|
DE860795C
(de)
*
|
1939-03-23 |
1952-12-22 |
Hoechst Ag |
Verfahren zur Herstellung von aliphatischen Dinitroalkoholen
|
|
US2632022A
(en)
|
1950-07-07 |
1953-03-17 |
Rohm & Haas |
Method of preparing 1, 8-diamino-p-menthane
|
|
US2897179A
(en)
|
1956-07-18 |
1959-07-28 |
Union Carbide Corp |
Hardener for epoxy resin composition
|
|
US3488831A
(en)
*
|
1967-04-14 |
1970-01-13 |
Continental Can Co |
Fluxing materials for soldering metal surfaces
|
|
BE786932A
(fr)
*
|
1971-07-28 |
1973-01-29 |
Int Nickel Ltd |
Fondants de soudage
|
|
US3814638A
(en)
*
|
1972-05-05 |
1974-06-04 |
Int Nickel Co |
Soldering fluxes
|
|
US4028143A
(en)
*
|
1974-12-30 |
1977-06-07 |
Chevron Research Company |
Wax-flux composition containing a succinimide salt of an alkylaryl sulfonic acid for soldering
|
|
US4165244A
(en)
*
|
1977-10-21 |
1979-08-21 |
Jacobs Norman L |
Soldering flux and method of using same
|
|
US4196024A
(en)
*
|
1978-11-02 |
1980-04-01 |
E. I. Du Pont De Nemours And Company |
Alkyl phosphate soldering fluxes
|
|
US4360144A
(en)
*
|
1981-01-21 |
1982-11-23 |
Basf Wyandotte Corporation |
Printed circuit board soldering
|
|
USRE32309E
(en)
*
|
1983-10-31 |
1986-12-16 |
Scm Corporation |
Fusible powdered metal paste
|
|
GB8900381D0
(en)
*
|
1989-01-09 |
1989-03-08 |
Cookson Group Plc |
Flux composition
|
|
US5145722A
(en)
*
|
1989-04-11 |
1992-09-08 |
Hughes Aircraft Company |
Method and composition for protecting and enhancing the solderability of metallic surfaces
|
|
US5011546A
(en)
*
|
1990-04-12 |
1991-04-30 |
International Business Machines Corporation |
Water soluble solder flux and paste
|
|
DE548224T1
(de)
*
|
1990-09-11 |
1993-10-14 |
Schering Corp |
Verfahren zur herstellung von albutero, sowie von arylglyoxal-, acetal-, hemiacetal- und hydrat-zwischenprodukten.
|
|
CN1223250A
(zh)
*
|
1990-09-11 |
1999-07-21 |
先灵公司 |
乙缩醛和半乙缩醛及乙二醛水合物的制备方法
|
|
US5615827A
(en)
|
1994-05-31 |
1997-04-01 |
International Business Machines Corporation |
Flux composition and corresponding soldering method
|
|
US5571340A
(en)
|
1994-09-09 |
1996-11-05 |
Fry's Metals, Inc. |
Rosin-free, low VOC, no-clean soldering flux and method using the same
|
|
JP3498427B2
(ja)
*
|
1995-06-19 |
2004-02-16 |
ソニー株式会社 |
成形はんだ用フラックス
|
|
US5851311A
(en)
|
1996-03-29 |
1998-12-22 |
Sophia Systems Co., Ltd. |
Polymerizable flux composition for encapsulating the solder in situ
|
|
US5958151A
(en)
|
1996-07-22 |
1999-09-28 |
Ford Global Technologies, Inc. |
Fluxing media for non-VOC, no-clean soldering
|
|
US6367150B1
(en)
|
1997-09-05 |
2002-04-09 |
Northrop Grumman Corporation |
Solder flux compatible with flip-chip underfill material
|
|
US5963355A
(en)
*
|
1997-11-17 |
1999-10-05 |
Asahi Kogaku Kogyo Kabushiki Kaisha |
Optical scanning system with single element refractive/reflective Fθlθ lens
|
|
EP1029630B1
(en)
*
|
1998-04-14 |
2007-02-14 |
Harima Chemicals, Inc. |
A brazing composition, and method of brazing aluminium materials
|
|
JP4343354B2
(ja)
*
|
1999-11-02 |
2009-10-14 |
Ａｇｃセイミケミカル株式会社 |
半田用フラックス這い上がり防止剤組成物とその用途
|
|
US6402013B2
(en)
*
|
1999-12-03 |
2002-06-11 |
Senju Metal Industry Co., Ltd |
Thermosetting soldering flux and soldering process
|
|
US6217671B1
(en)
|
1999-12-14 |
2001-04-17 |
International Business Machines Corporation |
Composition for increasing activity of a no-clean flux
|
|
JP2001300766A
(ja)
*
|
2000-04-27 |
2001-10-30 |
Tamura Kaken Co Ltd |
回路基板はんだ付用フラックス及び回路基板
|
|
ATE400395T1
(de)
*
|
2000-11-29 |
2008-07-15 |
Senju Metal Industry Co |
Lötpasten
|
|
US6794761B2
(en)
*
|
2001-04-26 |
2004-09-21 |
Intel Corporation |
No-flow underfill material
|
|
US20030111519A1
(en)
*
|
2001-09-04 |
2003-06-19 |
3M Innovative Properties Company |
Fluxing compositions
|
|
TWI228132B
(en)
|
2001-09-26 |
2005-02-21 |
Nof Corp |
Soldering flux composition and solder paste
|
|
US20060043157A1
(en)
*
|
2004-08-25 |
2006-03-02 |
Harima Chemicals, Inc. |
Flux for soldering, soldering method, and printed circuit board
|
|
JP4142312B2
(ja)
*
|
2002-02-28 |
2008-09-03 |
ハリマ化成株式会社 |
析出型はんだ組成物及びはんだ析出方法
|
|
US6887319B2
(en)
*
|
2002-04-16 |
2005-05-03 |
Senju Metal Industry Co., Ltd. |
Residue-free solder paste
|
|
AU2003241670A1
(en)
*
|
2002-06-17 |
2003-12-31 |
Harima Chemicals, Inc. |
Water-base aluminum-brazing composition and process of brazing
|
|
US20050170188A1
(en)
*
|
2003-09-03 |
2005-08-04 |
General Electric Company |
Resin compositions and methods of use thereof
|
|
US7022410B2
(en)
*
|
2003-12-16 |
2006-04-04 |
General Electric Company |
Combinations of resin compositions and methods of use thereof
|
|
US7276673B2
(en)
|
2003-09-26 |
2007-10-02 |
Tdk Corporation |
Solder bonding method and solder bonding device
|
|
TWI262041B
(en)
|
2003-11-14 |
2006-09-11 |
Hitachi Chemical Co Ltd |
Formation method of metal layer on resin layer, printed wiring board, and production method thereof
|
|
US7671114B2
(en)
*
|
2004-01-26 |
2010-03-02 |
Henkel Corporation |
Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
|
|
MY148568A
(en)
*
|
2004-12-09 |
2013-04-30 |
Lonza Ag |
Quaternary ammonium salts as a conversion coating or coating enhancement
|
|
US20060147683A1
(en)
*
|
2004-12-30 |
2006-07-06 |
Harima Chemicals, Inc. |
Flux for soldering and circuit board
|
|
US20060272747A1
(en)
|
2005-06-03 |
2006-12-07 |
Renyi Wang |
Fluxing compositions
|
|
US20060275608A1
(en)
|
2005-06-07 |
2006-12-07 |
General Electric Company |
B-stageable film, electronic device, and associated process
|
|
US7780801B2
(en)
*
|
2006-07-26 |
2010-08-24 |
International Business Machines Corporation |
Flux composition and process for use thereof
|
|
US20080156852A1
(en)
*
|
2006-12-29 |
2008-07-03 |
Prakash Anna M |
Solder flux composition and process of using same
|
|
US7569164B2
(en)
*
|
2007-01-29 |
2009-08-04 |
Harima Chemicals, Inc. |
Solder precoating method
|
|
KR20100132480A
(ko)
|
2007-07-23 |
2010-12-17 |
헨켈 리미티드 |
땜납 플럭스
|
|
CN101596656B
(zh)
*
|
2009-07-02 |
2011-11-02 |
东莞市中实焊锡有限公司 |
一种无铅焊接用水清洗助焊剂及其制备方法
|
|
CA2791226C
(en)
*
|
2009-12-22 |
2014-04-15 |
Dow Global Technologies, Inc. |
Novel diamino-alcohol compounds and processes for their manufacture
|