JP2012148354A - Method of manufacturing fixed abrasive grain wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a fixed abrasive grain wire, while improving bonding strength between an abrasive grain and a wire body as well as machining and cutting performances using the abrasive grain, without adding a leveling agent in plating solution.SOLUTION: In the plating solution, an electrode member and the wire body are arranged opposite to each other. Application of reverse pulse voltage is repeated by applying a positive electrolytic pulse voltage so that the electrode member is an anode and the wire body is a cathode, and applying a reversed electrolytic pulse voltage so that the electrode member is a cathode and the wire body is an anode thereafter, as one cycle, to electro-deposit a plating layer including an abrasive grain group to the wire body, while exposing apexes of at least some of the abrasive grains of the abrasive grain group.

Description

  The present invention relates to a method for manufacturing a fixed abrasive wire in which abrasive grains are fixed to a wire by electrolytic plating.

  As a method for manufacturing a fixed abrasive wire used for cutting hard materials such as silicon and ceramic, a method has been proposed in which abrasive particles are fixed to the surface of a wire body by electrolytic plating (see, for example, Patent Document 1 below).

  Specifically, in Patent Document 1, the electrode plate and the wire body face each other in a plating tank containing a plating solution containing abrasive grains, the electrode plate serves as an anode, and the wire body serves as a cathode. And applying a voltage so as to deposit a plating layer containing the abrasive grains on the surface of the wire body, and including a leveling agent in the plating solution. Is disclosed.

  The manufacturing method described in Patent Document 1 includes a fixed abrasive that can improve the cutting performance or cutting performance of the abrasive while improving the fixing strength of the abrasive by including a leveling agent in the plating solution containing the abrasive. It is said that wires can be manufactured.

  That is, the leveling agent in the plating solution is preferentially adsorbed on a portion adjacent to the electrode plate that acts as an anode, that is, near the apex of the abrasive grains. As a result, the growth rate of the plating layer in the vicinity of the apex of the abrasive grains is that of the plating layer in the base end side portion (the portion of the abrasive grains close to the wire body) that is separated from the electrode plate. Slower than the growth rate. Accordingly, the plating layer deposited relatively thick on the base end side portion of the abrasive grains improves the adhesive strength of the abrasive grains while thinning the plating layer near the apex of the abrasive grains, or the cutting performance by the abrasive grains or It is said that cutting performance can be improved.

  However, by adding the leveling agent to the plating solution, the thickness of the plating layer deposited near the top of the abrasive grains can be reduced, but the leveling agent is adsorbed near the top of the abrasive grains. Therefore, this leveling agent may cause a problem that the cutting performance or cutting performance by the abrasive grains deteriorates.

  In addition, as described in Patent Document 1, the leveling agent has a difference in function depending on the type. Therefore, even with a leveling agent that exhibits an appropriate leveling effect on abrasive grains of a specific size and shape, the leveling effect is effective on abrasive grains of a different size and shape. Not exclusively.

  The abrasive grain group contained in the plating solution includes a plurality of abrasive grains each having a specific size and shape. Therefore, it is difficult to obtain an effective leveling effect with the leveling agent for this abrasive grain group.

Japanese Patent No. 4538049

  The present invention has been made in view of the above prior art, and is a method for producing a fixed abrasive wire in which abrasive grains are fixed to a wire body by electrolytic plating using a plating solution containing abrasive grains. A method for producing a fixed-abrasive wire capable of simultaneously improving the fixing strength of the abrasive grains to the wire body and improving the cutting performance or cutting performance of the abrasive grains without adding a leveling agent to the plating solution The purpose is to provide

  In order to achieve the above object, the present invention produces a fixed abrasive flow wire in which abrasive particles are fixed to the wire body by electrodepositing a plating layer on the wire body using a plating solution containing a group of abrasive grains. A positive electrolysis pulse voltage is applied so that the electrode member serves as an anode and the wire body serves as a cathode with the electrode member and the wire body facing each other in the plating solution; By repeating the application of the reverse pulse voltage with one cycle of applying the reverse electrolysis pulse voltage so that the electrode member serves as a cathode and the wire body serves as an anode, at least a part of the abrasive grains in the abrasive grain group is applied. Provided is a method for producing a fixed abrasive wire in which the plating layer including the abrasive grain group is electrodeposited on the wire body in a state where the top of the grain is exposed.

  Preferably, when the potential difference of the positive electrolysis pulse voltage is V (N), the potential difference V (R) of the reverse electrolysis pulse voltage is V (R) = 2 to 8 × V (N), and the inversion When the period of the pulse voltage is T, the pulse width T (N) of the positive electrolysis pulse voltage is T (N) = 0.7 to 0.9 × T and the pulse width T ( R) is T (R) = 0.05 to 0.2 × T.

  Preferably, the frequency of the inversion pulse voltage is 10 Hz to 3 KHz.

  In the various embodiments, the abrasive grains are coated with the same metal as a part or all of the metals contained in the plating solution at the stage of being contained in the plating solution.

  According to the method for producing a fixed abrasive wire according to the present invention, a positive electrolysis pulse voltage in which an electrode member disposed opposite to a wire body in a plating solution including an abrasive grain group serves as an anode and the wire body serves as a cathode. And then applying the reversal pulse voltage with one cycle of applying a reverse electrolysis pulse voltage such that the electrode member becomes a cathode and the wire body becomes an anode. Since the plating layer including the abrasive grain group is electrodeposited on the wire body in a state where the tops of at least some of the abrasive grains are exposed, the strength of fixing the abrasive grains to the wire body can be improved. The cutting performance or cutting performance by the abrasive grains can be improved while being planned.

In particular, since the effect can be obtained without adding a leveling agent to the plating solution, the cutting performance or cutting performance of abrasive grains caused by the leveling agent is not deteriorated, and various grains The said effect can be effectively show | played with respect to the abrasive grain group containing an abrasive grain of a diameter and a shape.
In addition, more abrasive grains are exposed from the plated layer while effectively preventing the abrasive grains from dropping than when at least a part of the abrasive grains of the abrasive grains group is exposed by dressing treatment or polishing treatment. be able to.

FIG. 1 is a schematic view of a plating tank used in a method for manufacturing a fixed abrasive wire according to an embodiment of the present invention. FIG. 2 (a) is a partial schematic cross-sectional view of a fixed abrasive wire manufactured by a conventional plating process. FIG. 2B is a partial schematic cross-sectional view of a fixed abrasive wire manufactured by the method for manufacturing a fixed abrasive wire according to an embodiment of the present invention. FIG. 3 is a particle size distribution diagram of an example of an abrasive grain group used in the method of manufacturing a fixed abrasive wire according to an embodiment of the present invention. FIG. 4 is a process schematic diagram in the method of manufacturing a fixed abrasive wire according to one embodiment of the present invention. FIG. 5 is a waveform diagram of the inversion pulse voltage used in the plating step in the method of manufacturing the fixed abrasive wire according to the embodiment of the present invention.

  Hereinafter, preferred embodiments of a method for producing a fixed abrasive wire according to the present invention will be described with reference to the accompanying drawings.

The fixed abrasive wire is fixed to a wire body such as carbon steel coated with copper such as diamond and is suitably used for cutting or cutting a hard material such as silicon or ceramic.
In the method for manufacturing a fixed abrasive wire according to the present embodiment, the abrasive grains are fixed to the wire body by electrodepositing a plating layer made of a plating solution containing the abrasive grains on the wire body.

In FIG. 1, the schematic diagram of the plating apparatus used for the manufacturing method which concerns on this Embodiment is shown.
As shown in FIG. 1, in the manufacturing method, the electrode member 20 becomes an anode and the wire body 5 is in a state where the electrode member 20 and the wire body 5 are opposed to each other in a plating solution 10 containing abrasive grains. Is applied with a positive electrolysis pulse voltage so that the electrode member 20 becomes a cathode, and then a reverse pulse with a process of applying a reverse electrolysis pulse voltage so that the electrode member 20 becomes a cathode and the wire body 5 becomes an anode. By repeatedly applying the voltage, the plating layer 11 (see FIG. 2B) is applied to the wire body 5 in a state including the abrasive grains 15 (see FIG. 2B below) forming the abrasive grain group. It is comprised so that it may precipitate on the surface.
In addition, the code | symbol 30 in FIG. 1 is a plating tank by which the said electrode member 20 and the said wire main body 5 are opposingly arranged in the state which accommodated the said plating solution 10. As shown in FIG.
Reference numeral 35 denotes a reserve tank for the plating solution 10, and the plating solution 10 is circulated between the plating tank 30 and the reserve tank 35 via a pump 40.

Thus, according to the manufacturing method according to the present embodiment, the plating layer 11 containing the abrasive grains 15 is deposited on the surface of the wire body 5 by repeatedly applying a reverse pulse voltage. The cutting performance or cutting performance of the abrasive grains 15 can be improved while improving the adhesion strength of the abrasive grains 15 to the wire body 5.
This point will be described in detail.

In a normal plating process, a voltage is applied so that the electrode member 20 is necessarily an anode and the wire body 5 is necessarily a cathode, and the plating layer 11 is deposited on the surface of the wire body 5.
In this case, the deposition rate of the plating layer 11 becomes faster in the region closer to the electrode member 20 acting as the anode.

Therefore, when a plating layer having a layer thickness sufficient to obtain a sufficient bonding strength of the abrasive grains 15 to the wire body 5 is formed, as shown in FIG. The layer thickness of the plating layer 11 at the top portion is increased.
Since the cutting action or the cutting action in the fixed abrasive wire is performed by the plurality of abrasive grains 15, when the plating layer 11 having a layer thickness is laminated on the top portion of the plurality of abrasive grains 15, the abrasive The cutting ability or cutting ability by the grains 15 deteriorates.

On the other hand, in the manufacturing method according to the present embodiment, the plating layer 11 including the abrasive grains 15 is deposited on the surface of the wire body 5 by repeatedly applying an inversion pulse voltage.
Here, as described above, the inversion pulse voltage includes a positive electrolysis pulse voltage in which the electrode member 20 serves as an anode and the wire body 5 serves as a cathode, and the electrode member 20 serves as a cathode and the wire body 5 serves as a cathode. And a reverse electrolysis pulse voltage that serves as an anode.

That is, the plating layer 11 including the abrasive grains 15 is deposited on the surface of the wire body 5 by applying a positive electrolysis pulse voltage, while the plating layer 11 is peeled off by applying the reverse electrolysis pulse voltage. It has become. At this time, a portion of the plated layer 11 that is close to the electrode member 20, that is, a portion that is stacked on the top portions of the plurality of abrasive grains 15 is peeled off preferentially.
Accordingly, as shown in FIG. 2 (b), the base end side portions of the plurality of abrasive grains 15 forming the abrasive grain group are firmly fixed to the wire body 5 by the plating layer 11, while the abrasive grain group is It is possible to improve the cutting ability or cutting ability of the abrasive grains 15 by exposing at least the top portions of the abrasive grains 15.

In particular, in the present embodiment, as described above, the plating layer 11 at the top of at least some of the abrasive grains 15 in the abrasive grain group is peeled off by applying a reverse electrolysis pulse voltage, and the plating solution There is no need to add a leveling agent in 10.
Therefore, the cutting ability or cutting ability due to the leveling agent adhering to the abrasive grains 15 is not reduced.

Furthermore, the leveling agent has a difference in function depending on the type. That is, in order to obtain an appropriate leveling effect with respect to an abrasive having a specific size and shape, it is necessary to use a dedicated leveling agent.
However, the abrasive grain group contained in the plating solution includes a plurality of abrasive grains 15 each having a specific size and shape. Therefore, it is difficult to effectively obtain a leveling effect for an abrasive grain group including a plurality of abrasive grains 15 having different sizes and shapes with a specific leveling agent.

  On the other hand, in the present embodiment, as described above, the plating layer 11 at the top of at least some of the abrasive grains 15 in the abrasive grain group is peeled off by applying a reverse electrolysis pulse voltage. Therefore, it is possible to effectively improve the cutting performance by improving the fixing strength of the plurality of abrasive grains 15 having different sizes and shapes.

  In addition, it is possible to expose at least a part of the abrasive grain group by dressing treatment or polishing process after depositing a plating layer containing the abrasive grain group on the surface of the wire body by a normal plating process. In the method, only about 20% of the abrasive grains in the group of abrasive grains can be exposed.

In this regard, a case where a diamond particle group having an average particle diameter of 15 μm by a laser diffraction scattering method is used as the abrasive grain group will be described as an example.
FIG. 3 shows a particle size distribution diagram of the diamond particle group.

  As shown in FIG. 3, the diamond particle group having an average particle diameter of 15 μm contains the largest number of diamond particles having a particle diameter of 15 μm, but includes particles having a particle diameter of 10 μm or less to particles having a particle diameter of 20 μm or more.

  If a polishing process is performed to such a degree that, for example, particles having a particle diameter of 15 μm are exposed to a group of diamond particles including particles having such various particle diameters, particles having a particle diameter larger than 15 μm are over-polished.

  That is, when diamond particles are exposed by polishing, it is necessary to set the polishing amount so that particles having a relatively large particle size do not fall off. For example, a particle size of 17 corresponding to about 20% of the entire particle group. Only diamond particles of 5 μm or more can be exposed.

  In contrast, in the present embodiment, the plating layer at the top of the diamond particles is preferentially peeled off by applying a reverse electrolysis pulse voltage, so that the adhesion strength of the diamond particles to the wire body is sufficiently maintained. More than half of the diamond particle group having an average particle diameter of 15 μm, for example, diamond particles having a particle diameter of about 13 μm or more can be exposed. This corresponds to about 70% of the entire particle group.

Here, specific steps of the manufacturing method according to the present embodiment will be described.
In FIG. 4, the process schematic diagram in the said manufacturing method is shown.

As shown in FIG. 4, the long wire main body supplied from the supply machine 100 passes through the following treatment tanks and is wound up by the winder 200.
The wire body is, for example, copper-plated carbon steel and has a diameter of 0.1 to 0.3 mm.

  As described above, the manufacturing method includes a pulse plating step of depositing a plating layer 11 including a plurality of abrasive grains 15 on the wire body 5 by repeatedly applying a reverse pulse voltage. Prior to the pulse plating step, Preferably, a pretreatment step can be included.

As shown in FIG. 4, the pretreatment process includes a degreasing process using a degreasing tank 110 and a water washing process using a water washing tank 120.
When the wire body 5 is previously coated by plating or the like, the pretreatment process further includes a coating peeling process using a coating peeling tank 130.

Further, the pretreatment process may include a strike plating process in the strike plating tank 140.
In the strike plating step, a thin plating layer is formed on the surface of the wire body 5 prior to the deposition of the plating layer 11, and the wire of the plating layer 11 including the abrasive grains 15 is formed by the thin plating layer. Adhesion to the main body can be improved.

  As described above, in the pulse plating step, the application of the positive electrolysis pulse voltage and the reverse electrolysis are performed in a state where the electrode member 20 and the wire body 5 are arranged to face each other in the plating solution 10 including the abrasive grain group. The inversion pulse voltage is applied repeatedly with the application of the pulse voltage as one cycle.

For example, diamond particles can be used as the abrasive grains 15, and nickel sulfamate can be used as the plating solution 10, for example.
The electrode member 20 can be made of nickel.

Preferably, the abrasive grains 15 of the group of abrasive grains are coated with the same metal as a part or all of the metals contained in the plating solution 10 when included in the plating solution 10. .
According to such a configuration, the fixing strength between the abrasive grains 15 and the plating layer 11 can be improved.

FIG. 5 shows a waveform diagram of the inversion pulse voltage.
As shown in FIG. 5, preferably, when the potential difference of the positive electrolysis pulse voltage is V (N), the potential difference V (R) of the reverse electrolysis pulse voltage is V (R) = 2 to 8 × V (N). When the period of the inversion pulse voltage is T, the pulse width T (N) of the positive electrolysis pulse voltage is T (N) = 0.7 to 0.9 × T and the pulse width of the reverse electrolysis pulse voltage T (R) is set to T (R) = 0.05 to 0.2 × T.

  In the illustrated form, the pulse width T (N) of the positive electrolysis pulse voltage is T (N) = 0.8 × T, and the pulse width T (R) of the reverse electrolysis pulse voltage is T (R) = 0. 1 × T, and an interval of 0.1 × T is provided between the application of the positive electrolysis pulse voltage and the application of the reverse electrolysis pulse voltage.

  The frequency of the inversion pulse voltage is preferably 10 Hz to 3 KHz.

As shown in FIG. 4, the manufacturing method may include a post-treatment after the plating process.
The post-treatment includes a post-plating process in the post-plating tank 150, a water-washing process in the water-washing tank 160, and a rust-proofing process process in the rust-proofing tank 170.
The post-plating step is a step for improving the adhesion strength of the abrasive grains 15, and the electrode member 20 and the wire body 5 are opposed to each other in the post-plating tank 150 in which the plating solution 10 is accommodated. In this state, a plating layer is deposited by applying a positive electrolysis voltage so that the electrode member 20 becomes an anode and the wire body 5 becomes a cathode.
In the state after the pulse plating step, the top of the abrasive grains 15 is exposed (that is, the plating layer 11 and the coating on the top of the abrasive grains 15 are peeled off), and the post-plating process. Depending on the plating process, the plating layer is not deposited on the exposed tops of the abrasive grains 15.

In the present embodiment, the pulse plating process is performed immediately after the strike plating process, but the present invention is not limited to such a form.
For example, it is possible to include a positive electroplating step between the strike plating step and the pulse plating step according to the voltage value and pulse width setting of the positive electrolysis pulse voltage and the reverse electrolysis pulse voltage in the pulse plating step. is there.
That is, a positive electrolytic plating process is included between the strike plating process and the pulse plating process as long as the tops of at least some of the abrasive grains 15 in the abrasive grain group are exposed at the end of the pulse plating process. Is also possible.

5 Wire body 10 Plating solution 11 Plating layer 15 Abrasive grain 20 Electrode member

Claims (4)

A method of manufacturing a fixed abrasive flow wire in which abrasive particles are fixed to the wire body by electrodepositing a plating layer on the wire body using a plating solution containing a group of abrasive grains,
A positive electrolysis pulse voltage is applied so that the electrode member serves as an anode and the wire body serves as a cathode in a state where the electrode member and the wire body are opposed to each other in the plating solution. And by repeating the application of the reverse pulse voltage with one cycle of the process of applying the reverse electrolysis pulse voltage so that the wire body becomes the anode, the top part of at least a part of the abrasive grains of the abrasive grain group is exposed. A method for producing a fixed abrasive wire, comprising electrodepositing the plating layer including the abrasive grain group on the wire body in a state. When the potential difference of the positive electrolysis pulse voltage is V (N), the potential difference V (R) of the reverse electrolysis pulse voltage is V (R) = 2-8 × V (N),
When the period of the inversion pulse voltage is T, the pulse width T (N) of the positive electrolysis pulse voltage is T (N) = 0.7 to 0.9 × T and the pulse width of the reverse electrolysis pulse voltage T (R) is made into T (R) = 0.05-0.2 * T, The manufacturing method of the fixed abrasive wire of Claim 1 characterized by the above-mentioned.   The method of manufacturing a fixed abrasive wire according to claim 1 or 2, wherein the frequency of the inversion pulse voltage is 10 Hz to 3 KHz.   The abrasive grain is coated with the same metal as a part or all of the metal contained in the plating solution in the stage of being contained in the plating solution. The manufacturing method of the fixed abrasive wire of crab.

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