JP2012164956A5 - - Google Patents
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- Publication number
- JP2012164956A5 JP2012164956A5 JP2011223051A JP2011223051A JP2012164956A5 JP 2012164956 A5 JP2012164956 A5 JP 2012164956A5 JP 2011223051 A JP2011223051 A JP 2011223051A JP 2011223051 A JP2011223051 A JP 2011223051A JP 2012164956 A5 JP2012164956 A5 JP 2012164956A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- support device
- component support
- placement region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011223051A JP5709719B2 (ja) | 2011-01-18 | 2011-10-07 | 電子部品支持装置及び電子デバイス |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011007519 | 2011-01-18 | ||
| JP2011007519 | 2011-01-18 | ||
| JP2011223051A JP5709719B2 (ja) | 2011-01-18 | 2011-10-07 | 電子部品支持装置及び電子デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012164956A JP2012164956A (ja) | 2012-08-30 |
| JP2012164956A5 true JP2012164956A5 (OSRAM) | 2014-10-23 |
| JP5709719B2 JP5709719B2 (ja) | 2015-04-30 |
Family
ID=46844012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011223051A Expired - Fee Related JP5709719B2 (ja) | 2011-01-18 | 2011-10-07 | 電子部品支持装置及び電子デバイス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5709719B2 (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9368469B2 (en) | 2012-08-30 | 2016-06-14 | Panasonic Intellectual Property Management Co., Ltd. | Electronic component package and method of manufacturing same |
| US9449937B2 (en) | 2012-09-05 | 2016-09-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US9524917B2 (en) * | 2014-04-23 | 2016-12-20 | Optiz, Inc. | Chip level heat dissipation using silicon |
| EP3817041B1 (en) * | 2018-06-26 | 2023-08-16 | Kyocera Corporation | Electronic element mounting substrate, electronic device, and electronic module |
| CN114614228A (zh) * | 2020-12-09 | 2022-06-10 | 深南电路股份有限公司 | 耦合器及电子设备 |
| KR102855264B1 (ko) * | 2022-11-22 | 2025-09-03 | 앱솔릭스 인코포레이티드 | 패키징 기판 및 이를 포함하는 반도체 패키지 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008294253A (ja) * | 2007-05-25 | 2008-12-04 | Ngk Spark Plug Co Ltd | 発光素子実装用配線基板 |
| JP2009117489A (ja) * | 2007-11-02 | 2009-05-28 | Sharp Corp | 半導体素子パッケージ及び実装基板 |
| JP5357706B2 (ja) * | 2009-11-10 | 2013-12-04 | パナソニック株式会社 | 半導体実装構造体 |
-
2011
- 2011-10-07 JP JP2011223051A patent/JP5709719B2/ja not_active Expired - Fee Related
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