JP2012160659A5 - - Google Patents

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Publication number
JP2012160659A5
JP2012160659A5 JP2011020999A JP2011020999A JP2012160659A5 JP 2012160659 A5 JP2012160659 A5 JP 2012160659A5 JP 2011020999 A JP2011020999 A JP 2011020999A JP 2011020999 A JP2011020999 A JP 2011020999A JP 2012160659 A5 JP2012160659 A5 JP 2012160659A5
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JP
Japan
Prior art keywords
wafer table
wafer
dicing method
holding surface
irradiating
Prior art date
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Granted
Application number
JP2011020999A
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English (en)
Japanese (ja)
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JP5846470B2 (ja
JP2012160659A (ja
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Priority to JP2011020999A priority Critical patent/JP5846470B2/ja
Priority claimed from JP2011020999A external-priority patent/JP5846470B2/ja
Publication of JP2012160659A publication Critical patent/JP2012160659A/ja
Publication of JP2012160659A5 publication Critical patent/JP2012160659A5/ja
Application granted granted Critical
Publication of JP5846470B2 publication Critical patent/JP5846470B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011020999A 2011-02-02 2011-02-02 レーザダイシング装置及び方法並びにウェーハ処理方法 Expired - Fee Related JP5846470B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011020999A JP5846470B2 (ja) 2011-02-02 2011-02-02 レーザダイシング装置及び方法並びにウェーハ処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011020999A JP5846470B2 (ja) 2011-02-02 2011-02-02 レーザダイシング装置及び方法並びにウェーハ処理方法

Publications (3)

Publication Number Publication Date
JP2012160659A JP2012160659A (ja) 2012-08-23
JP2012160659A5 true JP2012160659A5 (cg-RX-API-DMAC7.html) 2014-03-06
JP5846470B2 JP5846470B2 (ja) 2016-01-20

Family

ID=46840931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011020999A Expired - Fee Related JP5846470B2 (ja) 2011-02-02 2011-02-02 レーザダイシング装置及び方法並びにウェーハ処理方法

Country Status (1)

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JP (1) JP5846470B2 (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5860217B2 (ja) * 2011-03-04 2016-02-16 株式会社ディスコ レーザー加工装置
JP5860219B2 (ja) * 2011-03-10 2016-02-16 株式会社ディスコ レーザー加工装置
TWI512867B (zh) * 2012-12-14 2015-12-11 Yayatech Co Ltd 晶圓切割道之檢測方法及其檢測治具
JP2014212282A (ja) * 2013-04-22 2014-11-13 株式会社ディスコ ウェーハの加工方法
JP6151557B2 (ja) * 2013-05-13 2017-06-21 株式会社ディスコ レーザー加工方法
DE102018200656A1 (de) * 2018-01-16 2019-07-18 Disco Corporation Verfahren zum Bearbeiten eines Wafers
JP6651208B1 (ja) * 2019-05-15 2020-02-19 ハイソル株式会社 ウェハチャック及びチャックリング
JP7286503B2 (ja) 2019-09-26 2023-06-05 株式会社ディスコ ウエーハの加工方法、及びウエーハの加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002248593A (ja) * 2000-12-21 2002-09-03 Hitachi Metals Ltd シート部材のレーザ加工治具及び加工方法
JP4770126B2 (ja) * 2003-06-06 2011-09-14 日立化成工業株式会社 接着シート
JP2007275920A (ja) * 2006-04-05 2007-10-25 Seiko Epson Corp 基体の製造方法、表示装置、電気光学装置、電子機器
JP2009101384A (ja) * 2007-10-23 2009-05-14 Olympus Corp レーザ加工方法
JP2009262216A (ja) * 2008-04-28 2009-11-12 Toyota Motor Corp 透明基材のレーザ加工方法および電解質膜の製造方法
JP2010029930A (ja) * 2008-07-31 2010-02-12 Disco Abrasive Syst Ltd レーザ加工装置及びレーザ加工方法

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