JP2012149338A5 - - Google Patents

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Publication number
JP2012149338A5
JP2012149338A5 JP2011205736A JP2011205736A JP2012149338A5 JP 2012149338 A5 JP2012149338 A5 JP 2012149338A5 JP 2011205736 A JP2011205736 A JP 2011205736A JP 2011205736 A JP2011205736 A JP 2011205736A JP 2012149338 A5 JP2012149338 A5 JP 2012149338A5
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JP
Japan
Prior art keywords
magnet
magnetic pole
plate
yoke plate
yoke
Prior art date
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Granted
Application number
JP2011205736A
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English (en)
Japanese (ja)
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JP5873276B2 (ja
JP2012149338A (ja
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Publication date
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Priority to JP2011205736A priority Critical patent/JP5873276B2/ja
Priority claimed from JP2011205736A external-priority patent/JP5873276B2/ja
Priority to US13/328,793 priority patent/US9058962B2/en
Publication of JP2012149338A publication Critical patent/JP2012149338A/ja
Publication of JP2012149338A5 publication Critical patent/JP2012149338A5/ja
Priority to US14/696,909 priority patent/US9911526B2/en
Application granted granted Critical
Publication of JP5873276B2 publication Critical patent/JP5873276B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011205736A 2010-12-27 2011-09-21 磁石ユニットおよびマグネトロンスパッタリング装置 Active JP5873276B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011205736A JP5873276B2 (ja) 2010-12-27 2011-09-21 磁石ユニットおよびマグネトロンスパッタリング装置
US13/328,793 US9058962B2 (en) 2010-12-27 2011-12-16 Magnet unit and magnetron sputtering apparatus
US14/696,909 US9911526B2 (en) 2010-12-27 2015-04-27 Magnet unit and magnetron sputtering apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010291235 2010-12-27
JP2010291235 2010-12-27
JP2011205736A JP5873276B2 (ja) 2010-12-27 2011-09-21 磁石ユニットおよびマグネトロンスパッタリング装置

Publications (3)

Publication Number Publication Date
JP2012149338A JP2012149338A (ja) 2012-08-09
JP2012149338A5 true JP2012149338A5 (OSRAM) 2014-12-18
JP5873276B2 JP5873276B2 (ja) 2016-03-01

Family

ID=46315361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011205736A Active JP5873276B2 (ja) 2010-12-27 2011-09-21 磁石ユニットおよびマグネトロンスパッタリング装置

Country Status (2)

Country Link
US (2) US9058962B2 (OSRAM)
JP (1) JP5873276B2 (OSRAM)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104094368A (zh) * 2012-01-30 2014-10-08 三菱电机株式会社 磁路
US20150034476A1 (en) * 2013-07-08 2015-02-05 Veeco Instruments, Inc. Deposition of thick magnetizable films for magnetic devices
US10091594B2 (en) 2014-07-29 2018-10-02 Cochlear Limited Bone conduction magnetic retention system
US9583244B2 (en) * 2014-09-30 2017-02-28 Nichia Corporation Bonded magnet, bonded magnet component, and bonded magnet production method
US10130807B2 (en) 2015-06-12 2018-11-20 Cochlear Limited Magnet management MRI compatibility
US20160381473A1 (en) 2015-06-26 2016-12-29 Johan Gustafsson Magnetic retention device
US10917730B2 (en) * 2015-09-14 2021-02-09 Cochlear Limited Retention magnet system for medical device
EP4215240A1 (en) 2019-09-27 2023-07-26 Cochlear Limited Multipole magnet for medical implant system

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63317671A (ja) 1987-06-19 1988-12-26 Shinku Kikai Kogyo Kk スパッタリング方法および装置
JPH04175242A (ja) 1990-11-06 1992-06-23 Asahi Glass Co Ltd 無アルカリガラス
JPH05148642A (ja) * 1991-11-28 1993-06-15 Hitachi Ltd マグネトロンスパツタ装置
JPH11158625A (ja) * 1997-11-25 1999-06-15 Sony Corp マグネトロンスパッタ成膜装置
JP3803520B2 (ja) * 1999-02-22 2006-08-02 忠弘 大見 マグネット回転スパッタ装置
JP2001348863A (ja) 2000-06-05 2001-12-21 Nobumasa Noro 矢板用取付金物
JP2001348663A (ja) 2000-06-08 2001-12-18 Sony Corp スパッタリング装置
JP4175242B2 (ja) 2003-11-07 2008-11-05 松下電器産業株式会社 マグネトロンスパッタ装置および方法
US8500975B2 (en) * 2004-01-07 2013-08-06 Applied Materials, Inc. Method and apparatus for sputtering onto large flat panels
EP1710829A1 (de) * 2005-04-05 2006-10-11 Applied Films GmbH & Co. KG Magnetanordnung für ein Planar-Magnetron
US20100126848A1 (en) * 2005-10-07 2010-05-27 Tohoku University Magnetron sputtering apparatus
WO2007071719A1 (en) * 2005-12-22 2007-06-28 Oc Oerlikon Balzers Ag Method of manufacturing at least one sputter-coated substrate and sputter source
US20080296142A1 (en) * 2007-05-29 2008-12-04 Hien-Minh Huu Le Swinging magnets to improve target utilization
CN101595240B (zh) 2007-10-31 2012-05-23 佳能安内华股份有限公司 磁控管单元、磁控管溅射设备和制造电子器件的方法
JP2009299184A (ja) * 2008-05-12 2009-12-24 Canon Anelva Corp 磁場発生装置、磁場発生方法、スパッタ装置及びデバイスの製造方法
JP5730077B2 (ja) 2010-06-03 2015-06-03 キヤノンアネルバ株式会社 磁石ユニットおよびマグネトロンスパッタリング装置

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