Board | substrate, 10a Through-hole, 21 Perforation, 30 Heating body, 30a Main body part, 30b foot part, 60 component support member, 60a mounting piece part, 60b component receiving part.

Claims (6)

A substrate,
A heating element that has a foot portion connected and fixed to the substrate, and generates heat based on an electrical signal applied from the substrate through the foot portion;
The heating element is located in the hole after removing a part of the substrate as a substrate,
A heating element fixing structure, further comprising: a heated body that is fixed to the substrate and is heated by the heat generated by the heating element while supporting the heating element in contact with the main surface of the heating element.   The heating element fixing structure according to claim 1, wherein a length of the foot portion is 15 mm or more. The heated body is screwed to the substrate,
The heating element fixing structure according to claim 1, wherein the heating element is screwed to the heated body. A method of fixing a heating element to a substrate,
(A) preparing the substrate including a discarded substrate in a partial area;
(B) The heating element is disposed on the discarding substrate, and the heating element is attached to the substrate other than the discarding substrate so that the heating element can generate heat based on an electrical signal from the substrate. Connecting and fixing,
(C) removing the discarded substrate from the substrate to form a hole, and positioning the heating element in the hole;
(D) fixing a heating target heated by the heat generation of the heating element to the substrate while contacting the main surface of the heating element to support the heating element;
A method for fixing a heating element.   The heating element fixing method according to claim 4, wherein a length of the foot portion is 15 mm or more. In the step (d),
The heated body is screwed to the substrate,
6. The heating element fixing method according to claim 4, wherein the heating element is screwed to the heated body.

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