JP2012129254A - Electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the increase in transportation time of substrates.SOLUTION: An electronic component mounting device 100 mounts electronic components on substrates. The electronic component mounting device 100 has multiple stages 3FI, 3RI, 3FE, 3RE. These stages mount and support substrates on which electronic components are mounted. Each substrate on which the electronic components are to be mounted is transported from a substrate supply part 1 to a substrate carrying out part 2. Two stages, 3FI and 3RI, are arranged in a direction that intersects the transportation direction of the substrates and move in the direction. Further, two stages, 3FE and 3RE, are also arranged in the direction that intersects the transportation direction of the substrates and move in the direction.

Description

  The present invention relates to an electronic component mounting apparatus for mounting electronic components on a substrate.

  As an apparatus for mounting an electronic component on a substrate, there is an electronic component mounting device that has a head having a number of nozzles and sucks the electronic component with the nozzle and mounts it on the substrate. Here, the head mounts the sucked electronic component on the substrate by moving the nozzle in a direction perpendicular to the surface of the substrate. In such an electronic component mounting apparatus, when mounting of the electronic component on the substrate positioned in the region where the electronic component is mounted is completed, the substrate is unloaded and then a new substrate is loaded into the region. (For example, Patent Document 1).

JP 2001-189595 A

  The technique described in Patent Document 1 stops the substrate once at the position of the carry-in rail or the carry-out rail when carrying the substrate into or out of the production position, and then moves the substrate in a direction orthogonal to the substrate conveyance direction. You may have to do that. Due to the stop, there is a problem that the time for transporting the substrate is increased. Even if a single stop is short, if the number of times increases, the time for transporting the substrate significantly increases, leading to a decrease in production efficiency. An object of the present invention is to suppress an increase in time for transporting a substrate when an electronic component is mounted on the substrate.

  In order to solve the above-described problems and achieve the object, the present invention provides an electronic component mounting apparatus for mounting an electronic component on a substrate, a support portion that supports the substrate, and loading the substrate into the support portion, and Including a substrate transport mechanism for carrying out the substrate from a support unit, wherein the substrate transport mechanism is arranged in a direction orthogonal to a direction in which the substrate is transported, and the at least two stages are A stage moving mechanism for moving the substrate in a direction orthogonal to a direction in which the substrate is transferred; and a head for mounting the electronic component on the substrate supported by the stage; and the at least two stages and these There are at least two stage stages including the stage moving mechanism to be moved in a direction in which the substrate is conveyed. It is a component mounting apparatus.

  As a desirable mode of the present invention, it is preferable that there are at least two heads.

  As a desirable aspect of the present invention, the support unit has a substrate fixing / releasing mechanism for fixing the substrate to the stage or releasing the fixing, and the substrate fixing / releasing mechanism is configured such that the stage moves. It is preferable that the substrate is fixed or the fixing is released during the operation.

  As a desirable aspect of the present invention, it is preferable that the stage moving mechanism moves the at least two stages in conjunction with each other.

  As a desirable mode of the present invention, it is preferable that at least two stages including the at least two stages and the stage moving mechanism for moving the at least two stages are provided in the direction in which the substrate is conveyed.

  As a desirable aspect of the present invention, each of the stage moving mechanisms moves in the same direction in the first production mode in which the adjacent stage stages are moved in opposite directions and the adjacent stage stages are moved in the same direction. It is preferable to have a second production mode.

  According to the present invention, when an electronic component is mounted on a substrate, an increase in time for transporting the substrate can be suppressed.

FIG. 1 is a plan view showing an electronic component mounting apparatus according to this embodiment. FIG. 2 is a front view of the electronic component mounting apparatus according to the present embodiment as viewed from the direction of arrow A in FIG. FIG. 3 is a plan view of a board transfer unit included in the electronic component mounting apparatus according to the present embodiment. FIG. 4 is a view of the stage of the substrate transport unit as viewed from the direction in which the substrate is transported. 5 is a BB arrow view of FIG. FIG. 6 is a plan view of the substrate supporting and conveying apparatus. FIG. 7 is a diagram illustrating a driving mechanism of a transport belt included in the substrate support transport apparatus. FIG. 8 is a diagram illustrating the substrate fixing device. FIG. 9 is a diagram illustrating a substrate fixing device. FIG. 10 is a schematic diagram for explaining the positions and functions of various sensors included in the substrate transport unit. FIG. 11 is a plan view of a component mounting portion included in the electronic component mounting apparatus according to the present embodiment. FIG. 12 is an explanatory diagram of a head included in the electronic component mounting apparatus according to the present embodiment. FIG. 13 is a plan view of a component supply unit included in the electronic component mounting apparatus according to the present embodiment. FIG. 14 is a configuration diagram of a control device that controls the electronic component mounting apparatus according to the present embodiment. FIG. 15 is a flowchart showing the procedure of the first production mode when the electronic component mounting apparatus according to the present embodiment mounts the electronic component on the board. FIG. 16 is an explanatory diagram of the first production mode. FIG. 17 is an explanatory diagram of the first production mode. FIG. 18 is an explanatory diagram of the first production mode. FIG. 19 is an explanatory diagram of the first production mode. FIG. 20 is an explanatory diagram of the first production mode. FIG. 21 is an explanatory diagram showing a modification of the first production mode. FIG. 22 is an explanatory diagram showing a modification of the first production mode. FIG. 23 is an explanatory diagram showing a modification of the first production mode. FIG. 24 is a schematic diagram showing an electronic component mounting apparatus in which a stage for holding the substrate is fixed when the substrate supply unit and the substrate carry-out unit move and the electronic component is mounted on the substrate. FIG. 25 is a flowchart showing the procedure of the second production mode when the electronic component mounting apparatus according to this embodiment mounts the electronic component on the board. FIG. 26 is an explanatory diagram of the second production mode. FIG. 27 is an explanatory diagram of the second production mode. FIG. 28 is an explanatory diagram of the second production mode. FIG. 29 is an explanatory diagram of the second production mode. FIG. 30 is an explanatory diagram of the second production mode. FIG. 31 is an explanatory diagram showing a modification of the second production mode. FIG. 32 is an explanatory diagram showing a modification of the second production mode. FIG. 33 is an explanatory diagram showing a modification of the second production mode.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the constituent elements described below can be appropriately combined.

  FIG. 1 is a plan view showing an electronic component mounting apparatus according to this embodiment. FIG. 2 is a front view of the electronic component mounting apparatus according to the present embodiment as viewed from the direction of arrow A in FIG. The electronic component mounting apparatus 100 is an apparatus for mounting (mounting) electronic components on the surface of a substrate. The electronic component mounting apparatus 100 includes a board transfer unit 101, a component mounting unit 102, a component supply unit 103, and a control unit 104. In the electronic component mounting apparatus 100, the substrate transport unit 101 transports a substrate on which an electronic component is to be mounted to the component mounting unit 102, and the substrate transport unit 101 transports the substrate after mounting the electronic component from the component mounting unit 102. . The direction in which the substrate is transported is the X direction in FIGS. 1 and 2, the direction orthogonal to the direction in which the substrate is transported is the Y direction, and the direction orthogonal to the X direction and the Y direction and the plate surface of the substrate is the Z direction. And The electronic component mounting apparatus 100 is generally arranged so that the board surface of the board is horizontal (in the vertical direction, that is, orthogonal to the direction in which gravity acts). For this reason, normally, the Z direction is parallel to the vertical direction.

  The substrate transport unit 101 transports a substrate on which electronic components are mounted to the component mounting unit 102 and transports a substrate on which electronic components are mounted from the component mounting unit 102. The substrate transport unit 101 includes a substrate supply unit 1, a plurality of stages 3FI, 3RI, 3FE, 3RE, and a substrate carry-out unit 2. The substrate supply unit 1 conveys a substrate on which electronic components are to be mounted to the respective stages 3FI, 3RI, 3FE, and 3RE. The substrate supply unit 1 is disposed on the opposite side (upstream side) of the traveling direction of the substrate in the direction in which the substrate is transported from the respective stages 3FI and 3RI.

  Each of the stages 3FI, 3RI, 3FE, and 3RE is disposed below (vertical direction side) the component mounting unit 102. The two stages 3FI and 3RI are arranged closer to the substrate supply unit 1 than the two stages 3FE and 3RE. Each stage 3FI, 3RI, 3FE, 3RE supports the substrate conveyed from the substrate supply unit 1 while the electronic component is mounted on the substrate. In addition, each of the stages 3FI, 3RI, 3FE, and 3RE conveys the substrate on which the electronic component is mounted to the substrate carry-out unit 2. Each of the stages 3FI, 3RI, 3FE, and 3RE is moved by the stage moving mechanisms 4I and 4E in a direction orthogonal to the direction in which the substrate is transported. More specifically, the two stages 3FI and 3RI arranged in the direction orthogonal to the direction in which the substrate is conveyed are moved by the stage moving mechanism 4I. Further, the two stages 3FE and 3RE arranged in a direction orthogonal to the direction in which the substrate is conveyed are moved by the stage moving mechanism 4E.

  The substrate carry-out unit 2 is arranged on the traveling direction side in the direction in which the substrate is transported from the respective stages 3FE and 3RE. The board carry-out unit 2 receives the board on which electronic components are carried that are transported from the respective stages 3FI, 3RI, 3FE, and 3RE. And the board | substrate carrying-out part 2 conveys the received said board | substrate to the apparatus used for the following process (for example, reflow process).

  The component mounting unit 102 includes a plurality (two in the present embodiment) of heads 6F and 6R and a head moving device 5 that moves the plurality of heads 6F and 6R separately. At least one head may be used, but at least two heads are more preferable. In this way, manufacturing efficiency is improved. The heads 6F and 6R have a plurality of nozzles that suck electronic components. The heads 6F and 6R are devices that adsorb electronic components to the nozzles and mount the adsorbed electronic components on the surface of the substrate. The head moving device 5 is a device that moves the heads 6F and 6R in the X direction and the Y direction. That is, the head moving device 5 moves the heads 6F and 6R within the XY plane. The head moving device 5 can move the heads 6F and 6R in the XY directions to move the heads 6F and 6R to a position facing the substrate or a position facing a component supply device 8 described later. The head moving device 5 adjusts the relative positions of the heads 6F and 6R and the substrate by moving the heads 6F and 6R. With such a function, the head moving device 5 can move the electronic component held by the heads 6F and 6R to an arbitrary position on the surface of the substrate. As a result, the heads 6F and 6R can mount electronic components at arbitrary positions on the surface of the substrate.

  The component supply unit 103 supplies the electronic components to the heads 6F and 6R that mount the electronic components on the substrate. In the present embodiment, the electronic component mounting apparatus 100 includes a plurality (two in the present embodiment) of component supply units 103F and 103R. Each of the component supply units 103F and 103R is provided on both sides of two stages 3FI and 3RI (the same applies to the two stages 3FE and 3RE) in the direction in which the substrate is conveyed, that is, the direction orthogonal to the X direction (Y direction). Each is arranged.

  In this way, the heads 6F and 6R can receive the supply of the electronic components to be mounted on the substrate from the component supply units 103F and 103R at a closer position, so that the time for mounting the electronic components on the substrate is shortened. be able to. The component supply units 103 </ b> F and 103 </ b> R include a support base 7 and a component supply device 8 that is mounted on and supported by the support base 7. The support base 7 can be mounted with a plurality of component supply devices 8 or other devices (for example, a measurement device, a camera, etc.).

  The control unit 104 includes a control device 105, an input device 105C, and a display device 105M. The control device 105 performs operations of the respective stages 3FI, 3RI, 3FE, and 3RE of the electronic component mounting apparatus 100, operations of the stage moving mechanisms 4I and 4E, operations of the respective heads 6F and 6R, operations of the head moving device 5, and the like. Control. The input device 105C accepts the operator's operation when the operator causes the control device 105 to teach the suction position of the electronic component or inputs data such as the arrangement and type of the electronic component. Is input to the control device 105. The display device 105M displays the progress status of the production process and displays information necessary for the teaching.

  The positions at which the display device 105M and the input device 105C are attached to the electronic component mounting apparatus 100 are positions that can be operated and visually recognized by the operator in consideration of the operability and visibility of the operator. In the present embodiment, the side on which the display device 105M and the input device 105C are attached is the front surface of the electronic component mounting apparatus 100, and the side on which the display device 105M and the input device 105C are not attached is the electronic component mounting apparatus 100. The back side.

  In the electronic component mounting apparatus 100, the regions where the stages 3FI, 3RI, 3FE, and 3RE are arranged and are movable in the Y direction are regions where the electronic components can be mounted on the substrate. Hereinafter, this area is referred to as a production area. In the electronic component mounting apparatus 100, the production area is divided into three in the Y direction, that is, the direction orthogonal to the X direction, which is the direction in which the substrate is conveyed. In the present embodiment, the front-side production area MAf is the front-side production area MAf, the rear-side production area is the rear-side area MAr, and the production area between the front-side area MAf and the rear-side area MAr is intermediate. This is called area MAm. In the present embodiment, the stages 3FI and 3RI and the stages 3FE and 3RE arranged adjacent to each other in the Y direction move in the Y direction. For this reason, the number of divisions of the production area in the Y direction may be larger than the number of arrangements of the stages 3FI, 3RI, etc. in the Y direction. In this way, the stages 3FI, 3RI and the like arranged adjacent to each other in the Y direction can move in the Y direction. Next, each part of the board | substrate conveyance part 101, the component mounting part 102, the component supply part 103, and the control apparatus 105 which the control part 104 has is demonstrated in detail.

  FIG. 3 is a plan view of a board transfer unit included in the electronic component mounting apparatus according to the present embodiment. FIG. 4 is a view of the stage of the substrate transport unit as viewed from the direction in which the substrate is transported. 5 is a BB arrow view of FIG. Since the stages 3FI, 3RI, 3FE, and 3RE have the same structure, in the following description, the stages 3FI, 3RI, 3FE, and 3RE are simply referred to as the stage 3 as necessary.

  The substrate transport unit 101 is disposed between a pair of frames FL and FL that are disposed to face each other. The frame FL is a frame of the electronic component mounting apparatus 100 shown in FIG. A plurality of guide rails 43I, 43I, 43E, 43E are spanned between the pair of frames FL, FL as guide members for guiding the stages 3FI, 3RI, 3FE, 3RE. The plurality of guide rails 43I, 43I, 43E, and 43E are rod-shaped structures, and their longitudinal directions are parallel to the Y direction. With such a configuration, the plurality of guide rails 43I, 43I, 43E, 43E are supported by the pair of frames FL, FL.

  The pair of guide rails 43I and 43I penetrates the stages 3FI and 3RI arranged in the Y direction. Sliding bearings 31 are provided between the stages 3FI and 3RI and the respective guide rails 43I and 43I. Further, the pair of guide rails 43E and 43E pass through the stages 3FE and 3RE arranged in the Y direction. Sliding bearings 31 are provided between the stages 3FE and 3RE and the guide rails 43E and 43E. With such a configuration, the stages 3FI and 3RE are guided by the guide rails 43I and 43I, and the stages 3FE and 3RI are guided by the guide rails 43E and 43E and move in the Y direction.

  Each of the stage moving mechanisms 4I and 4E includes an electric motor 40 and a screw 41 rotated by the electric motor 40. Thus, the screw 41 is one of the constituent members of the stage moving mechanisms 4I and 4E. The screws 41 of the stage moving mechanisms 4I and 4E are rotatably supported by bearings 42F and 42R provided on the respective frames FL and FL. The axial direction of the screw 41 is parallel to the Y direction. In addition, a nut 32 that meshes with the screw 41 is fixed to each of the stages 3FI, 3RI, 3FE, and 3RE.

  With this configuration, when the screw 41 is rotated by the electric motor 40, the relative position of the nut 32 and the screw 41 in the axial direction of the screw 41 (the traveling direction of the screw 41) changes. Since the nut 32 is fixed to the stages 3FI, 3RI, 3FE, and 3RE, when the screw 41 is rotated by the electric motor 40, the stages 3FI, 3RI, 3FE, and 3RE move in the Y direction.

  The stage moving mechanism 4I moves the stages 3FI and 3RI arranged in the Y direction in the Y direction, and the stage moving mechanism 4E moves the stages 3FE and 3RE arranged in the Y direction in the Y direction. The stages 3FI and 3FE are arranged on the front side of the electronic component mounting apparatus 100 shown in FIG. 1, and the stages 3RI and 3RE are arranged on the rear side of the electronic component mounting apparatus 100. The stages 3FI and 3RI arranged in the Y direction are arranged on the substrate supply unit 1 side, and the stages 3FE and 3RE arranged in the Y direction are arranged on the substrate carry-out unit 2 side. For this reason, the stage moving mechanism 4I is disposed on the substrate supply unit 1 side, and the stage moving mechanism 4E is disposed on the substrate carry-out unit 2 side.

  In the present embodiment, the screw 41 is directly rotated by the electric motor 40, but the screw 41 may be rotated by reducing the rotation speed of the electric motor 40 by a reduction device. In this way, the stage moving mechanisms 4I, 4E can move the stages 3FI, 3RI, etc. even when an electric motor with a small torque is used. As a result, the electric motor can be reduced in size and weight. The types of the screw 41 and the nut 32 are not particularly limited, but it is preferable to use a ball screw because the positioning accuracy of the stages 3FI, 3RI, 3FE, and 3RE can be improved. An air cylinder or a hydraulic cylinder may be used instead of the stage moving mechanisms 4I and 4E using the screw 41, the nut 32, and the electric motor 40.

  The stages 3FI and 3RI arranged in the Y direction and the stage moving mechanism 4I for moving them constitute the first stage stage 3I. Further, the stages 3FE and 3RE arranged in the Y direction and the stage moving mechanism 4E for moving them constitute the second stage stage 3E. The first stage stage 3I and the second stage stage 3E are arranged in the direction in which the substrate is transported, that is, in the X direction, and are adjacent to each other. The number of stages arranged in the Y direction and the number of stage stages arranged in the X direction may both be two or more. Note that the number of stages arranged in the X direction is preferably an even number because the control of the electronic component mounting apparatus 100 described later can be easily performed. Thus, it is preferable that the substrate transport unit 101 arranges at least two stages including at least two stages and stage moving mechanisms 4E and 4I for moving them in the direction in which the substrate is transported. In this way, more substrates can be supported on the stage, and electronic components can be mounted on the substrate, so that the production efficiency of the substrate on which the electronic components are mounted is improved. Even in this case, since the substrate supply unit 1, the plurality of stages, and the substrate carry-out unit 2 can be arranged in a row in the X direction, the substrate can be transferred to many stages at a time, and many stages can be transported. The board can be taken out from Even in this case, the substrate supply unit 1 or the substrate carry-out unit 2 does not need to move to the position of the stage, so there is no opportunity to stop them. As a result, it is possible to suppress an increase in the substrate transport time resulting from the stop of the substrate supply unit 1 or the substrate carry-out unit 2, thereby improving the production efficiency of the substrate on which electronic components are mounted.

  The stages 3FI and 3RI and the stages 3FE and 3RE arranged in the Y direction move between the front side region MAf, the intermediate region MAm, and the back side region MAr. In the example shown in FIG. 3, stages 3FI and 3FE are present in the intermediate area MAm, and stages 3RI and 3RE are present in the back side area MAr. In this case, the component mounting unit 102 shown in FIG. 1 mounts electronic components on the substrates respectively supported by the stages 3FI and 3FE and the stages 3RI and 3RE existing in the intermediate region MAm and the back region MAr.

  In the present embodiment, the two stages 3FI and 3RI (or stages 3FE and 3RE) arranged in the Y direction move in conjunction with each other. This is preferable because the structure of the electronic component mounting apparatus 100 can be simplified. Also, the control can be simplified by moving the two stages 3FI, 3RI (or stages 3FE, 3RE) arranged in the Y direction in conjunction with each other.

  Note that the two stages 3FI and 3RI (or stages 3FE and 3RE) arranged in the Y direction may be moved separately and independently. In this case, the two stages 3FI and 3RI are moved by independent stage moving mechanisms. In this way, the structure of the electronic component mounting apparatus 100 is complicated, but the degree of freedom of control is improved. For example, the electronic components can be mounted on the substrate by arranging the stages 3FI and 3RI in the front side region MAf and the back side region MAr, respectively. In this case, since the stages 3FI and 3RI approach the component supply units 103F and 103R, respectively, the distance that the heads 6F and 6R move between the component supply units 103F and 103R and the stages 3FI and 3RI can be reduced. As a result, since the heads 6F and 6R can receive the supply of the electronic component quickly, the time for mounting the electronic component on the substrate can be shortened.

  As shown in FIGS. 4 and 5, each of the stages 3 </ b> FI, 3 </ b> RI, 3 </ b> FE, and 3 </ b> RE includes a substrate support transport device 10 and a substrate fixing device 20. The substrate support / conveyance device 10 is also provided in the substrate supply unit 1 and the substrate carry-out unit 2. The substrate support / transport apparatus 10 includes a support unit that supports a substrate and a substrate transport mechanism that carries the substrate into and out of the support unit. Further, the substrate fixing device 20 included in each of the stages 3FI, 3RI, 3FE, and 3RE fixes the substrate to each of the stages 3FI, 3RI, 3FE, and 3RE, or releases the fixing.

  As illustrated in FIG. 4, the stage 3 includes a pair of frame members 30 and 30 that are arranged to face each other. A pair of substrate pressing members 34, 34 are attached to one end of the pair of frame members 30, 30. As shown in FIGS. 4 and 5, a guide rail 43I (or a guide rail 43E) passes through the pair of frame members 30 and 30. Between the pair of frame members 30, the substrate support transport device 10 and the substrate fixing device 20 are disposed.

  The substrate support / conveyance device 10 is disposed so as to face each other as a pair of conveyance belts 11 and 11 as substrate conveyance means for conveying a substrate, and as a support unit that supports the substrate via the pair of conveyance belts 11 and 11. A pair of substrate support members 12 and 12 and a transport motor 13 as a power source for driving the pair of transport belts 11 and 11 are included. The pair of transport belts 11 and 11 are both endless belts. The outer peripheral surface of the transport belt 11 of the substrate support transport device 10 faces the substrate pressing members 34 and 34 attached to the pair of frame members 30 and 30 of the stage 3. When the pair of transport belts 11, 11 is driven in a state where the substrate is in contact with the outer peripheral surfaces of the pair of transport belts 11, the substrate is transported by the pair of transport belts 11, 11. The substrate is supported by the pair of substrate support members 12 and 12 via the pair of transport belts 11 and 11.

  As shown in FIG. 5, the substrate support member 12 has long holes 14, 14 that are open to the outer periphery of the substrate support member 12. The long holes 14 and 14 are engaged with positioning members 33 and 33 provided in the frame member 30 of the stage 3. With such a configuration, the substrate supporting and conveying apparatus 10 is attached to and supported by the pair of frame members 30 and 30 of the stage 3. Further, since the long holes 14 and 14 and the positioning members 33 and 33 are engaged with each other, the substrate supporting and conveying apparatus 10 is allowed to move toward the pair of substrate pressing members 34 and 34. Further, the substrate supporting and conveying apparatus 10 is allowed to move away from the pair of substrate pressing members 34 and 34 until the long holes 14 and 14 and the positioning members 33 and 33 are engaged with each other. As described above, the substrate supporting and conveying apparatus 10 is supported in a state in which relative movement is allowed with respect to the pair of frame members 30 and 30 of the stage 3.

  The pair of substrate support members 12, 12 included in the substrate support / conveyance apparatus 10 has a plurality of leg portions 15 on the side opposite to the side where the conveyance belt 11 is disposed. Each leg 15 is attached to the substrate support member 12 in a cantilever structure. Therefore, each leg portion 15 has a fixed end on the substrate support member 12 side and an open end on the opposite side to the fixed end.

  The substrate fixing device 20 fixes the substrate to the stage 3 and releases the substrate from the stage 3. The substrate fixing device 20 includes a table 21 that presses the substrate supporting and conveying device 10 toward the pair of substrate pressing members 34 and 34, and a frame 22 for attaching the substrate fixing device 20 to the stage 3. The frame 22 is attached to the pair of frame members 30 and 30 of the stage 3. With such a configuration, the substrate fixing device 20 is attached to and supported by the stage 3. In the substrate fixing device 20, the table 21 presses the substrate support / transport device 10 toward the pair of substrate pressing members 34, 34, whereby the transport belt 11 of the substrate support / transport device 10 and the pair of substrate pressing members 34, 34. The substrate is sandwiched between them. The stage 3 has a substrate fixing / releasing mechanism using such a substrate fixing device 20. Note that the stage 3 may not have the substrate fixing / releasing mechanism. Next, a mechanism in which the substrate supporting and conveying device 10 drives the pair of conveying belts 11 and 11 will be described in more detail.

  FIG. 6 is a plan view of the substrate supporting and conveying apparatus. FIG. 7 is a diagram illustrating a driving mechanism of a transport belt included in the substrate support transport apparatus. The transfer motor 13 is fixed to a support plate 16 that spans the pair of substrate support members 12 and 12. An output pulley 24A is attached to the output shaft 13S of the electric motor 13 for conveyance. As shown in FIG. 7, the conveyor belt 11 includes a pair of tension belts that stretch the conveyor belt 11 at positions of a drive pulley 18 </ b> C, a plurality of guide pulleys 18 </ b> D, and a conveyor belt support portion 12 </ b> S provided on the substrate support member 12. It is wound around the pulleys 18E and 18E. With such a structure, both the substrate support members 12, 12, more specifically, the pair of transport belt support portions 12 </ b> S, 12 </ b> S are arranged on the inner peripheral surface side of the pair of transport belts 11, 11. The substrate support / conveyance apparatus 10 includes a pair of substrate support members 12, 12. The pair of transport belts 11, 11 are attached to both the substrate support members 12, 12 with the same structure.

  As shown in FIG. 6, the pair of drive pulleys 18 </ b> C and 18 </ b> C are attached to the drive shaft 17. The drive shaft 17 is rotatably supported by the pair of substrate support members 12 and 12. An input pulley 18 </ b> B is attached to the drive shaft 17. An endless transmission belt 19 is wound around an output pulley 24A attached to the output shaft 13S of the conveying motor 13 and an input pulley 18B attached to the drive shaft 17. With such a configuration, the power of the transport motor 13 is input to the drive shaft 17 via the output pulley 24A, the transmission belt 19, and the input pulley 18B. The power input to the drive shaft 17 drives the pair of transport belts 11 and 11 via the pair of drive pulleys 18C and 18C attached to the drive shaft 17.

  When the pair of transport belts 11 and 11 are driven and rotated at the positions of the transport belt support portions 12S and 12S of the pair of substrate support members 12 and 12, the substrate CB in contact with the outer peripheral surfaces of the pair of transport belts 11 and 11 is paired. It moves on the conveyor belt support parts 12S and 12S. With such a configuration, the substrate support transport device 10 drives the pair of transport belts 11 and 11 to carry the substrate CB into the pair of substrate support members 12 and 12. When the substrate CB stops on the pair of transport belt support portions 12S and 12S, the pair of transport belt support portions 12S and 12S supports the substrate CB. That is, the pair of substrate support members 12 and 12 support the substrate CB as a platen. In this state, when the pair of transport belts 11 and 11 are further driven, the substrate CB is unloaded from the substrate support members 12 and 12. As described above, the substrate support / conveyance apparatus 10 includes the pair of substrate support members 12 and 12 serving as support portions for supporting the substrate CB, the loading of the substrate CB into the pair of substrate support members 12 and 12, and the pair of substrate support members 12. , 12 includes a substrate transfer mechanism for carrying out the substrate CB. The direction in which the substrate transport mechanism transports the substrate CB is the Y direction in FIG. 1, and is the direction in which the stages 3FI and 3RI and the stages 3FE and 3RE are arranged. Next, the substrate fixing device 20 will be described in more detail.

  8 and 9 are diagrams showing the substrate fixing device, respectively. Both drawings show a state in which the substrate fixing device 20 is viewed from a direction orthogonal to the direction in which the substrate CB is conveyed. FIG. 8 shows a state where the substrate CB is released from the stage 3, and FIG. 9 shows a state where the substrate CB is fixed to the stage 3. In any of the figures, the substrate CB exists between the substrate pressing member 34 of the stage 3 and the transport belt 11 of the substrate support transport device 10.

  The substrate fixing device 20 is disposed to face the open end of the leg portion 15 included in the substrate support member 12 of the substrate support transport device 10. The substrate fixing device 20 is configured to move and press the substrate supporting and conveying device 10 toward the substrate pressing member 34 by the table 21. For this reason, the board fixing device 20 includes a board fixing motor 23 as a power source for driving the table 21. The board fixing device 20 has a power transmission mechanism for transmitting the power to the table 21. This power transmission mechanism has a function of converting rotation of the substrate fixing motor 23 into linear motion. As shown in FIGS. 8 and 9, the board fixing motor 23 is attached to the frame 22. An output pulley 24 </ b> A is attached to the output shaft 23 </ b> S of the board fixing motor 23.

  In the present embodiment, a screw shaft 28 having a male screw and a rotating body 26 having a female screw that meshes with the screw shaft 28 are used as the power transmission mechanism. When the screw shaft 28 and the rotating body 26 are relatively rotated, the relative positions of the screw shaft 28 and the rotating body 26 in the axial direction (screw traveling direction) change. Using this, the rotation of the substrate fixing motor 23 is converted into a linear motion.

  The rotating body 26 is a cylindrical structure. An input pulley 24 </ b> B is attached to one end of the rotating body 26. The rotating body 26 is attached to the frame 22 via a bearing 27. With such a configuration, the frame 22 supports the rotating body 26 in a rotatable manner. In the present embodiment, the substrate fixing device 20 includes a plurality of rotating bodies 26. The screw shaft 28 is screwed into each rotating body 26. One end of the screw shaft 28 is attached to an attachment member 21 </ b> B provided on the surface of the table 21 on the side opposite to the substrate support transport device 10.

  An endless drive belt 25 is wound around the input pulley 24B of the plurality of rotating bodies 26, the output pulley 24A attached to the output shaft 23S of the board fixing motor 23, and the encoder 24C. With such a configuration, the power of the board fixing motor 23 is transmitted to each rotating body 26 via the output pulley 24A, the drive belt 25, and the input pulley 24B. The operation of the substrate fixing motor 23 is controlled using the output of the encoder 24C. When the respective rotating bodies 26 are rotated by the power, the screw shafts 28 screwed into the respective rotating bodies 26 are fixed to the table 21, so that the relative relationship between the screw shaft 28 and the rotating body 26 in the axial direction is reached. The position changes. More specifically, the screw shaft 28 protrudes from the rotating body 26 or enters the rotating body 26. Since the rotating body 26 is fixed to the frame 22, the distance between the frame 22 and the table 21 changes when the rotating body 26 rotates by the power of the board fixing motor 23.

  As described above, the frame 22 is fixed to the pair of frame members 30 and 30 of the stage 3 (see FIG. 4). Further, the substrate support / conveyance device 10 is supported in a state in which relative movement is allowed with respect to the pair of frame members 30, 30 of the stage 3. Further, the table 21 of the substrate fixing device 20 is disposed between the frame 22 and the substrate support transport device 10. For this reason, when the table 21 is separated from the frame 22, the distance between the table 21 and the substrate support transport device 10 becomes small, and both come into contact with each other. In the present embodiment, the buffer member 29 included in the table 21 and the leg portion 15 included in the substrate support member 12 are in contact with each other. The buffer member 29 is an elastic member such as rubber or resin. Although the buffer member 29 is not essential, when the buffer member 29 comes into contact with the leg portion 15, noise and impact at the time of contact between the two can be suppressed.

  When the table 21 moves away from the frame 22 even after both contact, the substrate support transport device 10 moves toward the substrate pressing member 34. With such a configuration, the substrate fixing device 20 can press the transport belt 11 of the substrate support transport device 10 against the substrate pressing member 34, so that the substrate support transport device is interposed via the transport belt 11 as shown in FIG. The substrate CB can be held between the ten substrate support members 12 and the substrate pressing member 34 of the stage 3. As a result, the substrate CB is fixed to the stage 3. This fixing is released when the substrate fixing device 20 brings the table 21 close to the frame 22. Such a mechanism realized by the substrate fixing device 20 is a substrate fixing / releasing mechanism for fixing the substrate CB to the stage 3 or releasing the fixing.

  The numbers of the rotators 26 and screw shafts 28 are not limited, but in order to stably move the substrate support transport apparatus 10, the numbers of the rotators 26 and screw shafts 28 are 3 or more, preferably 4 or more. It is desirable to do. If it does in this way, the board | substrate fixing apparatus 20 can support the board | substrate support conveyance apparatus 10 stably. By this action, the substrate fixing device 20 can press the substrate CB more uniformly against the substrate pressing member 34, and therefore, it is possible to suppress the displacement of the substrate CB. Next, the sensor which the board | substrate conveyance part 101 has is demonstrated.

  FIG. 10 is a schematic diagram for explaining the positions and functions of various sensors included in the substrate transport unit. When an electronic component is mounted on the substrate, when the substrate is transferred from the substrate supply unit 1 to the respective stages 3FI, 3RI, 3FE, and 3RE, the substrate is transferred from the stages 3FI, 3RI, 3FE, and 3RE to the substrate unloading unit 2. It is necessary to stop the substrate or to carry the substrate in and out. For this reason, the board | substrate conveyance part 101 has a sensor which detects the position of a board | substrate. The carry-in sensor 90 detects that a substrate has been carried into the substrate supply unit 1. The carry-out sensor 91 detects that the substrate has been carried out from the substrate carry-out unit 2. The standby sensor 92 detects whether or not the substrate is present at a position where the substrate is waiting in the substrate supply unit 1. The stop sensor 93 detects whether or not the substrate is present at a position (component mounting position) where the electronic component is mounted on the substrate in each of the stages 3FI, 3RI, 3FE, and 3RE. The conveyance sensor 94 detects that the board has been unloaded from the component mounting positions of the respective stages 3FI, 3RI, 3FE, and 3RE. The stage detection sensor 95 detects the positions of the stages 3FI, 3RI, 3FE, 3RE in the Y direction. Using this function, the positions of the substrate supply unit 1 and the stages 3FI, 3RI, 3FE, and 3RE and the positions of the substrate carry-out unit 2 and the stages 3FI, 3RI, 3FE, and 3RE can be matched. The stage detection sensor 95 is provided at the position of MAf shown in FIG. The carry-in sensor 90, the carry-out sensor 91, the standby sensor 92, the stop sensor 93, the carry sensor 94, and the stage detection sensor 95 are not particularly limited in system, but for example, an optical non-contact sensor can be used. . The control device 105 shown in FIG. 1 acquires information on the position of the substrate detected by the carry-in sensor 90, the carry-out sensor 91, and the like, and uses it for control when the substrate is transported. Next, the component mounting part 102 (refer FIG. 1) is demonstrated.

  FIG. 11 is a plan view of a component mounting portion included in the electronic component mounting apparatus according to the present embodiment. The head moving device 5 included in the component mounting unit 102 includes two X-direction moving devices 50F and 50R and two Y-direction moving devices 54I and 54E. In the present embodiment, these are all linear motors, but the head moving device 5 is not limited to this. For example, a mechanism that converts a rotational motion into a linear motion using a rack and pinion, a mechanism that converts a rotational motion into a linear motion using a ball screw, or a mechanism that converts a rotational motion into a linear motion using a belt, etc. It can also be used as the moving device 5. However, when a linear motor is used for the head moving device 5, it is not necessary to convert the rotational motion into a linear motion, so that loss due to the conversion can be reduced. As a result, when a linear motor is used for the head moving device 5, energy for driving the head moving device 5 can be suppressed.

  The X-direction moving devices 50F and 50R are provided with a support 51, a stator 52 attached to and supported by the support 51, and heads 6F and 6R, and electromagnetic force generated between the stator 52 and the X-direction moving devices 50F and 50R. And a movable element 53 that moves along the support body 51. The Y-direction moving devices 54 </ b> I and 54 </ b> E are movable that move along the support body 55 by the electromagnetic force generated between the support body 55, the stator 56 attached to and supported by the support body 55, and the stator 56. And a child 57.

  One X-direction moving device 50F is arranged on the front side of the electronic component mounting apparatus 100 shown in FIG. 1, and the other X-direction moving device 50R is arranged on the back side. One Y-direction moving device 54I is arranged on the substrate supply unit 1 side of the electronic component mounting apparatus 100 shown in FIG. 1, and the other Y-direction moving device 54E is arranged on the substrate carry-out unit 2 side. The pair of X-direction moving devices 50F and 50R are arranged so that they face each other and the longitudinal direction is parallel to the X direction. Further, the pair of Y-direction moving devices 54I and 54E are arranged so that they face each other and the longitudinal direction is parallel to the Y direction. The X-direction moving devices 50F and 50R and the Y-direction moving devices 54I and 54E are combined in a rectangular shape so as to be orthogonal to each other. The pair of movers 57 and 57 included in the pair of Y-direction moving devices 54I and 54E supports the X-direction moving device 50F, and the other pair of movers 57 and 57 supports the X-direction moving device 50R. With such a configuration, the head moving device 5 can independently move the heads 6F and 6R in at least one of the X direction and the Y direction. The heads 6F and 6R are not limited to two, and may be three or more.

  FIG. 12 is an explanatory diagram of a head included in the electronic component mounting apparatus according to the present embodiment. Since the heads 6F and 6R have the same structure, the head 6F will be described in the following description. The head 6F is driven by the X-direction moving device 50F. The head 6F includes a control board 60, a Z-axis motor 61, a θ motor 62, an air control valve 63, a board recognition camera 64, a laser alignment sensor 65, and a nozzle (suction nozzle) that sucks electronic components. Including. The control board 60 has a drive circuit for driving the Z-axis motor 61, the air control valve 63, the θ motor 62, and the like.

  The Z-axis motor 61 moves the suction nozzle in the Z-axis direction. With this function, the Z-axis motor 61 moves the suction nozzle closer to the substrate and moves the suction nozzle closer to the substrate away from the substrate. The Z-axis motor 61 mounts the electronic component on the substrate by bringing the suction nozzle that has attracted the electronic component closer to the substrate and bringing the electronic component into contact with the terminal electrode of the substrate. The θ motor 62 rotates the suction nozzle around the Z axis. The Z axis is orthogonal to the XY plane, but the XY plane is parallel to the surface of the substrate on which the electronic component is mounted, so the θ motor 62 rotates the nozzle about an axis orthogonal to the surface of the substrate. . With this function, the θ motor 62 can adjust the positional relationship between the electronic component and the board.

  The air control valve 63 switches between suction and suction stop of the suction nozzle. In other words, the air control valve 63 sucks air from the opening of the suction nozzle, thereby sucking the electronic component into the opening of the suction nozzle. Further, the air control valve 63 stops the suction, thereby opening the electronic component sucked by the opening of the suction nozzle from the opening. The air control valve 63 controls the suction and release of the electronic component by the suction nozzle by causing the suction nozzle to perform such an operation.

  One substrate recognition camera 64 is provided for each of the heads 6F and 6R. The substrate recognition camera 64 images the recognition mark provided on the suction position reference in addition to the alignment mark provided on the substrate. By this operation, the substrate recognition camera 64 detects information (position information) about the position of the substrate and the stage 3. The board recognition camera 64 detects the position information while the electronic component is being mounted on the board, and detects the position information in teaching of the suction position of the electronic component and inspection of the mounting position. The laser alignment sensor 65 has a laser measurement function. With this function, information such as the distance between the head 6F and the substrate and the inclination of the head 6F is detected. In order to control the Z-axis motor 61 and θ motor 62 of the head 6F, suck air from the suction nozzle, transmit information detected by the substrate recognition camera 64, etc., the head 6F has a flexible cable and a suction tube. A bundle of flexible cables 66 is connected. Next, the component supply unit 103 (see FIG. 1) will be described.

  FIG. 13 is a plan view of a component supply unit included in the electronic component mounting apparatus according to the present embodiment. The component supply units 103F and 103R are disposed on both sides in the direction orthogonal to the direction in which the substrate is conveyed, that is, in the Y direction. Each of the component supply units 103 </ b> F and 103 </ b> R has a plurality of component supply devices 8 mounted on the support base 7. The component supply device 8 can continuously supply the electronic components to be mounted on the substrate to the heads 6F and 6R, and the electronic components can be sucked to a plurality of suction nozzles respectively provided in the heads 6F and 6R. The component supply device 8 holds the electronic component in the concave portion and sends the tape whose concave portion is sealed by the sealing material, and at the same time removes the tape sealing material to expose the electronic component in the concave portion, and the head 6F, An electronic component is adsorbed by a 6R adsorption nozzle. The component supply device 8 is not limited to such a method (tape feeder), but it is preferable that the component supply device 8 be detachable from the support base 7.

  The component supply device 8 of the component supply unit 103F supplies electronic components to the head 6F. The component supply device 8 of the component supply unit 103R supplies electronic components to the head 6R. As described above, the component supply unit 103 includes the component supply devices 8 that supply the electronic components to the heads 6F and 6R separately, and each of the heads 6F and 6R supplies the electronic components from the closer component supply device 8. Receive. With such a configuration, each of the heads 6F and 6R can quickly receive the supply of electronic components, and the access to the component supply device 8 is also increased, so that the productivity of the board on which the electronic components are mounted is improved. .

  The component supply units 103 </ b> F and 103 </ b> R have a component recognition camera 83. The component recognition camera 83 is installed between the component supply device 8 and the production area, and images an electronic component sucked by the suction nozzle from the suction nozzle opening side of the heads 6F and 6R. The control device 105 shown in FIG. 1 obtains the posture and the like of the electronic component sucked by the suction nozzle from the information captured by the component recognition camera 83, and the electronic component is mounted based on the obtained information such as the posture. Position it. The component recognition camera 83 can be substituted by a laser alignment sensor 65 shown in FIG. Next, the control device 105 included in the control unit 104 illustrated in FIG. 1 will be described.

  FIG. 14 is a configuration diagram of a control device that controls the electronic component mounting apparatus according to the present embodiment. The control device 105 controls the operation of the electronic component mounting apparatus 100 shown in FIG. The control device 105 includes a calculation unit 106, a storage unit 107, a board recognition camera control unit 108, a component recognition camera control unit 109, an information detection unit 110, a head position control unit 111, a laser control unit 112, The head controller 113, the substrate transport controller 114, the XY controller 115, the substrate fixing motor driver 116, the substrate transport motor driver 117, the stage moving motor driver 118, and the servo amplifier 119 are included. Of the control device 105, the substrate fixing motor driver 116, the substrate transport motor driver 117, the stage moving motor driver 118, and the servo amplifier 119 are electronic devices that combine electronic components (hardware) such as semiconductor elements, resistors, and capacitors. It is a device.

  The computing unit 106 is, for example, a CPU (Central Processing Unit). Based on information detected by the carry-in sensor 90 and the carry-out sensor 91 shown in FIG. 10, information taken by the component recognition camera 83 shown in FIG. 13, and the like, the calculation unit 106 is configured to move the stage moving mechanisms 4I, 4E, stage 3, and substrate. It controls the operation of the devices constituting the electronic component mounting apparatus 100 such as the support / conveyance device 10, the substrate fixing device 20, the head moving device 5, and the heads 6F and 6R. The storage unit 107 is a random access memory (RAM), a read only memory (ROM), a semiconductor storage device, or a combination thereof. The storage unit 107 stores a computer program for controlling the operation of the electronic component mounting apparatus 100, information on the types of boards and electronic components, information necessary for mounting electronic components on the board, and the like.

  The board recognition camera control unit 108 controls the operation of the board recognition camera 64 according to a command from the calculation unit 106. The component recognition camera control unit 109 controls the operation of the component recognition camera 83 according to a command from the calculation unit 106. The information detection unit 110 converts information detected by the board recognition camera 64, the component recognition camera 83, the carry-in sensor 90, the carry-out sensor 91, the laser alignment sensor 65, and the like into a signal that can be processed by the calculation unit 106. The head position control unit 111 controls the X-direction moving devices 50F and 50R and the Y-direction moving devices 54I and 54E via the servo amplifier 119 according to a command from the calculation unit 106. By this control, the position in the X direction and the position in the Y direction of the boards 6F and 6R included in the board carrying part 101 and the component mounting part 102 are controlled. The laser control unit 112 controls the operation of the laser alignment sensor 65 according to a command from the calculation unit 106. The head controller 113 controls the operation of the heads 6F and 6R according to a command from the calculator 106. The substrate transfer control unit 114 controls the operation of the substrate fixing motor 23 via the substrate fixing motor driver 116 according to a command from the arithmetic unit 106. By this control, the substrate is fixed to the stage 3 and the fixing is released. Further, the substrate transfer control unit 114 controls the operation of the transfer motor 13 via the substrate transfer motor driver 117 according to a command from the calculation unit 106. By this control, conveyance of the substrate to the stage 3 and conveyance of the substrate from the stage 3 are realized. The XY control unit 115 controls the operation of the stage moving mechanisms 4I and 4E via the stage moving motor driver 118 based on a command from the calculation unit 106. By this control, the position of the stage 3 in the X direction and the position in the Y direction are controlled.

  In the present embodiment, the substrate recognition camera control unit 108, the component recognition camera control unit 109, the information detection unit 110, the head position control unit 111, the laser control unit 112, the head control unit 113, and the substrate transport control unit. 114 and the XY control unit 115 are each realized by a dedicated circuit board or coprocessor. Note that these functions may be realized by software. In this case, these functions are realized by the arithmetic unit 106 executing software that realizes these functions. Next, an example of a production mode when the electronic component mounting apparatus 100 shown in FIG. 1 mounts electronic components on a substrate will be described.

(First production mode)
FIG. 15 is a flowchart showing the procedure of the first production mode when the electronic component mounting apparatus according to the present embodiment mounts the electronic component on the board. 16 to 20 are explanatory diagrams of the first production mode. In the first production mode, the stage moving mechanisms 4I and 4E of the electronic component mounting apparatus 100 shown in FIG. 1 are arranged so that at least two adjacent stages (in the example shown in FIG. 16, the first stage stage 3I and the second stage). The stage 3E) is moved in opposite directions to mount electronic components on the board. As shown in FIG. 16, the first stage stage 3I is stages 3FI and 3RI adjacent in the Y-axis direction, and the second stage stage 3E is stages 3FE and 3RE adjacent in the Y-axis direction.

  When the electronic component mounting apparatus 100 mounts an electronic component on the board in the first production mode, the operator presses a start button for starting production in the first production mode of the input device 105C shown in FIG. The control device 105 that has received the signal for starting production in the first production mode from the input device 105C drives the stage moving mechanisms 4I and 4E shown in FIG. 3, and sets the stages 3FI, 3RI, 3FE, and 3RE to the first one. Move to the initial position in the production mode (step S101). In this movement, the stage moving mechanisms 4I and 4E move the first stage stage 3I toward the rear side area MAr and move the second stage stage 3E toward the front side area MAf. That is, the first stage stage 3I and the second stage stage 3E move in opposite directions. In addition, as shown in FIG. 16, the stage 3FI and the stage 3RE are present in the intermediate area MAm, the stage 3RI is present in the rear side area MAr, and the stage 3FE is present in the front side area MAf. It is.

  Next, proceeding to step S102, the control device 105 transfers the two substrates (first substrate CB1 and second substrate CB2) from the substrate transfer unit 101 to the stage 3FI and the stage 3RE present in the intermediate area MAm. . In this case, the control device 105 drives the substrate support / conveyance device 10 (FIGS. 6 and 7) of the substrate supply unit 1 using the carry-in sensor 90 of the substrate supply unit 1 as a trigger. And the control apparatus 105 drives the board | substrate support conveyance apparatus 10 which each stage 3FI and 3RE have as a trigger that the standby sensor 92 is ON. The control device 105 stops the substrate support / conveyance device 10 included in each of the stages 3FI and 3RE, triggered by the fact that both the stop sensors 93 of the respective stages 3FI and 3RE are ON (step S103). By such processing, as shown in FIG. 17, the stage 3FI mounts and supports the second substrate CB2, and the stage 3RE supports and supports the first substrate CB1. Note that the third substrate CB3 is transported to the substrate supply unit 1.

  Next, the process proceeds to step S104, and it is determined whether or not an electronic component is mounted on any stage, that is, whether there is a substrate being mounted. When the control device 105 detects that the heads 6F and 6R do not mount the electronic component on the substrate at any stage, the control device 105 branches the process of step S104 to affirmative (Yes) and sets the second production mode. Proceed to step S105.

  In step S105, the control device 105 drives the stage moving mechanisms 4I and 4E to move the first stage stage 3I (stages 3FI and 3RI) and the second stage stage 3E (stages 3FE and 3RE) in opposite directions. Move to. In this example, as shown in FIG. 17, the stage moving mechanisms 4I and 4E move the first stage stage 3I toward the front side area MAf (the direction indicated by the arrow F in FIG. 17), and the second stage stage 3E. Is moved toward the rear side region MAr (direction indicated by an arrow R in FIG. 17). When the stages 3FI, 3RE, etc. start moving, the stage detection sensor 95 shown in FIG. 10 does not detect the stages 3FI, 3RE, and outputs OFF (step S106).

  Next, proceeding to step S107, the control device 105 executes a substrate fixing operation with the stage detection sensor 95 being turned off as a trigger. Specifically, the control device 105 includes the substrate fixing device 20 (see FIGS. 8 and 9) for the stage 3RE that supports the first substrate CB1, and the substrate fixing device for the stage 3FI that supports the second substrate CB2. 20 is driven to fix the first substrate CB1 to the stage 3RE and the second substrate CB2 to the stage 3FI. Since the substrate fixing operation in step S107 is performed on the stages 3FI and 3RE, the mounting of the electronic component on the substrate can be started immediately after the stages 3FI and 3RE stop or in a short time after the stop. As a result, it is possible to shorten the time from the conveyance of the substrate to the end of the mounting of the electronic component. As described above, when the substrate fixing operation is performed during the movement of the stages 3FI and 3RE, if the substrate fixing operation is terminated before the stages 3FI and 3RE are stopped, the electronic components are started immediately after the stages 3FI and 3RE are stopped. It is preferable because it can shift to mounting. Note that this embodiment does not exclude processing for performing the substrate fixing operation after the stages 3FI and 3RE are stopped.

  Next, in step S108, when the stage detection sensor 95 detects the stages 3RI and 3FE and outputs ON, the control device 105 stops the stage moving mechanisms 4I and 4E using this as a trigger. Next, in step S109, the control device 105 transfers the electronic component A to the first substrate CB1 fixed to the stage 3RE by the component mounting unit 102 shown in FIG. 1 and the second substrate CB2 fixed to the stage 3FI. Mounting is started (see FIG. 18). In this state, as shown in FIG. 18, the electronic component A is mounted on the second substrate CB2 of the stage 3FI in the front side region MAf, and on the first substrate CB1 of the stage 3RE in the back side region MAr. The stages 3RI and 3FE have moved to the intermediate area MAm.

  Next, the process proceeds to step S110. When the standby sensor 92 is ON, the substrate supply unit 1 has a substrate to be transported to the stages 3RI and 3FE that have moved to the intermediate area MAm. When detecting that the standby sensor 92 is ON, the control device 105 branches the process of step S110 to negative (No). By this branching process, the first production mode returns to step S102. In step S102 and step S103, the substrate supply unit 1 transfers the third substrate CB3 to the stage 3FE and the fourth substrate CB4 to the stage 3RI (see FIG. 18). In this state, mounting of electronic components on the second substrate CB2 and the first substrate CB1 has already been started in the stages 3FI and 3RE. Accordingly, in step S104, the control device 105 branches the process of step S104 to negative (No), and advances the first production mode to step S111.

  In step S111, the control device 105 performs a substrate fixing operation. Specifically, the control device 105 drives the substrate fixing device 20 of the stage 3FE supporting the third substrate CB3 and the substrate fixing device 20 of the stage 3RI supporting the fourth substrate CB4, thereby The substrate CB3 is fixed to the stage 3FE, and the fourth substrate CB4 is fixed to the stage 3RI. Then, the process proceeds to step S112, and when the control device 105 detects that the mounting of the electronic components on the first substrate CB1 and the second substrate CB2 is completed, the control device 105 proceeds the first production mode to step S113. In step S113, the control device 105 drives the stage moving mechanisms 4I and 4E so that the first stage stage 3I (stages 3FI and 3RI) and the second stage stage 3E (stages 3FE and 3RE) are in directions opposite to each other. Move to. In step S113, the stage moving mechanisms 4I and 4E move the second stage stage 3E toward the front side area MAf (in the direction indicated by the arrow F in FIG. 18), and move the first stage stage 3I toward the back side area MAr. (The direction indicated by the arrow R in FIG. 18). This is because the first substrate CB1 and the second substrate CB2 on which mounting of the electronic components has been completed are carried out of the production area.

  When the stages 3FI, 3RE, etc. start moving, the stage detection sensor 95 shown in FIG. 10 does not detect the stages 3FI, 3RE, and outputs OFF (step S114). Next, proceeding to step S115, the control device 105 executes a substrate fixing releasing operation with the stage detection sensor 95 being turned off as a trigger. Specifically, the control device 105 drives the substrate fixing device 20 of the stage 3RE that supports the first substrate CB1 and the substrate fixing device 20 of the stage 3FI that supports the second substrate CB2. The fixing of the substrate CB1 to the stage 3RE and the fixing of the second substrate CB2 to the stage 3FI are released. The substrate fixing release operation in step S115 is executed for the stages 3FI and 3RE. For this reason, it is possible to start transporting the first substrate CB1 and the second substrate CB2 on which mounting of the electronic components has been completed to the substrate unloading unit 2 immediately after the stages 3FI and 3RE are stopped or in a short time after the stop. As a result, the time for transporting the substrate from the production area to the substrate unloading unit 2 can be shortened. As described above, when the substrate fixing release operation is performed during the movement of the stages 3FI and 3RE, if the substrate fixing release operation is ended before the stages 3FI and 3RE are stopped, the production time can be shortened. In addition, this is preferable because the substrate 3 can be transferred immediately after the stages 3FI and 3RE are stopped. Note that this embodiment does not exclude processing for performing the substrate fixing release operation after the stages 3FI and 3RE are stopped.

  Next, in step S116, when the stage detection sensor 95 detects the stages 3FI and 3RE and outputs ON, the control device 105 stops the stage moving mechanisms 4I and 4E using this as a trigger (see FIG. 19). . Next, in step S117, the control device 105 drives the substrate support / conveyance device 10 included in the stages 3FI and 3RE to move the first substrate CB1 and the second substrate CB2 from the stages 3FI and 3RE to the substrate unloading unit 2. Transport. At this time, the control device 105 drives the substrate support / conveyance device 10 provided in the substrate carry-out section 2 with the fact that the conveyance sensor 94 outputs ON as a trigger.

  Next, proceeding to step S118, it is determined whether or not to end production, that is, whether or not there is a board on which electronic components are mounted. For example, when the control device 105 detects that no substrate is present in all the stages 3FI, 3RI, 3FE, 3RE and the substrate supply unit 1, the control device 105 branches the process of step S118 to affirmative (Yes), End the production mode. Further, when the control device 105 detects a board on which an electronic component is mounted, the control device 105 branches the process of step S118 to negative (No), and advances the first production mode to step S109. In this case, since there is a substrate on which the electronic component is mounted, production is continued. In this example, since the electronic component A is now mounted on the first substrate CB1 and the fourth substrate CB4 shown in FIG. 19, the processing from step S109 is executed.

  In the example illustrated in FIG. 19, the fifth substrate CB <b> 5 exists in the substrate supply unit 1. For this reason, the standby sensor 92 is ON in step S110 after the first production mode returns to step S109. When the standby sensor 92 is ON, the controller 105 has a substrate to be transported to the stages 3FI and 3RE moved to the intermediate area MAm in the substrate supply unit 1. When detecting that the standby sensor 92 is ON, the control device 105 branches the process of step S110 to negative (No). By this branching process, the first production mode returns to step S102. In steps S102 and S103, the substrate supply unit 1 transfers the sixth substrate CB6 to the stage 3FI and the fifth substrate CB5 to the stage 3RE (see FIG. 20). Subsequent processing is as described above.

  In step S110 after the first production mode returns to step S109, when there is no substrate in the substrate supply unit 1, that is, when the standby sensor 92 is OFF, the control device 105 affirms the process of step S110 ( Branch to Yes). At this point, steps S109 to S118 are repeated until the mounting of the electronic components on all the boards existing in stages 3FI, 3RI, 3FE, and 3FR is completed.

  As described above, in the electronic component mounting apparatus 100 according to the present embodiment, at least two stages 3FI, 3RI, and the like arranged in the Y direction move in the Y direction, receive a substrate from the substrate supply unit 1, and receive a substrate. 2. Transfer the substrate to 2. For this reason, the substrate supply unit 1 and the substrate carry-out unit 2 do not need to move to the stages 3FI, 3RI, etc. arranged in the Y direction when transferring the substrate. As a result, the substrate supply unit 1 and the substrate carry-out unit 2 are either transferred from the substrate supply unit 1 to the stages 3FI, 3RI or the like or from the stage 3FI, 3RI or the like to the substrate carry-out unit 2. Therefore, it is possible to suppress an increase in the time for transporting the substrate, which occurs due to these stops. In particular, when using a plurality of stages 3FI, 3FR, and the like arranged in the X direction as in the first production mode, the effect of suppressing an increase in the time for transporting the substrate becomes very large.

  In the first production mode, in this way, the production area can be brought closer to the component supply unit by moving the adjacent stage stages in the opposite direction. Specifically, as shown in FIG. 18, a stage 3FI and a stage 3RE are arranged in the front side area MAf and the back side area MAr, respectively. The front side region MAf is adjacent to the component supply unit 103F, and the back side region MAr is adjacent to the component supply unit 103R. For this reason, the head 6F shown in FIG. 1 mounts electronic components on the substrate of the stage 3FI arranged in the front side region MAf, and the head 6R has an electron on the substrate of the stage 3RE arranged in the back side region MAr. Parts can be mounted. Further, since the heads 6F and 6R can receive the supply of the electronic components to be mounted on the substrate from the component supply units 103F and 103R at a closer position, the time for mounting the electronic components on the substrate can be shortened.

  FIG. 21 to FIG. 23 are explanatory diagrams showing modifications of the first production mode. In this modified example, as shown in FIG. 21, after the electronic component A is mounted on the first substrate CB1 and the second substrate CB2, do not convey them to the substrate carry-out unit 2, as shown in FIG. Electronic components are mounted on the third substrate CB3 and the fourth substrate CB4. Then, when the electronic components are mounted on the third substrate CB3 and the fourth substrate CB4, these are transferred to the substrate carry-out unit 2. At the same time, the fifth substrate CB5 and the sixth substrate are transferred from the substrate supply unit 1 to the stages 3FE and 3RI. Next, as shown in FIG. 21, the control device 105 drives the stage moving mechanisms 4I and 4E to move the stages 3FE and 3RI on which the fifth substrate CB5 and the sixth substrate CB6 are transferred in opposite directions. . In the example shown in FIG. 21, the stage moving mechanisms 4I and 4E move the first stage stage 3I (stages 3FI and 3RI) toward the rear side area MAr and move the second stage stage 3E (stages 3FE and 3RE) to the front surface. Move toward the side area MAf. When this movement is completed, mounting of electronic components is started on the fifth substrate CB5 supported by the stage 3FE and the sixth substrate CB6 supported by the stage 3RI.

  Through the processing described above, the stages 3FI and 3RE move to the intermediate area MAm. In this state, as shown in FIG. 22, the first substrate CB1 and the second substrate CB2 on which the electronic components have been mounted are transferred from the stages 3RE and 3FI to the substrate carry-out section 2. At the same time, as shown in FIG. 23, the seventh substrate CB7 and the eighth substrate CB8 are transferred from the substrate supply unit 1 to the stages 3RE and 3FI, respectively. Thereafter, the above-described procedure is repeated to mount the electronic component on the substrate.

  In this modification, after all the stages 3FI, 3RI, 3FE, and 3RE support the substrate, the mounting of the electronic components on all the substrates is completed, and then all the substrates are transferred to the substrate carry-out unit 2. Even in such a process, the substrate supply unit 1 and the substrate supply unit 1 and the stage 3FI, 3RI, etc., and the substrate supply unit 1 and the stage 3FI, 3RI, etc. The substrate carry-out unit 2 does not stop. As a result, it is possible to suppress an increase in time for transporting the substrate generated due to these stops.

  FIG. 24 is a schematic diagram showing an electronic component mounting apparatus in which a stage for holding the substrate is fixed when the substrate supply unit and the substrate carry-out unit move and the electronic component is mounted on the substrate. This electronic component mounting apparatus 200 is the electronic component mounting apparatus described in Patent Document 1 described above, and includes four positioning portions corresponding to the stage 3 of the electronic component mounting apparatus 100 of the present embodiment. The electronic component mounting apparatus 200 includes four fixed stages 203FI, 203RI, 203FE, and 203RE, and the substrate supply unit 201 and the substrate carry-out unit 202 move to the first position Mf and the second position Mr in the Y direction. It is.

When electronic components are mounted on four substrates CB, the steps required for substrate transport and stage movement required by the electronic component mounting apparatus 100 of the present embodiment are as follows:
(1) Step of transporting the first substrate CB1 and the second substrate CB2 to the stages 3RE and 3FI (2) Step of moving the first stage 3I and the second stage 3E in opposite directions to each other (3) Third (4) Step of transporting the substrate CB3 and the fourth substrate CB4 to the stages 3FE and 3RI (4) Step of moving the first stage 3I and the second stage 3E in opposite directions (5) First mounting electronic components Step (6) of transporting the substrate CB1 and the second substrate CB2 to the substrate unloading section 2 After mounting electronic components on the third substrate CB3 and the fourth substrate CB4, the first stage stage 3I and the second stage stage 3E (7) A total of seven steps of transferring the third substrate CB3 and the fourth substrate CB4 to the substrate carry-out unit 2 are required.

On the other hand, when the electronic component mounting apparatus 200 mounts electronic components on four substrates CB,
(1) The process of transporting two substrates CB from the substrate supply unit 201 to the stages 203FE and 203FI, and the substrate supply unit 201 receiving one substrate CB. (2) The substrate supply unit 201 from the first position Mf. Step of moving to second position Mr (3) Step of transferring one substrate CB from substrate supply unit 201 to stage 203RE (4) Step of moving substrate supply unit 201 from second position Mr to first position Mf (5) Step of receiving substrate CB by substrate supply unit 201 (6) Step of moving substrate supply unit 201 from first position Mf to second position Mr (7) Single substrate CB from substrate supply unit 201 (8) Step of transporting two substrates CB from the stages 203FE and 203FI to the substrate unloading unit 202 (9) Substrate unloading unit 202 at the first position Mf (10) Step of transferring one substrate CB from the stage 203RE to the substrate unloading section 202 (11) The substrate unloading section 202 moves from the second position Mr to the first position Mf. Step (12) Step in which the substrate unloading section 202 unloads one substrate CB (13) Step in which the substrate unloading portion 202 moves from the first position Mf to the second position Mr (14) One substrate CB moves to the stage 203RI Step (15) to be transferred from the second position Mr to the first position Mf is required.

  In the electronic component mounting apparatus 200 (that is, the electronic component mounting apparatus disclosed in Patent Document 1), the substrate supply unit 201 and the substrate carry-out unit 202 stop once in the conveyance of the substrate CB. For this reason, when mounting electronic components on the same number of substrates CB, the electronic component mounting apparatus 200 requires more than twice as many steps as the electronic component mounting apparatus 100 according to the present embodiment. As described above, the electronic component mounting apparatus 100 can significantly improve the productivity as compared with the electronic component mounting apparatus described in Patent Document 1. Next, the second production mode will be described.

(Second production mode)
FIG. 25 is a flowchart showing the procedure of the second production mode when the electronic component mounting apparatus according to this embodiment mounts the electronic component on the board. 26 to 30 are explanatory diagrams of the second production mode, respectively. In the second production mode, the stage moving mechanisms 4I and 4E of the electronic component mounting apparatus 100 shown in FIG. 1 are arranged so that at least two adjacent stages (in the example shown in FIG. 26, the first stage 3I and the second stage). The stage 3E) is moved in conjunction with the same direction to mount the electronic component on the board. As shown in FIG. 26, the first stage stage 3I is the stages 3FI and 3RI adjacent in the Y-axis direction, and the second stage stage 3E is the stages 3FE and 3RE adjacent in the Y-axis direction. In the second production mode, a substrate having a size that cannot be supported by one stage 3FI or the like is supported by two adjacent stages 3FI or 3FE or two adjacent stages 3RI or 3RE, and an electronic component is mounted. Is.

  When the electronic component mounting apparatus 100 mounts an electronic component on the board in the second production mode, the operator presses a start button for starting production in the second production mode of the input device 105C shown in FIG. The control device 105, which has received the signal for starting production in the second production mode from the input device 105C, drives the stage moving mechanisms 4I, 4E shown in FIG. 3 to set the stages 3FI, 3RI, 3FE, 3RE to the second Move to the initial position in the production mode (step S201). In this movement, the stage moving mechanisms 4I and 4E move both the first stage stage 3I and the second stage stage 3E toward the back side region MAr. That is, the first stage stage 3I and the second stage stage 3E move in the same direction. Further, as shown in FIG. 26, the state where the stage 3FI and the stage 3FE are present in the intermediate area MAm and the stage 3RI and the stage 3RE are present in the back area MAr is the initial position in step S201.

  Next, the process proceeds to step S202, and the control device 105 conveys one substrate (first substrate CB1) from the substrate supply unit 1 to the stage 3FI and the stage 3FE existing in the intermediate area MAm. In this case, the control device 105 drives the substrate support / conveyance device 10 of the substrate supply unit 1 with a trigger that the carry-in sensor 90 of the substrate supply unit 1 is ON. And the control apparatus 105 drives the board | substrate support conveyance apparatus 10 which each stage 3FI and 3FE have as a trigger that the standby sensor 92 is ON. The control device 105 stops the substrate support / conveyance device 10 included in each of the stages 3FI and 3RE using the stop sensor 93 of the stage 3FE closer to the substrate carry-out unit 2 as a trigger (step S203). By such processing, as shown in FIG. 27, the stage 3FI and the stage 3FE mount and support the first substrate CB1 having a size that cannot be supported by one stage. Note that the second substrate CB <b> 2 is transported to the substrate supply unit 1.

  Next, proceeding to step S204, it is determined whether or not an electronic component is mounted on any stage, that is, whether there is a substrate being mounted. In any stage, when the control device 105 detects that the heads 6F and 6R do not mount the electronic component on the substrate, the control device 105 branches the process of step S204 to affirmative (Yes). Advances to step S205.

  In step S205, the control device 105 drives the stage moving mechanisms 4I and 4E to move the first stage stage 3I (stages 3FI and 3RI) and the second stage stage 3E (stages 3FE and 3RE) in the same direction. Move to. In this example, as shown in FIG. 27, the stage moving mechanisms 4I and 4E move the first stage stage 3I and the second stage stage 3E toward the front side area MAf (direction indicated by the arrow F in FIG. 27). . When the stages 3FI, 3FE, etc. start moving, the stage detection sensor 95 does not detect the stages 3FI, 3RE, and outputs OFF (step S206).

  Next, proceeding to step S207, the control device 105 executes the substrate fixing operation with the stage detection sensor 95 being turned off as a trigger. Specifically, the control device 105 drives the substrate fixing device 20 of the stages 3FI and 3FE supporting the first substrate CB1, and fixes the first substrate CB1 to the stages 3FI and 3FE. Since the substrate fixing operation in step S207 is performed on the stages 3FI and 3FE, the mounting of the electronic component on the substrate can be started immediately after the stages 3FI and 3FE stop or in a short time after the stop. As a result, it is possible to shorten the time from the conveyance of the substrate to the end of the mounting of the electronic component. As described above, when the substrate fixing operation is performed during the movement of the stages 3FI and 3FE, if the substrate fixing operation is terminated before the stages 3FI and 3FE are stopped, the electronic components are started immediately after the stages 3FI and 3FE are stopped. It is preferable because it can shift to mounting. Note that this embodiment does not exclude processing for performing the substrate fixing operation after the stages 3FI and 3FE are stopped.

  Next, in step S208, when the stage detection sensor 95 detects the stages 3RI and 3RE and outputs ON, the control device 105 stops the stage moving mechanisms 4I and 4E using this as a trigger. In step S209, the control device 105 starts mounting the electronic component A on the first substrate CB1 fixed to the stages 3FI and 3FE by the component mounting unit 102.

  Next, the process proceeds to step S210. When the standby sensor 92 is ON, the substrate supply unit 1 has a substrate to be transported to the stages 3RI and 3RE that have moved to the intermediate area MAm. When detecting that the standby sensor 92 is ON, the control device 105 branches the process of step S210 to No (No). By this branching process, the second production mode returns to step S202. In step S202 and step S203, the second substrate CB2 is transferred from the substrate supply unit 1 to the stage 3RI and the stage 3RE (see FIG. 28). In this state, in stages 3FI and 3FE, mounting of electronic components on the first substrate CB1 has already started. Therefore, in step S204, the control device 105 branches the process of step S204 to negative (No), and advances the second production mode to step S211.

  In step S211, the control device 105 performs a substrate fixing operation. Specifically, the control device 105 drives the substrate fixing device 20 of the stages 3RI and 3RE supporting the second substrate CB2, and fixes the second substrate CB2 to the stages 3RI and 3RE. Then, the process proceeds to step S212, and when the control device 105 detects that the mounting of the electronic component on the first substrate CB1 is completed, the control apparatus 105 proceeds the second production mode to step S213. In step S213, the control device 105 drives the stage moving mechanisms 4I and 4E to move the first stage stage 3I and the second stage stage 3E in the same direction. In step S213, the stage moving mechanisms 4I and 4E move toward the first stage stage 3I and the second stage stage 3E rear side area MAr (direction indicated by the arrow R in FIG. 28). This is because the first substrate CB1 on which the electronic component has been mounted is carried out of the production area.

  When the stages 3FI, 3RE, etc. start moving, the stage detection sensor 95 does not detect the stages 3RI, 3RE, and outputs OFF (step S214). Next, proceeding to step S215, the control device 105 executes a substrate fixing releasing operation with the stage detection sensor 95 being turned off as a trigger. Specifically, the control device 105 drives the substrate fixing device 20 of the stages 3FI and 3FE supporting the first substrate CB1 to release the fixing of the first substrate CB1 to the stages 3FI and 3FE. The substrate fixing release operation in step S215 is performed on the stages 3FI and 3FE. For this reason, it is possible to start transporting the first substrate CB1 after mounting of the electronic components to the substrate carry-out unit 2 immediately after the stages 3FI and 3FE are stopped or in a short time after the stop. As a result, the time for transporting the substrate from the production area to the substrate unloading unit 2 can be shortened. As described above, when the substrate fixing release operation is executed while the stages 3FI and 3FE are moving, the production time can be shortened by stopping the substrate fixing release operation before the stages 3FI and 3FE are stopped. In addition, this is preferable because it is possible to shift to mounting electronic components immediately after the stages 3FI and 3FE are stopped. Note that this embodiment does not exclude processing for performing the substrate fixing release operation after the stages 3FI and 3FE are stopped.

  Next, in step S216, when the stage detection sensor 95 detects the stages 3FI and 3RE and outputs ON, the control device 105 stops the stage moving mechanisms 4I and 4E using this as a trigger (see FIG. 29). . Next, in step S217, the control device 105 drives the substrate support / conveyance device 10 included in the stages 3FI and 3FE to move the first substrate CB1 and the second substrate CB2 from the stages 3FI and 3RE to the substrate unloading unit 2. Transport. At this time, the control device 105 drives the substrate support / conveyance device 10 included in the substrate carry-out unit 2 by using the fact that the conveyance sensor 94 of the stage 3FE outputs ON as a trigger.

  Next, proceeding to step S218, it is determined whether or not to end production, that is, whether or not there is a board on which electronic components are mounted. For example, when the control device 105 detects that no substrate exists in all the stages 3FI, 3RI, 3FE, 3RE and the substrate supply unit 1, the control device 105 branches the process of step S218 to affirmative (Yes), End the production mode. In addition, when the electronic device is being mounted or when a substrate on which the electronic component is to be mounted is detected, the control device 105 branches the process of step S218 to negative (No) and advances the second production mode to step S209. . In this case, since there is a substrate on which the electronic component is mounted, production is continued. In this example, since the electronic component A is now mounted on the second substrate CB2 shown in FIG. 29, the processing from step S209 is executed. In step S209, the control device 105 mounts an electronic component on the second substrate CB2 in the back side region MAr.

  In the example shown in FIG. 29, the third substrate CB3 exists in the substrate supply unit 1. For this reason, in step S210 after the second production mode returns to step S209, the standby sensor 92 is ON. When the standby sensor 92 is ON, the controller 105 has a substrate to be transported to the stages 3FI and 3FE existing in the intermediate area MAm in the substrate supply unit 1. When detecting that the standby sensor 92 is ON, the control device 105 branches the process of step S210 to No (No). By this branching process, the second production mode returns to step S202. In step S202 and step S203, the third substrate CB3 is transferred from the substrate supply unit 1 to the stages 3FI and 3FE (see FIG. 30). Subsequent processing is as described above.

  In step S210 after the second production mode returns to step S209, when there is no substrate in the substrate supply unit 1, that is, when the standby sensor 92 is OFF, the control device 105 affirms the process of step S210 ( Branch to Yes). At this time, Steps S209 to S218 are repeated until the mounting of the electronic components on all the boards existing in the stages 3FI, 3RI, 3FE, and 3FR is completed.

  In the second production mode, a plurality of stage stages are arranged in the direction in which the substrate is transported, that is, in the X direction, and adjacent stage stages are moved in conjunction with each other in the same direction. With such a process, an electronic component can be mounted using the electronic component mounting apparatus 100 even if the substrate has a size that cannot be mounted on one stage.

  FIG. 31 to FIG. 33 are explanatory diagrams showing modifications of the second production mode, respectively. In this modification, electronic components are mounted on both the first substrate CB1 and the second substrate CB2 in the state shown in FIG. When electronic components are mounted on both the first substrate CB1 and the second substrate CB2, as shown in FIG. 31, the second substrate CB2 is transferred from the stages 3RI and 3RE to the substrate carry-out unit 2 and the substrate supply unit 1 Then, the third substrate CB3 is transferred to the stages 3RI and 3RE. Next, as shown in FIG. 32, the stages 3FI and 3FE move (in the direction of arrow R in FIG. 32). Then, the first substrate CB1 is transferred from the stages 3FI and 3FE to the substrate carry-out unit 2, and the fourth substrate CB4 is transferred from the substrate supply unit 1 to the stages 3FI and 3FE. Then, electronic components are mounted on both the third substrate CB3 and the fourth substrate CB4 in the state shown in FIG. Next, when there is a substrate on which the component is mounted, the fourth substrate CB4 on which the electronic component is mounted is transferred from the stages 3FI and 3FE currently supporting the fourth substrate CB4 to the substrate unloading unit 2, and the next substrate is mounted. The substrate is fed from the substrate supply unit 1 to the stages 3FI and 3FE.

  Even when such a process is performed, the substrate supply unit 1 and the substrate supply unit 1 and the stage 3FI, 3FE, and the like are either transferred to the substrate unloading unit 2 or the stage 3FI, 3FE, or the like. The substrate carry-out unit 2 does not stop. As a result, it is possible to suppress an increase in time for transporting the substrate, which occurs due to these stops.

  As described above, in the present embodiment, it is not necessary to move the substrate supply unit and the substrate carry-out unit by arranging the stages in the Y direction and moving in the Y direction. For this reason, since the stop before delivering a board | substrate after moving these to the position of a stage can be avoided, the increase in the time at the time of conveying a board | substrate which arises due to the said stop can be suppressed. In the present embodiment, the substrate is fixed to the stage or the substrate is released from the stage while the stage is moving. Such processing can further suppress an increase in time when the substrate is transported. Further, in the present embodiment, by moving the adjacent stage stages in the opposite directions, the time for mounting the electronic component on the substrate can be shortened by minimizing the moving distance of the head. In this embodiment, adjacent stage stages are moved in conjunction with each other in the same direction, so that even a substrate having a size that could not be mounted on one stage can be mounted. As a result, the degree of freedom in mounting electronic components on the board is improved, so that various production plans can be flexibly handled.

  As described above, the electronic component mounting apparatus according to the present invention is useful for suppressing an increase in time for transporting a substrate when the electronic component is mounted on the substrate.

1, 201 Substrate supply unit 2, 202 Substrate unloading unit 3, 3FI, 3RI, 3FE, 3RE stage 3I First stage stage 3E Second stage stage 4E, 4I Stage moving mechanism 5 Head moving device 6F, 6R Head 8 Component supply device DESCRIPTION OF SYMBOLS 10 Substrate support conveyance apparatus 11 Conveyance belt 12 Substrate support member 12S Conveyance belt support part 13 Conveyance motor 20 Substrate fixing apparatus 23 Substrate fixation motor 30 Frame member 31 Sliding bearing 32 Nut 34 Substrate pressing member 40 Electric motor 43E, 43I Guide rail 50F , 50R X direction moving device 54E, 54I Y direction moving device 64 Substrate recognition camera 65 Laser alignment sensor 83 Component recognition camera 100, 200 Electronic component mounting device 101 Substrate transport unit 102 Component mounting unit 103, 103F, 103R Component supply unit 104 Control DESCRIPTION OF SYMBOLS 105 Control apparatus 106 Operation part 107 Storage part 108 Board | substrate recognition camera control part 109 Component recognition camera control part 110 Information detection part 111 Head position control part 112 Laser control part 113 Head control part 114 Substrate conveyance control part 115 XY control part 116 Substrate fixation Motor driver 117 Motor driver for board transfer 118 Motor driver for stage movement 119 Servo amplifier

Claims (6)

In an electronic component mounting apparatus for mounting electronic components on a board,
A support unit that supports the substrate; and a substrate transport mechanism that carries the substrate into and out of the support unit, and the substrate transport mechanism is orthogonal to a direction in which the substrate is transported. At least two stages arranged in a direction;
A stage moving mechanism that moves the at least two stages in a direction orthogonal to a direction in which the substrate transport mechanism transports the substrate;
A head for mounting the electronic component on the substrate supported by the stage;
Including
An electronic component mounting apparatus comprising: at least two stages including at least two stages and a stage moving mechanism for moving the at least two stages in a direction in which the substrate is conveyed.   The electronic component mounting apparatus according to claim 1, wherein the number of the heads is at least two. The stage includes a substrate fixing / releasing mechanism that fixes the substrate to the support portion or releases the fixation.
The electronic component mounting apparatus according to claim 1, wherein the substrate fixing / releasing mechanism fixes the substrate or releases the fixing while the stage is moving.   The electronic component mounting apparatus according to claim 1, wherein the stage moving mechanism moves the at least two stages in conjunction with each other.   The component supply part which supplies the said electronic component to the head which mounts the said electronic component on the said board | substrate is each arrange | positioned on both sides of the said at least 2 stage in the direction orthogonal to the direction in which the said board | substrate is conveyed. 5. The electronic component mounting apparatus according to any one of 1 to 4. Each of the stage moving mechanisms is
6. The method according to claim 1, further comprising: a first production mode in which the adjacent stage stages are moved in directions opposite to each other; and a second production mode in which the adjacent stage stages are moved in conjunction with each other in the same direction. The electronic component mounting apparatus of Claim 1.

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