JP2012204743A - Electronic component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting method which can achieve reduction of tact time by improving work efficiency of a mark recognition camera at the time of mounting an electronic component on a substrate.SOLUTION: An electronic component mounting method comprises: an allowable area storage process of storing an allowable area in a camera view field, in which reading information from a mark is allowed; a farther end edge calculation process of calculating, for the current camera position, an X direction end edge and a Y direction end edge of a periphery part of an imaging object mark to be imaged next on a farther side with respect to a current camera position among X direction both end edges and Y direction end edges of the periphery part; and a camera movement process of moving the mark recognition camera such that an X direction end edge and a Y direction end edge of the allowable area at the camera position on a side nearer to the imaging object mark to be imaged next among X direct both end edges and Y direct both end edges of the allowable area for the imaging object mark at least cross over the X direction end edge and the Y direction end edge on the farther side to the farther side with respect to the current camera position.

Description

  The present invention relates to an electronic component mounting method for mounting an electronic component on a substrate.

  Conventionally, electronic components are mounted in an electronic component mounting apparatus with the substrate positioned at a predetermined position. However, mounting on the substrate is caused by a positional shift of the substrate relative to the mounting device or a relative position shift of the printed wiring pattern of the substrate. The point may deviate from the normal position. Therefore, a recognition mark such as a mounting point is attached on the board in advance, and the position of the board is checked and the orientation of the board is recognized prior to component mounting, and the recognition mark is recognized. The position of each mark is detected by taking an image with a camera, and the position deviation of the mounting point, etc. is checked based on these results, the correction amount is calculated accordingly, and the mounting point is corrected by the obtained correction amount. And the correct mounting is done.

  Patent Document 1 as an apparatus for correcting a displacement of a mounting point based on such a recognition mark discloses a position where a main mark (reference position mark) provided on a diagonal of the board and an electronic component on the board are mounted. Correction data corresponding to the positional deviation with respect to the apparatus main body is obtained from the local marks (position marks) provided diagonally on the substrate, and a specific point related to the local mark is recognized as a relative positional deviation with respect to the substrate. It is described that correction data corresponding to the positional deviation with respect to the substrate is obtained. The positional deviation with respect to the main body of the apparatus must be performed every time the apparatus is changed. However, since the positional deviation with respect to the substrate is specific to the substrate to be transported, If the positional deviation with respect to the substrate is obtained in the first apparatus, it is not necessary to calculate it in the second and subsequent mounting apparatuses, and the tact time is reduced by omitting obtaining such positional deviation with respect to the board. It is described to do.

JP 2006-287047 A

  In the electronic component mounting apparatus according to Patent Document 1, when the recognition mark provided on the substrate is read by the mark recognition camera, the mark is generally positioned and read at the center of the lens of the mark recognition camera. It is. Therefore, when a large number (for example, 40 to 50) of recognition marks are provided on one substrate, there is a problem that the time for the mark recognition camera to move between the respective recognition marks is cumulatively increased.

  Also, in general, marks read by the mark recognition camera include not only a main mark and a local mark for correcting misalignment, but also an ID mark indicating a substrate ID, a skip mark for instructing skipping during mounting, and the like. When reading these marks, like the main marks and local marks, they are positioned and read at the center of the lens.

  The present invention has been made in view of the above-described conventional problems, and mounting of an electronic component capable of improving the working efficiency of the mark recognition camera and reducing the tact time when mounting the electronic equipment on the substrate. Is to provide a method.

  In order to solve the above-described problem, the structural feature of the invention according to claim 1 is that a board transfer device that carries a substrate on which an electronic component is to be mounted by a component transfer device and positions the substrate on a predetermined position, and the positioning. A mark recognition camera that is provided above the substrate and individually recognizes a plurality of marks attached to the substrate; and a camera moving unit that moves the mark recognition camera in the X direction and Y direction above the substrate; The camera movement control means for positioning the mark recognition camera at any of the plurality of marks by controlling the camera movement means, and the mark recognition camera positioned at any of the plurality of marks. In an electronic component mounting apparatus comprising: an image pickup control means for picking up an image of the mark, reading of information from the mark by the image pickup of the mark is allowed An allowable area storing step for storing an allowable area in the camera field of view, and the current camera position among the X direction both ends and the Y direction both ends of the periphery of the imaging target mark to be imaged next with respect to the current camera position A far-end edge calculating step for calculating a far-side X-direction edge and a Y-direction end edge, and the far-side X-direction edge and the Y-direction edge are used as the X-direction end edges of the allowable area for the imaging target mark. The mark recognition camera so that the X direction edge and the Y direction edge close to the imaging target mark at the camera position at least far beyond the current camera position among the both edges in the Y direction A camera moving process for moving the camera.

  According to a second aspect of the present invention, there is provided a structural feature according to the first aspect, wherein the imaging target mark has a plurality of types, and in the camera moving step, the type of the imaging target mark has a low positional accuracy. For example, if the mark is included in the visual field on the outer edge side of the allowable area, and the type of the imaging target mark has high positional accuracy, the mark is displayed in the visual field on the center side in the allowable area. Positioning the mark recognition camera.

  The structural feature of the invention according to claim 3 is that, in the first or second aspect, in the allowable area storing step, in the plurality of types of imaging target marks, the positional accuracy of the types of marks to be imaged is low. If there is, the allowable area is set in a wide area, and if the position accuracy of the type of mark to be imaged is high, the allowable area is set and stored in a narrow area.

  According to the first aspect of the present invention, the X direction end on the far side from the current camera position among the X direction both end edges and the Y direction both end edges of the peripheral portion of the imaging target mark to be imaged next with respect to the current camera position. By calculating the edge and the edge in the Y direction, the shortest distance from the current camera position to the imaging target mark is obtained. Then, these X-direction edge and Y-direction edge on the far side are arranged on the side closer to the imaging target mark at the camera position among the X-direction both end edges and the Y-direction both end edges of the allowable area for the imaging target mark. The mark recognition camera is moved so that the X direction edge and the Y direction edge extend at least on the far side with respect to the current camera position. Can be made. In this way, the mark recognition camera moves between the imaging target marks with the shortest distance, so that the movement time can be shortened and the tact time can be shortened.

  Note that “at least beyond the far side” means that the X direction edge and the Y direction edge on the far side of the mark to be imaged, the X direction edge on the side close to the image to be imaged at the camera position, and Moving the mark recognition camera so that the edges in the Y direction match is ideally the shortest movement distance, but in reality, it is necessary to consider substrate positioning errors, dimensional errors, etc. is there. Further, when the movement is performed so as to coincide with each other, the same handling in consideration of the positioning error and the like can be performed by setting the allowable area to be set narrower by the positioning error and the like.

  According to the second aspect of the present invention, if the mark to be imaged is of a plurality of types, for example, an ID mark may have a low positional accuracy, the mark is included in the visual field on the outer edge side of the allowable area. By positioning in such a manner, the moving time can be shortened by setting the moving distance between marks that are continuously imaged as the shortest distance. For example, if high positional accuracy is required, such as a local mark, positioning the mark recognition camera so that the mark is included in the visual field on the center side in the allowable area, lens distortion, etc. It is possible to satisfy the high positional accuracy by eliminating the influence of.

  According to the invention according to claim 3, in the plurality of types of imaging target marks, if the positional accuracy of the type of mark to be imaged is low, the position of the type of mark to be imaged in the wide allowable area If the accuracy is high, the allowable area is set in a narrow area and stored. In this way, by changing the area of the allowable area in accordance with the required position accuracy, it is possible to set the best state that satisfies both the shortening of the movement time of the mark recognition camera and the required position accuracy. it can.

The top view which shows the outline of embodiment of the electronic component mounting apparatus which concerns on this invention. The figure which shows the visual field and tolerance area of a camera for mark recognition. The block diagram which shows the outline | summary of a structure of the apparatus controlled by a control apparatus. FIG. 6 is a diagram for explaining alignment with a first mark and movement of a mark recognition camera in the first embodiment. The figure explaining the alignment to the 2nd mark, and the movement of the camera for mark recognition. The figure explaining the alignment to the 3rd mark, and the movement of the camera for mark recognition. The figure explaining the alignment to the 4th mark, and the movement of the camera for mark recognition. The figure explaining the alignment to the 5th mark, and the movement of the camera for mark recognition. 9 is a flowchart showing a procedure for moving a mark recognition camera in order to take an image of a mark in the second embodiment. The figure explaining position alignment of the camera for mark recognition to the first reference position mark. The figure explaining position alignment of the camera for mark recognition to the 2nd reference position mark. The figure explaining position alignment of the camera for mark recognition to an ID mark. The figure explaining position alignment of the camera for mark recognition to the first skip mark. The figure explaining position alignment of the camera for mark recognition to the 2nd skip mark. The figure explaining position alignment of the camera for mark recognition to the 3rd skip mark. The figure explaining the alignment of the camera for mark recognition to the first position mark. The figure explaining position alignment of the camera for mark recognition to the 2nd position mark. The figure which shows the state which positioned the mark in another example in the outer edge part side outside the permissible area of a visual field. The figure which shows the state which repositioned the mark to the center part side of the visual field of the camera for mark recognition. The figure which shows the state which set the tolerance area narrowly. The figure which shows the state which set the tolerance area widely.

A first embodiment of an electronic component mounting apparatus that implements an electronic component mounting method according to the present invention will be described below with reference to the drawings.
As shown in FIG. 1, the electronic component mounting apparatus 2 includes a substrate transfer device 4 that loads a substrate 3 into a loading position and positions the substrate 3 at a predetermined position, a component supply device 5, and a base 6 in a horizontal direction. A component transfer device 12 having a mounting head 10 and a mark recognition camera 14 provided on a moving table (Y-direction moving table) 8 supported so as to be movable in a certain X direction and Y direction are fixed to the base 6. The component recognition camera 16 and a control device 18 for controlling the mounting by the component transfer device 12 are provided.

  The substrate transfer device 4 is a so-called double conveyor type, and each conveyor is provided in parallel along a guide rail 20 extending in the X direction and is provided in parallel with a conveyor belt (in parallel) for carrying the substrate 3 to a positioned position. (Not shown), a support frame (not shown) for supporting each of the loaded substrates 3, and a lifting device (not shown) for raising the supported substrates 3 to a mounting position (predetermined position). And a clamping device (not shown) for clamping the substrate 3 at each position (predetermined position).

  The component supply device 5 is configured by arranging a plurality of cassette-type feeders 21 in parallel on the side portion (front side in FIG. 1) of the substrate transfer device 4. Each of the cassette type feeders 21 includes a case part detachably attached to the slot (not shown), a supply reel provided at the rear part of the case part, and a component take-out part provided at the tip of the case part. An elongated tape (not shown) in which electronic parts (for example, electronic parts, shield parts, etc.) are enclosed at a predetermined pitch is wound and held on the supply reel, and this tape is pulled out at a predetermined pitch by a sprocket (not shown). The parts are released from the encapsulated state and are sequentially fed into the part take-out section. A code (identification code) is affixed to the cassette-type feeder 21, and data corresponding to this code and the ID, part number, number of enclosures, part weight, etc. of the electronic parts is managed by the control device 18 to the host computer It is recorded in advance in the mounting program data transmitted from (not shown).

  An X-direction moving beam 22 is provided above the substrate transport device 4, and the X-direction moving beam 22 extends in the Y direction and extends in the X direction along the substrate transport device 4 ( It is provided so as to be movable along (not shown). As shown in FIG. 2, the X-direction moving beam 22 can move the Y-direction moving table 8 to a Y-direction rail (not shown) provided on the side surface of the X-direction moving beam 22 via a slider (not shown). Is provided. A component transfer device 12 having a mounting head 10 and a mark recognition camera (mark camera) 14 are movably held together with the Y direction moving table 8 on the Y direction moving table 8. The X-direction moving beam 22 is driven by a servo motor via a ball screw mechanism (not shown), and the Y-direction moving table 8 is driven by a servo motor (not shown) via a Y-direction moving ball screw mechanism. Is done. The drive of these servo motors is controlled by the control device 18. These X-direction moving beam 22, Y-direction moving table 8, servo motor and the like constitute a camera moving means, and the controller 18 for controlling the servo motor and the like constitutes a camera movement control means.

  The optical axis of the mark recognition camera 14 is parallel to the Z direction perpendicular to the X direction and the Y direction. As shown in FIG. 2, the mark recognition camera 14 has a rectangular field of view SA. In the field of view SA, an allowable area KA in which the image accuracy of the camera is allowed to read information from a mark or the like is set. Is done. A central portion CP is set at the center of the allowable area KA. The permissible area KA is not limited to a region smaller than the visual field SA, and may be the camera visual field area SA itself. In the allowable area KA, X-direction edges 32a and 32b and Y-direction edges 34a and 34b are set and stored in the storage device (ROM) 24 of the control device 18. The timing for imaging the mark of the mark recognition camera 14 is controlled by the control device 18, and the control device 18 constitutes a camera imaging control means.

  A captured image captured by the mark recognition camera 14 is input to an image recognition device 25 including an A / D converter (not shown). The image recognition device 25 takes in an image of the allowable area KA set in the storage device 24 and reads information from the mark m. Then, the position deviation of the mark m is calculated by the calculation device 26 provided in the control device 18. When the mark recognition camera 14 is moved by the camera movement control means, the position shift is corrected and moved.

  The component transfer device 12 includes the Y-direction moving table 8, a mounting head lifting / lowering device (not shown) supported by the Y-direction moving table 8 so as to be movable up and down in the X direction and the Z direction perpendicular to the Y direction. And a mounting head 10 supported by the head lifting device. The mounting head 10 is provided so as to be rotatable about a central axis with respect to the mounting head lifting device, and is lifted and lowered by the mounting head lifting device by a servo motor (not shown). A suction nozzle (not shown) is attached to the tip of the mounting head 10, and an electronic component is sucked and held by supplying negative pressure to the tip of the suction nozzle from a negative pressure supply pump (not shown).

  A component recognition camera 16 is provided between the substrate transport device 4 and the component supply device 5, and the electronic component sucked by the suction nozzle is imaged by the component recognition camera 16, so that a substrate to be produced is produced. It is determined whether the electronic component is of a type suitable for the type, whether the suction state is good, and whether there is a defective portion of the component itself.

  The electronic component mounting apparatus 2 is provided with an input device 38 such as a keyboard for inputting board data, component data, and the like. The input device 38 is provided with a display device 40. The screen of the display device 40 can display board data, component data, calculation data, an image captured by the mark recognition camera 14, and the like.

  A procedure for reading a mark applied to a substrate using the electronic component mounting apparatus configured as described above will be described below with reference to FIG.

  The allowable area KA of the field of view SA in the mark recognition camera 14 is set in advance according to the type of mark to be imaged and stored in the storage device 24 (allowable area storing step).

  In this embodiment, the marks m1, m2, m3, m4, and m5 to be imaged are all marks that require low positional accuracy. The mark recognition camera 14 stands by at the lower right corner (for example, the origin P0) of the substrate 3 as an initial position.

  The control device 18 as the arithmetic device 26 first calculates the position of the mark m1 to be imaged. The X-direction end edges 42a and 42b and the Y-direction end edges 44a and 44b of the mark m1 are far from the mark recognition camera 14 based on the position coordinates and dimensions of the mark m1 stored in the storage device 24 of the control device 18 in advance. Are calculated for the X direction edge 42a and the Y direction edge 44a, and for the straight lines Lx1 and Y direction orthogonal to the X direction including the coordinate position obtained by adding the expected position errors Δx1 and Δy1 in the X direction and Y direction. An orthogonal straight line Ly1 is calculated (far edge calculation step).

  Next, the control device 18 moves the mark recognition camera to the mark m1. At this time, the X-direction end edge 32a and the Y-direction end edge 34a closer to the mark m1 among the X-direction end edges 32a and 32b and the Y-direction end edges 34a and 34b of the allowable area KA are respectively straight lines Lx1 and Ly1. Positioning so as to match (camera moving process). Here, in the previous step, the calculation is performed for the far X direction edge 42a and the Y direction edge 44a, and the straight lines Lx1 and Y orthogonal to the X direction including the coordinate position obtained by adding the predicted position error Δx1 and Δy1. The calculation of the straight line Ly1 orthogonal to the direction, and the movement of the mark recognition camera 14 based on the straight line Ly1 corresponds to “at least beyond the far side” in claim 1.

  In this case, the mark m1 is positioned in the visual field on the outer edge side of the allowable area KA, and the movement distance can be made shorter than in the case where the mark m1 is positioned on the center side of the allowable area KA.

  Next, the control device 18 causes the mark recognition camera 14 to image the mark m1 and reads information from the mark m1. If the mark m1 is, for example, a reference position mark, the position coordinates on the substrate 3 are grasped. When there is a deviation from the position coordinates of the mark m1 stored in advance in the storage device 24 of the control device 18 as the position information of the mark m1, the control device 18 carries the substrate 3 and positions it at a predetermined position. A shift amount due to a substrate positioning error (an error in the X direction, the Y direction, and the rotation direction) that is considered to have occurred at the time is determined.

  Next, the position of the mark m2 to be imaged is calculated. As shown in FIG. 5, the X-direction end edges 46a and 46b and the Y-direction end edges 48a and 48b of the mark m2 from the position coordinates and dimensions of the mark m2 stored in advance in the storage device 24 of the control device 18 A straight line orthogonal to the X direction including the coordinate position obtained by calculating the X direction end edge 46b and the Y direction end edge 48a far from the mark recognition camera 14 and further adding the expected position error Δx2 and Δy2 in the X direction Y direction. A straight line Ly2 orthogonal to Lx2 and the Y direction is calculated. The predicted position error Δx2 and Δy2 in this case may be caused by, for example, expansion / contraction due to a temperature difference of the substrate 3. Since the positional deviation due to the substrate positioning error is corrected by the position data of the mark m1, the predicted position errors Δx2 and Δy2 can be set to values smaller than the predicted position errors Δx1 and Δy1. Note that the position of the mark m1 in FIG. 5 is the position after the positional deviation due to the substrate positioning error is corrected.

Next, the control device 18 moves the mark recognition camera 14 to the mark m2. At this time, the X-direction end edge 32b and the Y-direction end edge 34a closer to the mark m2 among the X-direction end edges 32a and 32b and the Y-direction end edges 34a and 34b of the allowable area KA are respectively straight lines Lx2 and Ly2. Position to match.
The control device 18 causes the mark recognition camera 14 to capture an image of the mark m2 and reads information from the mark m2.

  Next, similarly, as shown in FIG. 6, the X direction edge 32a on the side close to the mark m3 of the allowable area KA to the straight line Lx3 and the straight line Ly3 obtained based on the mark m3 to be imaged next, and The mark recognition camera 14 is moved so as to match the Y direction edge 34a, and the information from the mark m3 is read.

  Next, as shown in FIG. 7, the X-direction edge 32b and the Y-direction edge 34a on the side close to the mark m4 of the allowable area KA on the straight line Lx4 and the straight line Ly4 obtained based on the mark m4 to be imaged. The mark recognition camera 14 is moved so as to match, and the information from the mark m4 is read.

  Next, as shown in FIG. 8, the X-direction edge 32b and the Y-direction edge 34b on the side close to the mark m5 of the allowable area KA are added to the straight line Lx5 and the straight line Ly5 obtained based on the mark m5 to be imaged. The mark recognition camera 14 is moved so as to match, and the information from the mark m4 is read.

  In this manner, the long moving distance can be shortened as a whole by repeatedly moving the shortest distance in order to read the mark information. For example, if the movement can be shortened by 2 mm, the movement distance can be shortened by 4 m in a module substrate having about 2000 marks.

  According to the mark m imaging procedure using the electronic component mounting apparatus 2 configured as described above, for example, referring to FIG. 4, the imaging target to be imaged next with respect to the current camera position P0 of the mark recognition camera 14. Of the X-direction end edges 42a and 42b and the Y-direction end edges 44a and 44b at the peripheral edge of the mark m1, the X-direction end edge 42a and the Y-direction end edge 44a farther from the current camera position P0 are set to the predicted position error Δx1, By calculating including Δy1, the shortest distance including the error from the current camera position P0 to the imaging target mark m1 is obtained. The X-direction end edge 42a and the Y-direction end edge 44a on the far side are used as the camera among the X-direction end edges 32a and 32b and the Y-direction end edges 34a and 34b of the allowable area KA with respect to the imaging target mark m1. The mark recognition camera so that the X-direction end edge 32a and the Y-direction end edge 34a on the side close to the imaging target mark m1 at the position P0 exceed the expected position errors Δx1 and Δy1 on the far side with respect to the current camera position P0. By moving 14, the imaging target mark m 1 can be moved by the shortest distance including an error so that it falls within the allowable area KA. In this way, by moving the mark recognition camera 14 between the imaging target marks m by the shortest distance, the movement time can be shortened and the tact time can be shortened.

  In the present embodiment, the predicted position errors Δx1 and Δy1 are added to the positions of the X-direction edge 32a and the Y-direction edge 34a farther from the camera position before the imaging target mark m1 is moved, and the mark recognition camera 14 However, the present invention is not limited to this. For example, the permissible area KA of the field of view of the mark recognition camera 14 is set to be narrower than the expected position error Δx1 and Δy1, and the permissible area (not shown) set narrowly is set. The mark recognition camera 14 is configured so that the X-direction edge and the Y-direction edge (not shown) on the side close to the mark m1 coincide with the far-side X-direction edge 42a and the Y-direction edge 44a of the imaging target mark m1. May be moved.

Next, a second embodiment of an electronic component mounting apparatus that implements the electronic component mounting method according to the present invention will be described below with reference to the flowchart of FIG.
In the second embodiment, there are a plurality of types of marks to be imaged, and a mark having a high required positional accuracy and a mark having a low required positional accuracy are mixedly applied to the substrate 53. As marks with low position accuracy, as shown in FIG. 10, for example, reference position marks (main marks) SPm1, SPm2, ID mark IDm1 and skip marks SKm1, SKm2, SKm3 are given. For example, position marks (local marks) Pm1 and Pm2 are given. In addition, since the structure of the electronic component mounting apparatus 2 used for 2nd Embodiment is the same as that of 1st Embodiment, description is abbreviate | omitted.

  As shown in FIG. 10, the mark recognition camera 14 is positioned at the origin P <b> 0 of the lower left corner of the substrate 53. First, the control device 18 determines whether or not there is a reference position mark (step 1 “hereinafter abbreviated as S1”). This corresponds to the substrate type produced from the production plan, and is determined from data stored in the storage device 24 of the control device 18 in advance.

  When it is determined that there is a reference position mark, the control device 18 as an arithmetic unit first extracts a reference position mark (main mark) SPm1 to be imaged (S2), and the reference position mark to be imaged. The position of SPm1 is calculated at the shortest position (S3). Since this series of operations is the same as that in the first embodiment and will be described in a simplified manner, first, the X direction edge of the reference position mark SPm1 is determined from the position coordinates and dimensions of the reference position mark SPm1 stored in the storage device 24. Of the 52a, 52b and Y-direction edge 54a, 54b, calculation is performed for the X-direction edge 52b and Y-direction edge 54a far from the mark recognition camera 14, and further, an estimated position error in the X-direction and Y-direction (illustrated) A straight line LX1 and a straight line LY1 including the coordinate position to which (omitted) is added are calculated.

Next, the control device 18 moves the mark recognition camera 14 to the reference position mark SPm1. At this time, the X direction edge 32b and the Y direction edge 34a closer to the reference position mark SPm1 among the X direction both edges 32a and 32b and the Y direction both edges 34a and 34b of the allowable area KA shown in FIG. Are positioned so as to coincide with the straight lines LX1 and LY1, respectively. In this case, the reference position mark SPm1 is positioned in the visual field on the outer edge side of the allowable area KA, and the movement distance can be shortened compared to the case where the reference position mark SPm1 is positioned on the center side of the allowable area KA.
The control device 18 causes the mark recognition camera 14 to image the reference position mark SPm1, and reads position information from the reference position mark SPm1.

  Next, the control device 18 determines whether there is another reference position mark (S4). This corresponds to the type of substrate to be produced, and is determined from data stored in the storage device 24 of the control device 18 in advance. In the present embodiment, since the reference position mark SPm2 exists, the process returns to step 2 to extract the reference position mark SPm2 (S2). Then, as shown in FIG. 11, as in the case of the reference position mark SPm1, the shortest position necessary for the mark recognition camera 14 to move is determined (S3), and the mark recognition camera 14 is set to the reference position mark SPm2. Move. Therefore, for the reference position mark SPm2, the X direction end edge 32b and the Y direction end edge 34a closer to the reference position mark SPm2 in the allowable area KA are obtained in the same manner as described above for the reference position mark SPm2. Positioning so as to coincide with the straight line LX2 and the straight line LY2.

  The control device 18 causes the mark recognition camera 14 to image the reference position mark SPm2, and reads position information from the reference position mark SPm2. The control device 18 grasps the amount of deviation due to positioning errors (errors in the X direction, Y direction, and rotation direction) in the carry-in positioning of the substrate 53 based on the position information of the reference position mark SPm1 and the reference position mark SPm2.

  Next, the control device 18 determines whether there is a remaining reference position mark to be imaged (S4). In the present embodiment, since there is no reference position mark to be imaged, the process proceeds to step 5.

  The control device 18 determines whether there is an ID mark (S5). In the present embodiment, one ID mark IDm1 is given to the substrate 53. The control device 18 extracts the ID mark IDm1 (S6).

  Next, as shown in FIG. 12, similarly to the reference position mark, straight line LX3 and straight line LY3 obtained in the same manner from the far end in the X direction and Y direction of ID mark IDm1 including the expected position error. Then, the position that minimizes the moving distance is determined by matching the X direction end edge 32a and the Y direction end edge 34b on the side close to the mark in the permissible area KA (S7). Move. The control device 18 causes the mark recognition camera 14 to capture an image of the ID mark IDm1, and reads information from the ID mark IDm1, for example, the type of component to be mounted, the number of components, mounting coordinates, and the like.

  Next, the control device 18 determines whether there is another ID mark (S8). Since there is no other ID mark in this embodiment, the process proceeds to step 9.

  The control device 18 determines whether there is a SKIP mark (S9). There are three SKIP marks on the substrate 53 in the present embodiment, and the control device 18 extracts the SKIP mark SKm1 which is one of them (S10). Also in this case, as shown in FIG. 13, the X direction edge 32a and the Y direction edge 34b on the side near the SKIP mark SKm1 of the allowable area KA of the mark recognition camera 14 from the position of the ID mark IDM1 are expected. The mark recognition camera 14 is moved so as to coincide with the straight line LX4 and the straight line LY4 obtained in the same manner from the far edge of the SKIP mark SKm1 including the position error (S11). Thus, the mark recognition camera 14 is moved so as to have the shortest movement distance.

  The control device 18 causes the mark recognition camera 14 to capture an image of the SKIP mark SKm1 and reads information on the SKIP mark SKm1. For example, information on some electronic components that are not mounted is read and stored in the storage device 24.

  Next, the control device 18 determines whether or not there is another SKIP mark (S12). In addition, since the SKIP mark is given to the substrate 53, the process returns to step 10 to extract one SKIP mark SKm2 (S10). As shown in FIG. 14, the mark recognition camera 14 is moved so that the end portions 32a and 34b of the allowable area KA of the mark recognition camera 14 coincide with the straight line LX5 and the straight line LY5 in the same manner as described above (S11).

  Then, the control device 18 causes the mark recognition camera 14 to capture an image of the SKIP mark SKm2, and reads information on the SKIP mark SKm2.

  Next, the control device 18 determines whether or not there is another SKIP mark (S12). In the present embodiment, since there is a SKIP mark SKm3, as shown in FIG. 15, the process returns to step 10 to extract one SKIP mark SKm3 (S10). Similarly to the above, the mark recognition camera 14 is moved so that the ends 32a and 34b of the permissible area KA of the mark recognition camera 14 coincide with the straight line LX6 and the straight line LY6 (S11). The control device 18 causes the mark recognition camera 14 to image the SKIP mark SKm3 in the same manner as described above.

  Next, the control device 18 determines whether or not there is another SKIP mark (S12). Since there is no other SKIP mark, the process proceeds to step 13.

  The control device 18 determines whether or not there is a position mark (local mark) (S13). In the present embodiment, two position marks are provided on the substrate 53. The position marks are stored in the storage device 24 with their number, coordinate position, etc. set based on the substrate type information based on the production plan.

The control device 18 extracts one of the position marks Pm1 (S14).
As for the coordinate position of the position mark Pm1, corrected position coordinates are calculated from the position information of the reference position mark SPm1 and the reference position mark SPm2. Since the position mark Pm1 serves as a reference for the mounting position of the electronic component to be mounted, high position accuracy is required. Therefore, as shown in FIG. 16, the center coordinates of the position mark Pm1 are calculated, and the mark recognition camera 14 is moved so that the center of the position mark Pm1 is positioned at the center of the allowable area KA (S15). As described above, by capturing an image on the center side of the allowable area KA of the mark recognition camera 14 (center side of the camera field of view), the influence of the distortion of the camera lens is eliminated and accurate position information is obtained. be able to.

  Next, the control device 18 determines whether there is another position mark (S16). Since there are other position marks, the process returns to step 14 and the control device 18 extracts the position mark Pm2 (S14).

  Next, for the coordinate position of the position mark Pm2, corrected position coordinates are calculated from the position information of the reference position marks SPm1, SPm2 and the position mark Pm1. Then, as shown in FIG. 17, the mark recognition camera 14 is moved so that the center of the position mark Pm1 is positioned at the center of the allowable area KA (S15). Position information is acquired from the position mark Pm2, and an accurate mounting position of the mounted electronic component is specified.

  Next, the control device 18 determines whether there is another position mark (S16). Since there is no other position mark, the control for reading information from the mark given to the substrate 53 is terminated.

  According to the procedure for reading the mark provided on the substrate 53 using the electronic component mounting apparatus 2 configured as described above, there are a plurality of types of imaging target marks, and for example, low positional accuracy such as the ID mark IDm1. If it is acceptable, the positioning is performed so that the mark is included in the field of view on the outer edge side of the permissible area KA, so that the moving time between the consecutively picked-up marks m is set as the shortest distance to shorten the moving time. be able to. If a high position accuracy is required like the position mark Pm1, the lens for recognizing the mark Pm1 is positioned so that the mark Pm1 is included in the visual field on the center side in the permissible area KA. High positional accuracy can be satisfied by eliminating the influence of distortion and the like.

  In the present embodiment, the mark recognition camera 14 is moved and imaged for each type of mark. However, the present invention is not limited to this. For example, the mark recognition camera 14 moves in the order of the mark located near the origin P0. In other words, the mark recognition camera may be divided into a mark that requires high position accuracy and a mark that does not require high position accuracy, and the mark recognition camera may be moved in order from the nearest.

  Further, as in the present embodiment, the coordinate position of the position mark is corrected based on the position information of the reference position mark, and the position mark is imaged on the center side of the allowable area KA. In the case where the mark recognition camera 14 is not attached to the mark 3, as shown in FIG. 18, the mark recognition camera 14 may be positioned in a state where the position mark Pm is in an area with low accuracy. In such a case, the position mark Pm is once imaged at a position outside the allowable area KA, and the mark recognition camera is moved again as shown in FIG. 19 based on the position of the position mark Pm in the field of view. The image may be picked up again by repositioning so that the position mark Pm is in the center of the area KA. As a result, the position of the position mark can be accurately recognized without the reference position mark.

  Further, as shown in FIGS. 20 and 21, the allowable area KA is narrowed as the required positional accuracy of the mark to be imaged is higher (allowable area KAS), and is wider as the required positional accuracy is lower ( (Allowable area KAL) can be set and stored in the storage device 24 of the control device 18.

  As described above, in a plurality of types of imaging target marks, if the mark SKm has a low position accuracy of the type of the image to be captured, the allowable area is set to a wide area KAL, and the position accuracy of the type of the image to be captured is high. If it is Pm, the allowable area is set and stored in the narrow area KAS. Then, by changing the area of the allowable area KA in accordance with the required position accuracy, it is possible to set the best state that satisfies both the shortening of the movement time of the mark recognition camera 14 and the required position accuracy. it can.

  In the above embodiment, one mark recognizing camera is moved by one camera moving unit. However, the present invention is not limited to this. For example, two mark recognizing cameras move two cameras each. It may be used simultaneously for one substrate by means. Even in this case, by positioning the mark on the outer edge of the field of view of each mark recognition camera and moving the shortest distance, the movement range of each mark recognition camera becomes narrow, so that the operations interfere with each other. Can be prevented.

  Thus, the specific configuration described in the above-described embodiment is merely an example of the present invention, and the present invention is not limited to such a specific configuration. Various embodiments can be adopted without departing from the scope.

2 ... Electronic component mounting device, 3 ... Board, 14 ... Camera for mark recognition, 18 ... Control device, 32a, 32b ... X direction edge, 34a, 34b ... Y direction edge, 42a, 42b ... X of imaging target mark Both ends in the direction, 44a, 44b ... Y direction both ends of the imaging target mark, IDm ... ID mark, KA ... Allowable area, m ... Mark, SA ... Field of view, Pm ... Position mark, SKm ... SKIP mark, SPm ... Reference position mark , Δx1 ... expected position error, Δy1 ... expected position error.

Claims (3)

A substrate transfer device that carries in and positions a substrate on which electronic components are mounted by a component transfer device;
A mark recognition camera that is provided above the positioned substrate and individually recognizes a plurality of marks attached to the substrate;
Camera moving means for moving the mark recognition camera in the X direction and Y direction above the substrate;
Camera movement control means for positioning the mark recognition camera at any of the plurality of marks by controlling the camera movement means;
Camera imaging control means for imaging the mark by a mark recognition camera positioned on any of the plurality of marks;
In an electronic component mounting apparatus comprising:
An allowable area storage step of storing an allowable area within the camera field of view in which reading of information from the mark by imaging of the mark is allowed;
For the current camera position, the X direction edge and the Y direction edge on the side farther from the current camera position among the X direction both ends and the Y direction both ends of the periphery of the imaging target mark to be imaged next are calculated. A far edge calculation step;
The X-direction end edge and the Y-direction end edge on the far side are the X-direction end on the side close to the imaging target mark at the camera position among the X-direction both end edges and the Y-direction both end edges of the allowable area for the imaging target mark. A camera moving step of moving the mark recognition camera so that an edge and an edge in the Y direction cross at least a far side with respect to the current camera position;
An electronic component mounting method comprising the steps of: In Claim 1, the imaging target mark is a plurality of types,
In the camera moving step, if the type of the imaging target mark has a low position accuracy, positioning is performed so that the mark is included in the visual field on the outer edge side of the allowable area,
If the type of the imaging object mark has high positional accuracy, the mark recognition camera is positioned so that the mark is included in the visual field on the center side in the permissible area. Method.   3. The allowable area storing step according to claim 1, wherein, in the plurality of types of the imaging target marks, if the positional accuracy of the type of mark to be captured is low, the allowable area is imaged in a wide area. An electronic component mounting method comprising: setting and storing the permissible area in a narrow area if the position accuracy of the mark type is high.

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