JP2010052070A - Electrodeposition bonded abrasive tool, method of manufacturing the same, and abrasive grain used for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of stably manufacturing an electrodeposition bonded abrasive tool having an adequate bonding force for abrasive grains and the original sharpness of the abrasive grain. <P>SOLUTION: A grain where the same metal as a part or the whole of metal constituting a metallic plated layer coated on a surface of a substrate formed of metal or metal having affinity for the metal constituting the metallic plated layer is coated on a part of the surface of the abrasive grain contained in an electrolytic solution and the coating of the metal is not imparted to the remaining part of the abrasive grain is used as an abrasive grain. The substrate is immersed in the electrolytic solution containing a plurality of the abrasive grains and cations of metal to be plated, and metal reduced from the cation is deposited together with the plurality of the abrasive grains contained in the electrolytic solution on the surface of the substrate to be a cathode, so that electrodeposition bonded abrasive tool having the coating of the metallic plated layer containing the plurality of the abrasive grains is manufactured. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electrodeposited fixed abrasive tool, a method for manufacturing the same, and an abrasive used for manufacturing the electrodeposited fixed abrasive tool.

  Various types of abrasive processing tools in which abrasive grains are fixed to a tool body by a plating method are used. As the plating bath, a nickel alloy bath having high hardness is mainly used. Since the tool manufactured in this way is excellent in wear resistance, it is used in combination with diamond abrasive grains and CBN abrasive grains, which are super abrasive grains also excellent in wear resistance. Among these, what uses the plating layer containing an abrasive grain in the state which adhered to the tool base metal (cathode at the time of electrolysis) is called an electrodeposition fixed abrasive tool in this application. As this electrodeposition fixed abrasive tool, for example, a fixed abrasive wire in which abrasive grains such as diamond abrasive grains are fixed to the wire, a linear blade such as a diamond band saw, a diamond blade saw, an inner peripheral grinding wheel, and an outer peripheral blade Examples thereof include a rotary blade such as a grindstone, and an electrodeposition wheel (grinding grindstone) of a rotary tool used for grinding or drilling.

  In order to facilitate understanding of the present invention, a fixed abrasive wire will be described as an example of an electrodeposited fixed abrasive tool.

  The fixed abrasive wire is a wire in which abrasive grains used for cutting, slicing, inner surface polishing, dicing or ingot cutting of hard materials such as silicon, quartz, and ceramic are fixed to the wire. If the example of use of this fixed abrasive wire is demonstrated, this fixed abrasive wire can be used for a wire saw, for example. With this wire saw, a thin wire row to which tension is applied is run, and a workpiece (for example, a silicon ingot) is pressed against the wire row while spraying a slurry-like abrasive containing abrasive grains on the wire row, It is an apparatus that cuts the workpiece into a wafer shape by the polishing action of the loose abrasive grains, and since it is possible to obtain a plurality of wafers at the same time, it is also called a multi-cutting method. FIG. 9 shows a schematic configuration diagram of a wire saw device used for processing single crystal silicon as an example.

  Referring briefly to FIG. 9, the wire 42 supplied from the feeding bobbin 41 forms a wire array having a predetermined pitch in a plurality of groove rollers 44 having a plurality of grooves via a plurality of guide rollers 43 for guiding the wire. Then, the workpiece 46 is cut into a wafer by spraying slurry-like free abrasive grains from the nozzle 47 toward the wire row while pressing the workpiece 46 against the wire row by the feed unit 45. The wire row is wound around a winding bobbin 49 through a number of guide rollers 48. The wire 42 travels by the driving force of the driving motor 50 attached to the groove roller 44. At this time, the movement information of the dancer rollers 51 and 52 is fed back to the rotation of the feeding bobbin 41 and the take-up bobbin 49, and a certain amount Tension is maintained. Usually, the wire 42 moves forward while performing a certain bidirectional traveling or one-way traveling according to a request from the viewpoint of quality such as effective use as a material and improvement in cut surface roughness, and is finally wound around the winding bobbin 49. .

  As the slurry-like free abrasive grains, generally, silicon carbide abrasive grains dispersed in an oil agent are often used. Mineral oils are used as oil agents, but due to environmental problems such as the need for organic solvents for cleaning, conversion to water-soluble ones based on glycol solvents is progressing. The characteristics of the wire saw using such loose abrasive grains are as follows: (1) Since the entire workpiece is cut at once, it can be processed in a large amount even if the cutting speed is not high. (2) Tool Since the wire is a wire, it is relatively easy to cut a large-diameter workpiece. (3) In addition to cutting using the polishing action of loose abrasive grains, the tool is a thin wire, so a thin wafer However, since slurry-like free abrasive grains are used, the abrasive grains are scattered on the workbench and dried, resulting in a fouling of the work environment, as well as waste liquid treatment and cutting. There are disadvantages such as the need to clean the wafers formed.

  Therefore, as a means for solving the above drawbacks, a wire in which diamond abrasive grains or the like are attached to a wire with a thermosetting resin binder or a photocurable resin binder, and the resin is thermoset or photocured to attach fixed abrasive grains. Has been proposed. However, the method of adhering abrasive grains to the wire with resin does not have sufficient adhesion force, so the abrasive grains fall off due to the frictional action associated with cutting in the process of cutting the workpiece into a wafer shape by vigorous reciprocation of the wire. there's a possibility that.

  Therefore, in order to solve the problems of the above-mentioned loose abrasive wire saw or wire saw using a wire in which abrasive particles are attached to a wire with a resin, a wire saw using an abrasive electrodeposition wire in which abrasive particles are fixed to the wire by an electrolytic method. Are proposed in Patent Documents 1 to 3.

  In Patent Document 1, as shown in FIG. 10, a first electrodeposition layer 63 obtained by electrodepositing coarse diamond abrasive grains 62 on a wire or ribbon material 61 and a first electrodeposition layer 63 on the first electrodeposition layer 63 as compared with the abrasive grains. A diamond electrodeposition wire or ribbon having a second electrodeposition layer 65 electrodeposited with fairly fine diamond abrasive grains 64 is disclosed.

  In Patent Document 2, as shown in FIG. 11, an electroplating layer 73 for depositing abrasive grains 72 on the surface of the wire 71, and an electroless method for strengthening the grounding state of the abrasive grains 72 outside the electroplating layer 73. An abrasive coated wire with a plated layer 74 is disclosed.

  In Patent Document 3, as shown in FIG. 12, the surface of the wire 81 is covered with a soft plating layer 82, and the soft plating layer 82 is further covered with a hard plating layer 83. 84, the inner end 85 of the superabrasive grain 84 is in the soft plating layer 82, and the outer end 86 of the superabrasive grain 84 is exposed to the outside of the hard plating layer 83 to be on the same cylindrical surface. A wire saw is disclosed.

  In the abrasive electrodeposition wire shown in FIGS. 10 to 12, the adhesion force of the abrasive grains to the plating layer is superior to that obtained by attaching the abrasive grains to the wire with a resin. In the process of cutting the wafer into a wafer, the frictional force generated along with the cutting is extremely large. Therefore, as shown in FIGS. The present inventors have confirmed that abrasive grains fall off within a relatively short period of time.

  Therefore, the present inventor manufactured an abrasive electrodeposited wire in which Ni-coated diamond abrasive grains obtained by coating abrasive grains (diamond) with the same metal component (nickel) as the plating layer were fixed to the wire by an electrolytic method. As a result, an abrasive electrodeposition wire having an outer shape as shown in FIG. 13 was obtained. In FIG. 13, diamond abrasive grains exist inside the protrusion 91. However, in this abrasive electrodeposition wire, the portion extending from the substantially flat portion to the curved projection 91 is a recess recessed inward, and stress concentration occurs in this recess. The inventor has confirmed that the adhesive strength of the abrasive grains to the plating layer is not at a level that can withstand actual use, and that the abrasive grains fall off within a relatively short period of time.

  In view of this, the present inventor has proposed a fixed abrasive wire in which abrasive grains are fixed to a wire and has an excellent fixing force. In the fixed abrasive wire proposed by the present inventor, the surface of the wire is coated with a metal plating layer containing a plurality of abrasive grains, and the surface of the metal plating layer has a substantially flat portion with curved projections containing the abrasive grains. Since it has a shape that protrudes from the surface and has a characteristic shape in which stress concentration is unlikely to occur in the portion from the substantially flat portion to the curved protrusion, it is accompanied by cutting in the process of cutting the workpiece. Even if a large frictional force is generated on the wire, the abrasive grains are less likely to fall off.

  By the way, the abrasive grains incorporated in the metal plating layer coated on the surface of the wire include the same metal as a part or all of the metal constituting the plating layer or a metal having an affinity for the metal constituting the plating layer. Often covered. This is because the familiarity between the abrasive grains and the metal plating layer is improved, and the effect of increasing the adhesion of the abrasive grains by the metal plating layer can be expected.

However, if the entire surface of the abrasive grains is coated with metal, there are the following disadvantages. That is, in a fixed abrasive wire in which abrasive grains such as diamond abrasive grains are fixed to the wire, the diamond abrasive grains themselves contribute to the cutting operation, and the metal coated with the diamond abrasive grains directly contributes to the cutting operation. do not do. Therefore, if the diamond abrasive grains are entirely covered with metal, there is a disadvantage that the original sharpness of the abrasive grains cannot be exhibited from the beginning of the cutting operation.
Japanese Unexamined Patent Publication No. 63-22275 Japanese Patent Laid-Open No. 9-1455 JP-A-9-150314

  The present invention has been made in view of the above-described problems of the prior art, and retains the adhesive strength of the abrasive grains to the extent necessary in actual work, and is essentially the original grain of the cutting work. A method for stably producing an electrodeposited fixed abrasive tool capable of exhibiting the sharpness of the electrode, an electrodeposited fixed abrasive tool produced by the method, and the electrodeposited fixed abrasive tool It is in providing the abrasive grain for.

  In order to achieve the above object, a method for producing an electrodeposition-fixed abrasive tool according to the present invention comprises immersing a metal substrate in an electrolyte containing a plurality of abrasive grains and a metal cation to be plated. A metal reduced from a cation together with a plurality of abrasive grains contained in an electrolytic solution on the surface of a base material which is a cathode by using the base material as a cathode and applying an appropriate potential difference between the anode and the cathode In the method of manufacturing an electrodeposition fixed abrasive tool having a coating of a metal plating layer containing a plurality of abrasive grains by precipitating, a part of the surface of the abrasive grains contained in the electrolyte is a base material The same metal as a part or all of the metal constituting the metal plating layer coated on the surface of the metal or a metal having affinity with the metal constituting the metal plating layer is coated, and the remainder of the abrasive grains is coated with the metal Used as abrasive grains It is characterized in Rukoto.

  The electrodeposition fixed abrasive tool of the present invention comprises a metal base material immersed in an electrolyte containing a plurality of abrasive grains and a metal cation to be plated, and the base material as a cathode. By applying an appropriate potential difference between the cathode and the cathode, a metal reduced from the cation is precipitated together with a plurality of abrasive grains contained in the electrolyte solution on the surface of the base material that is the cathode, whereby a plurality of abrasive In an electrodeposition fixed abrasive tool having a coating of a metal plating layer containing grains, the metal constituting the metal plating layer coated on the surface of the base material is part of the surface of the abrasive grains contained in the electrolytic solution By using the same metal as a part or all of the above or a metal having an affinity for the metal constituting the metal plating layer, and the rest of the abrasive grains not coated with metal is used as the abrasive grains. It is characterized by being obtained.

  Further, the abrasive used in the electrodeposition fixed abrasive tool of the present invention is obtained by immersing a metal base material in an electrolytic solution containing a plurality of abrasive grains and a metal cation to be plated. By providing an appropriate potential difference between the anode and the cathode, a metal reduced from a cation together with a plurality of abrasive grains contained in the electrolytic solution is deposited on the surface of the base material that is the cathode. Abrasive grains contained in the electrolytic solution for producing an electrodeposition-fixed abrasive tool having a coating of a metal plating layer containing a plurality of abrasive grains, the surface of the abrasive grains contained in the electrolytic solution A part is coated with the same metal as part or all of the metal constituting the metal plating layer to be coated on the surface of the base material or a metal having affinity with the metal constituting the metal plating layer, and the abrasive grains That the rest of the metal is not covered with metal. It is a symptom.

  According to the method for producing an electrodeposited fixed abrasive tool according to claim 1 and the electrodeposited fixed abrasive tool according to claim 2, a part of the surface of the abrasive grains contained in the electrolytic solution is formed on the surface of the base material. The same metal as a part or all of the metal constituting the metal plating layer to be coated or a metal having affinity with the metal constituting the metal plating layer is coated, and the remainder of the abrasive grains is coated with metal. Since the abrasive grains that are not used are used as abrasive grains, it is possible to retain the adhesive strength of the abrasive grains as required in actual work and to exhibit the original sharpness of the abrasive grains from the beginning of the cutting work.

  According to the abrasive grain of Claim 3, the abrasive suitable for the electrodeposition fixed abrasive tool manufacturing method of Claim 1 and the electrodeposition fixed abrasive tool of Claim 2 can be provided.

  Below, a fixed abrasive wire is demonstrated as an example of the electrodeposition fixed abrasive tool of this invention.

  The wire used for the fixed abrasive wire is not particularly limited as long as it can be electroplated and the strength and elastic modulus can withstand the tension between the guide roller and the groove roller. Steel wires such as piano wires, and metal wires such as tungsten wires and molybdenum wires.

  The diameter of the wire can be appropriately selected depending on the shape and characteristics of the work to be cut, and usually about 0.05 to 0.5 mm is often adopted, but even with a thin wire of 0.1 mm or less, Even if the line is thicker than 0.1 mm, the effect of the present invention is the same.

  It is preferred to degrease and clean the surface of the wire prior to electroplating. There is no restriction | limiting in particular in the degreasing method, For example, it can carry out by acid immersion, solvent degreasing, emulsifier degreasing, alkali degreasing, etc., and can also be finished by electrolytic degreasing as needed.

  The alkali degreased wire is preferably neutralized by passing through a pickling tank, and the type of acid is not particularly limited, and for example, sulfuric acid, hydrochloric acid or nitric acid is preferably used.

  The wire that has passed through the pickling tank is preferably washed by passing it through the washing tank.

  It is preferred to pre-treat the wire prior to electroplating. The pretreatment is a treatment for improving the adhesion of the plating layer. As the pretreatment, for example, strike plating can be performed, but the treatment is not limited thereto.

  There is no particular limitation on the method of performing electroplating on the wire surface following the pretreatment. For example, a plating layer is formed on the wire surface by connecting the cathode to the wire and connecting the anode to the plating solution to perform electroplating. Can be formed. In order to manufacture the fixed abrasive wire, for example, a plating solution containing nickel-containing organic acid or nickel-containing inorganic acid and abrasive grains can be used. Although not particularly limited, a nickel sulfamate plating solution can be used as the nickel-containing organic acid.

  Although it does not specifically limit as an abrasive grain, A diamond abrasive grain with a diameter of 100 micrometers or less can be used.

  Furthermore, when the plating solution contains a leveling agent, as will be described below, the force for fixing the abrasive grains to the plating layer is increased, and the effect that chips generated during cutting hardly stay on the wire surface is expected. it can.

  The leveling agent is added to promote smoothing of the plating film and impart gloss, and the surface of the plating film can be smoothed by a mechanism as described below.

  As shown in FIG. 1, which is a schematic diagram of an electroplating method, when a leveling agent is contained in the plating solution, 1 is an anode, and 2 is a target metal (cathode) to be plated. An additive 4 such as a leveling agent is preferentially adsorbed on the high current portion 3 on the surface of the target metal 2 located nearby. As a result, the surface of the target metal 2 on which the additive 4 has been adsorbed is the resistance of the additive 4, so that the surface of the target metal 2 is in the high current portion 3 and indented from the surface inside. The potential with the low current portion 5 far from the anode 1 is reversed, and the growth rate of the plating film 6 of the low current portion 5 is faster than that of the high current portion 3, and finally the plating film 6 is at a smooth level. According to the mechanism, the plating film 6 is formed until 7 is formed.

  By containing a leveling agent in the plating solution, it is possible to form abrasive grains that are excellent in adhesion to the plating film and hardly fall off by the mechanism described below by using the action of the leveling agent.

  In normal electroplating, as shown in FIG. 2, when the abrasive grains 11 previously coated with the same metal as the plating metal are fixed to the target metal 2 by the electrolytic method, the surface of the target metal 2 near the anode 10. The growth rate of the plating film 13 in the high current portion 12 is faster than the growth rate of the plating film in the low current portion 14 located far from the anode 10. However, by containing a leveling agent in the plating solution at the time of electroplating, the growth rate of the plating film of the low current portion 14 is faster than that of the high current portion 12 as described with reference to FIG. That is, as shown in FIG. 3, the growth of the plating film on the apex portion 15 of the abrasive grain 11 near the anode 10 is suppressed, and the plating of the bottom portion 16 that effectively contributes to fix the abrasive grain 11 to the plating film 13. The growth of the coating 13 is promoted, and the fixing force of the abrasive grains 11 by the plating coating 13 is increased.

  Further, as shown in FIG. 3, the shape of the plating film 13 is thicker than that of the base metal portion 16 near the target metal 2 to eliminate the recesses, so that a cut generated at the time of cutting compared to that of FIG. It is also possible to expect an effect that the waste hardly stays on the surface of the target metal 2.

  By the way, it is the abrasive grains 11 that actually perform the cutting operation, and the plating film 13 functions to fix the abrasive grains 11 so that they do not fall off during the cutting operation, as shown in FIG. In order to reduce the amount of the plating film 13 that is above the abrasive grains 11 and does not contribute to the cutting operation from the bottom portion 16, and exhibit the sharpness inherent in the abrasive grains 11, the apex 15 of the abrasive grains 11. Is preferably free of the plating film 13.

  As described above, the plating solution contains a leveling agent, thereby improving the adhesive force of the abrasive grains to the plating film, and it is possible to expect an effect that chips generated during cutting are less likely to stay on the wire surface. By using abrasive grains coated with the same metal as the plating metal, there is an inconvenience that the original sharpness of the abrasive grains cannot be exhibited.

  Therefore, as shown in the following examples, by performing electroplating using an electrolytic solution containing abrasive grains coated with the same metal as the plating metal on only a part of the surface of the abrasive grains, the metal plating layer is obtained. Thus, it is possible to manufacture an electrodeposition-fixed abrasive tool with excellent sharpness while securing the necessary fixing force of the abrasive grains.

  The electroplated wire is preferably washed by passing it through a washing tank.

Examples of the present invention will be described below. However, the present invention is not limited to the following examples, and can be appropriately changed and modified without departing from the technical scope of the present invention.
(1) Manufacture of diamond abrasive grains coated with metal on part of the surface << Diamond abrasive grains used as material >>
Diamond abrasive grains used as a material include diamond abrasive grains (with a particle size of 30 to 40 μm) in which a Ni-P coating is formed on all surfaces in advance by electroless plating, and diamonds on which such a coating is not formed. Both abrasive grains (having a particle size of 30-40 μm) were used.

  That is, a diamond pulverized product having a particle size of 30 to 40 μm is subjected to a catalytic treatment with a catalyst treatment solution having the composition shown in Table 1 below, and the diamond crushed product after the catalyst treatment is subjected to the following table. By applying electroless plating of Ni-P using an electroless plating bath having the composition shown in No. 2, diamond abrasive grains having a Ni-P coating formed on the entire surface were obtained.

<< Manufacture of diamond abrasive grains with metal coated on part of the surface >>
a. When using diamond abrasive grains not formed with a Ni-P coating as a raw material As shown in FIG. 4 (a), the surface of a polyvinyl chloride sheet 21 having a thickness of 10 mm has a particle diameter of about A wax film 22 was formed by applying a wax having a melting point of 160 ° C. so as to be half the film thickness (thickness of about 15 to 20 μm). A large number of diamond abrasive grains 23 were dispersed on the wax film 22.

  Further, as shown in FIG. 4 (b), a sheet 24 of urethane foam (foamed urethane) excellent in heat resistance is pressed onto the diamond abrasive grains 23, so that a polyvinyl chloride sheet 21, a wax film 22 and diamonds are pressed. The total temperature of the abrasive grains 23 was set to about 120 ° C. As a result, a part of the surface of each diamond abrasive grain 23 was pushed into the softened wax film 22.

  Thereafter, the urethane foam sheet 24 was removed, and a polyvinyl chloride sheet 21 having a wax film 22 into which a part of the surface of each diamond abrasive grain 23 was pressed was adjusted to a pH of 3 and the composition shown in Table 3 below. After pretreatment by immersing in a catalyst plating solution at room temperature for 10 minutes, the polyvinyl chloride sheet 21 is heated for 6 minutes using an electroless plating bath having a pH of 3 and the composition shown in Table 4 below. By applying electroless plating of Ni—P, a Ni—P film was formed on the portion of each diamond abrasive grain 23 that was not covered with wax.

b. When diamond abrasive grains having a Ni-P coating formed on the entire surface are used as a raw material In the same manner as the operations shown in FIGS. 4 (a) and 4 (b), a polyvinyl chloride sheet 21 having a thickness of 10 mm is formed. A wax film 22 was formed on the surface, and a part of the surface of each of the diamond abrasive grains 23 was pushed into the softened wax film 22.

  Then, the urethane foam sheet 24 was removed, and the polyvinyl chloride sheet 21 on which the wax film 22 was formed was replaced with an 80 ° C. nickel stripping solution having a pH of 13 and the composition shown in Table 5 below (Okuno Pharmaceutical Co., Ltd.). Was immersed for 9 minutes, the Ni-P coating on the surface of each diamond abrasive grain 23 not covered with wax was peeled off.

<< Recovery of diamond abrasive grains with a metal coating on part of the surface >>
After removing the wax by immersing the polyvinyl chloride sheet subjected to the treatments as described above in a and b in toluene, the collected diamond abrasive grains are filtered using a filter paper, so that the surface of all the diamond abrasive grains is removed. It was confirmed that a Ni-P film was formed on a part.
(2) Preparation of Test Electrodeposition Fixed Abrasive Tool Diamond abrasive grains produced as described above, with a Ni-P coating formed on a part of the surface by plating, and Ni on a part of the surface by peeling method Electrodeposition fixed abrasive using diamond abrasive grains with a -P coating formed, diamond abrasive grains with a Ni-P coating formed on the entire surface, and diamond abrasive grains with no Ni-P coating formed A grain tool was produced. Specifically, diamond abrasive grains were electrolytically deposited on a 10 mm tip portion of a S45C rod (length: 100 mm) having a diameter of 10 mm. That is, after degreasing the surface of the S45C bar and pickling, strike plating was performed under the composition and electrolysis conditions shown in Table 6 below, and then composite plating was performed under the composition and electrolysis conditions shown in Table 7 It was. Furthermore, with respect to some tools, post-plating, which is normally performed to improve the retention of abrasive grains by the plating film, was performed after composite plating. The bath composition of the post plating is the same as the bath composition not containing diamond abrasive grains in the composite plating bath of Table 7, and the conditions of the post plating are the same as those of Table 7.

As a strike plating bath for improving the adhesion, in addition to the watt bath shown in Table 6, a nickel chloride bath was also examined. As a result of evaluating the adhesion using a cemented carbide needle, Since there was less peeling of the plating film when used, the watt bath shown in Table 6 was adopted as the strike plating bath.
(3) Eutectoid Amount of Abrasive Grain of Test Electrodeposition Fixed Abrasive Tool Regarding the electrolysis time in composite plating, the working time was adjusted so that the amount of eutectoid of the abrasive grains was the same. The electrolytic work time is shown in FIG. The vertical axis in FIG. 5 indicates the electrolytic work time, and the horizontal axis indicates the type of abrasive grains. Symbols A, B, C, and D on the horizontal axis represent diamond abrasive grains in which no Ni-P coating is formed (no post-plating), and diamond abrasive grains in which the Ni-P coating is formed on the entire surface (post-plating). None), diamond abrasive grains with Ni-P coating formed on a part of the surface by a peeling method (no post-plating), diamond abrasive grains with Ni-P coating formed on a part of the surface by a plating method (post-plating) None). As in the conventional knowledge, FIG. 5 shows that the electrolytic work time (B) of the diamond abrasive grains with the Ni-P coating formed on the entire surface is short, and the electrolytic work time of the diamond abrasive grains with no Ni-P coating formed. (A) shows that it is long.

On the other hand, the electrolytic work time of the diamond abrasive grains having a Ni-P film formed on a part of the surface is an intermediate value between them, and the diamond abrasive grains having a Ni-P film formed on a part of the surface by a peeling method. The reason why the electrolysis operation time (C) is longer than that of the plating method (D) seems to be because the Ni-P coating was not peeled off satisfactorily.
(4) Surface observation result of test electrodeposition fixed abrasive tool FIG. 6 shows the result of observing the surface of the test electrodeposition fixed abrasive tool produced as described above with an optical microscope (200 times). FIG. 6A shows the case of diamond abrasive grains in which no Ni—P coating is formed. In FIG. 6A, the slightly black lump portion indicates diamond abrasive grains. The boundary surface between the diamond abrasive grains and the base plating film can be clearly recognized, and no plating film is recognized on the surface of the diamond abrasive grains.

  FIG.6 (b) shows the case of the diamond abrasive grain in which the Ni-P film was formed in the whole surface. A plating film that looks somewhat white can be recognized on the surface of the diamond abrasive grains that are in the form of black lump. Moreover, a mode that the diamond abrasive grain has aggregated is seen.

FIG.6 (c) shows the case of the diamond abrasive grain in which the Ni-P film was formed in a part of surface by the plating method. The dispersion state of the diamond abrasive grains, which are a little black, is close to that shown in FIG. In addition, a whitish plating film is deposited around a slightly black block of diamond abrasive grains so as to form a skirt. It is considered that the holding power of the diamond abrasive grains can be obtained by the plating film forming the base.
(5) Cutting Experiment with Test Electrodeposition Fixed Abrasive Tool FIG. 7 is a diagram for explaining a cutting experiment method with the test electrodeposition fixed abrasive tool produced as described above.

In FIG. 7, the test electrodeposition fixed abrasive tool 32 produced on the spindle 31 of the machining center is held in a state protruding 50 mm from a chuck (not shown), and the thickness t is 1 mm at the electrolytic precipitation portion of the abrasive grains. Then, the end face 34 of the soda glass 33 having a width w of 25 mm was cut. The goal is to cut 5 μm in the L direction by one reciprocation in the width w direction, and the actual cutting amount of the soda glass 33 when the reciprocation is made 10 times in the width w direction is the weight change of the soda glass 33 before and after cutting. I asked for it. The feed rate in the width w direction of the test electrodeposition fixed abrasive tool 32 is 15 mm / min. During cutting, the cutting fluid is discharged at a discharge rate of 1 cm ³ / min from the nozzle 35 and the test electrodeposition fixed abrasive tool 32 and soda. The glass 33 was supplied to the contact portion.

  FIG. 8 shows the cutting result. The vertical axis in FIG. 8 indicates the actual cutting amount (g), and the horizontal axis indicates the type of abrasive grains. Symbols A1, A2, B1, B2, C1, C2, D1, and D2 on the horizontal axis are diamond abrasive grains without Ni-P coating (no post-plating), and Ni-P coating is not formed at all. No diamond abrasive grains (with post-plating), diamond abrasive grains with Ni-P coating formed on the entire surface (without post-plating), diamond abrasive grains with Ni-P coating formed on the entire surface (with post-plating), Diamond abrasive grains with Ni-P coating formed on a part of the surface by a peeling method (without post-plating), Diamond abrasive grains with Ni-P coating formed on a part of the surface by a peeling method (with post-plating), Diamond abrasive grains with Ni-P coating formed on part of the surface by plating (no post-plating), Diamond abrasive grains with Ni-P coating formed on part of the surface by plating (with post-plating) Show.

  Since the diameter (10 mm) of the test electrodeposition fixed abrasive tool 32 shown in FIG. 7 is thin, the test electrodeposition fixed abrasive tool 32 is easy to bend in the direction in which the cutting is reduced by the resistance during cutting. Therefore, the actual cutting amount decreases as the resistance during cutting increases.

  As shown in FIG. 8, the actual cutting amount of the tools (A1, A2) having diamond abrasive grains in which no Ni—P coating is formed is the largest, indicating that the sharpness is excellent.

  It can be seen that the actual cutting amount of the tools (B1, B2) having diamond abrasive grains with the Ni-P coating formed on the entire surface is the smallest and the sharpness is poor.

  The actual cutting amount of a tool (C1, C2, D1, D2) having diamond abrasive grains having a Ni-P coating formed on a part of the surface is an intermediate value between A1, A2, and B1, B2. The actual cutting amount of the diamond abrasive grains (C1, C2) having a Ni-P coating formed on a part of the surface by the peeling method is slightly less than that by the plating method (D1, D2). It seems that this was not done well.

  Moreover, in any tool having diamond abrasive grains, the actual cutting amount of a tool having diamond abrasive grains subjected to post plating is slightly smaller than that of a tool having no post plating.

FIG. 1 is a view for explaining the smoothing action of the plating film surface by the leveling agent. FIG. 2 is a diagram for explaining the growth of a plating film in general electroplating. FIG. 3 is a view for explaining the growth of the plating film when the leveling agent is contained in the electroplating bath, and shows the case where the abrasive is previously coated with the same metal as the plating metal. FIG. 4A is a diagram showing a wax film formed on the surface of a polyvinyl chloride sheet and diamond abrasive grains, and FIG. 4B is a diagram in which a urethane foam sheet is pressed onto the diamond abrasive grains. It is a figure explaining the method of pushing a diamond abrasive grain in a wax film | membrane. FIG. 5 is a diagram showing the relationship between the electrolytic work time and abrasive grains in composite plating. FIG. 6 is an optical micrograph of the surface of the test electrodeposition fixed abrasive tool. FIG. 6 (a) is a diamond abrasive with no Ni-P coating formed, and FIG. In the case of diamond abrasive grains in which the Ni—P coating is formed on the entire surface, FIG. 6C shows the case of diamond abrasive grains in which a Ni—P coating is formed on a part of the surface by plating. FIG. 7 is a diagram for explaining a cutting experiment method using a test electrodeposition fixed abrasive tool. FIG. 8 is a diagram for explaining the results of a cutting experiment using a test electrodeposition fixed abrasive tool. FIG. 9 is a schematic configuration diagram of a general wire saw device. FIG. 10 is a view showing a cross section of a conventional abrasive electrodeposition wire. FIG. 11 is a view showing a cross section of another conventional electrodeposited wire for abrasive grains. FIG. 12 is a view showing a cross section of still another conventional abrasive electrodeposition wire. FIG. 13 is an enlarged photograph (2700 times) of the surface of a conventional abrasive electrodeposition wire.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Anode 2 Target metal 3 High current part 4 Additive 5 Low current part 6 Plating film 7 Smooth level 10 Anode 11 Abrasive grain 12 High current part 13 Plating film 14 Low current part 15 Vertex part 16 Side part 21 Polyvinyl chloride sheet 31
22 Wax film 23 Diamond abrasive grain 24 Urethane foam sheet 31 Main spindle of machining center 32 Test electrodeposition fixed abrasive tool 33 Soda glass 34 End face 35 Nozzle 41 Feeding bobbin 42 Wire 43 Guide roller 44 Groove roller 45 Feed unit 46 Workpiece 47 Nozzle 48 Guide roller 49 Winding bobbin 50 Drive motor 51 Dancer roller 52 Dancer roller 61 Wire 62 Coarse diamond abrasive grain 63 First electrodeposition layer 64 Fine diamond abrasive grain 65 Second electrodeposition layer 71 Wire 72 Abrasive grain 73 Electroplating layer 74 Electroless Plating Layer 81 Wire 82 Soft Plating Layer 83 Hard Plating Layer 84 Super Abrasive Grain 85 Inner End 86 Outer End 91 Projection

Claims (3)

  A metal base is immersed in an electrolytic solution containing a plurality of abrasive grains and a metal cation to be plated, and the base is used as a cathode, and an appropriate potential difference is provided between the anode and the cathode. Thus, an electrode having a coating of a metal plating layer containing a plurality of abrasive grains by precipitating a metal reduced from cations together with a plurality of abrasive grains contained in the electrolytic solution on the surface of the base material that is a cathode. In the method of manufacturing a fixed abrasive grain tool, a part of the surface of the abrasive grains contained in the electrolytic solution may be the same metal as a part or all of the metal constituting the metal plating layer coated on the surface of the base material. An electrodeposition-fixed abrasive tool characterized in that a metal having an affinity for the metal constituting the metal plating layer is coated, and the remaining abrasive grains are not coated with a metal as abrasive grains. Manufacturing method.   A metal base is immersed in an electrolytic solution containing a plurality of abrasive grains and a metal cation to be plated, and the base is used as a cathode, and an appropriate potential difference is provided between the anode and the cathode. Thus, an electrode having a coating of a metal plating layer containing a plurality of abrasive grains by precipitating a metal reduced from cations together with a plurality of abrasive grains contained in the electrolytic solution on the surface of the base material that is a cathode. In a fixed abrasive tool, a part of the surface of the abrasive grains contained in the electrolytic solution may be the same metal as part or all of the metal constituting the metal plating layer coated on the surface of the base material or the above metal plating layer An electrodeposition-fixed abrasive tool obtained by coating a metal having an affinity for the metal constituting the metal and using the remaining abrasive grains not coated with a metal as the abrasive grains .   A metal base is immersed in an electrolytic solution containing a plurality of abrasive grains and a metal cation to be plated, and the base is used as a cathode, and an appropriate potential difference is provided between the anode and the cathode. Thus, an electrode having a coating of a metal plating layer containing a plurality of abrasive grains by precipitating a metal reduced from cations together with a plurality of abrasive grains contained in the electrolytic solution on the surface of the base material that is a cathode. A part of the surface of the abrasive grains contained in the electrolytic solution for manufacturing a fixed abrasive tool, and a metal plating layer coated on the surface of the base material It is characterized in that the same metal as a part or all of the constituent metal or a metal having an affinity for the metal constituting the metal plating layer is coated, and the remainder of the abrasive grains is not coated with the metal. Abrasive grain.