JP2019009341A - Heat dissipating unit of heat generating element - Google Patents

Heat dissipating unit of heat generating element Download PDF

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Publication number
JP2019009341A
JP2019009341A JP2017125160A JP2017125160A JP2019009341A JP 2019009341 A JP2019009341 A JP 2019009341A JP 2017125160 A JP2017125160 A JP 2017125160A JP 2017125160 A JP2017125160 A JP 2017125160A JP 2019009341 A JP2019009341 A JP 2019009341A
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circuit board
base
heat
bracket
terminal
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岳士 安在
Takeshi Anzai
岳士 安在
真勝 小金澤
Masakatsu Koganezawa
真勝 小金澤
翔太 塩津
Shota Shiozu
翔太 塩津
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Marelli Corp
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Calsonic Kansei Corp
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Abstract

To improve heat dissipation efficiency when attaching a circuit board connected with a heat generating element to an attachment object by means of a bracket.SOLUTION: A chip 91 of a circuit element 9 generating heat by electrification is separated from the reverse face 33, i.e., the connection surface of a circuit board 3, and fixed to an exposed surface 19 on the opposite side to a board attachment surface 13 to which the circuit board 3 of the base 11 of a metal bracket 1 is attached. The terminal 93 of the circuit element 9 is joined to a conductive pattern on the reverse face 33 of the circuit board 3 by soldering, the place of a terminal hole 35 of the circuit board 3 is placed in an exposure region E exposed to the exposure surface 19 side of the base 11 through a through hole 21 of the base 11 of a bracket 1, and molten solder is blown from the exposure surface 19 side of the base 11. At that time, the through hole 21 of the base 11 becomes a mask, and molten solder is blown only to a limited range of the exposure region E of the reverse face 33 of the circuit board 3 where other circuit element 7 is not connected.SELECTED DRAWING: Figure 2

Description

本発明は、回路基板に接続された発熱素子の放熱ユニットに関する。   The present invention relates to a heat dissipating unit for a heating element connected to a circuit board.

例えば、ジャンクションボックス（電気接続箱）のように、発熱する素子を接続した基板を筐体に収容して取付対象に固定する際に、基板を金属製の取付用ブラケットに当接させて、基板を介して取付用ブラケットの当接面とは反対側の面から発熱素子の熱を放熱する構造が、従来から知られている（例えば、特許文献１）。   For example, when a board to which a heat generating element is connected, such as a junction box (electrical connection box), is housed in a housing and fixed to a mounting target, the board is brought into contact with a metal mounting bracket, A structure for radiating the heat of the heating element from the surface opposite to the abutting surface of the mounting bracket via a pin is conventionally known (for example, Patent Document 1).

特開２００６−１９１７７２号公報JP 2006-191772 A

上述した従来の提案に係る放熱構造では、発熱素子から取付用ブラケットへの放熱経路に基板が介在することから、基板がネックとなって放熱性が下がらないようにする工夫が必要となる。特に、例えば半導体パワーデバイス等の半導体素子を正常な動作の確保のために冷却する場合には、その必要性が顕著となる。   In the heat dissipation structure according to the above-described conventional proposal, since the substrate is interposed in the heat dissipation path from the heat generating element to the mounting bracket, it is necessary to devise measures to prevent the heat dissipation from being reduced due to the substrate becoming a neck. In particular, when a semiconductor element such as a semiconductor power device is cooled to ensure normal operation, the necessity becomes remarkable.

本発明は前記事情に鑑みなされたもので、本発明の目的は、発熱素子が接続された回路基板をブラケットにより取付対象に取り付ける際の放熱効率を向上させることにある。   This invention is made | formed in view of the said situation, and the objective of this invention is to improve the thermal radiation efficiency at the time of attaching the circuit board to which the heat generating element was connected to the attachment object with the bracket.

上記目的を達成するため、本発明の第１の態様による発熱素子の放熱ユニットは、
通電により発熱する発熱素子が接続された回路基板と、
前記回路基板が取り付けられ、かつ、該回路基板の前記発熱素子の素子本体が直接固定された金属製のブラケットと、
を備える。 In order to achieve the above object, the heat dissipating unit of the heat generating element according to the first aspect of the present invention comprises:
A circuit board to which a heating element that generates heat when energized is connected;
A metal bracket to which the circuit board is attached and an element body of the heating element of the circuit board is directly fixed;
Is provided.

また、本発明の第２の態様による発熱素子の放熱ユニットの製造方法は、
本発明の第１の態様による発熱素子の放熱ユニットにおいて、
前記ブラケットは、前記回路基板と平行に配置された基部を有し、
前記発熱素子は端子を有し、
前記端子は、前記基部に対向する前記回路基板の対向面と半田付けにより接合されていて、
前記基部を介して前記対向面における前記端子の接合箇所を露出させる開口が前記基部に形成されている場合に、
通電により発熱する発熱素子の素子本体を金属製のブラケットの基部に固定する素子固定工程と、
前記基部に前記素子本体が固定された前記ブラケットに、前記発熱素子を接続する回路基板を取り付けて、前記回路基板の前記基部に形成された開口に臨む箇所に前記発熱素子の端子を挿通する基板取付工程と、
前記回路基板の前記箇所に挿通された前記端子に前記開口を通じて溶融半田を付着させるフロー半田付け工程と、
を含む製造方法で製造する、というものである。 Moreover, the manufacturing method of the heat dissipation unit of the heat generating element according to the second aspect of the present invention is as follows:
In the heat dissipation unit of the heat generating element according to the first aspect of the present invention,
The bracket has a base disposed in parallel with the circuit board,
The heating element has a terminal;
The terminal is joined to the facing surface of the circuit board facing the base by soldering,
In the case where an opening that exposes the joint portion of the terminal on the facing surface through the base is formed in the base,
An element fixing step of fixing the element body of the heating element that generates heat by energization to the base of the metal bracket;
A circuit board for connecting the heat generating element to the bracket having the element body fixed to the base, and a terminal through which the terminal of the heat generating element is inserted at a position facing the opening formed in the base of the circuit board Installation process;
A flow soldering step of attaching molten solder through the opening to the terminal inserted through the portion of the circuit board;
Is manufactured by a manufacturing method including

本発明によれば、発熱素子が接続された回路基板をブラケットにより取付対象に取り付ける際の放熱効率を向上させることができる。   ADVANTAGE OF THE INVENTION According to this invention, the thermal radiation efficiency at the time of attaching the circuit board to which the heat generating element was connected to the attachment object by the bracket can be improved.

本発明の第１実施形態に係る発熱素子の放熱ユニットを示す断面図である。It is sectional drawing which shows the thermal radiation unit of the heat generating element which concerns on 1st Embodiment of this invention. 図１の放熱ユニットの製造手順を示すフローチャートである。It is a flowchart which shows the manufacture procedure of the thermal radiation unit of FIG. （ａ）〜（ｃ）は図２の手順で図１の放熱ユニットを製造する際の各工程における放熱ユニットの状態を示す断面図である。(A)-(c) is sectional drawing which shows the state of the thermal radiation unit in each process at the time of manufacturing the thermal radiation unit of FIG. 1 in the procedure of FIG. 本発明の第２実施形態に係る発熱素子の放熱ユニットを示す断面図である。It is sectional drawing which shows the thermal radiation unit of the heat generating element which concerns on 2nd Embodiment of this invention.

以下、本発明の実施形態について図面を参照しながら説明する。まず、本発明の第１実施形態に係る発熱素子の放熱ユニットについて、図１乃至図３を参照して説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, the heat radiating unit of the heat generating element according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 3.

図１は本発明の第１実施形態に係る発熱素子の放熱ユニットを示す断面図である。図１に示す本実施形態の放熱ユニットは、ブラケット１と、ブラケット１に取り付けられた回路基板３と、回路基板３に接続された回路素子５，７，９とを備えている。   FIG. 1 is a cross-sectional view showing a heat dissipating unit of a heat generating element according to the first embodiment of the present invention. The heat dissipation unit of the present embodiment shown in FIG. 1 includes a bracket 1, a circuit board 3 attached to the bracket 1, and circuit elements 5, 7, 9 connected to the circuit board 3.

ブラケット１は、回路基板３を取付対象（図示せず）に取り付けるための金属製の金具であり、回路基板３が取り付けられる基部１１と、基部１１の基板取付面１３の一端から立設されて不図示の取付対象に取り付けられる取付部１５とを有している。   The bracket 1 is a metal fitting for attaching the circuit board 3 to an attachment target (not shown), and is erected from one end of a base 11 to which the circuit board 3 is attached and a board attachment surface 13 of the base 11. And an attachment portion 15 attached to an attachment target (not shown).

基部１１の基板取付面１３は、回路基板３を取付可能な大きさの矩形を呈しており、基板取付面１３の四隅には取付用ボス１７がそれぞれ立設されている（断面図である図１では、取付用ボス１７を２つだけ図示している）。   The board mounting surface 13 of the base 11 has a rectangular shape with a size that allows the circuit board 3 to be mounted, and mounting bosses 17 are erected at the four corners of the board mounting surface 13 (a cross-sectional view). 1 shows only two mounting bosses 17).

基部１１の四隅の取付用ボス１７の内側の箇所には、基板取付面１３から反対側の露出面１９にかけて基部１１を貫通する貫通孔２１（請求項中の開口に相当）が形成されている。   Through holes 21 (corresponding to openings in the claims) penetrating the base 11 from the board mounting surface 13 to the exposed surface 19 on the opposite side are formed at locations inside the mounting bosses 17 at the four corners of the base 11. .

回路基板３は、セラミックやエポキシ樹脂等の絶縁部材で矩形状に形成されている。回路基板３の四隅は、表面３１から裏面３３（請求項中の対向面に相当）に向けて挿通された取付用ねじ２３によって、ブラケット１の基部１１の取付用ボス１７に取り付けられている。基部１１に取り付けられた回路基板３の裏面３３は、取付用ボス１７の高さだけ基板取付面１３から離間して基部１１と平行に配置される。   The circuit board 3 is formed in a rectangular shape with an insulating member such as ceramic or epoxy resin. The four corners of the circuit board 3 are attached to the mounting boss 17 of the base 11 of the bracket 1 by mounting screws 23 inserted from the front surface 31 toward the back surface 33 (corresponding to the opposing surface in the claims). The back surface 33 of the circuit board 3 attached to the base 11 is spaced apart from the board mounting surface 13 by the height of the mounting boss 17 and arranged in parallel with the base 11.

回路素子５は、回路基板３の表面３１に接続されており、回路素子７，９は、回路基板３の裏面３３に接続されている。   The circuit element 5 is connected to the front surface 31 of the circuit board 3, and the circuit elements 7 and 9 are connected to the back surface 33 of the circuit board 3.

このうち、回路基板３の裏面３３に接続されている回路素子９（請求項中の発熱素子に相当）は、チップ９１（請求項中の素子本体に相当）が通電により高熱を発するＩＧＢＴやＭＯＳＦＥＴ等のパワー半導体スイッチング素子である。   Among these, the circuit element 9 (corresponding to the heating element in the claims) connected to the back surface 33 of the circuit board 3 is an IGBT or MOSFET in which the chip 91 (corresponding to the element body in the claims) generates high heat when energized. Power semiconductor switching element.

この回路素子９は、回路素子５，７よりも長尺の端子９３を有している。この端子９３の先端は、回路基板３の裏面３３のうち、ブラケット１の基部１１の貫通孔２１を通じて基部１１の露出面１９側に露出する露出領域Ｅ（請求項中の対向面における開口により基部を介して露出される領域に相当）に開口する端子孔３５（請求項中の接合箇所、回路基板の基部に形成された開口に臨む箇所に相当）に挿通されている。そして、回路素子９の端子９３は、回路基板３の裏面３３の導電パターン（図示せず）に半田付けＳにより接合されている。   The circuit element 9 has a terminal 93 longer than the circuit elements 5 and 7. The distal end of the terminal 93 is exposed to the exposed surface E of the base 11 through the through-hole 21 of the base 11 of the bracket 1 on the back surface 33 of the circuit board 3 (the base is defined by the opening on the opposing surface in the claims). Terminal hole 35 (corresponding to a portion exposed to the opening formed in the base portion of the circuit board). The terminal 93 of the circuit element 9 is joined to the conductive pattern (not shown) on the back surface 33 of the circuit board 3 by soldering S.

なお、回路基板３の裏面３３の露出領域Ｅには、裏面３３に接続された他の回路素子７は一切配置されていない。   It should be noted that no other circuit element 7 connected to the back surface 33 is disposed in the exposed region E of the back surface 33 of the circuit board 3.

また、回路素子９のチップ９１は、回路素子９と一緒に回路基板３の裏面３３に接続された他の回路素子７よりも、回路基板３から離間した箇所に配置されている。そして、チップ９１は、ブラケット１の基部１１の貫通孔２１を通って基部１１の露出面１９側に突出した端子９３のＬ字型の折曲部９５を経た先に、露出面１９に当接するように配置され、固定ねじ２５によって基部１１に固定されている。   Further, the chip 91 of the circuit element 9 is arranged at a location farther from the circuit board 3 than the other circuit elements 7 connected to the back surface 33 of the circuit board 3 together with the circuit element 9. Then, the tip 91 comes into contact with the exposed surface 19 after passing through the L-shaped bent portion 95 of the terminal 93 protruding to the exposed surface 19 side of the base portion 11 through the through hole 21 of the base portion 11 of the bracket 1. And fixed to the base 11 by a fixing screw 25.

このように、本実施形態の放熱ユニットによれば、通電により発熱する回路素子９のチップ９１を回路基板３の接続面である裏面３３から離間させて、金属製のブラケット１の基部１１の回路基板３が取り付けられた基板取付面１３とは反対側の露出面１９に固定する構成とした。   Thus, according to the heat dissipation unit of the present embodiment, the circuit 91 of the base portion 11 of the metal bracket 1 is separated from the back surface 33 that is the connection surface of the circuit board 3 by separating the chip 91 of the circuit element 9 that generates heat by energization. It was set as the structure fixed to the exposed surface 19 on the opposite side to the board | substrate attachment surface 13 to which the board | substrate 3 was attached.

このため、金属製のブラケット１の基部１１を放熱部材として利用することができる。しかも、回路基板３が取り付けられる基部１１の基板取付面１３よりも反対側の露出面１９の方が、周辺雰囲気への露出面積が大きく、かつ、雰囲気の対流が起こりやすい平坦な構造であることから、露出面１９に回路素子９の発熱源であるチップ９１を固定することで、チップ９１の発熱をブラケット１の基部１１から効率よく放熱させることができる。   For this reason, the base 11 of the metal bracket 1 can be used as a heat dissipation member. In addition, the exposed surface 19 on the opposite side of the substrate mounting surface 13 of the base 11 to which the circuit board 3 is mounted has a flat structure in which the exposed area to the surrounding atmosphere is large and convection of the atmosphere is likely to occur. Therefore, by fixing the chip 91 that is the heat generation source of the circuit element 9 to the exposed surface 19, the heat generated by the chip 91 can be efficiently radiated from the base 11 of the bracket 1.

また、高電圧の電力が通電されるパワー半導体スイッチング素子である回路素子９の端子９３と、金属製のブラケット１の基部１１との間に、貫通孔２１によって大きい絶縁距離を確保することができる。このため、貫通孔２１の径を調整することで、回路素子９とブラケット１の基部１１との間で放電等によるデッドショートが起きにくい構成を、容易に実現することができる。   In addition, a large insulation distance can be secured by the through hole 21 between the terminal 93 of the circuit element 9 which is a power semiconductor switching element through which high-voltage power is supplied and the base 11 of the metal bracket 1. . For this reason, by adjusting the diameter of the through hole 21, it is possible to easily realize a configuration in which a dead short due to discharge or the like does not occur between the circuit element 9 and the base portion 11 of the bracket 1.

さらに、回路素子９の端子９３を半田付けＳにより回路基板３の裏面３３の導電パターンに接合する箇所（回路基板３の端子孔３５の箇所）が、ブラケット１の基部１１の貫通孔２１を通じて基部１１の露出面１９側に露出する露出領域Ｅに配置されるので、端子９３の半田付けＳの作業を、例えばフロー炉（図示せず）内での、端子孔３５に先端が挿入された端子９３に対する溶融半田の付着により、インライン上で行うことができる。   Further, a location where the terminal 93 of the circuit element 9 is joined to the conductive pattern on the back surface 33 of the circuit board 3 by soldering S (a location of the terminal hole 35 of the circuit board 3) is a base portion through the through hole 21 of the base portion 11 of the bracket 1. 11 is disposed in the exposed region E exposed on the exposed surface 19 side, so that the operation of soldering S of the terminal 93 is performed, for example, in a terminal having a tip inserted into the terminal hole 35 in a flow furnace (not shown). The adhesion of the molten solder to 93 can be performed in-line.

このとき、フロー炉においては、ブラケット１の基部１１の露出面１９側から溶融半田の吹き付けを行う。その際に、基部１１の貫通孔２１がマスクとなって、溶融半田が、回路基板３の裏面３３のうち、基部１１の貫通孔２１を通じて露出面１９側に露出する露出領域Ｅの範囲内に限定して吹き付けられる。   At this time, in the flow furnace, the molten solder is sprayed from the exposed surface 19 side of the base 11 of the bracket 1. At that time, the through hole 21 of the base portion 11 serves as a mask, and the molten solder is within the range of the exposed region E exposed to the exposed surface 19 side through the through hole 21 of the base portion 11 on the back surface 33 of the circuit board 3. Limited spray.

一方、回路素子９と共に回路基板３の裏面３３に接続された回路素子７（請求項中の回路基板に接続された発熱素子を除く回路素子に相当）は、裏面３３の露出領域Ｅには一切配置されていない。   On the other hand, the circuit element 7 connected to the back surface 33 of the circuit board 3 together with the circuit element 9 (corresponding to the circuit element excluding the heating element connected to the circuit board in the claims) is not in the exposed region E of the back surface 33 at all. Not placed.

このため、フロー炉内で吹き付けにより溶融半田を、端子孔３５に先端が挿入された端子９３に付着させる際に、裏面３３に接続された他の回路素子７に溶融半田が付着することはない。   For this reason, when the molten solder is attached to the terminal 93 whose tip is inserted into the terminal hole 35 by spraying in the flow furnace, the molten solder does not adhere to the other circuit elements 7 connected to the back surface 33. .

したがって、溶融半田の付着により回路素子７に不具合を生じさせるのを回避するために、フロー炉を用いたインラインでの半田付け作業を断念して手作業による半田付け作業を行う必要もない。   Therefore, it is not necessary to abandon the in-line soldering work using the flow furnace and perform the manual soldering work in order to avoid causing trouble in the circuit element 7 due to the adhesion of the molten solder.

よって、本実施形態の放熱ユニットのような構成を採用することで、高い生産性を維持しつつ、回路素子９が接続された回路基板３をブラケット１により取付対象に取り付ける際の放熱効率を向上させることができる。   Therefore, by adopting the configuration of the heat dissipation unit of the present embodiment, the heat dissipation efficiency when the circuit board 3 to which the circuit element 9 is connected is attached to the attachment target by the bracket 1 while maintaining high productivity is improved. Can be made.

さらに、端子孔３５に先端が挿入された端子９３のフロー炉による半田付け作業を、回路素子５，７の半田付けを終えた回路基板３をブラケット１の基部１１によって下から支持した状態で行うので、回路基板３をフロー炉に安定した状態で配置することができ、フロー炉における回路素子９の端子９３の半田付け作業を精度良く行うことができる。   Further, the soldering operation of the terminal 93 whose tip is inserted into the terminal hole 35 by the flow furnace is performed in a state where the circuit board 3 after the soldering of the circuit elements 5 and 7 is supported from below by the base 11 of the bracket 1. Therefore, the circuit board 3 can be stably placed in the flow furnace, and the soldering operation of the terminals 93 of the circuit elements 9 in the flow furnace can be performed with high accuracy.

次に、本実施形態の放熱ユニットの製造方法について、図２及び図３を参照して説明する。   Next, the manufacturing method of the thermal radiation unit of this embodiment is demonstrated with reference to FIG.2 and FIG.3.

図２は放熱ユニットの製造手順を示すフローチャートである。図１に示す本実施形態の放熱ユニットは、図２に示す素子固定工程（ステップＳ１）、基板取付工程（ステップＳ３）及びフロー半田付け工程（ステップＳ５）を含んだ製造手順によって製造することができる。   FIG. 2 is a flowchart showing the manufacturing procedure of the heat dissipation unit. The heat dissipation unit of the present embodiment shown in FIG. 1 can be manufactured by a manufacturing procedure including the element fixing step (step S1), the board mounting step (step S3) and the flow soldering step (step S5) shown in FIG. it can.

このうち、ステップＳ１の素子固定工程では、図３（ａ）の断面図に示すように、回路素子９の折曲部９５からＬ字型に折り曲げた端子９３の先端側を、ブラケット１の基部１１の貫通孔２１に露出面１９側から挿入し、回路素子９のチップ９１を露出面１９に当接させて、貫通孔２１に挿入した端子９３を貫通孔２１の中心に位置させる。そして、固定ねじ２５によってチップ９１を基部１１に固定する。   Among these, in the element fixing step of step S1, as shown in the sectional view of FIG. 3A, the distal end side of the terminal 93 bent from the bent portion 95 of the circuit element 9 into the L-shape is used as the base portion of the bracket 1. 11 is inserted into the through hole 21 from the exposed surface 19 side, the chip 91 of the circuit element 9 is brought into contact with the exposed surface 19, and the terminal 93 inserted into the through hole 21 is positioned at the center of the through hole 21. Then, the chip 91 is fixed to the base 11 by the fixing screw 25.

次に、ステップＳ３の基板取付工程では、図３（ｂ）の断面図に示すように、回路素子５，７を表面３１及び裏面３３に接続して半田付けを済ませた回路基板３の端子孔３５に、回路素子９の端子９３を裏面３３側から挿入させつつ、回路基板３の裏面３３の四隅をブラケット１の基部１１の四隅の取付用ボス１７にそれぞれ載置して、取付ねじ２３により回路基板３の四隅を取付用ボス１７に取り付ける。   Next, in the board mounting step of step S3, as shown in the sectional view of FIG. 3B, the terminal holes of the circuit board 3 in which the circuit elements 5 and 7 are connected to the front surface 31 and the back surface 33 and soldered. 35, while the terminals 93 of the circuit element 9 are inserted from the back surface 33 side, the four corners of the back surface 33 of the circuit board 3 are respectively placed on the mounting bosses 17 at the four corners of the base 11 of the bracket 1, and the mounting screws 23 are used. The four corners of the circuit board 3 are attached to the mounting bosses 17.

この状態で、回路基板３の裏面３３のうち、ブラケット１の基部１１の貫通孔２１を通じて基部１１の露出面１９側に露出する露出領域Ｅには、端子孔３５が存在するのみで、裏面３３に接続された回路素子７は、露出領域Ｅに一切配置されていない。   In this state, of the back surface 33 of the circuit board 3, only the terminal hole 35 exists in the exposed region E exposed to the exposed surface 19 side of the base portion 11 through the through hole 21 of the base portion 11 of the bracket 1. The circuit element 7 connected to is not disposed in the exposed region E at all.

続いて、ステップＳ５のフロー半田付け工程では、図３（ｃ）の断面図に示すように、基板取付工程後のブラケット１を不図示のフロー炉に投入し、基部１１の貫通孔２１が通過するタイミングに合わせて露出面１９側から溶融半田を吹き付けさせる。   Subsequently, in the flow soldering process of step S5, as shown in the cross-sectional view of FIG. 3C, the bracket 1 after the board mounting process is put into a flow furnace (not shown), and the through hole 21 of the base 11 passes therethrough. The molten solder is sprayed from the exposed surface 19 side in accordance with the timing.

このとき、吹き付けた溶融半田が仮に基部１１の貫通孔２１を外れても、貫通孔２１の周縁の露出面１９に溶融半田が付着するだけで、回路基板３の裏面３３の露出領域Ｅを外れた周辺の領域に接続された回路素子７に溶融半田が付着することはない。   At this time, even if the sprayed molten solder is removed from the through hole 21 of the base 11, the molten solder only adheres to the exposed surface 19 at the peripheral edge of the through hole 21, so that the exposed area E of the back surface 33 of the circuit board 3 is removed. In addition, the molten solder does not adhere to the circuit element 7 connected to the peripheral region.

そして、裏面３３の露出領域Ｅに吹き付けられた溶融半田は、端子孔３５に先端が挿入された回路素子９の端子９３に付着し、冷却により固化する。これにより、裏面３３の不図示の導電パターンに端子９３が接合されて、図１に示す放熱ユニットが完成する。   The molten solder sprayed onto the exposed region E of the back surface 33 adheres to the terminal 93 of the circuit element 9 whose tip is inserted into the terminal hole 35 and is solidified by cooling. Thereby, the terminal 93 is joined to the conductive pattern (not shown) on the back surface 33, and the heat dissipation unit shown in FIG. 1 is completed.

なお、上述した実施形態では、通電により発熱する回路素子９のチップ９１をブラケット１の基部１１の露出面１９に固定したが、図４の断面図に示す第２実施形態の放熱ユニットのように、回路素子９のチップ９１をブラケット１の基部１１の基板取付面１３に固定してもよい。   In the above-described embodiment, the chip 91 of the circuit element 9 that generates heat when energized is fixed to the exposed surface 19 of the base portion 11 of the bracket 1. However, like the heat dissipation unit of the second embodiment shown in the cross-sectional view of FIG. The chip 91 of the circuit element 9 may be fixed to the board mounting surface 13 of the base 11 of the bracket 1.

その場合は、チップ９１と回路基板３の裏面３３との間隔を確保するために、基部１１の取付用ボス１７の高さを増やす。これにより、放熱ユニットとしての大きさは第１実施形態よりも増えるが、回路素子９のチップ９１を回路基板３や回路基板３に接続された他の回路素子５，７と共に、基部１１の基板取付面１３側に配置して、電気的なストレスや物理的な外力等から回路素子９のチップ９１を保護しやすい構造とすることができる。   In that case, the height of the mounting boss 17 of the base portion 11 is increased in order to ensure the space between the chip 91 and the back surface 33 of the circuit board 3. As a result, the size of the heat dissipation unit is larger than that of the first embodiment, but the substrate 91 of the base 11 is mounted together with the circuit board 3 and the other circuit elements 5 and 7 connected to the circuit board 3. It can be arranged on the mounting surface 13 side so that the chip 91 of the circuit element 9 can be easily protected from electrical stress or physical external force.

一方、第１実施形態の放熱ユニットでは、チップ９１をブラケット１の基部１１の露出面１９に固定することで、基部１１の肉厚分だけ回路基板３を基部１１に近付けて配置することができ、放熱ユニットとしての大きさをコンパクト化することができる。   On the other hand, in the heat dissipation unit of the first embodiment, by fixing the chip 91 to the exposed surface 19 of the base 11 of the bracket 1, the circuit board 3 can be arranged close to the base 11 by the thickness of the base 11. The size of the heat dissipation unit can be made compact.

なお、第１及び第２実施形態の放熱ユニットにおいて、ブラケット１の基部１１の基板取付面１３側には、必要に応じて、四隅の取付用ボス１７やこれに取り付けられた回路基板３、及び、回路基板３の表面３１や裏面３３に接続された回路素子５，７を覆うカバー（図示せず）を取り付けることができる。   In the heat radiating units of the first and second embodiments, on the board mounting surface 13 side of the base 11 of the bracket 1, if necessary, the four corner mounting bosses 17 and the circuit board 3 attached thereto, and A cover (not shown) for covering the circuit elements 5 and 7 connected to the front surface 31 and the back surface 33 of the circuit board 3 can be attached.

また、本発明は、ブラケットに取り付けられた回路基板に通電により発熱する発熱素子が接続されている場合の放熱ユニットに広く適用可能である。   Further, the present invention can be widely applied to a heat radiating unit in the case where a heating element that generates heat by energization is connected to a circuit board attached to a bracket.

本発明は、ブラケットに取り付けられた回路基板の通電により発熱する発熱素子の放熱ユニットにおいて利用することができる。   The present invention can be used in a heat radiating unit of a heat generating element that generates heat by energization of a circuit board attached to a bracket.

１ ブラケット
３ 回路基板
５ 回路素子
７ 回路素子（回路基板に接続された発熱素子を除く回路素子）
９ 回路素子（発熱素子）
１１ 基部
１３ 基板取付面
１５ 取付部
１７ 取付用ボス
１９ 露出面
２１ 貫通孔（開口）
３１ 表面
３３ 裏面（対向面）
３５ 端子孔（接合箇所、回路基板の基部に形成された開口に臨む箇所）
９１ チップ（素子本体）
９３ 端子
９５ 折曲部
Ｅ 露出領域（対向面における開口により基部を介して露出される領域）
Ｓ 半田付け 1 Bracket 3 Circuit board 5 Circuit element 7 Circuit element (Circuit elements excluding heating elements connected to the circuit board)
9 Circuit elements (heating elements)
DESCRIPTION OF SYMBOLS 11 Base part 13 Substrate attachment surface 15 Attachment part 17 Mounting boss 19 Exposed surface 21 Through-hole (opening)
31 Front 33 Back (opposite surface)
35 Terminal hole (joint location, location facing the opening formed in the base of the circuit board)
91 chip (element body)
93 Terminal 95 Bent part E Exposed area (Area exposed through the base by the opening in the opposite surface)
S soldering

Claims (5)

通電により発熱する発熱素子（９）が接続された回路基板（３）と、
前記回路基板（３）が取り付けられ、かつ、該回路基板（３）の前記発熱素子（９）の素子本体（９１）が直接固定された金属製のブラケット（１）と、
を備える発熱素子（９）の放熱ユニット。 A circuit board (3) to which a heating element (9) that generates heat when energized is connected;
A metal bracket (1) to which the circuit board (3) is attached and the element body (91) of the heating element (9) of the circuit board (3) is directly fixed;
A heat dissipating unit for the heat generating element (9). 前記ブラケット（１）は、前記回路基板（３）と平行に配置された基部（１１）を有し、
前記発熱素子（９）は端子（９３）を有し、
前記端子（９３）は、前記基部（１１）に対向する前記回路基板（３）の対向面（３３）と半田付け（Ｓ）により接合されている請求項１記載の発熱素子（９）の放熱ユニット。 The bracket (1) has a base (11) arranged in parallel with the circuit board (3),
The heating element (9) has a terminal (93),
The heat dissipation of the heating element (9) according to claim 1, wherein the terminal (93) is joined to the facing surface (33) of the circuit board (3) facing the base portion (11) by soldering (S). unit. 前記基部（１１）を介して前記対向面（３３）における前記端子（９３）の接合箇所（３５）を露出させる開口（２１）が前記基部（１１）に形成されている請求項２記載の発熱素子（９）の放熱ユニット。   The heat generation according to claim 2, wherein an opening (21) is formed in the base (11) through which the joint (35) of the terminal (93) on the facing surface (33) is exposed through the base (11). Heat dissipation unit of element (9). 前記回路基板（３）に接続された前記発熱素子（９）を除く回路素子（７）が、前記対向面（３３）における前記開口（２１）により前記基部（１１）を介して露出される領域（Ｅ）を除く領域に配置されている請求項３記載の発熱素子（９）の放熱ユニット。   A region where the circuit elements (7) excluding the heating element (9) connected to the circuit board (3) are exposed through the base (11) by the opening (21) in the facing surface (33). The heat dissipating unit of the heat generating element (9) according to claim 3, which is disposed in a region excluding (E). 請求項３又は４に記載した発熱素子（９）の放熱ユニットの製造方法であって、
通電により発熱する発熱素子（９）の素子本体（９１）を金属製のブラケット（１）の基部（１１）に固定する素子固定工程（Ｓ１）と、
前記基部（１１）に前記素子本体（９１）が固定された前記ブラケット（１）に、前記発熱素子（９）を接続する回路基板（３）を取り付けて、前記回路基板（３）の前記基部（１１）に形成された開口（２１）に臨む箇所（３５）に前記発熱素子（９）の端子（９３）を挿通する基板取付工程（Ｓ３）と、
前記回路基板（３）の前記箇所（３５）に挿通された前記端子（９３）に前記開口（２１）を通じて溶融半田を付着させるフロー半田付け工程（Ｓ５）と、
を含む発熱素子（９）の放熱ユニットの製造方法。 A method for manufacturing a heat dissipation unit of a heating element (9) according to claim 3 or 4,
An element fixing step (S1) for fixing the element body (91) of the heating element (9) that generates heat by energization to the base (11) of the metal bracket (1);
A circuit board (3) for connecting the heating element (9) is attached to the bracket (1) having the element body (91) fixed to the base (11), and the base of the circuit board (3) is attached. A board mounting step (S3) for inserting the terminal (93) of the heating element (9) into the location (35) facing the opening (21) formed in (11);
A flow soldering step (S5) in which molten solder is attached to the terminal (93) inserted through the portion (35) of the circuit board (3) through the opening (21);
A method for manufacturing a heat radiating unit of a heating element (9) including:
JP2017125160A 2017-06-27 2017-06-27 Heat dissipating unit of heat generating element Pending JP2019009341A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7450526B2 (en) 2020-12-17 2024-03-15 日立建機株式会社 work vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7450526B2 (en) 2020-12-17 2024-03-15 日立建機株式会社 work vehicle

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