JP2012217155A5 - - Google Patents

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Publication number
JP2012217155A5
JP2012217155A5 JP2012058933A JP2012058933A JP2012217155A5 JP 2012217155 A5 JP2012217155 A5 JP 2012217155A5 JP 2012058933 A JP2012058933 A JP 2012058933A JP 2012058933 A JP2012058933 A JP 2012058933A JP 2012217155 A5 JP2012217155 A5 JP 2012217155A5
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JP
Japan
Prior art keywords
wafer
preparing
plates
glass
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012058933A
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English (en)
Japanese (ja)
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JP2012217155A (ja
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Publication date
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Priority to JP2012058933A priority Critical patent/JP2012217155A/ja
Priority claimed from JP2012058933A external-priority patent/JP2012217155A/ja
Priority to US13/434,836 priority patent/US9018825B2/en
Publication of JP2012217155A publication Critical patent/JP2012217155A/ja
Publication of JP2012217155A5 publication Critical patent/JP2012217155A5/ja
Pending legal-status Critical Current

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JP2012058933A 2011-03-30 2012-03-15 圧電デバイス及び圧電デバイスの製造方法 Pending JP2012217155A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012058933A JP2012217155A (ja) 2011-03-30 2012-03-15 圧電デバイス及び圧電デバイスの製造方法
US13/434,836 US9018825B2 (en) 2011-03-30 2012-03-29 Piezoelectric device and manufacturing method of piezoelectric device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011075237 2011-03-30
JP2011075237 2011-03-30
JP2012058933A JP2012217155A (ja) 2011-03-30 2012-03-15 圧電デバイス及び圧電デバイスの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016076969A Division JP2016154368A (ja) 2011-03-30 2016-04-07 圧電デバイス及び圧電デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2012217155A JP2012217155A (ja) 2012-11-08
JP2012217155A5 true JP2012217155A5 (cg-RX-API-DMAC7.html) 2015-04-23

Family

ID=46926266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012058933A Pending JP2012217155A (ja) 2011-03-30 2012-03-15 圧電デバイス及び圧電デバイスの製造方法

Country Status (2)

Country Link
US (1) US9018825B2 (cg-RX-API-DMAC7.html)
JP (1) JP2012217155A (cg-RX-API-DMAC7.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011199065A (ja) * 2010-03-19 2011-10-06 Seiko Instruments Inc 真空パッケージ、真空パッケージの製造方法、圧電振動子、発振器、電子機器及び電波時計
JP2012217155A (ja) * 2011-03-30 2012-11-08 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
JP5972598B2 (ja) * 2012-02-22 2016-08-17 日本電波工業株式会社 圧電デバイス及び圧電デバイスの製造方法
JP1565481S (cg-RX-API-DMAC7.html) * 2016-05-25 2016-12-19
USD857020S1 (en) * 2016-05-25 2019-08-20 Tdk Corporation Piezoelectric element
CN109427828B (zh) * 2017-09-04 2021-02-09 中芯国际集成电路制造(上海)有限公司 半导体装置的制造方法
WO2019195334A1 (en) * 2018-04-03 2019-10-10 Corning Incorporated Hermetically sealed optically transparent wafer-level packages and methods for making the same
JP1649916S (cg-RX-API-DMAC7.html) * 2019-05-20 2020-01-20
USD958763S1 (en) * 2019-05-20 2022-07-26 Tdk Corporation Piezoelectric element

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3345878B2 (ja) * 1997-02-17 2002-11-18 株式会社デンソー 電子回路装置の製造方法
JPH11163668A (ja) * 1997-11-28 1999-06-18 Matsushita Electric Ind Co Ltd 積層圧電単結晶基板及びそれを用いた圧電デバイス
JP3704478B2 (ja) 2001-03-12 2005-10-12 株式会社巴川製紙所 電子部品封止用蓋材ウエハ及びその製造方法
JP2002319710A (ja) * 2001-04-20 2002-10-31 Matsushita Electric Ind Co Ltd 発光装置とその製造方法
KR100909817B1 (ko) * 2005-04-27 2009-07-28 쿄세라 코포레이션 압전 부품 및 그 제조 방법
JP2007013636A (ja) * 2005-06-30 2007-01-18 Kyocera Kinseki Corp 圧電振動子の製造方法及び圧電振動子
JP2008116648A (ja) * 2006-11-02 2008-05-22 Nishiyama Stainless Chem Kk Ｆｐｄの製造方法、及びこれに使用する封止材
JP2008167302A (ja) * 2006-12-28 2008-07-17 Kyocera Kinseki Corp 水晶振動子の電気的導通路の形成方法
JP5180975B2 (ja) * 2008-02-18 2013-04-10 セイコーインスツル株式会社 圧電振動子の製造方法および圧電振動子
JP5369887B2 (ja) * 2008-10-24 2013-12-18 セイコーエプソン株式会社 電子部品用パッケージ、圧電デバイスおよびその製造方法
JP4843012B2 (ja) * 2008-11-17 2011-12-21 日本電波工業株式会社 圧電デバイスとその製造方法
JP2012217155A (ja) * 2011-03-30 2012-11-08 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
JP2012217143A (ja) * 2011-03-31 2012-11-08 Nippon Dempa Kogyo Co Ltd 水晶デバイス及びその製造方法
JP2012253587A (ja) * 2011-06-03 2012-12-20 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
JP2013098814A (ja) * 2011-11-02 2013-05-20 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス

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