JP2012212712A5 - - Google Patents

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Publication number
JP2012212712A5
JP2012212712A5 JP2011076410A JP2011076410A JP2012212712A5 JP 2012212712 A5 JP2012212712 A5 JP 2012212712A5 JP 2011076410 A JP2011076410 A JP 2011076410A JP 2011076410 A JP2011076410 A JP 2011076410A JP 2012212712 A5 JP2012212712 A5 JP 2012212712A5
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JP
Japan
Prior art keywords
semiconductor device
bonding
bonding material
material provided
pad portions
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Application number
JP2011076410A
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English (en)
Japanese (ja)
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JP6043049B2 (ja
JP2012212712A (ja
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Priority claimed from JP2011076410A external-priority patent/JP6043049B2/ja
Publication of JP2012212712A publication Critical patent/JP2012212712A/ja
Publication of JP2012212712A5 publication Critical patent/JP2012212712A5/ja
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JP2011076410A 2011-03-30 2011-03-30 半導体装置の実装構造及び半導体装置の実装方法 Active JP6043049B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011076410A JP6043049B2 (ja) 2011-03-30 2011-03-30 半導体装置の実装構造及び半導体装置の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011076410A JP6043049B2 (ja) 2011-03-30 2011-03-30 半導体装置の実装構造及び半導体装置の実装方法

Publications (3)

Publication Number Publication Date
JP2012212712A JP2012212712A (ja) 2012-11-01
JP2012212712A5 true JP2012212712A5 (zh) 2014-04-24
JP6043049B2 JP6043049B2 (ja) 2016-12-14

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ID=47266464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011076410A Active JP6043049B2 (ja) 2011-03-30 2011-03-30 半導体装置の実装構造及び半導体装置の実装方法

Country Status (1)

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JP (1) JP6043049B2 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103918067B (zh) * 2012-05-29 2017-03-01 日本精工株式会社 半导体模块及其制造方法
US9609775B2 (en) 2012-11-05 2017-03-28 Nsk Ltd. Semiconductor module
JP5892250B2 (ja) * 2012-11-05 2016-03-23 日本精工株式会社 半導体モジュール
EP2916348B1 (en) * 2012-11-05 2020-05-13 NSK Ltd. Semiconductor module
BR112016001171A2 (pt) * 2013-10-21 2017-12-12 Nsk Ltd módulo semicondutor.
JP6566634B2 (ja) * 2014-12-09 2019-08-28 国立大学法人大阪大学 接合構造体、及び、接合構造体の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4550503B2 (ja) * 2004-07-22 2010-09-22 ルネサスエレクトロニクス株式会社 半導体装置
JP2006344652A (ja) * 2005-06-07 2006-12-21 Toshiba Components Co Ltd 半導体装置及び半導体素子の搭載方法
JP5076440B2 (ja) * 2006-10-16 2012-11-21 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2010050364A (ja) * 2008-08-25 2010-03-04 Hitachi Ltd 半導体装置
JP5388661B2 (ja) * 2009-04-03 2014-01-15 三菱電機株式会社 半導体装置およびその製造方法
JP2012212713A (ja) * 2011-03-30 2012-11-01 Toshiba Corp 半導体装置の実装構造
JP2012217213A (ja) * 2012-08-01 2012-11-08 Toshiba Corp 画像処理装置および画像処理方法

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