JP2016004964A - Substrate transfer device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate transfer device which enables successful transfer without using a transfer jig to inhibit an increase in manufacturing cost even when the substrate is thin and flexible thereby to inhibit an increase in manufacturing cost of the substrate.SOLUTION: A substrate transfer device comprises: a pair of substrate transfer parts 31, 32 which extend in a transfer direction of transferring a substrate K and which are arranged in parallel with and at a distance from each other, for transferring the substrate K by supporting ends of the substrate K on both sides, respectively; a pair of substrate guide parts 41, 42 which are arranged alongside respective substrate transfer parts 31, 32, for guiding lateral faces on both sides of the substrate to be transferred, respectively; a bearing member 52 arranged between the pair of substrate transfer parts 31, 32; and a rotary member 6 which is supported by the bearing member 52 and freely rotates in the transfer direction while supporting an undersurface of the substrate K to be transferred.

Description

  The present invention relates to a substrate transfer apparatus that is incorporated in a substrate production apparatus, a substrate production line, or the like and conveys a substrate.

  As a board production apparatus that produces a board on which a large number of electronic components are mounted, there are a solder printing apparatus, a component mounting apparatus, a reflow apparatus, a board inspection apparatus, and the like. In many cases, these substrate production apparatuses are connected to construct a substrate production line. Substrate transport apparatuses are widely used for applications in which a substrate is transported inside each substrate production apparatus and for applications in which a substrate is transferred between substrate production apparatuses. In general, the substrate transfer apparatus includes a pair of substrate transfer units that support and transfer edges on both sides of the substrate, specifically, a conveyor belt and the like. In addition, a substrate transfer device used in the substrate production apparatus often includes a backup mechanism for positioning and holding the substrate when performing production work.

  One technical example regarding this type of substrate transfer apparatus is disclosed in Patent Document 1. The substrate manufacturing apparatus of Patent Document 1 attaches a flexible substrate to a conveyance jig, and conveys the flexible substrate along a conveyance line using the conveyance jig as a medium. By using a transport jig, even a flexible flexible substrate can be easily transported and a reliable production operation can be performed.

JP 2005-210003 A

  By the way, the problem of bending cannot be ignored even in rigid type substrates that are rigid, not limited to flexible substrates that require a transfer jig. That is, the pair of substrate transport units support and transport the edge portions on both sides of the substrate, but the rigid unsupported intermediate portion of the rigid type substrate is bent downward. Due to the deformation caused by the bending, the substrate may come off the conveyor belt or interfere with the backup mechanism, which may cause a problem that the conveyance becomes impossible. As a countermeasure against this, it is not a good idea to use a transfer jig on a rigid-type substrate because the number of processes and production time are increased and the production cost is increased.

  In addition, the problem of the bending of the substrate is not limited at the time of conveyance, and may also occur at the time of positioning and holding in the backup mechanism. For example, in a component mounting apparatus, when an electronic component is mounted on a substrate that is positioned and held, if the substrate is bent, a large error occurs in the mounting position and mounting posture of the electronic component. Further, for example, in a solder printing apparatus, if the substrate that has been positioned and held is bent, paste solder cannot be printed satisfactorily.

  The present invention has been made in view of the problems of the background art described above, and enables reliable transport without using a transport jig, even if the substrate is thin and flexible, and the production cost of the substrate is reduced. It is an object to be solved to provide a substrate transfer device that suppresses an increase.

  The invention of the substrate transport apparatus according to claim 1 that solves the above-mentioned problems extends in the transport direction for transporting the substrate, is arranged in parallel with being spaced apart from each other, and supports and transports the edges on both sides of the substrate. A pair of substrate transport portions, a pair of substrate guide portions that are arranged side by side on each of the substrate transport portions and guide side surfaces on both sides of the substrate to be transported, and a support member disposed between the pair of substrate transport portions And a rotating member that is supported by the supporting member and that freely rotates in the conveying direction while supporting the lower surface of the substrate to be conveyed.

  According to the substrate transport apparatus of the first aspect, in addition to the edge portions on both sides of the substrate being supported by the substrate transport portion, the intermediate portion in the width direction of the substrate is supported by the rotating member. For this reason, even if it is a thin and flexible board | substrate, the amount of bending can be reduced and reliable conveyance is attained. Furthermore, since the support member and the rotating member added to the conventional configuration have a simple structure, the initial cost of the substrate transfer apparatus is only slightly increased. On the other hand, a transfer jig that increases the number of processes and production time is unnecessary, and the running cost does not increase. Therefore, an increase in the production cost of the substrate is suppressed in a comprehensive manner.

It is a top view which shows the whole structure of the component mounting apparatus with which the board | substrate conveyance apparatus of 2 units | sets of embodiments was integrated. It is a perspective view of the board | substrate conveyance apparatus of embodiment. It is a perspective view of the board | substrate conveyance apparatus of embodiment, and a part of member is abbreviate | omitted from FIG. 2, and it is easy to see a backup mechanism. FIG. 3 is a front view of a support member, a rotating member, and the like as seen from the direction of a white arrow A1 in FIG. 2. It is a perspective view which shows the state which the back-up mechanism positioned and hold | maintained the board | substrate carried in in the component mounting position. FIG. 4 is a front view of the backup mechanism and the like as viewed from the direction of the white arrow A2 in FIG. 3 and shows a substrate that is positioned and held. It is a figure which illustrates another kind of rotating member from which a shape differs, Comprising: It is the figure seen from the white arrow A1 direction of FIG. It is a perspective view which shows the conveyance condition of the board | substrate by the board | substrate conveyance apparatus of a conventional structure.

  A substrate transfer apparatus 1 according to an embodiment of the present invention will be described with reference to FIGS. First, the overall configuration of the component mounting apparatus 9 in which the board conveyance device 1 of the embodiment is incorporated will be schematically described. FIG. 1 is a plan view showing an overall configuration of a component mounting apparatus 9 in which the board transfer apparatuses 1 of two embodiments are incorporated. The component mounting apparatus 9 is configured by assembling two board transfer apparatuses 1, component supply apparatuses 92 and 93, a component transfer apparatus 95, component camera apparatuses 96 and 97, and the like on the machine base 91. The left-right direction in FIG. 1 is the transport direction for transporting the substrate K, and is referred to as the X-axis direction. 1 is a width direction orthogonal to the transport direction and is referred to as a Y-axis direction.

  The two board transfer devices 1 are disposed near the center of the component mounting device 9 in the longitudinal direction (Y-axis direction). The two substrate transfer apparatuses 1 each extend in the transfer direction (X-axis direction) and are arranged in parallel to each other. Each board transfer device 1 loads a board K (shown with hatching for convenience in FIG. 1) from the upstream side (left side in FIG. 1) and positions it at a component mounting position set near the middle in the loading direction. Hold. Furthermore, each board | substrate conveyance apparatus 1 carries out the board | substrate K with which the electronic component was mounted downstream (right side of FIG. 1).

  The two component supply devices 92 and 93 are arranged so as to face each other on the front side and the rear side (the upper side and the lower side in FIG. 1) of the machine base 91 with the substrate transfer device 1 interposed therebetween. Each of the component supply devices 92 and 93 is configured by arranging a plurality of flat cassette type feeders 941 extending in the Y-axis direction in the X-axis direction. Each cassette type feeder 941 feeds out the tape in which the electronic components are sealed from the component supply reel 942 to the component supply position 943 at the tip, and sequentially supplies the electronic components.

  The component transfer device 95 includes a Y-axis slider 951 (shown by a one-dot chain line), an X-axis slider 952 (shown by a one-dot chain line), a mounting head 953, and a Y-axis rail, a Y-axis drive mechanism, and an X-axis drive mechanism that are not shown. It is configured. The mounting head 953 is driven at a position higher than the substrate K between the two component supply devices 92 and 93 in the X-axis direction and the Y-axis direction. The mounting head 953 includes a suction nozzle 954, a substrate recognition camera 955, a nozzle recognition camera 956, and the like. The suction nozzle 954 is provided downward, and sucks and collects an electronic component in the lower end nozzle opening using negative pressure. The component transfer device 95 picks up and collects the electronic components supplied to the component supply positions 943 of the component supply devices 92 and 93, transports them to the mounting position on the substrate K, and mounts them.

  The two component camera devices 96 and 97 are provided upwardly between the substrate transfer device 1 and the component supply devices 92 and 93, respectively. Each of the component camera devices 96 and 97 captures the electronic component collected by suction while the suction nozzle 954 moves from the component supply devices 92 and 93 onto the substrate K, and acquires image data. By the image processing of the image data, an error in the suction posture of the electronic component or a shift in the rotation angle is determined. Electronic parts that cannot be used due to the determination are discarded in disposal boxes 98 and 99 disposed adjacent to the component camera devices 96 and 97.

  The detailed description of the substrate transfer apparatus 1 of the embodiment will now be described. FIG. 2 is a perspective view of the substrate transfer apparatus 1 according to the embodiment. The substrate transport apparatus 1 includes a fixed support portion 21, a movable support portion 22, a pair of substrate transport portions 31, 32, a pair of substrate guide portions 41, 42, support members 51, 52, a rotating member 6, a width adjusting portion 7, and The backup mechanism 8 is configured. FIG. 3 is also a perspective view of the substrate transfer apparatus 1 according to the embodiment, in which some members are omitted from FIG. 2 so that the backup mechanism 8 can be easily seen.

  4 is a front view of the support member 5 and the rotating member 6 as seen from the direction of the white arrow A1 in FIG. FIG. 4 shows a state in which the substrate K is supported by the rotating member 6 while being transported by the pair of substrate transport units 31 and 32. FIG. 5 is a perspective view showing a state in which the loaded board K is positioned and held by the backup mechanism 8 at the component mounting position. Further, FIG. 6 is a front view of the backup mechanism 8 and the like seen from the direction of the white arrow A2 in FIG. 3, and shows the substrate K that is positioned and held. Also in FIG. 6, some members are omitted.

  As shown in FIGS. 2, 3, and 5, the fixed support portion 21 includes two fixed brackets 211 and 212 and a fixed plate member 213. The two fixing brackets 211 and 212 are erected and fixed at positions separated from each other in the X-axis direction on the machine base 91 of the component mounting apparatus 9. The fixed plate material 213 is a long plate-like member extending in the X-axis direction. The fixed plate material 213 is stretched over the upper portions of the two fixed brackets 211 and 212, and is fixed with the plate width direction up and down.

  The movable support portion 22 includes two movable brackets 221 and 222 and a movable plate member 223. The movable support part 22 is spaced apart from the fixed support part 21 and arranged in parallel. The two movable brackets 221 and 222 are disposed at positions separated from each other in the X-axis direction on the machine base 91 and are disposed to face the two fixed brackets 211 and 212 in the Y-axis direction. The two movable brackets 221 and 222 can be moved in the Y-axis direction by sliding on the upper surface of the machine base 91 or by moving the space above the machine base 91 by being supported by the width adjusting unit 7. ing. The movable plate member 223 is a plate-like member that is approximately the same shape and size as the fixed plate member 213. The movable plate member 223 is stretched over the upper portions of the two movable brackets 221 and 222, and the plate width direction is set up and down. The movable plate 223 moves in the Y axis direction together with the movable brackets 221 and 222.

  At the upstream end and the downstream end of the fixed support portion 21 and the movable support portion 22, light reaching type substrate detection sensors 23 and 23 are provided, respectively. The substrate detection sensor 23 includes a light projecting unit 231 provided on one of the fixed plate member 213 and the movable plate member 223 and a light receiving unit 232 provided on the other. The substrate detection sensor 23 determines the passage of the front end of the substrate K when the light reaching the light receiving portion 232 from the light projecting portion 231 is blocked, and the passage of the rear end of the substrate K when the light reaches again. Determine.

  The pair of substrate transport units 31 and 32 are mainly disposed inside the fixed support unit 21 and the movable support unit 22 facing each other. Since the pair of substrate transport portions 31 and 32 have a mirror-symmetrical structure, FIGS. 2 and 3 will be described with reference to the visible substrate transport portion 32 on the movable support portion 22 side. In FIGS. 4 and 6, both substrate transport units 31 and 32 are described with reference numerals. Each of the board transfer units 31 and 32 includes a rail member 321, conveyor belts 312, 322, two drive pulleys 314, 323, 324, a plurality of transfer pulleys (not shown), and the like.

  The rail member 321 is a member that is elongated in the X-axis direction, and is disposed along the fixed plate member 213 and the movable plate member 223. A component mounting position is set near the middle of the rail member 321 in the X-axis direction (shown in FIGS. 2 and 3). The endless annular conveyor belts 312 and 322 are stretched around the rail members 311 and 321 in a lengthwise direction so as to be able to rotate and rotate. The drive pulleys 314, 323, and 324 are disposed in proximity to the fixed brackets 211 and 212 and the movable brackets 221 and 222, and are engaged with the expanded portions of the conveyor belts 312 and 322.

  The drive pulley in the vicinity of the upstream fixed bracket 211 and the drive pulley 323 in the vicinity of the upstream movable bracket 221 are rotationally connected to the spline shaft 315 (shown in FIG. 3). The spline shaft 315 is supported by the fixed bracket 211 and the movable bracket 221. The spline shaft 315 is rotationally driven by an upstream side conveyance motor 316 disposed outside the movable bracket 221. Similarly, the drive pulley 314 near the downstream fixed bracket 212 and the drive pulley 324 near the downstream movable bracket 222 are rotationally connected to the second spline shaft 317 (shown in FIG. 3). The second spline shaft 317 is supported by the fixed bracket 212 and the movable bracket 222. The second spline shaft 317 is driven to rotate by a downstream side conveyance motor 318 disposed outside the movable bracket 222. In addition, a plurality of unillustrated transport pulleys apply tension to the conveyor belts 312 and 322.

  With the above-described configuration, the pair of conveyor belts 312 and 322 are driven to rotate at an equal speed. When the substrate K is supplied from the upstream side, the pair of conveyor belts 312 and 322 supports the edge portions on both sides of the substrate K on the upper surface thereof, and carries them to the component mounting position. When the mounting of the electronic components on the board K is finished, the pair of conveyor belts 312 and 322 supports the edges on both sides of the board K on the upper surface thereof, and carries them out from the component mounting position to the downstream side. Note that one of the upstream side conveyance motor 316 and the downstream side conveyance motor 318 may be omitted.

  As shown in FIGS. 4 and 6, the pair of substrate guide portions 41 and 42 are disposed between the substrate transport portion 31 and the fixed plate material 213 and between the substrate transport portion 32 and the movable plate material 223. . Substrate guide portions 41 and 42 are spaced apart from each other by substantially the width direction dimension of the substrate K, and extend in the X-axis direction. The substrate guides 41 and 42 guide the side surfaces on both sides of the substrate K to be transported, respectively, so that no side shake occurs.

  As shown in FIG. 2, the support members 51 and 52 are disposed between the pair of substrate transfer units 31 and 32 and are divided into two parts, an upstream side and a downstream side. Each of the divided two support members 51 and 52 includes four fixing pins 53, a fixing plate 54, two supporting plates 55, a coupling plate 56, and the like. The four fixing pins 53 are vertically erected in a rectangular four-vertex arrangement near the upstream end and the downstream end of the machine base 91. The fixing plate 54 is a rectangular plate material that is long in the Y-axis direction, and is horizontally fixed to the tops of the four fixing pins 53.

  The two support plates 55 are long plate-like members that extend in the X-axis direction and have the plate width direction up and down. As shown in FIG. 4, the two support plates 55 are coupled with a rectangular coupling plate 56 interposed therebetween, and are arranged in parallel with being spaced apart from each other. The coupling plate 56 is fixed to the upper surface of the fixed plate 54. The support plate 55 of the upstream support member 51 slightly protrudes from the fixed plate 54 toward the upstream end and greatly protrudes in the direction of the opposite component mounting position. On the other hand, the support plate 55 of the downstream support member 52 slightly protrudes from the fixed plate 54 toward the downstream end and greatly protrudes in the direction of the opposite component mounting position. The positions of the support plates 55 of the upstream and downstream support members 51 and 52 in the Y-axis direction coincide with each other. A plurality of support grooves 57 are formed at approximately equal intervals along the X-axis direction of the upper edge of each support plate 55. The support groove 57 corresponds to the support location of the present invention for supporting the rotating member 6.

  The two support plates 55 arranged in parallel have variable arrangement positions in the Y-axis direction. That is, at least one of the arrangement of the fixing pin 53 with respect to the machine base 91, the arrangement of the fixing plate 54 with respect to the fixing pin 53, and the arrangement of the coupling plate 56 with respect to the fixing plate 54 is variably adjusted. The structure of the support members 51 and 52 is not limited to the above. For example, instead of the support plate 55 that is divided into the upstream side and the downstream side, a single-piece support plate that extends from the upstream side to the downstream side can be used.

  As shown in FIG. 4, the rotating member 6 includes two roller members 61, a connecting shaft 62, two supported portions 63, and the like. The two roller members 61 are thick disk-shaped members having a rotation axis extending in the Y-axis direction, and are disposed apart from each other in the Y-axis direction. The connecting shaft 62 connects the rotating shafts of the two roller members 61. A supported portion 63 is formed on each end of the connecting shaft 62 protruding from the roller member 61. The supported portion 63 is supported by the support groove 57 of the support plate 55 of the support members 51 and 52. Therefore, the roller member 61, the connecting shaft 62, and the supported portion 63 rotate integrally, and the rotating member 6 freely rotates in the transport direction (X-axis direction). The rotating member 6 corresponds to the connecting roller member of the present invention.

  In FIG. 2, the upstream and downstream support members 51 and 52 support seven rotating members 6, respectively. That is, the number of serially arranged rotating members 6 in the transport direction is 14 pieces. However, it is not necessary to arrange the rotating member 6 in all the support grooves 57. That is, according to the kind of the board | substrate K to convey, the support groove | channel 57 which supports the rotation member 6 may be selected, and the serial number of the rotation members 6 may be 13 or less. For example, in each of the support members 51 and 52, every other four support grooves 57 may be selected and the rotation members 6 may be arranged, so that the total number of the rotation members 6 in series may be eight.

  Here, the dimensions of the support members 51 and 52 and the rotation member 6 are appropriately set so that the upper limit height positions of the two roller members 61 coincide with the upper surface height positions of the conveyor belts 312 and 322. Therefore, as shown in FIG. 4, the two roller members 61 of the rotating member 6 freely rotate in the transport direction while supporting the lower surface of the substrate K to be transported. As a result, the substrate K is supported at two locations in the intermediate portion in the X-axis direction in addition to the edge portions on both sides supported by the substrate transport portions 31 and 32.

  Further, the rotating member 6 may be prepared in a plurality of types having different materials for the roller member 61. The material of the roller member 61 that directly touches the substrate K is preferably selected based on a guideline such as not giving stress in consideration of properties such as the material of the substrate K. Examples of the material of the roller member 61 include metal, fluorine resin, acetal resin, and natural rubber. Moreover, a conductive resin can be illustrated as a material of the roller member 61 suitable for countermeasures against static electricity.

  The width adjusting unit 7 adjusts the separation distance between the pair of substrate transfer units 31 and 32 according to the width dimension of the substrate to be transferred in the Y-axis direction. The width adjusting unit 7 includes two sets of screw feeding mechanisms 71 and 72. The screw feeding mechanisms 71 and 72 are respectively provided from the fixed brackets 211 and 212 facing the Y axis direction to the movable brackets 221 and 222. Each of the screw feed mechanisms 71 and 72 includes a width adjustment shaft 73, a feed nut 74, a width adjustment motor 75, and the like. Hereinafter, the downstream screw feed mechanism 72 will be described in detail with reference to FIGS. 2 and 4.

  The width adjusting shaft 73 of the downstream screw feed mechanism 72 extends in the Y-axis direction. A male screw is engraved on the outer peripheral surface of the width adjusting shaft 73. One end portion of the width adjusting shaft 73 is supported by a bearing portion 214 formed in the fixed bracket 212 so as to be immovable and rotatable in the axial length direction. Near the other end of the width adjusting shaft 73 passes through a through hole 224 formed in the movable bracket 222. The other end of the width adjusting shaft 73 is driven to rotate by a width adjusting motor 75 disposed outside the movable bracket 222. The feed nut 74 is fixed to the outside of the through hole 224 of the movable bracket 222. The male screw of the width adjusting shaft 73 is screwed into the female screw engraved on the feed nut 74.

  The width adjusting motors 75 of the two sets of screw feeding mechanisms 71 and 72 operate with the same amount of rotation in the same direction. Then, the two width adjustment shafts 73 rotate, and the two feed nuts 74 advance or retract relative to the width adjustment shaft 73. Accordingly, the movable brackets 221 and 222 move relative to the fixed brackets 211 and 212, and the separation distance is adjusted while maintaining the parallelism between the fixed plate member 213 and the movable plate member 223. This is equivalent to the adjustment of the separation distance between the pair of substrate transfer units 31 and 32.

  As shown in FIGS. 5 and 6, the backup mechanism 8 positions and holds the loaded board K at the component mounting position. The backup mechanism 8 includes a pair of clamp support members 81, a backup member 82, a lift drive mechanism 84, a pair of clamp members 85, four support members 86, and the like.

  As shown in FIGS. 3, 5, and 6, the pair of clamp support members 81 are provided in the range of component mounting positions of the pair of board guide portions 41 and 42, and extend in the X-axis direction. . The pair of clamp support members 81 protrudes inward from the upper portions of the substrate guide portions 41 and 42 in the Y-axis direction so as to approach each other. For this reason, the separation distance between the pair of clamp support members 81 is smaller than the separation distance between the substrate guide portions 41 and 42. Therefore, the upper surfaces near the edge portions on both sides of the substrate K can be brought into contact with the clamp support member 81, respectively.

  The backup member 82 is a rectangular member that is slightly smaller than the range of the component mounting position. The backup member 82 is disposed below the fixed plate member 213 and the movable plate member 223. The four corners of the backup member 82 are held on the machine base 91 using a spring member 83 so as to be movable up and down. A lift drive mechanism 84 is disposed between the backup member 82 and the machine base 91 (shown in FIG. 2). The elevating drive mechanism 84 is driven to move up and down while maintaining the horizontal posture of the backup member 82. The backup member 82 does not interfere with the support members 51, 52 in the raised position, in other words, the support plate 55 of the support members 51, 52 is disposed at an upper position where it does not interfere with the raised backup member 82.

  The elevating drive mechanism 84 can be configured by combining, for example, an elevating drive motor and four sets of screw feed mechanisms that are driven by the elevating drive motor to raise and lower the four corners of the backup member 82, respectively. The applicant of the present application has already disclosed a configuration example of this type of lifting drive mechanism 84 in Japanese Patent Application No. 2012-277846.

  As shown in FIGS. 2 and 3, the pair of clamp members 85 are elongated plate-like members extending in the X-axis direction within the range of the component mounting positions. The pair of clamp members 85 are disposed on the edge portions near the fixed plate member 213 and the movable plate member 223 on the upper side of the backup member 82. The pair of clamp members 85 are located directly below the pair of clamp support members 81. The pair of clamp members 85 may be provided integrally with the backup member 82 or may be separate.

  The four support members 86 are elongated rod-like members extending in the X-axis direction within the range of the component mounting position. The four support members 86 are arranged so that two are aligned in the X-axis direction and two are also aligned in the Y-axis direction. Each support member 86 is fixed to the upper surface of the backup member 82 using two legs 87 (shown in FIGS. 3 and 6). The height position of the upper surface of each support member 86 coincides with the height position of the upper surfaces of the pair of clamp members 85.

  The backup member 82 lifted by the lifting drive mechanism 84 drives the pair of clamp members 85 and the four support members 86 together. Accordingly, the pair of clamp members 85 and the four support members 86 are in contact with the lower surface of the substrate K at the same time. Further, the rising clamp member 85 pushes up the edge of the substrate K, and the rising support member 86 pushes up two intermediate portions in the width direction of the substrate K. Thereby, the board | substrate K raises from the conveyance height shown by FIG. 4 to the positioning height shown by FIG. Finally, the pair of clamp members 85 sandwich and hold the edge portion of the substrate K between the pair of clamp support members 81. At this time, the four support members 86 are raised to the same height as the clamp members 85 and are in contact with the lower surface of the substrate K and held horizontally.

  The four support members 86 can be changed depending on whether they are attached or detached. Further, the support member 86 can be changed in position, number, and change in shape and material by replacement. Accordingly, an appropriate support method can be adopted in consideration of properties such as the width dimension and rigidity of the substrate K to be positioned and held.

  Next, another type of rotating member 6A having a different shape will be described. For example, the electronic component P may be mounted on the lower surface of the substrate K in advance, and the roller member 61 of the rotating member 6 shown in FIG. In this case, the rotating member 6 shown in FIG. 4 cannot be used, and is replaced with, for example, another type of rotating member 6A shown in FIG. FIG. 7 is a view illustrating another type of rotating member 6A having a different shape, as viewed from the direction of the white arrow A1 in FIG.

  As shown in FIG. 7, another type of rotating member 6A includes a single roller member 61A, a connecting shaft 62A, two supported portions 63, and the like. The shape of the roller member 61A is the same as that of the roller member 61 shown in FIG. The connecting shaft 62A extends through the rotation center of the roller member 61A. The same supported portion 63 as in FIG. 4 is formed at both ends of the connecting shaft 62A. The distance between the two supported parts 63 and the roller member 61A is the same on the left and right. In another type of rotating member 6A, contact with the electronic component P can be avoided by changing the arrangement position of the roller member 61A in the width direction (Y-axis direction) from FIG.

  Various shapes are conceivable as different types of rotating members. For example, in FIG. 4, the number of roller members 61 arranged in the width direction is two, and in FIG. 7, the number of roller members 61A arranged in parallel is one. However, the number of parallel arrangements in the width direction may be three or more. If the number in parallel is increased, the number of supporting portions in the width direction of the substrate K can naturally be increased. Further, for example, in FIG. 7, the distance between the two supported portions 63 and the roller member 61A can be different on the left and right sides, and the thickness of the roller member 61A itself can be changed.

  Furthermore, instead of exchanging the rotating members 6 and 6A, the arrangement position in the width direction may be adjusted while using the same rotating members 6 and 6A to avoid contact with the electronic component P. In this case, as described above, the arrangement position in the width direction (Y-axis direction) of the two support plates 55 of the support members 51 and 52 is changed.

  Further, the replacement operation of the rotating members 6 and 6A and the adjustment operation of the arrangement position in the width direction are not limited to avoiding contact with the electronic component P, and are appropriately performed according to the change in the type of the substrate K to be produced. Can be implemented. For example, when the dimension in the width direction of the substrate K is changed, it is preferable to adjust the arrangement position of the rotating members 6 and 6A so that the support portions in the width direction are arranged at equal intervals. For example, in the case of a substrate having a particularly large width dimension or a substrate having a particularly small rigidity, it is preferable to increase or replace the rotating members 6 and 6A so as to increase the number of supporting portions in the width direction. The operations relating to the rotating members 6 and 6A are performed in accordance with the adjustment of the separation distance between the substrate transfer units 31 and 32 by the width adjusting unit 7 in the setup operation when changing the type of the substrate K. be able to.

  Next, the operation of the substrate transfer apparatus 1 according to the embodiment will be described in comparison with the conventional configuration. FIG. 8 is a perspective view showing a state of transport of the substrate KX by the substrate transport apparatus 1X having the conventional configuration. The substrate transport apparatus 1 </ b> X having the conventional configuration does not have the support members 51 and 52 and the rotation member 6. For this reason, when the substrate K is transported by the pair of substrate transport portions 31 and 32, the substrate K is supported only at two places on the edge in the width direction. Therefore, as shown in FIG. 8, the substrate KX has its intermediate portion in the width direction bent downward. Then, the substrate KX may be detached from the conveyor belt 322 in the middle of conveyance or may interfere with the backup mechanism, thereby causing a problem that the conveyance becomes impossible.

  On the other hand, in the board | substrate conveyance apparatus 1 of embodiment, the board | substrate K is conveyed in the state shown by FIG. That is, the substrate K is supported at two locations in the X-axis direction in addition to the edge portions on both sides supported by the substrate transport portions 31 and 32. In the substrate transfer apparatus 1 according to the embodiment, the substrate K is positioned and held in the state shown in FIGS. 5 and 6. That is, the substrate K is supported by the four support members 86 at two locations in the intermediate portion in the width direction (X-axis direction) in addition to the edge portions on both sides held by the clamp support member 81 and the clamp member 85. .

  The substrate transfer apparatus 1 according to the embodiment includes a pair of substrate transfer units 31 that extend in the transfer direction for transferring the substrate K, are spaced apart from each other in parallel, and support and transfer edges on both sides of the substrate K, respectively. 32, a pair of substrate guides 41 and 42 that are arranged side by side on each substrate transport unit 31 and 32 and guide the side surfaces on both sides of the substrate K to be transported, and the pair of substrate transport units 31 and 32, respectively. And the rotating member 6 that is supported by the supporting members 51 and 52 and that freely rotates in the transport direction while supporting the lower surface of the transported substrate K.

  According to this, in addition to the edge portions on both sides of the substrate K being supported by the substrate transport portions 31 and 32, the intermediate portion in the width direction of the substrate K is supported by the rotating member 6. For this reason, even if the substrate K is thin and easily bent, the amount of bending can be reduced and reliable conveyance becomes possible. Furthermore, since the supporting members 51 and 52 and the rotating member 6 added to the conventional configuration have a simple structure, an increase in initial cost of the substrate transfer apparatus 1 is slight. On the other hand, a transfer jig that increases the number of processes and production time is unnecessary, and the running cost does not increase. Therefore, an increase in the production cost of the substrate K is suppressed as a whole.

  Further, in the substrate transport apparatus 1 of the embodiment, the rotating member 6 is a connecting roller in which two disk-shaped roller members 61 having a rotating shaft extending in the width direction (X-axis direction) are connected so as to rotate integrally. It is formed including members. According to this, two portions of the intermediate portion in the width direction of the substrate K are supported by the rotating member 6. For this reason, even if it is the thin board | substrate K which is easy to bend, the amount of bending can be reduced markedly and reliable conveyance is attained.

  Furthermore, in the substrate transport apparatus 1 according to the embodiment, the rotation member 6 has a variable arrangement position in the width direction orthogonal to the transport direction. According to this, when the width dimension of the board | substrate to produce is changed, the arrangement position of the width direction of the rotation member 6 can be adjusted, and the suitable location of the width direction of the board | substrate K can be supported. For this reason, even if the substrate K is thin and easily bent, it can be reduced while suppressing variation in the amount of bending at each position, thereby enabling reliable conveyance.

  Furthermore, the substrate transfer apparatus 1 according to the embodiment further includes a width adjusting unit 7 that adjusts the separation distance between the pair of substrate transfer units 31 and 32, and the rotating member 6 adjusts the separation distance by the width adjusting unit 7. The arrangement position in the width direction can be adjusted according to the above. According to this, the adjustment operation of the arrangement position of the rotating member 6 can be efficiently performed in accordance with the adjustment operation of the width adjusting unit 7 in the setup operation when changing the type of the substrate to be produced.

  Furthermore, in the substrate transfer apparatus 1 of the embodiment, the number of parallel rotation members 6 arranged in the width direction (Y-axis direction) and the number of series rotation members 6 arranged in the transfer direction (X-axis direction) are variable. At least a part of the plurality of rotating members 6 is detachable. According to this, since the quantity of the rotating members 6 can be adjusted in accordance with properties such as the width dimension and rigidity of the substrate K, the amount of bending of the substrate K can be appropriately reduced, and reliable conveyance becomes possible.

  Further, in the substrate transfer apparatus 1 of the embodiment, a plurality of types of rotating members 6 and 6A having different shapes and materials are prepared, and can be exchanged to the obstruction grooves 57 (supporting portions) of the supporting members 51 and 52. Is done. According to this, the shape and material of the rotating members 6 and 6A can be selected according to the properties such as the width dimension, rigidity, and material of the substrate K. Therefore, the amount of flexure can be reduced without giving stress to the substrate K, and reliable transport is possible.

  Further, in the substrate transfer apparatus 1 of the embodiment, the support members 51 and 52 have a plurality of obstacle grooves 57 (support locations) arranged in the conveyance direction, and the rotating members 6 and 6A are supported by the obstacle grooves 57. A plurality of disk-shaped roller members 61 and 61A that support the lower surface of the substrate 63 and the lower surface of the substrate K are formed so as to rotate integrally, and the distance between the supported portion 63 and the roller members 61 and 61A is different from each other. Types are prepared, and the selected types of rotating members 6 and 6A are exchangeably supported in the selected obstacle grooves 57 of the supporting members 51 and 52.

  According to this, the arrangement positions of the rotating members 6 and 6A and the adjustment range of the number thereof are extremely wide. Therefore, an appropriate support method can be reliably employed in accordance with the properties such as the width dimension, rigidity, and material of the substrate K, and even more reliable transport is possible.

  Furthermore, the substrate transport apparatus 1 according to the embodiment is provided with a pair of substrate guide portions 41 and 42, and a pair of clamp support members 81 with which the upper surfaces near the edges on both sides of the substrate K can contact each other, and a pair of substrates A backup member 82 disposed below the guide portions 41 and 42 and driven to move up and down, and disposed below the backup member 82 and driven by raising the backup member 82, the lower surfaces near the edges on both sides of the substrate K are respectively shown. A pair of clamp members 85 for positioning and holding the substrate K between the push-up clamp support member 81 and the upper side of the backup member 82 are driven by the upward movement of the backup member 82 and lifted to support the lower surface of the substrate K. A backup mechanism 8 having a support member 86, and the support members 51 and 52 interfere with the raised backup member 82. Is disposed in the upper position are.

  According to this, in the substrate K, in addition to the edge portions on both sides sandwiched between the clamp support member 81 and the clamp member 85, the four support members 86 have two places in the intermediate portion in the width direction (X-axis direction). Supported. For this reason, even if the substrate is thin and easily bent, the amount of bending can be reduced and the electronic component can be reliably mounted.

  Further, in the substrate transfer apparatus 1 of the embodiment, the support member 86 can be changed in presence or absence, change in position, change in the number, and change in shape and material by replacement. According to this, an appropriate support method can be adopted in consideration of properties such as the width dimension and rigidity of the substrate K to be positioned and held, and the electronic component can be mounted more reliably.

  In addition, the rotation members 6 and 6A are not limited to the shape of embodiment, For example, a spherical body may be sufficient. Moreover, the board | substrate conveyance apparatus 1 of embodiment can also be integrated in board production apparatuses other than the component mounting apparatus 9, for example, a solder printing apparatus. Furthermore, the present invention can be implemented as a substrate transfer device having only a transfer function that does not include the backup mechanism 8. Various other applications and modifications are possible for the present invention.

1: substrate transport device 21: fixed support portion 22: movable support portion 31, 32: substrate transport portion 311, 321: rail member 312, 322: conveyor belt 41, 42: substrate guide portion 51, 52: support member 53: fixed Pin 54: Fixed plate 55: Bearing plate 56: Connecting plate 57: Bearing groove (bearing location)
6, 6A: rotating member 61, 61A: roller member 62, 62A: connecting shaft 63: supported part,
7: Width adjusting unit 71, 72: Screw feed mechanism 8: Backup mechanism 81: Clamp support member 82: Backup member 84: Elevating drive mechanism 85: Clamp member 86: Support member 9: Component mounting device 91: Machine base 92, 93 Component supply device 95: Component transfer device 96: 97: Component camera device

Claims (9)

A pair of substrate transport units that extend in the transport direction for transporting the substrates and are spaced apart from each other and arranged in parallel to support and transport edges on both sides of the substrate;
A pair of substrate guide portions that are arranged side by side on each of the substrate transfer portions and guide the side surfaces on both sides of the substrate to be transferred, and
A support member disposed between the pair of substrate transfer units;
And a rotation member that is supported by the support member and that freely rotates in the transport direction while supporting a lower surface of the substrate to be transported.   The rotating member is configured such that a disk-shaped or columnar roller member having a rotating shaft extending in a width direction orthogonal to the transport direction, or a plurality of the roller members spaced apart in the width direction rotate integrally. The substrate transfer apparatus according to claim 1, wherein the substrate transfer apparatus is formed to include a connecting roller member or a sphere connected to each other.   The substrate transfer apparatus according to claim 1, wherein the rotation member has a variable arrangement position in a width direction orthogonal to the transfer direction. A width adjusting unit for adjusting a separation distance between the pair of substrate transfer units;
The substrate transfer apparatus according to claim 3, wherein the rotation member is configured such that an arrangement position in the width direction can be adjusted in accordance with adjustment of the separation distance by the width adjustment unit. At least one of the parallel number of the rotating members arranged in the width direction orthogonal to the conveying direction and the serial number of the rotating members arranged in the conveying direction is variable, or
The board | substrate conveyance apparatus as described in any one of Claims 1-4 in which at least one part of a some rotation member is detachable.   The substrate transport apparatus according to any one of claims 1 to 5, wherein the rotating member is prepared in a plurality of types different in at least one of a shape and a material and is exchangeably supported at a supporting location of the supporting member. The support member has a plurality of the support portions arranged in the transport direction,
The rotating member is formed such that a supported part supported at the supporting part and a disk-like or columnar roller member supporting the lower surface of the substrate rotate integrally, and the supported part and the Several types with different distances from the roller member are prepared,
The substrate transfer apparatus according to claim 6, wherein the selected type of rotating member is exchangeably supported at a selected supporting location of the supporting member. A pair of clamp support members provided on the pair of substrate guide portions and capable of abutting the upper surfaces near the edges on both sides of the substrate;
A backup member that is arranged below the pair of substrate guides and is driven up and down;
A pair of clamp members disposed above the backup member and driven by raising of the backup member to push up the lower surfaces near the edges on both sides of the substrate and position and hold the substrate between the clamp support members; ,
A backup mechanism further comprising a support member disposed on the backup member and driven by raising the backup member and supporting the lower surface of the substrate by raising;
The substrate transfer apparatus according to claim 1, wherein the support member is disposed at an upper position where the support member does not interfere with the raised backup member.   9. The substrate transfer apparatus according to claim 8, wherein the support member is capable of changing one or more items among a change in presence / absence, a change in position, a change in the number, and a change in at least one of shape and material by replacement. .

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