JP2012181119A - Inspection device of substrate and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe head for inspecting a substrate, which allows the tip of an inspection probe to accurately contact an inspection point.SOLUTION: As the horizontal movement of a coaxial inspection probe 50 is restricted by a positioning through hole 68a of a small-diameter positioning plate 68, a first probe 30 of the coaxial inspection probe is prevented from contacting an outer conductor 26 of a coaxial terminal 20. As a first through hole 64c of a first holding plate 64C and a second through hole 64a of a second holding plate 64A are arranged so that their center lines are positioned on a vertical line, allowing the coaxial inspection probe 50 to move along the vertical line without causing buckling, the coaxial inspection probe 50 can accurately contact an inspection point.

Description

The present invention relates to an inspection apparatus for electrically inspecting a wiring pattern formed on a substrate and a method of manufacturing the inspection apparatus.

Patent Document 1 discloses inspecting a wiring pattern by bringing two inspection probes into contact with an inspection point.

Patent Document 2 discloses a coaxial inspection probe.

JP 2004-279133 A JP 2007-205808 A

Patent Document 2 shows an example of how to use the coaxial probe in FIG. One end of the coaxial probe is in contact with the inspection point B, and the other end is in contact with the electrode portion EP. Moreover, the clearance w6 is shown by FIG. 2 of patent document 2, and patent document 2 is disclosing that w6 can be set to 1-10 micrometers. The coaxial probe 150 in FIGS. 7A and 7B is formed of an inner probe 130 and an outer probe 140. The electrode 120 is formed by an inner electrode 122 and an outer electrode 126. 7A is an example in which the coaxial probe 150 and the electrode 120 are correctly connected, and FIG. 7B is an example in which the coaxial probe 150 and the electrode 120 are not correctly connected. In Patent Document 2, since the clearance w6 is narrow, it is conceivable that the inner probe 130 and the outer probe 140 are short-circuited on the electrode 120 as shown in FIG. When the inner probe 130 and the outer probe 140 are short-circuited, the measurement accuracy deteriorates, so it is considered that the quality determination of the wiring pattern is erroneously determined.

The objective of this invention is providing the inspection apparatus which can test | inspect a wiring pattern by a 4 terminal method with a coaxial probe, and its manufacturing method.

An inspection apparatus according to a first aspect of the present invention has a front end and a rear end, and a coaxial inspection for inspecting conduction of the substrate to be inspected by pressing the front end against an inspection point of the substrate to be inspected. A probe; a holding portion for holding the inspection probe; and a coaxial electrode electrically connected to a rear end of the inspection probe. The inspection probe is formed of an elongated conductive first probe and a conductive second probe surrounding the first probe, and the electrode is electrically connected to the first probe; The holding portion is formed of a second electrode that is electrically connected to the second probe and is formed around the first electrode with an insulator interposed therebetween, and the holding portion includes a first surface and a first surface opposite to the first surface. A first plate having two surfaces and having a through hole, a first surface, a second surface opposite to the first surface, and a second plate having a through hole, the first surface, and the first surface are: A positioning plate having a second surface on the opposite side and a through-hole, wherein the first plate and the second plate are fixed apart by a fixing member, and the distal end side of the inspection probe is positioned on the first plate The inspection probe held in the through hole The rear end side is held in the through hole of the second plate and the through hole of the positioning plate, and the diameter of the through hole of the positioning plate is smaller than the diameter of the through hole of the second plate. When the through hole of the second plate and the through hole of the positioning plate are seen through the through hole of the first plate from directly above the through hole, the through hole of the first plate and the through hole of the second plate The through holes of the positioning plate overlap.

According to another aspect of the present invention, there is provided a method for manufacturing an inspection apparatus, comprising preparing a plate material for a first plate, a plate material for a second plate, and a plate material for a positioning plate, and the plate material for the second plate and the positioning material. Fixing a plate material for the plate, and a hole penetrating the plate material for the second plate and the plate material for the positioning plate at the same time in a state where the plate material for the second plate and the plate material for the positioning plate are fixed Forming a reference hole in the plate material for the second plate and forming a through hole in the plate material for the positioning plate; and a plate material for the second plate and a plate material for the positioning plate. Separating and forming a positioning plate, and forming a through hole larger than the reference hole at the same position with reference to the reference hole of the plate material for the second plate Forming the second plate; forming the first plate by forming a through hole in the plate material for the first plate; and the position of the through hole of the second plate and the through hole of the positioning plate. Laminating the second plate on the positioning plate so as to match the position, and separating the second plate from the second plate so that the position of the through hole of the first plate matches the position of the through hole of the second plate. The first plate is fixed to the second plate and the positioning plate, and an electrode formed by the first electrode and a second electrode formed around the first electrode through an insulating material is prepared. And fixing the electrode to the positioning plate so that the position of the electrode matches the position of the through hole of the positioning plate, and a coaxial probe from the first plate side Wherein the first plate through hole of, and inserting into the through hole of the through hole and the second plate of the positioning plate.

Sectional drawing of the probe head for an inspection which concerns on embodiment of this invention. The side view of the 1st probe and the 2nd probe which comprise the inspection probe of an embodiment. Sectional drawing of the test | inspection probe and electrode of embodiment. The manufacturing process figure of the electrode plate, positioning plate, and 2nd plate of embodiment. The manufacturing process figure of the electrode plate of the embodiment, the positioning plate, and the 2nd plate. The manufacturing process figure of the inspection device concerning an embodiment. The figure which shows the connection state of a test | inspection probe and an electrode. FIG. 8A is a cross-sectional view of the through hole of the positioning plate and the through hole of each holding plate, and FIG. 8B is a diagram showing the overlapping state of the through hole of each holding plate and the through hole of the positioning plate. The figure which shows the cross section and opening of a positioning plate when a positioning plate has a chamfer. Sectional drawing of the inspection apparatus which concerns on Embodiment 1 of this invention. Sectional drawing of the inspection apparatus which concerns on Embodiment 2 of this invention. The figure which shows the angle ((theta) 1) between a 1st probe and an electrode, and the angle ((theta) 2) between a 2nd probe and an electrode. FIG. 13A is a diagram illustrating a method for fixing the electrode and the expansion spring, and FIG. 13B is a diagram illustrating a method for fixing the first probe and the expansion spring.

FIG. 1 shows an inspection apparatus 10 according to the embodiment.
The inspection apparatus 10 includes a coaxial inspection probe (coaxial probe) 50, a holding portion 64 that holds the inspection probe, and a coaxial electrode 20. The coaxial probe 50 is formed by an inner first probe 30 and an outer second probe 40. The coaxial probe 50 has a front end and a rear end, and the front end is electrically connected to the inspection point of the substrate to be inspected. In order to ensure that the coaxial probe is in contact with the inspection point, the coaxial probe is preferably pressed against the inspection point.

2A shows a side view of the second probe 40, FIG. 2B shows a side view of the first probe 30, and FIG. 2C shows the first probe accommodated in the second probe 40. It shows the state. The second probe has elasticity because it makes contact with the inspection point with low resistance. The second probe 40 shown in FIG. 2A is a cylindrical conductor 40 having conductivity and stretchability. The outside of the conductor is covered with an insulating resin film (not shown). The inner wall of the second probe can be covered with an insulating resin film. When the conductor constituting the second probe is covered with the insulating resin film, the second probe is formed of the conductor 40 and the insulating resin film. An example of the second probe is shown in FIG. In this example, the second probe has sleeve portions 42a, 42b, and 42c, and spring portions 44a and 44b that connect the sleeve portions. The sleeve portion and the spring portion are formed of a metal such as nickel or copper having conductivity. The second probe 40 in FIG. 2 has elasticity by spring portions 44a and 44b, and the outside of the conductor 40 is covered with an insulating resin film (not shown). Even if the diameter of the second probe is uniform, the second probe may partially have a thin portion. The diameter of the second probe shown in FIG. 2 (D) is uniform. The second probe shown in FIG. 2A has a thin portion (fixed portion) 46. The diameter of the fixing portion 46 is equal to or smaller than the diameter of the first probe. The first probe and the second probe are in contact with each other at the fixing portion, and the movement of the first probe is suppressed by the fixing portion. Thereby, the movement of the first probe in the direction perpendicular to the axial direction (direction in FIG. 2C) is suppressed. Contact between the first probe and a second electrode to be described later can be prevented. Moreover, it becomes difficult to remove the first probe from the inspection apparatus 10. The diameter of the fixed part / the diameter of the first probe can be set to 0.8 to 0.98. The first probe can be inserted into the second probe and the movement of the first probe can be suppressed.

The first probe 30 is formed of an elongated conductive rod-like or needle-like conductive portion 34 and an insulating film 32 covering the conductive portion. The conductive portion 34 is formed of BeCu, W, ReW, copper, nickel, stainless steel, or the like, and can be formed of a copper wire or the like. The surface is preferably coated with Ni / Au. The insulating resin film and insulating film are formed of urethane, polyimide, epoxy, enamel, or the like. The first probe 30 is fixed to the second probe by a fixing portion 46 formed on the second probe. As shown in FIG. 1, the tip 34 b of the first probe 30 and the tip 40 b of the second probe 40 are in contact with the inspection point 82 of the substrate 80. FIG. 1 shows bumps 82 as examples of inspection points. Examples of inspection points include external terminals for connecting to an external substrate and electrodes for mounting electronic components in addition to bumps. The inspection probe is for four-terminal measurement, and the wiring on the board is inspected when another coaxial probe (not shown) contacts another inspection point. Here, only one bump is shown, but the inspection apparatus of the embodiment has 200 to 2000 coaxial inspection probes in order to inspect 200 to 1000 inspection points simultaneously.

The inspection apparatus has an electrode 20 for electrical connection to the rear end side of the inspection probe 50. The electrode is connected to a cable (not shown). The cable connects the inspection device to the substrate inspection device. The electrode has a first electrode 22 for electrical connection with the first probe. The shape of the first electrode is a circle, an ellipse, or a rectangle, and a circle is preferable. The first electrode is surrounded by an insulator 24. The insulator is a resin such as epoxy resin, polyimide, or urethane. In addition to surrounding the first electrode 22 with the insulator 24, a conductive wire in which a metal wire such as copper is coated with a resin such as enamel can be used. The electrode has a second electrode 26 for contacting the second probe outside the insulator 24. In FIG. 1, since the 2nd electrode 26 is formed in the donut shape, an electrode is coaxial. The second electrode 26 may partially surround the insulator 24, but preferably surrounds the entire circumference. The electrode 20 is covered with an insulating material 28. The electrode 20 is fixed to the electrode plate with an adhesive (not shown).

FIG. 3A shows a cross section of the coaxial electrode 20 and the inspection probe 50. The diameter 22D of the first electrode 22 is 10 μm to 70 μm, the thickness 24D of the insulator 24 is 3 μm to 10 μm, and the thickness 26D of the second electrode 26 is 5 μm to 35 μm. The diameter 34D of the conductive portion 34 of the first probe is 15 μm to 50 μm, and the thickness 32D of the insulating film 32 is 3 μm to 10 μm. The inner diameter 40DI of the second probe is 25 μm to 70 μm, and the outer diameter 40DO is 30 μm to 80 μm. When resin is coated on the inner wall of the second probe, the inner diameter is the distance between the resins covering the inner wall. When resin is coated on the outside of the second probe, the outer diameter is the distance between the resins covering the outside of the second probe. A clearance CL of 3 μm to 10 μm is provided between the first probe and the second probe. In FIG. 1, a telescopic spring 62 is formed between the first probe 30 and the first electrode 22. FIG. 3B shows a cross section of the coaxial electrode 20, the second probe, and the expansion spring 62. The length S1 of the metallic elastic spring 62 is 20 μm to 100 μm, and the spring is preferably covered with a resin film. The diameter 34D 'of the expansion spring is 10 μm to 70 μm. During the inspection, it is not necessary to provide the spring 62 between the first probe and the first electrode so that the first electrode and the first probe are in direct contact. However, the spring 62 stabilizes the connection between the first electrode and the first probe.

The holding portion for holding the inspection probe includes a first holding plate (first plate) 64C having a through hole (first through hole) and a second holding plate (second plate) having a through hole (second through hole). 64A and a third holding plate (third plate) 64B having a through hole (third through hole) (FIG. 1). The third holding plate is not essential. The front end side of the inspection probe 50 is held in the through hole (first through hole) 64c of the first plate 64C, and the rear end side of the inspection probe is held in the through hole (second through hole) 64a of the second plate 64A. The central portion of the inspection probe is held in the through hole (third through hole) 64b of the third plate 64B. The size of each through hole (first through hole, second through hole, third through hole) is 2 μm to 50 μm larger than the diameter of the inspection probe (outer diameter of the second probe). For this reason, when an inspection apparatus is manufactured, it becomes easy to pass an inspection probe through each through hole. The second holding plate 64A, the third holding plate 64B, and the first holding plate 64C are fixed by fixing members such as column members 66A and 66B. A positioning plate 68 is stacked on the second plate adjacent to the second holding plate 64A. The positioning plate has a through hole (positioning hole) 68a. The diameter of the through hole (positioning hole) of the positioning plate is larger than the outer shape of the inspection probe and smaller than the diameter of the second plate. The diameter of the positioning hole is 2 μm to 10 μm larger than the outer diameter of the inspection probe and 2 μm to 10 μm smaller than the diameter of the second through hole. Since the size of the through hole of the positioning plate is smaller than the size of the through hole of the second plate, it is possible to suppress the movement of the inspection probe in the horizontal direction (the direction shown in FIG. 2C) by the positioning plate. it can. This makes it difficult to electrically connect the first probe and the second electrode. Moreover, it becomes difficult to electrically connect the second probe and the first electrode. Measurement accuracy increases. As shown in FIG. 1, an electrode plate 70 is disposed on the positioning plate adjacent to the positioning plate 68. The electrode plate 70 has the electrode 20. The positioning plate has a first surface and a second surface opposite to the first surface. The first surface of the positioning plate is a surface facing the electrode and is a surface facing in the direction of the rear end side of the inspection probe. The second plate has a first surface and a second surface opposite to the first surface. The first surface of the second plate faces the second surface of the positioning plate. The positioning plate may be laminated directly on the second plate or may be laminated away from the second plate. The first plate has a first surface and a first surface opposite to the first surface, and the first surface of the first plate faces the second surface of the second plate. In FIG. 1, the electrode plate 70, the positioning plate 68, the second holding plate 64 </ b> A, and the first holding plate 64 </ b> C are fixed by pins 72.

When the through holes of each holding plate and the positioning plate are observed from the direction of the arrow in FIG. 8A (directly above the first through hole), they overlap. FIGS. 8B, 8 </ b> C, 8 </ b> D, and 8 </ b> E are diagrams obtained by projecting each through hole on one surface at the same magnification. 8 (B) to 8 (E) show that when the through holes of each holding plate and positioning plate are viewed from the direction shown in FIG. 8 (A), the through holes of each holding plate and positioning plate overlap. It shows the condition. As shown in FIGS. 8B to 8E, the positioning hole 68a of the positioning plate 68, the through hole 64a of the second plate 64A, the through hole 64b of the third plate 64B, and the through hole 64c of the first plate 64C. Are overlapping. When the through hole of the second plate and the through hole of the positioning plate are seen from directly above the through hole of the first plate through the through hole of the first plate, the through hole of the first plate, the through hole of the positioning plate, and the second The plate's through holes overlap. The through holes of the third plate also overlap. The through hole of the first plate has an opening of the first plate on the second surface of the first plate. The through hole of the second plate has an opening of the second plate on the second surface of the second plate. The through hole of the positioning plate has an opening of the positioning plate on the second surface of the positioning plate. When the positioning plate has a chamfered portion, the opening of the positioning plate is formed at the boundary between the chamfered portion and the inner wall of the through hole. The through hole of the third plate has an opening of the third plate on the second surface of the third plate. When the opening of the first plate is projected onto the second surface of the positioning plate at an equal magnification parallel to the second surface of the first plate, the opening of the positioning plate and the projected opening of the first plate overlap. In other words, the opening of the positioning plate is included in the projected opening of the first plate (FIGS. 8B, 8C, 8D, and 8E). When the opening of the second plate is projected onto the second surface of the positioning plate at an equal magnification parallel to the second surface of the first plate, the opening of the positioning plate and the projected opening of the second plate overlap. In other words, the opening of the positioning plate is included in the projected opening of the second plate (FIGS. 8B, 8C, 8D, and 8E). When the opening of the first plate and the opening of the second plate are projected onto the second surface of the positioning plate at the same magnification parallel to the second surface of the first plate, the projected first plate and the projected first plate of the second plate are projected. Plate openings overlap. In other words, the projected opening of the second plate is included in the projected opening of the first plate (FIGS. 8C and 8D). Alternatively, the projected opening of the second plate includes the projected opening of the first plate (FIG. 8E). Alternatively, the projected opening of the second plate coincides with the projected opening of the first plate (FIG. 8B). When the opening of the third plate is projected onto the second surface of the positioning plate at the same magnification parallel to the second surface of the first plate, the opening of the positioning plate and the projected opening of the third plate overlap. In other words, the opening of the positioning plate is included in the projected opening of the third plate (FIGS. 8B, 8C, 8D, and 8E). When the opening of the first plate, the opening of the second plate, and the opening of the third plate are projected on the second surface of the positioning plate at the same magnification parallel to the second surface of the first plate, the projected opening of the second plate And the projected apertures of the first plate overlap. In other words, the largest opening among the openings of the first plate, the second plate, and the third plate includes the other openings (FIGS. 8D and 8E). 8B and 8D, the through hole of the first plate is larger than the through hole of the second plate. In FIG. 8E, the through hole of the first plate is smaller than the through hole of the second plate. Since the through hole of the first plate, the through hole of the second plate, and the through hole of the positioning plate overlap, the inspection probe is held substantially perpendicular to the upper surface of the electrode. The upper surface of the electrode is the surface with which the inspection probe contacts. Therefore, it becomes difficult for the first electrode and the second probe to come into contact with each other. At the same time, it becomes difficult for the second electrode to contact the first electrode. The first probe and the first electrode are connected, and the second probe is in contact with the second electrode. Since the through hole of the first plate, the through hole of the second plate, and the through hole of the positioning plate overlap, the inspection probe can be easily inserted into the through hole of each plate. Furthermore, the through hole of each holding plate is larger than the through hole of the positioning plate. Therefore, when the machine or the operator passes the inspection probe through the through hole of the holding plate and the through hole of the positioning plate, it is easy to pass the inspection plate through the through hole other than the through hole of the positioning plate. In addition, since the positioning plate is disposed on the electrode plate, the inspection probe and the electrode are easily aligned. Also, when the inspection device is manufactured, the positioning plate's through-holes and each holding plate's through-holes overlap each other compared to when the positioning plate's through-holes and each holding plate's through-holes are offset. Or it is easy for an operator to insert an inspection plate into the through hole of the positioning plate and each holding plate. For this reason, the manufacturing time of the inspection apparatus is shortened, and the alignment accuracy between the electrode and the inspection probe is increased. The clearance C2 between the positioning hole 68a and the inspection probe 50 is 2 μm to 10 μm, and the clearance C1 between the through hole of the second holding plate and the inspection probe is 2 μm to 50 μm.

An inspection apparatus according to an embodiment is shown in FIG. The inspection apparatus according to the embodiment includes a telescopic spring 62 between the first probe 30 that does not have stretchability and the first electrode 22. The rear end of the first probe is connected to the telescopic spring 62. When the inspection probe is pushed into the inspection point, the second probe contracts. The telescopic spring 62 contracts according to the contraction of the second probe. By contracting the expansion / contraction spring 62, the first probe having no elasticity can be moved in the length direction. Therefore, even if the first probe does not have elasticity, the first probe does not bend in the horizontal direction (the direction parallel to the second surface of the first plate). Or, the amount of bending is reduced. Therefore, the inspection probe pushes the electrode and the inspection point substantially vertically. The first probe and the second probe push the inspection point and the electrode substantially vertically. Therefore, the first probe and the second probe are held substantially straight between the inspection point and the electrode. The first probe and the second probe do not bend in the horizontal direction (the direction parallel to the second surface of the first plate). Alternatively, the first probe and the second probe are difficult to bend in the horizontal direction. Even if the first probe is bent, the amount is considered to be less than that of the first embodiment described later. For this reason, the angle between the first probe and the electrode approaches 90 degrees or 90 degrees (see FIG. 12). The angle between the second probe and the electrode approaches 90 degrees or 90 degrees. Therefore, when the angle θ1 between the first probe and the electrode is compared between the first embodiment and the embodiment described later, the angle of the embodiment is closer to the right angle than the angle of the first embodiment described later. In the embodiment, the first probe and the first electrode are connected, and the second probe and the second electrode are connected. It becomes difficult to connect the first probe and the second electrode. Also, it is difficult for the second probe to connect to the first electrode. In the embodiment, even if pressure is applied to the inspection point or the electrode by the inspection probe, the inspection probe contacts the inspection point or the electrode at a substantially right angle. When a substrate is inspected using the inspection apparatus of the embodiment, the inspection accuracy is high. The first probe of the embodiment does not have elasticity. Therefore, when the manufacture of the first probe is compared between the second embodiment and the embodiment described later, the probe of the embodiment can be easily manufactured. Furthermore, in the embodiment, the extension spring and the first electrode can be mechanically fixed. In FIG. 13A, an extension spring is fixed to the electrode. The first electrode has a partially convex portion. The convex portion is inserted into the expansion spring. In FIG. 13B, a telescopic spring is fixed to the first probe. The conductive portion of the first probe is inserted into the telescopic spring. The expansion spring and the first electrode can be bonded with an adhesive or solder. The telescopic spring and the rear end of the first probe can be mechanically fixed. The extension spring and the rear end of the first probe can be bonded with an adhesive or solder. The first probe and the first electrode are securely connected by bonding or fixing. As a result, the second probe and the second electrode are also securely connected.

The inspection apparatus 10 according to the embodiment moves up and down by a drive mechanism (not shown). When the inspection apparatus 10 is lowered on the inspection point (bump 82 of the substrate 80), the tip of the inspection probe comes into contact with the inspection point. That is, the tip of the first probe 30 and the tip of the second probe 40 of the inspection probe come into contact with the bump 82, respectively. Further, the inspection probe is pressed against the inspection point by moving the inspection device. That is, the first probe and the second probe are pressed against the inspection point. Since the second probe 40 is contracted by the spring portions 44a and 44b, a load is applied to the inspection point 82. For this reason, the connection between the bump and the second probe is stabilized. Further, when the expansion spring 62 exists between the first probe 30 and the electrode, a load is applied to the inspection point 82 due to the expansion spring contracting. A load is relatively easily applied to the inspection point as compared with the case where the expansion spring 62 does not exist between the first probe and the electrode. For this reason, the connection between the bump and the first probe is stabilized. The telescopic spring applies force to the inspection point when it expands and contracts. Since the expansion spring 62 contracts, the first probe does not bend. Or the amount of bending is small. The first probe and the second probe are held substantially vertically between the electrodes at the inspection point. It is difficult for the first probe and the second probe to move in the horizontal direction. Since the extension spring pushes the first electrode substantially vertically, the extension spring and the second electrode do not contact each other. Extends the life of the telescopic spring. Further, the second probe and the second electrode are securely connected.

The inspection apparatus of Embodiment 1 is shown in FIG. The inspection apparatus according to the first embodiment does not have the expansion spring 62. Other than that is the same as the embodiment. In the inspection apparatus according to the first embodiment, since the through hole of the positioning plate and the through hole of each holding plate overlap, the inspection probe pushes the electrode substantially vertically even when the inspection probe is pushed into the inspection point. Therefore, the rear end of the inspection plate does not slide on the electrode. Or, the rear end becomes difficult to slide. As a result, the first probe and the first electrode are connected, and the second probe and the second electrode are connected. It becomes difficult to connect the first probe and the second electrode. Also, it is difficult for the second probe to connect to the first electrode.

The inspection apparatus of Embodiment 2 is shown in FIG. In the inspection apparatus of the second embodiment, a probe having elasticity is used as the first probe. The inspection apparatus in FIG. 11A has an expansion spring 62 between the first probe and the first electrode, and the inspection apparatus in FIG. 11B has an expansion spring 62 between the first probe and the first electrode. Absent. In the second embodiment, when the inspection probe is pushed into the inspection point, the first probe and the second probe contract. The inspection probe pushes the electrode and inspection point substantially vertically. The first probe and the second probe push the inspection point and the electrode substantially vertically. Therefore, the first probe and the second probe are held substantially straight between the inspection point and the electrode. The first probe and the second probe do not bend in the horizontal direction (the direction parallel to the second surface of the first plate). Alternatively, the first probe and the second probe are difficult to bend in the horizontal direction. Even if the first probe is bent, the amount is considered to be less than that of the first embodiment. For this reason, the angle θ1 (see FIG. 12) between the first probe and the electrode approaches 90 degrees or approaches 90 degrees. The angle θ2 (see FIG. 12) between the second probe and the electrode is 90 degrees or close to 90 degrees. Therefore, when θ1 and θ2 are compared in the first embodiment and the second embodiment, the angle of the second embodiment is closer to the right angle than the angle of the first embodiment. Since the 1st probe of Embodiment 2 has elasticity, the inspection device of Embodiment 2 has the same effect as the inspection device of an embodiment.

In the second embodiment, the first probe and the first electrode are connected, and the second probe and the second electrode are connected. It becomes difficult to connect the first probe and the second electrode. Also, it is difficult for the second probe to connect to the first electrode. In the embodiment and the second embodiment, even when pressure is applied to the inspection point or the electrode by the inspection probe, the inspection probe does not bend and contacts the inspection point or the electrode substantially vertically. When the substrate is inspected using the inspection apparatus of the embodiment or the embodiment 2, the inspection accuracy is high. When the inspection apparatus of Embodiment 2 has the expansion spring 62, the expansion spring and the first electrode are fixed by the same method as in the embodiment. Similar effects appear.

In the embodiment and the second embodiment, not only the second probe 40 but also at least one of the expansion spring 62 or the first probe 30 expands and contracts in the same manner, so that sliding between the first probe and the second probe is reduced. To do. Therefore, the peeling of the resin covering the first probe or the second probe is reduced. It is possible to prevent the peeled resin from falling on the inspection point or the electrode. Further, the first probe 30 applies a load to the inspection point by the expansion / contraction mechanism, and conduction is stabilized.

In the inspection apparatus of each embodiment, the second probe 40 is formed of sleeve portions 42a, 42b, 42c that do not have elasticity, and spring portions 44a, 44b that have elasticity. The second probe can be stretched by the spring portions 44a and 44b.
In the inspection apparatus of each embodiment, the through holes of the first plate, the second plate, and the positioning plate overlap. Therefore, it is difficult for the first probe and the second probe to bend. Inspection probe is difficult to bend. In particular, in the embodiment and the embodiment 2, the inspection probe is unlikely to buckle. Since the inspection probe pushes the electrode and the inspection point substantially vertically, the measurement accuracy is increased.

In the inspection device of each embodiment, the fixing portion 46 can be formed on the sleeve portion 42b. Since the first probe 30 is fixed to the second probe 40 by the fixing portion 46, it is possible to prevent the first probe 30 from falling off the inspection apparatus. The horizontal movement of the first probe can be controlled. The inspection probe is securely connected to inspection points and electrodes.

In the inspection apparatus of each embodiment, a straight line that passes through the center of gravity of the through hole of the positioning plate and is perpendicular to the first surface of the positioning plate and a center of gravity of the through hole of the second plate and that is perpendicular to the first surface of the positioning plate Are preferably overlapped. The electrode and inspection probe are securely connected. Furthermore, it is preferable that a straight line passing through the center of gravity of the through hole of the positioning plate and perpendicular to the first surface of the positioning plate and a center of gravity of the through hole of the first plate and perpendicular to the first surface of the positioning plate overlap. The inspection probe can be held vertically between the electrode and the inspection point. Furthermore, it is preferable that a straight line that passes through the center of gravity of the through hole of the positioning plate and is perpendicular to the first surface of the positioning plate and a center of gravity of the through hole of the third plate and that is perpendicular to the first surface of the positioning plate overlap. A manufacturing apparatus can be manufactured in a short time.

A method for manufacturing the electrode plate 70, the positioning plate 68, and the second holding plate 64A will be described with reference to FIGS.
(1) A plate material 70 for an electrode plate, a plate material 68 for a positioning plate, and a plate material 64A for a second holding plate are stacked (FIG. 4A). In this state, a through hole 69 is formed by a drill at a position corresponding to the pin hole (FIG. 4B). Pin holes 70b, 68b, and 64d are formed in the plate material 70 for the electrode plate, the plate material 68 for the positioning plate, and the plate material 64A for the second holding plate, respectively (FIG. 4C). And the pin 72 is inserted and three sheets are fixed (FIG. 5 (A)). Here, only one pin is shown, but two or more plate members are connected.

(2) A through hole having the same diameter as the positioning hole is formed in the plate material 70 for the electrode plate, the plate material 68 for the positioning plate, and the plate material 64A for the second holding plate. Thereby, the positioning through hole 68a is formed in the plate material 68 for the positioning plate, and at the same time, the reference hole 70a1 is formed in the plate material 70 for the electrode plate and the reference hole 64a1 is formed in the plate material 64A for the second holding plate (FIG. 5). (B)). Thereafter, the pin 72 is pulled out and the three sheets are separated. The positioning plate is completed.

(3) With reference to the reference hole 70a1 of the plate material 70 for the electrode plate (FIG. 5 (C1)), the fixing hole 70a is formed (FIG. 5 (C2)). The fixing hole 70a penetrates the electrode plate, and an electrode is formed therein. An electrode is formed in the fixing hole of the electrode plate by fixing the previously formed electrode to the fixing hole with an adhesive or the like. Another way of making the electrodes is shown below. A metal plating film having a predetermined thickness is formed on the inner wall of the fixing hole. The metal plating film is filled with resin. The resin filling the metal plating film is a filler. A through hole having a predetermined diameter is formed at the center of the filler. Thereafter, the through holes formed in the filler are filled with a metal plating film. A coaxial electrode is formed. After the through hole is filled with the metal plating film, the plate material 70 for the electrode plate can be polished. The upper surface is flat and a coaxial electrode is completed. The inspection probe contacts the upper surface.

(4) The corner on the second surface side of the through hole 68a of the positioning plate 68 is chamfered. Chamfering is performed on the second surface side of the through hole of the positioning plate to form a chamfered portion 68c (FIG. 5 (D2)). The chamfered portion 68c facilitates assembly of the positioning plate. In addition, the inspection probe can be easily passed through the through hole of the positioning plate.

(5) The through hole 64a of the second plate is formed with reference to the reference hole 64a1 of the plate material 64A for the second plate (FIG. 5 (E1)). The second plate 64A is manufactured (FIG. 5 (E2)). In the manufacturing method of FIG. 5, the reference hole 64a1 and the reference hole 64a, or the reference hole 70a1 and the fixing hole 70a are formed at the same position.

A method for manufacturing the inspection apparatus will be described with reference to FIGS.
The first plate 64C, the third plate 64B, the second plate 64A, and the positioning plate are fixed by the column members 66A and 66B (FIG. 6A). At this time, the holding plates are arranged such that the through hole 64a of the second plate 64A, the through hole 64b of the third plate 64B, the through hole 64c of the first plate 64C, and the through hole of the positioning plate overlap. The second plate is stacked on the positioning plate such that the second surface of the positioning plate faces the first surface of the second plate. At least the second plate passes through the center of gravity of the through hole of the second plate and is perpendicular to the first surface of the positioning plate and the straight line that passes through the center of gravity of the through hole of the positioning plate and is perpendicular to the first surface of the positioning plate. It is preferable to be laminated on a positioning plate. Further, the first plate is aligned such that a straight line that passes through the center of gravity of the through hole of the first plate and is perpendicular to the first surface of the positioning plate overlaps with a straight line that passes through the center of gravity of the through hole of the positioning plate and is perpendicular to the first surface of the positioning plate. It is preferable to be fixed to the column member.

An electrode plate 70 is stacked on the positioning plate 68 (FIG. 6A). The position of the through hole of the positioning plate and the position of the electrode are matched. The electrode plate is fixed to the positioning plate with pins 72 or the like (FIG. 6A). The through hole of the positioning plate and the electrode are aligned, and both are fixed. The positioning plate and the electrode plate are fixed so that the center of gravity of the through hole of the positioning plate and the center of gravity of the first electrode overlap. It is preferable that a straight line passing through the center of gravity of the through hole of the positioning plate and perpendicular to the first surface of the positioning plate overlaps with a straight line passing through the center of gravity of the first electrode and perpendicular to the first surface of the positioning plate. The electrode plate may be fixed to the positioning plate with a pillar member 66A.

The inspection probe 50 is passed through the through hole 64a of the second plate 64A, the through hole 64b of the third plate 64B, the through hole 64c of the first plate 64C, and the through hole of the positioning plate (FIG. 6B). The inspection probe is inserted into the through hole of each holding plate and positioning plate from the first plate side. The inspection probe stops when the rear end of the inspection probe hits the electrode or the extension spring. As described above, the through holes of each holding plate (the first plate through hole 64c, the second plate through hole 64a, and the third plate through hole 64b) have a clearance of 2 to 50 μm with respect to the inspection probe 50. Have. Further, since the through holes of the holding plates overlap, the inspection probe is inserted straight into the holding plates. The inspection device 50 is manufactured in a short time. The through hole of the positioning plate is smaller than the through hole of the holding plate. However, since the through hole of the positioning plate has a chamfered portion on the second surface side, it is easy to insert the inspection probe into the through hole of the positioning plate.

When the inspection apparatus has the expansion spring 62, the expansion spring is formed on the first electrode. A telescopic spring can be fixed to the first electrode with solder or conductive paste. As another example, the first electrode can have a protruding shape. The extension spring 62 is fixed to the protrusion 63 with solder or conductive paste (not shown) (FIG. 13A). By inserting the projection 63 into the expansion spring 62, both can be mechanically fixed.
Within the second probe 40 of the inspection probe 50, the rear end 34a of the first probe 30 is disposed on the telescopic spring 62 (FIG. 6B). The inspection probe is inserted into the through hole of each holding plate and positioning plate from the first plate side. The first probe comes into contact with the telescopic spring and stops.

A telescopic spring can be fixed to the rear end of the first probe (see FIG. 13B). The first probe and the extension spring can be mechanically fixed by inserting the rear end (conductive portion) of the first probe inside the extension spring. Further, the rear end of the first probe and the expansion spring can be fixed with solder or conductive paste (not shown). When solder or conductive paste is used for fixing, it is preferable that the rear end of the first probe is inserted inside the expansion spring. In this case, the first probe and the extension spring are inserted into the second probe while the extension spring is fixed to the first probe. The expansion spring stops at the electrode.

In the state of being connected by the pin 72, the through hole 68a of the positioning plate and the reference hole 64a1 of the through hole of the second plate and the opening 70a1 as the reference of the through hole for forming the electrode are formed simultaneously. These are again pinned after assembly of the inspection probe. Therefore, the position accuracy of the through hole of the positioning plate and the through hole of the second plate can be kept high while being easily processed and assembled.

In the embodiment described above, an example in which the substrate inspection probe head is applied to the inspection of bumps has been described. However, the substrate inspection probe head of the present invention can be used for inspection of various wirings and the like. In the above-described embodiment, the third holding plate is provided between the second holding plate and the first holding plate. However, the third holding plate can be omitted. In each embodiment, it is possible to assemble thousands of inspection probes for inspecting thousands of inspection points in a short time.

DESCRIPTION OF SYMBOLS 10 Inspection apparatus 20 Coaxial terminal 22 Inner conductor 26 Outer conductor 30 1st probe 40 2nd probe 42a Sleeve part 44a Spring part 50 Coaxial inspection probe 64C 1st holding plate 64c 1st through-hole 64A 2nd holding plate 64a 2nd through-hole 68 Positioning plate 68a Positioning through hole 70 Fixed plate

Claims (14)

A coaxial inspection probe for inspecting continuity of the substrate to be inspected by having a front end and a rear end and pressing the front end against an inspection point of the substrate to be inspected;
A holding unit for holding the inspection probe;
An inspection apparatus including a coaxial electrode electrically connected to a rear end of the inspection probe,
The inspection probe is formed of an elongated first conductive probe and a second probe surrounding the first probe and having elasticity and conductivity;
The electrode is electrically connected to the second probe formed around the insulator, a first electrode for electrically connecting to the first probe, an insulator formed around the first electrode, and the insulator. Formed with a second electrode for
The holding portion has a first surface, a second surface opposite to the first surface, a first plate having a through hole, a first surface, and a second surface opposite to the first surface. A second plate having a through hole, a first surface, a second plate opposite to the first surface, and a positioning plate having a through hole;
The first plate and the second plate are fixed apart by a fixing member,
The tip side of the inspection probe is held in the through hole of the first plate,
The rear end side of the inspection probe is held in the through hole of the second plate and the through hole of the positioning plate,
The diameter of the through hole of the positioning plate is smaller than the diameter of the through hole of the second plate,
When the through hole of the second plate and the through hole of the positioning plate are seen from directly above the through hole of the first plate through the through hole of the first plate, the through hole of the first plate and the second plate The through hole of the plate and the through hole of the positioning plate overlap. The inspection apparatus according to claim 1, wherein a diameter of the through hole of the first plate is larger than a diameter of the through hole of the second plate, and the through hole of the first plate includes the through hole of the second plate. Yes. The inspection apparatus according to claim 1, wherein a diameter of the through hole of the second plate is larger than a diameter of the through hole of the first plate, and the through hole of the second plate includes the through hole of the first plate. Yes. 2. The inspection apparatus according to claim 1, wherein the first surface of the positioning plate is in the direction of the rear end of the inspection probe, and the second plate is the second surface of the positioning plate and the first surface of the second plate. Are stacked on the positioning plate so as to face each other, and when the through hole of the positioning plate is projected onto the second plate at the same magnification along the perpendicular of the first surface of the second plate, the second plate The through-hole includes a through-hole of the positioning plate. 2. The inspection apparatus according to claim 1, wherein the second plate has a straight line that passes through the center of gravity of the through hole of the second plate and is perpendicular to the first surface of the second plate and the center of gravity of the through hole of the positioning plate. A straight line perpendicular to one surface overlaps. The inspection apparatus according to claim 1, further comprising a spring between the first probe and the first electrode. 2. The inspection apparatus according to claim 1, wherein the second probe is formed of a sleeve portion that does not have elasticity and a spring portion that has elasticity. The inspection apparatus according to claim 7, wherein the sleeve portion is formed of a thick portion and a thin portion. 9. The inspection apparatus according to claim 8, wherein the diameter of the narrow portion of the sleeve portion is the same as or smaller than the diameter of the first probe. The inspection apparatus according to claim 1, wherein the second probe is longer than the first probe. Preparing a plate material for the first plate, a plate material for the second plate, and a plate material for the positioning plate;
Fixing the plate material for the second plate and the plate material for the positioning plate;
By forming a hole penetrating the plate material for the second plate and the plate material for the positioning plate at the same time while the plate material for the second plate and the plate material for the positioning plate are fixed, the second plate Forming a reference hole in the plate material for use and forming a through hole in the plate material for the positioning plate;
Separating the plate material for the second plate and the plate material for the positioning plate, and forming a positioning plate;
Forming a second plate by forming a through hole larger than the reference hole at the same position on the basis of the reference hole of the plate material for the second plate;
Forming a first plate by forming a through hole in the plate material for the first plate;
Laminating the second plate on the positioning plate so that the position of the through hole of the second plate matches the position of the through hole of the positioning plate;
Fixing the first plate to the second plate and the positioning plate apart from the second plate so that the position of the through hole of the first plate matches the position of the through hole of the second plate;
Preparing an electrode formed of a first electrode and a second electrode formed around the first electrode via an insulating material;
Fixing the electrode to the positioning plate so that the position of the electrode matches the position of the through hole of the positioning plate;
An apparatus for inspecting the continuity of a circuit board including inserting a coaxial probe from the first plate side into the through hole of the first plate, the through hole of the positioning plate, and the through hole of the second plate Manufacturing method. 12. The method of manufacturing an apparatus for inspecting continuity of a circuit board according to claim 11, further comprising forming a through hole for fixing in the first plate, the second plate, and the positioning plate, Fixing includes inserting a pin into a through hole for fixing the first plate, the second plate, and the positioning plate. 12. The method of manufacturing an apparatus for inspecting continuity of a circuit board according to claim 11, wherein the through hole of the first board, the through hole of the positioning plate and the second hole are directly above the through hole of the first board. When the through hole of the plate is seen, the through hole of the first substrate, the through hole of the positioning plate, and the through hole of the second plate overlap. 12. The method of manufacturing an apparatus for inspecting continuity of a circuit board according to claim 11, further comprising forming a spring on the first electrode.

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