JP2012160659A5 - - Google Patents
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- JP2012160659A5 JP2012160659A5 JP2011020999A JP2011020999A JP2012160659A5 JP 2012160659 A5 JP2012160659 A5 JP 2012160659A5 JP 2011020999 A JP2011020999 A JP 2011020999A JP 2011020999 A JP2011020999 A JP 2011020999A JP 2012160659 A5 JP2012160659 A5 JP 2012160659A5
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- JP
- Japan
- Prior art keywords
- wafer table
- wafer
- dicing method
- holding surface
- irradiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
請求項１７に係る発明は、前記目的を達成するために、前記ウェーハテーブルは、前記保持面を上に向けて水平に設置され、前記ウェーハテーブルの下方から前記ウェーハテーブルに保持された前記ウェーハにレーザ光を照射することを特徴とする請求項１１〜１６のいずれか１項に記載のレーザダイシング方法を提供する。 Invention, in order to achieve the above object, the wafer table is installed horizontally facing up the holding surface, the wafer held from below the front Symbol wafer table on the wafer table according to Claim 17 The laser dicing method according to claim 11, wherein the laser dicing method is provided.
請求項１８に係る発明は、前記目的を達成するために、前記ウェーハテーブルは、前記保持面を下に向けて水平に設置され、前記ウェーハテーブルの上方から前記ウェーハテーブルに保持されたウェーハにレーザ光を照射することを特徴とする請求項１１〜１６のいずれか１項に記載のレーザダイシング方法を提供する。
The invention according to claim 18, in order to achieve the above object, the wafer table, the holding surface is provided horizontally toward the bottom, from the top of the front Symbol wafer table on the wafer held by the wafer table The laser dicing method according to claim 11, wherein the laser dicing method is provided.
Claims (2)
前記ウェーハテーブルの下方から前記ウェーハテーブルに保持された前記ウェーハにレーザ光を照射することを特徴とする請求項１１〜１６のいずれか１項に記載のレーザダイシング方法。 The wafer table is installed horizontally with the holding surface facing up ,
Laser dicing method according to any one of claims 11 to 16 from below the front Symbol wafer table and then irradiating a laser beam to the wafer held on the wafer table.
前記ウェーハテーブルの上方から前記ウェーハテーブルに保持されたウェーハにレーザ光を照射することを特徴とする請求項１１〜１６のいずれか１項に記載のレーザダイシング方法。 The wafer table is installed horizontally with the holding surface facing down ,
Laser dicing method according to any one of claims 11 to 16 from above the front Symbol wafer table and then irradiating a laser beam to the wafer held by the wafer table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011020999A JP5846470B2 (en) | 2011-02-02 | 2011-02-02 | Laser dicing apparatus and method, and wafer processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011020999A JP5846470B2 (en) | 2011-02-02 | 2011-02-02 | Laser dicing apparatus and method, and wafer processing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012160659A JP2012160659A (en) | 2012-08-23 |
| JP2012160659A5 true JP2012160659A5 (en) | 2014-03-06 |
| JP5846470B2 JP5846470B2 (en) | 2016-01-20 |
Family
ID=46840931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011020999A Active JP5846470B2 (en) | 2011-02-02 | 2011-02-02 | Laser dicing apparatus and method, and wafer processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5846470B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5860217B2 (en) * | 2011-03-04 | 2016-02-16 | 株式会社ディスコ | Laser processing equipment |
| JP5860219B2 (en) * | 2011-03-10 | 2016-02-16 | 株式会社ディスコ | Laser processing equipment |
| TWI512867B (en) * | 2012-12-14 | 2015-12-11 | Yayatech Co Ltd | Inspection method and inspection fixture for scribing lines of wafer |
| JP2014212282A (en) * | 2013-04-22 | 2014-11-13 | 株式会社ディスコ | Processing method of wafer |
| JP6151557B2 (en) * | 2013-05-13 | 2017-06-21 | 株式会社ディスコ | Laser processing method |
| DE102018200656A1 (en) * | 2018-01-16 | 2019-07-18 | Disco Corporation | Method for processing a wafer |
| JP6651208B1 (en) * | 2019-05-15 | 2020-02-19 | ハイソル株式会社 | Wafer chuck and chuck ring |
| JP7286503B2 (en) * | 2019-09-26 | 2023-06-05 | 株式会社ディスコ | Wafer processing method and wafer processing apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002248593A (en) * | 2000-12-21 | 2002-09-03 | Hitachi Metals Ltd | Method and jig for laser machining of sheet member |
| JP4770126B2 (en) * | 2003-06-06 | 2011-09-14 | 日立化成工業株式会社 | Adhesive sheet |
| JP2007275920A (en) * | 2006-04-05 | 2007-10-25 | Seiko Epson Corp | Substrate manufacturing method, display device, electrooptic apparatus, and electronic equipment |
| JP2009101384A (en) * | 2007-10-23 | 2009-05-14 | Olympus Corp | Laser beam machining method |
| JP2009262216A (en) * | 2008-04-28 | 2009-11-12 | Toyota Motor Corp | Laser beam machining method for transparent base material, and manufacturing method for electrolyte membrane |
| JP2010029930A (en) * | 2008-07-31 | 2010-02-12 | Disco Abrasive Syst Ltd | Laser beam machining apparatus and laser beam machining method |
-
2011
- 2011-02-02 JP JP2011020999A patent/JP5846470B2/en active Active
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