JP2012138561A - 発光装置及びその製造方法 - Google Patents
発光装置及びその製造方法 Download PDFInfo
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- JP2012138561A JP2012138561A JP2011142412A JP2011142412A JP2012138561A JP 2012138561 A JP2012138561 A JP 2012138561A JP 2011142412 A JP2011142412 A JP 2011142412A JP 2011142412 A JP2011142412 A JP 2011142412A JP 2012138561 A JP2012138561 A JP 2012138561A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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Abstract
【解決手段】 一次光を発光する発光素子と、前記一次光の一部を吸収して二次光を発光する波長変換部を備えた発光装置において、前記波長変換部は、少なくとも、第1の蛍光体を含む樹脂層からなる第1の波長変換部と第2の蛍光体を含む第2の波長変換部を含む複数の樹脂層からなり、前記第1の波長変換部は、前記第2の波長変換部より、前記発光素子に近い側に配置され、前記第2の波長変換部には、蛍光体を含まない光学的に透明な材料を配置していることを特徴とする。
【選択図】図1
Description
2 基板
3 パッケージ
4 発光素子
5 ワイヤ
6 第1の波長変換部
7、7´ 第2の波長変換部
10、10´ 発光装置
8 樹脂片
Claims (9)
- 一次光を発光する発光素子と、
前記一次光の一部を吸収して二次光を発光する波長変換部を備えた発光装置において、
前記波長変換部は、少なくとも、第1の蛍光体を含む樹脂層からなる第1の波長変換部と第2の蛍光体を含む第2の波長変換部を含む複数の樹脂層からなり、
前記第1の波長変換部は、前記第2の波長変換部より、前記発光素子に近い側に配置され、
前記第2の波長変換部には、蛍光体を含まない光学的に透明な材料を配置していることを特徴とする発光装置。 - 前記複数の樹脂層は、相対的に長い波長の二次光を発する順序で前記発光素子に近い側から配置されていることを特徴とする請求項1に記載の発光装置。
- 前記第1の波長変換部は、ナノ結晶である蛍光体を含む樹脂層から構成され、前記第2の波長変換部は、希土類付活蛍光体もしくは遷移金属元素付活蛍光体を含む樹脂層から構成されていることを特徴とする請求項2に記載の発光装置。
- 前記ナノ結晶蛍光体は、III―V族化合物半導体または、II―VI化合物半導体よりなることを特徴とする請求項3に記載の発光装置。
- 前記ナノ結晶蛍光体は、InPまたはCdSeのうち、少なくとも一つを含むことを特徴とする請求項4に記載の発光装置。
- 前記希土類付活蛍光体は、付活剤としてCeもしくはEuを含むことを特徴とする請求項5に記載の発光装置。
- 前記希土類付活蛍光体は、窒化物系蛍光体であることを特徴とする請求項3ないし5のいずれかに記載の発光装置。
- 前記希土類付活蛍光体は、サイアロン蛍光体であることを特徴とする請求項7に記載の発光装置。
- パッケージの底面上に発光素子を搭載する工程と、
前記発光素子を覆うように第1の蛍光体が混練された液状樹脂を注入して硬化させ、第1の波長変換部を形成する工程と、
前記第1の波長変換部の上に、第2の蛍光体及び蛍光体を含まない光学的に透明な材料が混練された液状樹脂を注入して硬化させ、第2の波長変換部を形成する工程を含むことを特徴とする発光装置の製造方法。
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JP2011142412A JP5231609B2 (ja) | 2010-12-08 | 2011-06-28 | 発光装置及びその製造方法 |
CN2011102153277A CN102376860A (zh) | 2010-08-05 | 2011-07-29 | 发光装置及其制造方法 |
US13/198,432 US8513872B2 (en) | 2010-08-05 | 2011-08-04 | Light emitting apparatus and method for manufacturing thereof |
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JP2010273091 | 2010-12-08 | ||
JP2011142412A JP5231609B2 (ja) | 2010-12-08 | 2011-06-28 | 発光装置及びその製造方法 |
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JP5231609B2 JP5231609B2 (ja) | 2013-07-10 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014041861A1 (ja) * | 2012-09-11 | 2014-03-20 | Nsマテリアルズ株式会社 | 半導体を利用した発光デバイス及びその製造方法 |
KR20150040933A (ko) * | 2012-08-08 | 2015-04-15 | 오스람 옵토 세미컨덕터스 게엠베하 | 광전자 반도체 소자, 변환 매체 박판 및 변환 매체 박판의 제조를 위한 방법 |
JP2016001735A (ja) * | 2014-05-21 | 2016-01-07 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP2018155968A (ja) * | 2017-03-17 | 2018-10-04 | 日亜化学工業株式会社 | 透光性部材の製造方法及び発光装置の製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9513000B2 (en) | 2010-09-29 | 2016-12-06 | Mitsubishi Hitachi Power Systems, Ltd. | Oxygen combustion system and method for operating same |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003101078A (ja) * | 2001-09-25 | 2003-04-04 | Toyoda Gosei Co Ltd | 発光装置 |
JP2004055632A (ja) * | 2002-07-17 | 2004-02-19 | Toshiba Corp | 半導体発光装置 |
JP2004161871A (ja) * | 2002-11-12 | 2004-06-10 | Nichia Chem Ind Ltd | 燒結蛍光体層 |
JP2005244226A (ja) * | 2004-02-23 | 2005-09-08 | Lumileds Lighting Us Llc | 波長変換型半導体発光素子 |
JP2006173498A (ja) * | 2004-12-17 | 2006-06-29 | Nichia Chem Ind Ltd | 発光装置 |
JP2006253336A (ja) * | 2005-03-10 | 2006-09-21 | Toyoda Gosei Co Ltd | 光源装置 |
JP2006303373A (ja) * | 2005-04-25 | 2006-11-02 | Matsushita Electric Works Ltd | 発光装置の製造方法と該発光装置を用いた照明器具 |
JP2008258171A (ja) * | 2008-05-07 | 2008-10-23 | Shizuo Fujita | 面状発光装置 |
JP2009094199A (ja) * | 2007-10-05 | 2009-04-30 | Sharp Corp | 発光装置、面光源、表示装置と、その製造方法 |
JP2009117831A (ja) * | 2007-11-02 | 2009-05-28 | Innolux Display Corp | 発光ダイオード |
JP2009161642A (ja) * | 2007-12-28 | 2009-07-23 | National Institute Of Advanced Industrial & Technology | 粘土を主成分とするフレキシブル蛍光フィルム |
WO2009123726A2 (en) * | 2008-03-31 | 2009-10-08 | Cree, Inc. | Emission tuning methods and devices fabricated utilizing methods |
JP2009272634A (ja) * | 2008-05-02 | 2009-11-19 | Cree Inc | 蛍光体により変換された白色発光ダイオード用の封止法 |
WO2009144922A1 (ja) * | 2008-05-30 | 2009-12-03 | 株式会社 東芝 | 白色ledおよびそれを用いたバックライトならびに液晶表示装置 |
JP2009295870A (ja) * | 2008-06-06 | 2009-12-17 | Panasonic Corp | 発光素子及び該発光素子を用いたバックライト装置 |
JP2009545888A (ja) * | 2006-08-03 | 2009-12-24 | インテマティックス・コーポレーション | 光放出蛍光体を包含するled照明配置 |
JP2010056398A (ja) * | 2008-08-29 | 2010-03-11 | Toshiba Corp | 発光デバイス及び発光装置 |
JP2010126596A (ja) * | 2008-11-26 | 2010-06-10 | Showa Denko Kk | 液状硬化性樹脂組成物、ナノ粒子蛍光体を含む硬化樹脂の製造方法、発光装置の製造方法、発光装置及び照明装置 |
JP2010199400A (ja) * | 2009-02-26 | 2010-09-09 | Toyoda Gosei Co Ltd | 発光装置の製造方法 |
-
2011
- 2011-06-28 JP JP2011142412A patent/JP5231609B2/ja not_active Expired - Fee Related
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003101078A (ja) * | 2001-09-25 | 2003-04-04 | Toyoda Gosei Co Ltd | 発光装置 |
JP2004055632A (ja) * | 2002-07-17 | 2004-02-19 | Toshiba Corp | 半導体発光装置 |
JP2004161871A (ja) * | 2002-11-12 | 2004-06-10 | Nichia Chem Ind Ltd | 燒結蛍光体層 |
JP2005244226A (ja) * | 2004-02-23 | 2005-09-08 | Lumileds Lighting Us Llc | 波長変換型半導体発光素子 |
JP2006173498A (ja) * | 2004-12-17 | 2006-06-29 | Nichia Chem Ind Ltd | 発光装置 |
JP2006253336A (ja) * | 2005-03-10 | 2006-09-21 | Toyoda Gosei Co Ltd | 光源装置 |
JP2006303373A (ja) * | 2005-04-25 | 2006-11-02 | Matsushita Electric Works Ltd | 発光装置の製造方法と該発光装置を用いた照明器具 |
JP2009545888A (ja) * | 2006-08-03 | 2009-12-24 | インテマティックス・コーポレーション | 光放出蛍光体を包含するled照明配置 |
JP2009094199A (ja) * | 2007-10-05 | 2009-04-30 | Sharp Corp | 発光装置、面光源、表示装置と、その製造方法 |
JP2009117831A (ja) * | 2007-11-02 | 2009-05-28 | Innolux Display Corp | 発光ダイオード |
JP2009161642A (ja) * | 2007-12-28 | 2009-07-23 | National Institute Of Advanced Industrial & Technology | 粘土を主成分とするフレキシブル蛍光フィルム |
WO2009123726A2 (en) * | 2008-03-31 | 2009-10-08 | Cree, Inc. | Emission tuning methods and devices fabricated utilizing methods |
JP2009272634A (ja) * | 2008-05-02 | 2009-11-19 | Cree Inc | 蛍光体により変換された白色発光ダイオード用の封止法 |
JP2008258171A (ja) * | 2008-05-07 | 2008-10-23 | Shizuo Fujita | 面状発光装置 |
WO2009144922A1 (ja) * | 2008-05-30 | 2009-12-03 | 株式会社 東芝 | 白色ledおよびそれを用いたバックライトならびに液晶表示装置 |
JP2009295870A (ja) * | 2008-06-06 | 2009-12-17 | Panasonic Corp | 発光素子及び該発光素子を用いたバックライト装置 |
JP2010056398A (ja) * | 2008-08-29 | 2010-03-11 | Toshiba Corp | 発光デバイス及び発光装置 |
JP2010126596A (ja) * | 2008-11-26 | 2010-06-10 | Showa Denko Kk | 液状硬化性樹脂組成物、ナノ粒子蛍光体を含む硬化樹脂の製造方法、発光装置の製造方法、発光装置及び照明装置 |
JP2010199400A (ja) * | 2009-02-26 | 2010-09-09 | Toyoda Gosei Co Ltd | 発光装置の製造方法 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150040933A (ko) * | 2012-08-08 | 2015-04-15 | 오스람 옵토 세미컨덕터스 게엠베하 | 광전자 반도체 소자, 변환 매체 박판 및 변환 매체 박판의 제조를 위한 방법 |
JP2015524620A (ja) * | 2012-08-08 | 2015-08-24 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス半導体デバイス、変換手段プレートおよび変換手段プレートの製造方法 |
US9406847B2 (en) | 2012-08-08 | 2016-08-02 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component, conversion-medium lamina and method for producing a conversion-medium lamina |
KR102033203B1 (ko) | 2012-08-08 | 2019-10-16 | 오스람 옵토 세미컨덕터스 게엠베하 | 광전자 반도체 소자, 변환 매체 박판 및 변환 매체 박판의 제조를 위한 방법 |
WO2014041861A1 (ja) * | 2012-09-11 | 2014-03-20 | Nsマテリアルズ株式会社 | 半導体を利用した発光デバイス及びその製造方法 |
JP2014056896A (ja) * | 2012-09-11 | 2014-03-27 | Ns Materials Kk | 半導体を利用した発光デバイス及びその製造方法 |
JP2016001735A (ja) * | 2014-05-21 | 2016-01-07 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP2018155968A (ja) * | 2017-03-17 | 2018-10-04 | 日亜化学工業株式会社 | 透光性部材の製造方法及び発光装置の製造方法 |
US10840415B2 (en) | 2017-03-17 | 2020-11-17 | Nichia Corporation | Method for manufacturing light-transmissive member and method for manufacturing light-emitting device |
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