JP2012225849A - マイクロチップおよびその製造方法 - Google Patents
マイクロチップおよびその製造方法 Download PDFInfo
- Publication number
- JP2012225849A JP2012225849A JP2011095413A JP2011095413A JP2012225849A JP 2012225849 A JP2012225849 A JP 2012225849A JP 2011095413 A JP2011095413 A JP 2011095413A JP 2011095413 A JP2011095413 A JP 2011095413A JP 2012225849 A JP2012225849 A JP 2012225849A
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- substrate
- fluid circuit
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- light
- microchip
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Classifications
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
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Abstract
【解決手段】内部に形成された空間からなる流体回路を備えるマイクロチップであって、光吸収性の第1の基板10と、第1の基板10上に貼合される光透過性の第2の基板20とを含み、第2の基板20における第1の基板10とは反対側の表面上であって、流体回路の少なくとも一部の直上の位置に、流体回路と平行に延びる断面がV字形状の溝40を有するマイクロチップおよびその製造方法である。
【選択図】図2
Description
l=〔a・tan(θ−θ’)〕/〔1+tanθ・tan(θ−θ’)〕 (1)
を満たすことが好ましい。
sinθ/sinθ’=n/1 (2)
を満たす角度であり、式(2)中のnは第2の基板の屈折率である。
<第1の実施形態>
図1は、本実施形態に係るマイクロチップを概念的に示す斜視図である。図1に示されるように、本実施形態のマイクロチップは、光吸収性の第1の基板10と、第1の基板10上に貼合される光透過性の第2の基板20とを含んで構成される。第1の基板10と第2の基板20とは、第2の基板20側から照射される光(レーザー光、ランプ光等)による溶着によって接合される。すなわち、第2の基板20を透過し、基板界面に達した光によって光吸収性の第1の基板の貼り合わせ面を融解させ、基板同士の接合がなされる。
l=〔a・tan(θ−θ’)〕/〔1+tanθ・tan(θ−θ’)〕 (1)
を満たすことが好ましい。
sinθ/sinθ’=n/1 (2)
を満たす角度である。上記式(2)中のnは、第2の基板20の屈折率である。
sinθ/sinθ’=n/1 〔a〕
の関係を満たす。この式〔a〕は上記式(2)と同一である。
tanθ=d/l 〔b〕
tan(θ−θ’)=w/(a−d) 〔c〕
の関係式が導かれる。
w=l 〔d〕
の関係を満たす場合であるから、上記〔b〕〜〔d〕より、遮光領域min(w,l)が最大になるのは、上記式(1)を満たす場合となる。
(A)光吸収性の第1の基板10上に、光透過性の第2の基板を配置する工程、および
(B)第2の基板20側であって、第2の基板20における第1の基板10とは反対側の表面に対して垂直な方向から光を照射することにより、第1の基板と第2の基板とを溶着させる工程を含む方法によって好適に製造することができる。
図11は、本実施形態に係るマイクロチップの一例を示す概略断面図である。図11に示されるように、本実施形態のマイクロチップは、光吸収性の第1の基板10と、第1の基板10上に貼合される光透過性の第2の基板20とを含んで構成される。第1の基板10と第2の基板20とは、上記第1の実施形態と同様、第2の基板20側から照射される光(レーザー光、ランプ光等)による溶着によって接合される。
Claims (8)
- 内部に形成された空間からなる流体回路を備えており、前記流体回路内に存在する液体を前記流体回路内の所望の位置に移動させるマイクロチップであって、
光吸収性の第1の基板と、前記第1の基板上に貼合される光透過性の第2の基板とを含み、
前記第2の基板における前記第1の基板とは反対側の表面上であって、前記流体回路の少なくとも一部の直上の位置に、前記流体回路と平行に延びる断面がV字形状の溝を有するマイクロチップ。 - 前記溝の幅方向両端部は、前記第1の基板と前記第2の基板とが接触している貼り合わせ部の直上に位置する請求項1に記載のマイクロチップ。
- 前記溝は、その断面形状が二等辺三角形であり、かつ下記式(1):
l=〔a・tan(θ−θ’)〕/〔1+tanθ・tan(θ−θ’)〕 (1)
[上記式(1)中、lは前記溝の幅方向両端部間の距離の1/2であり、aは前記第2の基板における前記溝が形成される側の表面から前記流体回路までの距離であり、θは前記溝の幅方向両端部間を結ぶ直線と前記溝を構成する傾斜面とがなす角度である。また、θ’は、下記式(2):
sinθ/sinθ’=n/1 (2)
を満たす角度であり、上記式(2)中のnは前記第2の基板の屈折率である。]
を満たす請求項1に記載のマイクロチップ。 - 内部に形成された空間からなる流体回路を備えており、前記流体回路内に存在する液体を前記流体回路内の所望の位置に移動させるマイクロチップであって、
光吸収性の第1の基板と、前記第1の基板上に貼合される光透過性の第2の基板とを含み、
前記流体回路は、前記第2の基板における前記第1の基板側表面上に設けられる溝と前記第1の基板とによって形成される空間からなり、
前記溝の底面に、断面形状が二等辺三角形であり、かつその頂角が90度である突起を含むテーパー構造部を備えるマイクロチップ。 - 前記テーパー構造部は、断面形状が二等辺三角形であり、かつその頂角が90度である三角柱状の突起の複数を平行に配列したものである請求項4に記載のマイクロチップ。
- 前記テーパー構造部は、断面形状が二等辺三角形であり、かつその頂角が90度である四角錘状の突起の複数を隣接して配列したものである請求項4に記載のマイクロチップ。
- 前記第2の基板における前記第1の基板とは反対側の表面上であって、前記流体回路の少なくとも一部の直上の位置に、前記流体回路と平行に延びる断面がV字形状の溝をさらに有する請求項4に記載のマイクロチップ。
- 前記第1の基板上に前記第2の基板を配置する工程と、
前記第2の基板側であって、前記第2の基板における前記第1の基板とは反対側の表面に対して垂直な方向から光を照射することにより、前記第1の基板と前記第2の基板とを溶着させる工程と、
を備える請求項1〜7のいずれかに記載のマイクロチップの製造方法。
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JP2000218698A (ja) * | 1999-01-28 | 2000-08-08 | Leister Process Technologies | レ―ザ―による樹脂の接合方法及びその装置 |
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