JP2012144678A5 - - Google Patents

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Publication number
JP2012144678A5
JP2012144678A5 JP2011006116A JP2011006116A JP2012144678A5 JP 2012144678 A5 JP2012144678 A5 JP 2012144678A5 JP 2011006116 A JP2011006116 A JP 2011006116A JP 2011006116 A JP2011006116 A JP 2011006116A JP 2012144678 A5 JP2012144678 A5 JP 2012144678A5
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JP
Japan
Prior art keywords
less
room temperature
fluidity
regarding
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011006116A
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English (en)
Japanese (ja)
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JP5647012B2 (ja
JP2012144678A (ja
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Priority to JP2011006116A priority Critical patent/JP5647012B2/ja
Priority claimed from JP2011006116A external-priority patent/JP5647012B2/ja
Publication of JP2012144678A publication Critical patent/JP2012144678A/ja
Publication of JP2012144678A5 publication Critical patent/JP2012144678A5/ja
Application granted granted Critical
Publication of JP5647012B2 publication Critical patent/JP5647012B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011006116A 2011-01-14 2011-01-14 ケイ素含有硬化性樹脂組成物 Expired - Fee Related JP5647012B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011006116A JP5647012B2 (ja) 2011-01-14 2011-01-14 ケイ素含有硬化性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011006116A JP5647012B2 (ja) 2011-01-14 2011-01-14 ケイ素含有硬化性樹脂組成物

Publications (3)

Publication Number Publication Date
JP2012144678A JP2012144678A (ja) 2012-08-02
JP2012144678A5 true JP2012144678A5 (cg-RX-API-DMAC10.html) 2013-12-26
JP5647012B2 JP5647012B2 (ja) 2014-12-24

Family

ID=46788578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011006116A Expired - Fee Related JP5647012B2 (ja) 2011-01-14 2011-01-14 ケイ素含有硬化性樹脂組成物

Country Status (1)

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JP (1) JP5647012B2 (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6143359B2 (ja) * 2013-11-19 2017-06-07 日本化薬株式会社 シリコーン変性エポキシ樹脂およびその組成物
JP6404110B2 (ja) 2014-12-18 2018-10-10 信越化学工業株式会社 シリコーン変性エポキシ樹脂と多価カルボン酸化合物を含有するエポキシ樹脂およびその硬化物
JP7771933B2 (ja) 2022-11-24 2025-11-18 信越化学工業株式会社 エポキシ基含有環状オルガノポリシロキサン、それを含む硬化性組成物およびその硬化物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001040066A (ja) * 1999-07-30 2001-02-13 Dow Corning Toray Silicone Co Ltd 紫外線硬化性組成物
JP2006249400A (ja) * 2005-02-10 2006-09-21 Sanyo Chem Ind Ltd エポキシ樹脂組成物
JP5248034B2 (ja) * 2007-04-23 2013-07-31 株式会社Ａｄｅｋａ ケイ素含有化合物、硬化性組成物及び硬化物
JP4707729B2 (ja) * 2008-03-31 2011-06-22 信越化学工業株式会社 剥離紙用低粘度紫外線硬化型シリコーン組成物
JP5251668B2 (ja) * 2009-03-27 2013-07-31 日油株式会社 熱硬化性樹脂組成物
WO2011065365A1 (ja) * 2009-11-30 2011-06-03 ナミックス株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP5734629B2 (ja) * 2010-11-25 2015-06-17 株式会社Adeka ポジ型感光性樹脂組成物及び永久レジスト
WO2013140601A1 (ja) * 2012-03-23 2013-09-26 株式会社Adeka ケイ素含有硬化性樹脂組成物

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