JP2012212712A5 - - Google Patents
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- JP2012212712A5 JP2012212712A5 JP2011076410A JP2011076410A JP2012212712A5 JP 2012212712 A5 JP2012212712 A5 JP 2012212712A5 JP 2011076410 A JP2011076410 A JP 2011076410A JP 2011076410 A JP2011076410 A JP 2011076410A JP 2012212712 A5 JP2012212712 A5 JP 2012212712A5
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- Prior art keywords
- semiconductor device
- bonding
- bonding material
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011076410A JP6043049B2 (ja) | 2011-03-30 | 2011-03-30 | 半導体装置の実装構造及び半導体装置の実装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011076410A JP6043049B2 (ja) | 2011-03-30 | 2011-03-30 | 半導体装置の実装構造及び半導体装置の実装方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012212712A JP2012212712A (ja) | 2012-11-01 |
JP2012212712A5 true JP2012212712A5 (zh) | 2014-04-24 |
JP6043049B2 JP6043049B2 (ja) | 2016-12-14 |
Family
ID=47266464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011076410A Active JP6043049B2 (ja) | 2011-03-30 | 2011-03-30 | 半導体装置の実装構造及び半導体装置の実装方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6043049B2 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103918067B (zh) * | 2012-05-29 | 2017-03-01 | 日本精工株式会社 | 半导体模块及其制造方法 |
US9609775B2 (en) | 2012-11-05 | 2017-03-28 | Nsk Ltd. | Semiconductor module |
JP5892250B2 (ja) * | 2012-11-05 | 2016-03-23 | 日本精工株式会社 | 半導体モジュール |
EP2916348B1 (en) * | 2012-11-05 | 2020-05-13 | NSK Ltd. | Semiconductor module |
BR112016001171A2 (pt) * | 2013-10-21 | 2017-12-12 | Nsk Ltd | módulo semicondutor. |
JP6566634B2 (ja) * | 2014-12-09 | 2019-08-28 | 国立大学法人大阪大学 | 接合構造体、及び、接合構造体の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4550503B2 (ja) * | 2004-07-22 | 2010-09-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2006344652A (ja) * | 2005-06-07 | 2006-12-21 | Toshiba Components Co Ltd | 半導体装置及び半導体素子の搭載方法 |
JP5076440B2 (ja) * | 2006-10-16 | 2012-11-21 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
JP2010050364A (ja) * | 2008-08-25 | 2010-03-04 | Hitachi Ltd | 半導体装置 |
JP5388661B2 (ja) * | 2009-04-03 | 2014-01-15 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JP2012212713A (ja) * | 2011-03-30 | 2012-11-01 | Toshiba Corp | 半導体装置の実装構造 |
JP2012217213A (ja) * | 2012-08-01 | 2012-11-08 | Toshiba Corp | 画像処理装置および画像処理方法 |
-
2011
- 2011-03-30 JP JP2011076410A patent/JP6043049B2/ja active Active
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