JP2012210697A5 - - Google Patents

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Publication number
JP2012210697A5
JP2012210697A5 JP2011243137A JP2011243137A JP2012210697A5 JP 2012210697 A5 JP2012210697 A5 JP 2012210697A5 JP 2011243137 A JP2011243137 A JP 2011243137A JP 2011243137 A JP2011243137 A JP 2011243137A JP 2012210697 A5 JP2012210697 A5 JP 2012210697A5
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Japan
Prior art keywords
grinding
workpiece
thickness
relative position
measuring
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JP2011243137A
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English (en)
Japanese (ja)
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JP2012210697A (ja
JP5891010B2 (ja
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Priority to JP2011243137A priority Critical patent/JP5891010B2/ja
Priority claimed from JP2011243137A external-priority patent/JP5891010B2/ja
Priority to KR1020120024977A priority patent/KR101891344B1/ko
Priority to DE102012204089A priority patent/DE102012204089A1/de
Priority to TW101108994A priority patent/TWI558503B/zh
Publication of JP2012210697A publication Critical patent/JP2012210697A/ja
Publication of JP2012210697A5 publication Critical patent/JP2012210697A5/ja
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Publication of JP5891010B2 publication Critical patent/JP5891010B2/ja
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JP2011243137A 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤 Active JP5891010B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011243137A JP5891010B2 (ja) 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤
KR1020120024977A KR101891344B1 (ko) 2011-03-18 2012-03-12 박판형 워크의 연삭 방법 및 양두 평면 연삭반
DE102012204089A DE102012204089A1 (de) 2011-03-18 2012-03-15 Verfahren zum Schleifen von dünnen blattförmigen Werkstücken und Doppelend-Oberflächenschleifer
TW101108994A TWI558503B (zh) 2011-03-18 2012-03-16 薄板狀工件之研磨方法及雙頭平面磨床

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011060520 2011-03-18
JP2011060520 2011-03-18
JP2011243137A JP5891010B2 (ja) 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤

Publications (3)

Publication Number Publication Date
JP2012210697A JP2012210697A (ja) 2012-11-01
JP2012210697A5 true JP2012210697A5 (cg-RX-API-DMAC7.html) 2014-11-27
JP5891010B2 JP5891010B2 (ja) 2016-03-22

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JP2011243137A Active JP5891010B2 (ja) 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤

Country Status (4)

Country Link
JP (1) JP5891010B2 (cg-RX-API-DMAC7.html)
KR (1) KR101891344B1 (cg-RX-API-DMAC7.html)
DE (1) DE102012204089A1 (cg-RX-API-DMAC7.html)
TW (1) TWI558503B (cg-RX-API-DMAC7.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104511814A (zh) * 2014-12-20 2015-04-15 重庆尹氏天润套装门有限公司 具有双面打磨的木板加工台
JP6285375B2 (ja) * 2015-02-17 2018-02-28 光洋機械工業株式会社 両頭平面研削装置
CN107984360A (zh) * 2017-11-20 2018-05-04 长沙市凤英机械科技有限公司 一种h型钢多面打磨除锈装置
CN108687644A (zh) * 2018-03-29 2018-10-23 芜湖凌梦电子商务有限公司 一种方便使用的平板电脑生产设备的抛光销
CN108747667B (zh) * 2018-05-07 2019-10-25 徐州恒林木业有限公司 一种bmc注塑模具板材表面去毛刺装置
CN110181383A (zh) * 2019-06-06 2019-08-30 扬州好管家科技信息咨询有限公司 一种升降式自控自吸型水泵模具加工用的高效性抛光装置
CN110539237B (zh) * 2019-09-30 2021-06-04 南通海润机床有限公司 一种磨床用可升降的双砂轮结构
CN110883661A (zh) * 2019-12-04 2020-03-17 浙江中慧厨房设备有限公司 一种用于钢板的双面抛光机
CN110860998B (zh) * 2019-12-09 2025-05-27 中环领先(徐州)半导体材料有限公司 双面减薄的装置和方法
CN111390678A (zh) * 2020-04-24 2020-07-10 山西潞安太阳能科技有限责任公司 一种硅片打磨机及其使用方法
JP7588494B2 (ja) * 2020-11-04 2024-11-22 株式会社ディスコ 被加工物の研削方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4524547A (en) * 1983-09-06 1985-06-25 Litton Industrial Products, Inc. Automatic double disc grinder control cycle
JP2005238444A (ja) * 1999-05-07 2005-09-08 Shin Etsu Handotai Co Ltd 両面同時研削方法および両面同時研削盤並びに両面同時ラップ方法および両面同時ラップ盤
JP2003071713A (ja) 2001-08-29 2003-03-12 Nippei Toyama Corp 研削装置及びウェーハの厚さ管理方法
JP2003236748A (ja) * 2002-02-14 2003-08-26 Sumitomo Heavy Ind Ltd 研削装置
JP2004058175A (ja) * 2002-07-25 2004-02-26 Sumitomo Heavy Ind Ltd 両頭研削装置
JP4319092B2 (ja) * 2004-06-03 2009-08-26 住友重機械工業株式会社 両面加工装置

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