JP2012191054A - Multiple wiring board and wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multiple wiring board that allows such division of a motherboard as reduces burrs of each wiring board region, and a wiring board with suppressed burrs and others.SOLUTION: In a multiple wiring board 10, a motherboard 1 comprising a flat lower motherboard on which a plurality of square wiring board regions 2 are arrayed in a matrix and an upper motherboard laminated on an upper surface of the lower motherboard to form wall portions 5 about mount portions in the wiring board regions 2 has dummy regions 4 arranged between adjacent wiring board regions 2 on one side of the wiring board regions 2, has the upper motherboard absent on the one side of the wiring board regions 2 to expose the upper surface of the lower motherboard from the wiring board regions 2 to the dummy regions 4, and has division grooves formed along boundaries of the wiring board regions 2 on an upper surface of the motherboard 1. The division grooves have a sufficient depth in the portions where the upper motherboard forming the wall portions 5 are absent to suppress burrs and cracks, so that the multiple wiring board 10 can be easily divided into wiring boards.

Description

  The present invention includes a wiring board having a mounting portion for mounting an electronic component such as a semiconductor element or an image sensor, and a wall portion formed in a U-shape in a plan view around the mounting portion, and the wiring board Relates to a multi-piece wiring board arranged vertically and horizontally.

  Conventionally, wiring boards used for mounting electronic components such as semiconductor elements and imaging elements are made of ceramic sintered bodies such as aluminum oxide sintered bodies and glass ceramic sintered bodies, and electronic components are mounted on the upper surface. A rectangular flat plate-like substrate portion having a mounting portion for forming a frame, and a frame-like wall portion made of a ceramic sintered body and laminated on the upper surface of the substrate portion so as to surround the mounting portion.

  Such a wiring board is generally manufactured in the form of a so-called multi-cavity wiring board in which a plurality of wiring boards are obtained simultaneously from a single large-area mother board. In the multi-cavity wiring board, the wiring board regions to be the wiring boards as described above are arranged vertically and horizontally on the mother board, and the board portions and the wall portions of the adjacent wiring board regions are connected to each other.

  In the conventional wiring board and the multi-cavity wiring board, a recess (so-called cavity) for hermetically sealing electronic components is formed by the mounting portion and the wall portion. For example, a lid is bonded to the upper surface of the wall portion. By closing the recess, the electronic component mounted on the mounting portion is hermetically sealed.

  In the multi-piece wiring board, the dividing groove is formed along the boundary of the wiring board region, and the mother board is broken by applying a bending stress to the mother board across the dividing groove. Is divided into wiring boards. The dividing groove is formed by cutting a predetermined depth on the upper surface of the unfired mother board using a cutter blade or the like at the boundary between the walls of adjacent wiring board regions.

JP 2009-283645 A

  In recent years, in order to open the mounting portion to the outside, a wiring board in which the mounting portion is opened while the wall portion stacked on the substrate portion is partially not formed has been used. Such a wiring board is manufactured in the form of a multi-cavity wiring board as shown in FIG. When manufacturing a wiring board from a multi-piece wiring board in this way, if it is attempted to form a dividing groove using a cutter blade along the side where the mounting portion is open to the outside, the cutter blade enters the wall portion deeply into the wall. Since the portion is deformed, it is difficult to insert the cutter blade to a sufficient depth along the side where the mounting portion is open to the outside. Therefore, the dividing groove is not formed at a sufficient depth in the portion where the wall portion is not formed, and burrs, cracks, and the like are likely to occur in the wiring board region when dividing. Further, there is a possibility that the end portion of the wall portion may be mechanically broken, or that the end portion may interfere with handling such as transportation of individual wiring boards or mounting of electronic components.

The present invention has been completed in view of such a conventional problem, and an object of the present invention is to provide a non-formed portion on the wall portion so as to open the mounting portion to the outside on one side of the wiring board region. A multi-piece wiring board provided, which can be easily divided into pieces without generating burrs, cracks, etc., and the multi-piece wiring board is divided into pieces. An object of the present invention is to provide a wiring board in which burrs and cracks are suppressed.

  The multi-cavity wiring board of the present invention is made of a ceramic sintered body, and is a flat lower mother board in which a plurality of rectangular wiring board regions having an electronic component mounting portion at the center of the upper surface are arranged vertically and horizontally. And a mother substrate made of a ceramic sintered body and laminated on the upper surface of the lower mother substrate, and an upper mother substrate for forming a wall portion around the mounting portion in each wiring substrate region And a dummy area is disposed between the wiring board areas arranged adjacent to each other on one side of the wiring board area, and the wiring board area includes the dummy area. In one side, the upper mother board is not formed, and the upper surface of the lower mother board is exposed from the wiring board region to the dummy region, and is located at the boundary of the wiring board region on the upper surface of the mother board. Along the minute It is characterized in that the groove is formed.

  The wiring board of the present invention is made of a ceramic sintered body, and is formed of a rectangular flat plate-like lower substrate having an electronic component mounting portion at the center of the upper surface, and a ceramic sintered body, and is laminated on the upper surface of the lower substrate. And a U-shaped upper substrate in plan view for forming a wall portion around the mounting portion on three sides of the lower substrate, and the lower portion on the other side where the wall portion is not formed. The substrate has a portion protruding outward from a line connecting both ends of the upper substrate, and an external terminal is disposed on an upper surface of the protruding portion.

  According to the multi-cavity wiring board of the present invention, each of the wiring board areas is formed by laminating a plurality of rectangular wiring board areas in the form of a flat bottom mother board arranged vertically and horizontally and the upper surface of the lower mother board. A dummy region is disposed between adjacent wiring substrate regions on one side of the wiring substrate region of the mother substrate formed of an upper mother substrate for forming a wall portion around the mounting portion in FIG. The upper mother board is not formed on one side of the wiring board area, and the upper surface of the lower mother board is exposed from the wiring board area to the dummy area. Since the dividing groove is formed along the boundary, the dividing groove can be formed at a sufficient depth even in a portion where the upper mother substrate which is the wall portion is not formed, and burrs, cracks, etc. are generated. It can be divided into individual wiring boards without Can be to an easy multiple patterning wiring board be.

  According to the wiring board of the present invention, the upper board is not formed, and the upper surface of the protruding part of the wiring board and the external circuit board are joined and electrically connected, so that the element is mounted on the wiring board. The height of the electronic component module bonded to the external circuit board can be reduced.

It is a top view which shows an example of embodiment of the multi-piece wiring board of this invention. It is a perspective view which expands and shows the A section of the multi-piece wiring board shown in FIG. It is a top view which shows the other example of embodiment of the multi-piece wiring board of this invention. (A) And (b) is the top view and perspective view which respectively show an example of embodiment of the wiring board of this invention. (A) And (b) is the top view and perspective view which show the other example of embodiment of the wiring board of this invention, respectively. (A) And (b) is the top view and perspective view which show the other example of embodiment of the wiring board of this invention, respectively. (A) is sectional drawing which shows an example of embodiment of the imaging module which mounted the electronic component on the wiring board shown in FIG. 5, (b) is embodiment of the imaging module which mounted the electronic component on the wiring board. Another example. (A) is a top view which shows the other example which mounted the electronic component on the wiring board shown in FIG. 4, (b) is sectional drawing in the AA of (a).

  A multi-piece wiring board and a wiring board according to the present invention will be described with reference to the accompanying drawings. 1 to 8, 1 is a mother board, 1a is an upper mother board, 1b is a lower mother board, 2 is a wiring board area, 3 is a mounting part, 3b is a mounting part on the lower surface, 4 is a dummy area, 4b is a first board 2 is a dummy area, 5 is a wall, 6a is a dividing groove of the upper mother board 1a, 6b is a dividing groove of the lower mother board 1b, 7 is a wiring conductor, 8 is an external terminal, 9 is a through hole, and 10 is a large number. Wiring board, 11 is an insulating board, 11a is an upper board, 11b is a lower board, 12 is an image sensor, 12a is a light receiving portion, 13 is a transparent plate, 14 is a lens, 15 is a lens fixing member, 16 is an external circuit board, 17 Is an underfill material, 18a is a tuner IC, and 18b is an OFDM chip. In FIG. 2, the individual wiring conductors 7, the external terminals 8, and the through holes 9 are not shown.

  In the multi-piece wiring board 10 of the present invention, an upper mother board 1a is laminated on a lower mother board 1b in which a plurality of wiring board regions 2 having mounting portions 3 are arranged vertically and horizontally. Divided grooves 6 a and 6 b are formed in the substrate 1 along the boundary of the wiring substrate region 2.

  Such a mother substrate 1 is made of a ceramic sintered body, and a wiring substrate region 2 is formed in a square shape. Further, the upper mother board 1 a is formed in a frame shape for forming the wall part 5 around the mounting part 3. Further, a dummy region 4 is disposed between at least one of the vertical and horizontal lines and the wiring substrate region 2 arranged adjacent to each other.

  That is, the upper mother board 1a is U-shaped with respect to one wiring board area 2 and is not a frame shape surrounding the periphery of the mounting portion 3, but one side of the wiring board area 2 and the wiring board area 2 The dummy regions 4 on the side are collectively enclosed in a frame shape, and the whole is a frame shape.

  Note that, in one side of the wiring board region 2, a portion where the upper mother board 1 a is not formed is one side of the wiring board region 2 and this one, as in the example shown in FIGS. 1 to 3. This is a part of the dummy region 4 on the side. That is, the upper mother board 1a is not formed from the wiring board area 2 to the middle of the dummy area 4 in the direction of the side where the upper mother board 1a is not formed. For example, in the example shown in FIGS. 1 and 3, the upper mother board 1a is not formed from the wiring board area 2 to the middle of the dummy area 4 adjacent to one side of the wiring board area 2 in the horizontal direction. Has been.

  As described above, the frame-shaped upper mother board 1a is not formed on one side of the wiring board area 2, and the upper surface of the lower mother board 1b is exposed from the wiring board area 2 to the dummy area 4 on this one side. Thus, a plurality of wiring board regions 2 are arranged. That is, the end portion of the wall portion 5 is cut away from the boundary of the wiring substrate region 2 and the wall portion 5 is not formed as compared with the multi-cavity wiring substrate of the prior art. The portion continues to reach the dummy region 4 along the boundary of the wiring board region 2.

  The mother substrate 1 is a ceramic sintered body such as a glass ceramic sintered body, an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, and a mullite sintered body. It is formed by. In the example of this embodiment, a second dummy area 4 b is provided on the outer periphery of the mother board 1 of the multi-piece wiring board 10 so as to surround the plurality of wiring board areas 2 arranged.

The mother board 1 is produced by, for example, integrally firing a lower mother board 1b and an upper mother board 1a. That is, by adding an appropriate organic solvent and binder to raw powders such as borosilicate glass, silicon oxide, and aluminum oxide, a plurality of ceramic green sheets are formed by molding into a sheet shape, and a part of this is punched After forming into a frame shape by laminating a frame-shaped ceramic green sheet on a flat ceramic green sheet that has not been punched, and baking this laminate integrally, borosilicate glass-aluminum oxide A mother substrate 1 made of a sintered glass ceramic material can be produced. In this case, the flat ceramic green sheet becomes the lower mother board 1b, and the frame-shaped ceramic green sheet becomes the upper mother board 1a.

  The plurality of wiring board regions 2 arranged on the lower mother board 1b have electronic component mounting parts 3 in the central part or the like, and each is an area that becomes the lower board 11b of the individual wiring board. A mother board 1 is formed by laminating a frame-shaped upper mother board 1a on the lower mother board 1b. The upper mother board 1a is for forming the wall part 5 around the mounting part 3, and serves as the upper board 11a of the individual wiring board. The wall portion 5 is for protecting electronic components mounted on the mounting portion 3.

  In the portion where the upper mother board 1a is not formed, a dividing groove 6b is formed at the boundary of the wiring board area 2 on the upper surface of the lower mother board 1b where the wiring board area 2 to the dummy area 4 are exposed. Yes. Further, in the portion where the upper mother board 1 a is formed, the dividing grooves 6 a are formed on the upper surface of the upper mother board 1 a along the boundary of the wiring board region 2. These dividing grooves 6a and 6b are formed on the upper surface of the ceramic green sheet serving as the lower mother board 1b and the upper surface of the ceramic green sheet serving as the upper mother board 1a in the ceramic green sheet stack as the mother board 1. It is formed by cutting with a cutter blade or the like along the boundary of the wiring board region 2.

  The division grooves 6a and 6b are for breaking the mother board 1 along the division grooves 6a and 6b and dividing the mother board 1 into individual wiring boards. As described above, the divided grooves 6a and 6b include the divided grooves 6a formed on the upper surface of the upper mother substrate 1a and the divided grooves 6b formed on the upper surface of the lower mother substrate 1b. It is preferable that those divided grooves 6a and 6b on the same continuous boundary of the wiring board region 2 continue on a straight line in plan view.

The depths of the dividing grooves 6a and 6b may be set as appropriate according to conditions that affect the fragility such as the material and thickness of the lower mother board 1b and the upper mother board 1a, the size of the wiring board region 2, and the like. For example, when the wiring board region 2 has a side length of about 2.5 to 10 mm, the upper mother board 1a and the lower mother board 1b constituting the mother board 1 are both made of borosilicate glass and aluminum oxide If the thickness of the mother substrate 1 is about 0.3 to 1.5 mm, the depth of the dividing groove 6a of the upper mother substrate 1a is about 0.25 to 0.3. The depth of the dividing groove 6b of the lower mother substrate 1b may be about 0.1 to 0.2 mm.

  Also, a lower surface side division groove (not shown) may be formed along the boundary of the wiring board region 2 on the lower surface of the mother substrate 1, that is, the lower surface of the lower mother substrate 1b. This lower surface side dividing groove is formed at a position overlapping with the dividing grooves 6a and 6b in a plan view, but the depth of what is formed at a position overlapping with the dividing groove 6a of the upper mother substrate 1a in a plan view is You may make deeper than the depth of what was formed in the position which overlaps with the lower mother board | substrate 1b by planar view. If the depth of the lower surface side dividing groove is set in this way, the mechanical strength of the mother substrate 1 at the portion where the dividing groove 6a is formed on the upper surface of the upper mother substrate 1a is lowered, and the mother substrate 1 Can be more easily divided.

  As described above, since the upper surface of the lower mother substrate 1b is exposed from the wiring substrate region 2 to the dummy region 4, the dividing groove 6b can be formed to a sufficient depth on the exposed upper surface of the lower mother substrate 1b. . Therefore, it can be divided into wiring boards without generating burrs or cracks.

In the example shown in FIGS. 1 and 3, the end portion of the wall portion 5 has a shape that is cut away from the boundary between the wiring board region 2 and the dummy region 4, and the wall portion 5 is not formed. Since the portion continues so as to reach from the wiring board region 2 to the dummy region 4, it is possible to reduce damage to the end portion of the wall portion 5 when dividing along the boundary between the dummy region 4 and the wiring board region 2. You can also.

  In the example shown in FIG. 1, a dummy region 4 is arranged on one side of the wiring substrate region 2 between the wiring substrate regions 2 arranged adjacent to each other, and on two sides adjacent to one side. The wiring substrate regions 2 arranged adjacent to each other are adjacent to each other, the upper mother substrate 1a is not formed on one side of the wiring substrate region 2, and the upper surface of the lower mother substrate 1b is separated from the wiring substrate region 2. The dummy region 4 is exposed and a dividing groove is formed along the boundary of the wiring substrate region 2 on the upper surface of the mother substrate 1. That is, in the example shown in FIG. 1, the portion where the upper mother board 1a is not formed is connected in the vertical direction on the one side (one side in the horizontal direction). With such a configuration, portions of the plurality of wiring board regions 2 where the upper mother board 1a is not formed are connected in either the vertical or horizontal direction (vertical direction in the example shown in FIG. 1). Since the dividing groove is formed in the flush portion, it is effective for accurately forming the dividing groove 6b of the lower mother substrate 1b.

  In the example shown in FIG. 3, the dummy area 4 and the upper mother board 1 a are arranged so as to surround each wiring board area 2, and between the one side where the upper mother board 1 a is not formed ( The upper mother substrate 1a is disposed between the non-formed portions in the vertical direction. With such a configuration, the strength of the multi-piece wiring board 10 can be increased, which is effective in suppressing the division during transportation. This is particularly effective when the multi-piece wiring board 10 is thin.

  Further, if the second dummy region 4b is provided on the outer periphery of the mother substrate 1, it is easy to make a part of the upper mother substrate 1a not formed in the arrangement of the outermost wiring substrate regions 2. For example, as in the example shown in FIG. 1, even if a non-formed portion connected in the vertical direction is provided on the upper mother substrate 1a, the upper mother substrate 1a is connected on the outer periphery by the second dummy region 4b. When the ceramic green sheet to be the upper mother substrate 1a is produced, through holes may be formed in the ceramic green sheet to be the upper mother substrate 1a in the portion to be the mounting portion and the portion to be the non-formed portion. Further, in the example shown in FIG. 3, since the non-formed portion of the upper mother substrate 1a is made smaller, the through hole formed in the ceramic green sheet that becomes the upper mother substrate 1a can be made smaller, Conveyance is facilitated and deformation of the ceramic green sheet can be suppressed.

The width of the portion where the upper mother substrate 1 a is not formed is about the same as the width of the wall portion 5. For example, if the wiring board region 2 is a quadrangular shape having a side length of about 3 to 10 mm in plan view and the area of the mounting portion 3 is about 4 to 80 mm ² , the wall portion 5 is used. Is set to about 0.25 to 0.5 mm. Therefore, the upper mother board 1a may be not formed on one side of the wiring board region 2 with the same width as that of the wall 5 described above.

  Since the upper mother board 1a is not formed and the upper surface of the lower mother board 1b is exposed from the wiring board region 2 to the dummy region 4, the upper surface of the lower mother substrate 1b, that is, the mounting portion 3 on which electronic components are mounted. It is easy to secure a sufficiently large area.

  Since the multi-piece wiring board 10 as described above is not divided into individual pieces, the end portion of the upper mother board 1a is not thin and protrudes outward. There is no hindrance.

In the example of this embodiment, the wiring conductor 7 is connected to the upper surface on the side where the upper mother board 1a is not formed or the lower mother board 1b from the mounting portion 3 in the lower mother board 1b of each wiring board region 2.
And is electrically connected to the external terminal 8.

  In the wiring board, the wiring conductor 7 is formed from the mounting portion 3 to the upper surface on the side where the wall portion 5 of the lower substrate 11b is not formed or the lower surface of the lower substrate 11b, and is electrically connected to the external terminal 8. It is connected to the. The wiring conductor 7 and the external terminal 8 serve as a conductive path for electrically connecting an electronic component mounted on the mounting portion 3 to an external electric circuit.

  The wiring conductor 7 and the external terminal 8 are made of a metal material such as copper, silver, palladium, gold, platinum, tungsten, molybdenum, or manganese. If the wiring conductor 7 and the external terminal 8 are made of, for example, copper, a metal paste (not shown) prepared by adding an organic solvent and a binder to copper powder is applied to the ceramic green sheet serving as the mother substrate 1 in a predetermined manner. It can be formed by applying it to a pattern and baking it simultaneously.

The exposed surfaces of the wiring conductor 7 and the external terminal 8 are coated with a metal plating having excellent corrosion resistance, such as nickel or gold, by an electrolytic plating method or an electroless plating method, and a nickel plating having a thickness of about 1 to 10 μm. The layer and the gold plating layer having a thickness of about 0.1 to 3 μm become a connection electrode or an external terminal electrode. Accordingly, corrosion of the wiring conductor 7 and the external terminal 8 can be effectively suppressed, the bonding between the wiring conductor 7 and the electronic component, the bonding between the wiring conductor 7 and the bonding wire, and the external terminal 8 and the external circuit board. The connection with 16 wires can be strengthened.

  Here, the effect of the multi-piece wiring board 10 of the present invention is that the lower base board 1b made of a borosilicate glass-aluminum oxide glass ceramic sintered body has a thickness of about 0.3 mm and the upper base board has a thickness of about 0.2 mm. A specific description will be given, taking as an example the case where square-shaped wiring board regions 2 each having a side length of about 5 mm are arranged on a mother board 1 formed by laminating the boards 1a.

That is, in the above example, on one side of the wiring board region 2, the dividing groove 6b is formed with a depth of about 0.1 mm on the upper surface of the lower mother board 1b exposed without forming the upper mother board 1a. A dividing groove 6a is formed on the upper surface of the mother substrate 1a at a depth of about 0.25 mm, and this is divided along the dividing grooves 6a and 6b to visually check for the occurrence of burrs and cracks (magnification about 20 times). Confirmed by

  The mother board 1 has a square shape with a side length of about 70 mm, and 6 × 7 wiring board regions 2 are arranged vertically and horizontally. Further, as a comparative example, a multi-piece wiring board of the prior art as shown in Patent Document 1, that is, a wall portion is connected between adjacent wiring board regions on the side where the mounting portion of the wiring board region is opened. A multi-cavity wiring board having a shape was prepared and divided along the dividing grooves in the same manner to check for the occurrence of burrs and cracks. In both the multi-cavity wiring board 10 of the specific example of the present invention and the multi-cavity wiring board of the comparative example, the number tested was 8 (336 individual wiring boards).

  As a result, in the multi-cavity wiring board 10 of the present invention, no burrs or cracks were observed, but in the multi-cavity wiring board of the comparative example, burrs were observed in three wiring boards. . As a result, it was possible to confirm the effect of suppressing the occurrence of burrs and cracks in the multi-piece wiring board 10 of the present invention.

The wiring board of the present invention is, for example, a square flat plate-like lower part in which the multi-cavity wiring board 10 of the present invention is divided along the dividing grooves 6a and 6b, and the electronic component mounting part 3 is provided at the center of the upper surface. A U-shaped upper portion made of a ceramic sintered body and laminated on the upper surface of the lower substrate 11b, forming a wall portion 5 around the mounting portion 3 on three sides of the lower substrate 11b in plan view Board 11a
And an insulating substrate 11 laminated with each other. A portion where the lower substrate 11b protrudes outside a line connecting both ends of the upper substrate 11a on one side where the wall portion 5 is not formed (an extended portion)
External terminals are arranged on the top surface of the substrate.

  According to such a wiring board, for example, the multi-cavity wiring board 10 of the present invention is divided into individual pieces, and the lower substrate 11b projects outward from the line connecting both ends of the upper substrate 11a. Since the upper surface of the protruding portion of the wiring board and the external circuit board 16 are joined and electrically connected, the electronic component module mounted on the wiring board and joined to the external circuit board 16 can be reduced in height. In addition, it is easy to secure the area of the electronic component mounting portion 3 and the like, for example, it is possible to provide a wiring board that secures a bonding area to the resin-sealed lower substrate 11b.

  The length of the protrusion to the outside of the lower substrate 11b is about the same as the width of the upper substrate 11a, and is about 0.25 to 0.5 mm, for example.

  When the electrodes are formed on the mounting portion 3 as in the example shown in FIG. 4, the wiring board can be flip-chip mounted. Further, when the through hole 9 is formed in the mounting portion 3 as in the example shown in FIG. 5, the imaging element can be mounted so that the light receiving portion is positioned in the through hole 9 in plan view. Alternatively, a heat radiating member such as a metal may be disposed in the through hole 9 and an element may be joined to the heat radiating member for mounting.

  The wiring board of the present invention is not limited to the shape shown in FIGS. 4 and 5 and may have other shapes. For example, in the example shown in FIG. 6, a stepped portion is provided on the inner periphery of the upper mother board 1a, and the wiring conductor 7 is formed on the upper surface of the stepped portion. The wiring conductor 7 is formed, for example, from the upper surface of the stepped portion to the lower surface of the lower substrate 11b, and serves as a conductive path for electrically connecting an electronic component mounted on the mounting portion 3 to an external electric circuit. .

  The wiring board as in the example shown in FIG. 6 is an example in which the shape of the upper mother board 1a stacked on each wiring board region 2 in the corresponding multi-cavity wiring board 10 is shown in FIG. It can be manufactured by setting it as a step like this and dividing it into pieces. In order to make the shape of the upper mother board 1a as described above, the upper mother board 1a is formed of a plurality of frame-shaped ceramic green sheets such as two layers, and the inner circumference of the frame portion of the upper ceramic green sheet is formed. Is made smaller than the inner circumference of the frame portion of the lower ceramic green sheet, and the layers are laminated so that a stepped portion is generated in accordance with this dimensional difference.

  Such a wiring board obtained by dividing the multi-cavity wiring board 10 is used in an imaging device or the like as in the example shown in FIG. The example shown in FIG. 7A shows an imaging device module in which an imaging device having an imaging element 12 mounted as an element on the wiring board mounting portion 3 of the example shown in FIG.

  When the wiring board is used for the imaging device, the light receiving portion 12a of the imaging element 12 is placed in the through hole 9 in a plan view on the wiring board in which the through hole 9 is formed as in the example shown in FIG. The image sensor 12 is mounted so as to be positioned. The electrode of the image pickup element 12 and the wiring conductor 7 are flip-chip bonded by bonding with solder, ultrasonic bonding with Au bumps, or bonding with an anisotropic conductive resin, and the through hole 9 is sealed with a transparent plate 13. Thus, an imaging device may be formed. When performing flip chip bonding using solder or Au bumps, in order to reinforce the bonding between the electrode of the image sensor 12 and the wiring conductor 7 and to seal the inside of the through hole 9 to protect the light receiving portion 12a. It is preferable to fill the underfill material 17. A lens 14 is disposed above the through hole 9 of the lower substrate 11b. With such a configuration, an imaging device capable of outputting a small, thin, high-quality image signal can be manufactured.

The transparent plate 13 is made of a resin such as crystal, glass, or epoxy resin, and is bonded to the lower substrate 11b with an adhesive such as thermosetting type or ultraviolet curing type epoxy resin or glass. For example, an ultraviolet curable epoxy resin is applied to the periphery of the through-hole 9 on the upper surface of the lower substrate 11b or the outer edge portion of the transparent plate material 13 by a dispensing method, and the transparent plate material 13 is placed on the lower substrate 11b to emit ultraviolet rays. Irradiation cures and seals the adhesive.

  The lens 14 is made of glass, epoxy resin, or the like, is attached to the opening of the lens fixing member 15, and allows the light transmitted through the lens 14 to enter the light receiving unit 12a.

  The lens fixing member 15 is made of resin, metal, or the like, and is fixed to the upper surface of the lower substrate 11b by an adhesive such as epoxy resin or solder. Alternatively, the lens fixing member 15 is fixed to the lower substrate 11b by a flange provided in advance.

  In such an imaging apparatus, the external terminal 8 is provided on the upper surface of the protruding portion of the wiring board. Therefore, as in the example shown in FIG. 7A, when the imaging device is mounted on the external circuit board 16, the upper surface of the protruding portion of the wiring board is bonded to the outer edge of the external circuit board 16. Therefore, the imaging module using the imaging device of the present invention can be reduced in height as compared with the conventional imaging device module in which the main surface of the imaging device is joined to the main surface of the external circuit board 16. In addition, the periphery of the image sensor 12 can be surrounded by the external circuit board 16 and the wall portion 5, and it is possible to suppress an impact from being applied to the image sensor 12 from the lateral direction. In addition, after mounting the image pickup device 12, compared to the case where the image pickup device 12 is protected by using, for example, an epoxy resin, the wall portion has a higher accuracy in the height direction. Further, it is possible to reduce the deformation of the image pickup element 12 due to the stress when the resin is cured.

  In the imaging apparatus, the imaging element 12 and the wiring conductor 7 may be electrically connected by wire bonding as in the example illustrated in FIG. 7B. In such a case as well, the same effect as in the case of the imaging apparatus as in the example shown in FIG. 7A can be obtained.

Further, the wiring board obtained by dividing the multi-cavity wiring board 10 may be used for applications such as a mobile phone TV tuner module as in the example shown in FIG. 8A, a tuner IC 18a which is an electronic component is mounted on the mounting portion 3 of the wiring board of the example shown in FIG. 4, and this is covered and sealed with a sealing material (not shown) such as resin. It is a top view which shows a state, FIG.8 (b) is sectional drawing in the AA of Fig.8 (a). In the example shown in FIG. 8, an electronic component mounting portion 3b is also provided on the lower surface of the lower mother substrate 1b, and an OFDM (orthogonal frequency division multiplex) chip is provided on the mounting portion 3b as another electronic component. 18b is installed.

  In the example shown in FIG. 8, the electrode (not shown) of the tuner IC 18a is electrically connected to the wiring conductor 7 via solder (not shown), and the electrode (not shown) of the OFDM 18b is bonded to the bonding wire. It is electrically connected to the wiring conductor 7 via (no symbol).

  In addition, this invention is not limited to the example of said embodiment, A various change is possible if it is the range which does not deviate from the summary of this invention. For example, a small electronic component such as a capacitor may be mounted on the upper surface of the lower substrate 11b. In such a case, the electronic component may be mounted in the recess by forming a recess in at least one of the upper substrate 11a and the lower substrate 11b in a region overlapping the upper substrate 11a in plan view.

  Further, when the wiring board is used in an imaging module, a concave portion may be formed in a portion joined to the lens fixing member 15, and the imaging module can be reduced in height by such a configuration.

Further, the lens fixing member 15 may include at least one of a driving device and an electronic component for moving the lens 14 in a direction along the optical axis. In such a case, the wiring board and the lens fixing member 15 may be electrically connected.

  Further, the lens fixing member 15 may be bonded to the protruding portion. In such a case, the lens fixing member 15 and the mother board 1 are bonded to each other over a wider area, so that the bonding strength can be increased. In such a case, the alignment of the lens fixing member 15 in the height direction is preferably performed without using the protruding portion. That is, it is preferable that the wall portion 5 of the lens fixing member 15 is provided with a recess in a region corresponding to the protruding portion so as not to contact the protruding portion.

  In addition, in the imaging device as in the example illustrated in FIGS. 7A and 7B, a small electronic component may be mounted on a portion where the wall portion 5 is opened and protruded. In such a case, the wiring length of the wiring conductor 7 between the imaging device 12 and the small electronic component can be shortened as compared with the case where the electronic component is mounted on the external circuit board 16.

  In addition, after electronic component elements are mounted on the mounting portions 3 of the individual wiring board regions 2 of the multi-piece wiring board 10, individual wiring boards (individual electronic devices in which electronic components are mounted on the wiring board) are provided. You may make it divide | segment into.

DESCRIPTION OF SYMBOLS 1 ... Mother board 1a ... Upper mother board 1b ... Lower mother board 2 ... Wiring board area | region 3 ... Mounting part 3b ... Lower surface mounting part 4 ... Dummy area 4b ... 2nd The dummy region 5 of the wall portion 6a, the dividing groove 6b of the upper mother substrate 1a, the dividing groove 7 of the lower mother substrate 1b, and the wiring conductor.
10 ... Multi-piece wiring board
11 ... Insulated substrate
11a ・ ・ Upper board
11b ・ ・ Lower board
12 ... Image sensor
12a ・ ・ Light detector
13 ... Transparent plate
14 ... Lens
15 ... Lens fixing member
16 ... External circuit board
17 ... Underfill material
18a tuner IC
18a ・ ・ OFDM chip

Claims (2)

A ceramic sintered body, and a plurality of square-shaped wiring board regions having an electronic component mounting portion in the center of the upper surface, and a plate-like lower mother board arranged vertically and horizontally, and a ceramic sintered body, A multi-piece wiring board composed of a mother board composed of an upper mother board for forming a wall portion around the mounting portion in each wiring board region, which is laminated on the upper surface of a lower mother board. ,
On one side of the wiring board area, a dummy area is disposed between the wiring board areas arranged adjacent to each other, and the upper mother board is not on the one side of the wiring board area. The upper surface of the lower mother board is exposed from the wiring board area to the dummy area, and a dividing groove is formed along the boundary of the wiring board area on the upper face of the mother board. Features a multi-piece wiring board.   A three-dimensional lower substrate made of a ceramic sintered body and having a square plate-like lower substrate having an electronic component mounting portion at the center of the upper surface, and a ceramic sintered body laminated on the upper surface of the lower substrate. And a U-shaped upper substrate in plan view that forms a wall portion around the mounting portion at the side, and the lower substrate is positioned at both ends of the upper substrate at the other side where the wall portion is not formed. A wiring board having a portion projecting outward from a line connecting the two and having an external terminal disposed on an upper surface of the projecting portion.

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