JP2010153803A5 - - Google Patents

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Publication number
JP2010153803A5
JP2010153803A5 JP2009252591A JP2009252591A JP2010153803A5 JP 2010153803 A5 JP2010153803 A5 JP 2010153803A5 JP 2009252591 A JP2009252591 A JP 2009252591A JP 2009252591 A JP2009252591 A JP 2009252591A JP 2010153803 A5 JP2010153803 A5 JP 2010153803A5
Authority
JP
Japan
Prior art keywords
electronic component
mounting module
component mounting
substrate
metal fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009252591A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010153803A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009252591A priority Critical patent/JP2010153803A/ja
Priority claimed from JP2009252591A external-priority patent/JP2010153803A/ja
Priority to EP09014627A priority patent/EP2192614A3/en
Priority to US12/625,917 priority patent/US8197099B2/en
Publication of JP2010153803A publication Critical patent/JP2010153803A/ja
Publication of JP2010153803A5 publication Critical patent/JP2010153803A5/ja
Pending legal-status Critical Current

Links

JP2009252591A 2008-11-28 2009-11-04 電子部品実装モジュール及び電気機器 Pending JP2010153803A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009252591A JP2010153803A (ja) 2008-11-28 2009-11-04 電子部品実装モジュール及び電気機器
EP09014627A EP2192614A3 (en) 2008-11-28 2009-11-24 Electronic component mounting module and electrical apparatus
US12/625,917 US8197099B2 (en) 2008-11-28 2009-11-25 Electronic component mounting module and electrical apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008303670 2008-11-28
JP2009252591A JP2010153803A (ja) 2008-11-28 2009-11-04 電子部品実装モジュール及び電気機器

Publications (2)

Publication Number Publication Date
JP2010153803A JP2010153803A (ja) 2010-07-08
JP2010153803A5 true JP2010153803A5 (OSRAM) 2012-11-08

Family

ID=41606672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009252591A Pending JP2010153803A (ja) 2008-11-28 2009-11-04 電子部品実装モジュール及び電気機器

Country Status (3)

Country Link
US (1) US8197099B2 (OSRAM)
EP (1) EP2192614A3 (OSRAM)
JP (1) JP2010153803A (OSRAM)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201540443U (zh) * 2009-10-23 2010-08-04 中强光电股份有限公司 光源模块
TWI435144B (zh) * 2010-04-12 2014-04-21 Young Lighting Technology Corp 背光模組
FR2967329B1 (fr) * 2010-11-10 2013-04-26 Valeo Systemes Thermiques Ecran d'affichage
KR20140017602A (ko) * 2011-03-22 2014-02-11 다우 코닝 코포레이션 Ｌｅｄ 조립체 내의 열 관리
KR101824038B1 (ko) * 2011-07-22 2018-01-31 엘지이노텍 주식회사 디스플레이 장치
KR101427119B1 (ko) * 2012-12-10 2014-08-06 주식회사 영동테크 마그네슘 압출물 히트싱크를 가진 고전력 led조명장치
GB2526226B (en) * 2013-03-06 2016-06-29 Aurora Ltd Improved downlights
US10420203B2 (en) * 2013-07-01 2019-09-17 Hamilton Sundstrand Corporation Heat pipe embedded heat sink with integrated posts
DE102015215011A1 (de) * 2015-08-06 2017-02-09 Robert Bosch Gmbh Thermisches und/oder elektrisches Kontaktelement, Kontaktanordnung und Verfahren zur Reduzierung einer Formtoleranz eines Kontaktelementes und/oder einer Kontaktanordnung
KR20200040770A (ko) 2017-08-23 2020-04-20 엔지케이 인슐레이터 엘티디 투명 밀봉 부재 및 광학 부품
BE1026114B1 (nl) * 2018-03-19 2019-10-17 Dk Ceramic Circuits Bvba Verbinding via component
BE1026115B1 (nl) * 2018-03-19 2019-10-17 Dk Ceramic Circuits Bvba Verbinding via pin
USD921905S1 (en) * 2019-07-19 2021-06-08 Carre Technologies Inc. Case
US11264299B1 (en) 2020-09-03 2022-03-01 Northrop Grumman Systems Corporation Direct write, high conductivity MMIC attach

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
US5345107A (en) * 1989-09-25 1994-09-06 Hitachi, Ltd. Cooling apparatus for electronic device
US5355280A (en) * 1989-09-27 1994-10-11 Robert Bosch Gmbh Connection arrangement with PC board
US5098609A (en) * 1989-11-03 1992-03-24 The Research Foundation Of State Univ. Of N.Y. Stable high solids, high thermal conductivity pastes
US5591034A (en) * 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
US5781412A (en) * 1996-11-22 1998-07-14 Parker-Hannifin Corporation Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
JP3583019B2 (ja) 1999-04-28 2004-10-27 京セラ株式会社 放熱配線基板の接合構造
US8100552B2 (en) * 2002-07-12 2012-01-24 Yechezkal Evan Spero Multiple light-source illuminating system
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
WO2004049462A1 (en) * 2002-11-26 2004-06-10 Stockeryale, (Irl), Limited An illuminator and production method
US6774482B2 (en) * 2002-12-27 2004-08-10 International Business Machines Corporation Chip cooling
JP3988735B2 (ja) * 2004-03-15 2007-10-10 日立金属株式会社 半導体装置及びその製造方法
US7719108B2 (en) * 2005-01-10 2010-05-18 Lockheed Martin Corporation Enhanced reliability semiconductor package
JP2006344690A (ja) 2005-06-07 2006-12-21 Fujikura Ltd 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機
CN101375395B (zh) * 2006-01-26 2012-10-03 迈图高新材料日本合同公司 散热材料以及使用该材料的半导体装置
JP2008103602A (ja) * 2006-10-20 2008-05-01 Seiko Epson Corp 電子基板、その製造方法および電子機器
DE102007023918A1 (de) * 2007-05-23 2008-11-27 Siemens Ag Österreich Beleuchtungseinheit

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