JP2012134329A5 - - Google Patents
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- JP2012134329A5 JP2012134329A5 JP2010285215A JP2010285215A JP2012134329A5 JP 2012134329 A5 JP2012134329 A5 JP 2012134329A5 JP 2010285215 A JP2010285215 A JP 2010285215A JP 2010285215 A JP2010285215 A JP 2010285215A JP 2012134329 A5 JP2012134329 A5 JP 2012134329A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- core
- coil wiring
- inductor
- core formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010285215A JP6051359B2 (ja) | 2010-12-22 | 2010-12-22 | コア付きインダクタ素子およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010285215A JP6051359B2 (ja) | 2010-12-22 | 2010-12-22 | コア付きインダクタ素子およびその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012134329A JP2012134329A (ja) | 2012-07-12 |
JP2012134329A5 true JP2012134329A5 (sr) | 2014-02-27 |
JP6051359B2 JP6051359B2 (ja) | 2016-12-27 |
Family
ID=46649582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010285215A Expired - Fee Related JP6051359B2 (ja) | 2010-12-22 | 2010-12-22 | コア付きインダクタ素子およびその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6051359B2 (sr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5858630B2 (ja) * | 2011-03-14 | 2016-02-10 | 日本碍子株式会社 | インダクタ内蔵基板及び当該基板を含んでなる電気回路 |
JP5815640B2 (ja) * | 2012-12-11 | 2015-11-17 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 電子部品の製造方法。 |
JP5915821B2 (ja) * | 2014-02-27 | 2016-05-11 | 株式会社村田製作所 | 電磁石の製造方法、および、電磁石 |
KR101942725B1 (ko) * | 2014-03-07 | 2019-01-28 | 삼성전기 주식회사 | 칩 전자부품 및 그 제조방법 |
CN104270885A (zh) * | 2014-05-05 | 2015-01-07 | 珠海越亚封装基板技术股份有限公司 | 具有聚合物基质的插件框架及其制造方法 |
US9496213B2 (en) * | 2015-02-05 | 2016-11-15 | Qualcomm Incorporated | Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate |
KR101659212B1 (ko) * | 2015-02-13 | 2016-09-22 | 삼성전기주식회사 | 인덕터 부품의 제조방법 |
JP6572791B2 (ja) * | 2016-02-05 | 2019-09-11 | 株式会社村田製作所 | コイル複合部品及び多層基板、ならびに、コイル複合部品の製造方法 |
KR20170118430A (ko) | 2016-04-15 | 2017-10-25 | 삼성전기주식회사 | 코일 전자부품 및 그 제조방법 |
KR101887106B1 (ko) * | 2016-10-31 | 2018-08-09 | 아비코전자 주식회사 | 초소형 인덕터 및 이의 제조 방법 |
WO2019027204A1 (ko) * | 2017-07-31 | 2019-02-07 | 주식회사 케이비켐 | 액추에이터 코일 구조체 및 그 제조방법 |
KR101964980B1 (ko) * | 2017-07-31 | 2019-08-13 | 주식회사 케이비켐 | 액추에이터 코일 구조체 및 그 제조방법 |
CN114420435B (zh) * | 2022-01-25 | 2023-11-24 | 沈阳工业大学 | 一种变压器用混合材料卷铁心截面设计方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08130109A (ja) * | 1994-11-02 | 1996-05-21 | Matsushita Electric Ind Co Ltd | 積層部品用非磁性絶縁材料、積層部品およびその製造法 |
JP2002043520A (ja) * | 2000-07-19 | 2002-02-08 | Sony Corp | 半導体装置及びその製造方法 |
JP2005109097A (ja) * | 2003-09-30 | 2005-04-21 | Murata Mfg Co Ltd | インダクタ及びその製造方法 |
JP2006049822A (ja) * | 2004-06-29 | 2006-02-16 | Tdk Corp | 半導体ic内蔵モジュール |
JP4803993B2 (ja) * | 2004-11-09 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP5136056B2 (ja) * | 2005-09-06 | 2013-02-06 | 日本電気株式会社 | 半導体装置 |
JP2008171853A (ja) * | 2007-01-09 | 2008-07-24 | Murata Mfg Co Ltd | 電子部品製造方法及び電子部品 |
-
2010
- 2010-12-22 JP JP2010285215A patent/JP6051359B2/ja not_active Expired - Fee Related
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