JP2012124459A - 車両用電子式モジュール - Google Patents
車両用電子式モジュール Download PDFInfo
- Publication number
- JP2012124459A JP2012124459A JP2011207205A JP2011207205A JP2012124459A JP 2012124459 A JP2012124459 A JP 2012124459A JP 2011207205 A JP2011207205 A JP 2011207205A JP 2011207205 A JP2011207205 A JP 2011207205A JP 2012124459 A JP2012124459 A JP 2012124459A
- Authority
- JP
- Japan
- Prior art keywords
- electronic module
- circuit board
- casing
- resin
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Abstract
【解決手段】電子式モジュール10であって、少なくとも2枚の回路基板12,13を有するケーシング11を備え、その中で1本以上の電気伝導体14の一端は、1枚の回路基板に連結され、他端は、他の回路基板に連結され、その電気伝導体の両端の連結部は、ウエッジボンディングの技術によって接合され、またケーシングの中で、電気伝導体の少なくとも一端の接合部は、ポリウレタン樹脂17で被覆されている。
【選択図】図1
Description
販売されている樹脂であるのが良い。それを使用すると、熱衝撃抵抗力は、−40℃から125℃まで有効であり、かつ30G以上の振動抵抗試験に合格する。
11、21 ケーシング
12、22 プリント回路パワー基板
13、23 プリント回路制御基板
14、24 電気伝導体
15、16、25、26 電導パッド
17、27 保護被覆樹脂
Claims (8)
- 車両の中に装備されるようになっている電子式モジュール(10,20)であって、少なくとも2枚の回路基板(12,13; 22,23)を有するケーシング(11,21)を備え、その中で、1本以上の電気伝導体(14,24)の一端を、1枚の回路基板に、他端を、別の回路基板に連結することによって、回路基板の全てを統合的に連結させ、その伝導体の先端は「ウエッジボンディング」技術で接合され、またケーシングの中で、電気伝導体の少なくとも一端は、ポリウレタン樹脂の保護皮膜で保護されていることを特徴とする電子式モジュール。
- 2枚の回路基板のうちの1枚(12,22)はパワー基板であり、他方の回路基板(13,23)は制御基板であることを特徴とする請求項1に記載の電子式モジュール。
- 保護樹脂(17)は、回路基板(13,23)を完全に被覆していることを特徴とする請求項2に記載の電子式モジュール。
- 保護樹脂(27)は、パワー回路基板(22)のみを被覆していることを特徴とする請求項2に記載の電子式モジュール。
- 制御基板(23)は、被覆樹脂(27)の上に配置されていることを特徴とする請求項4に記載の電子式モジュール。
- 電気伝導体(14,24)は、直径250ミクロン以上のアルミ製電線であることを特徴とする請求項1〜5のいずれか1項に記載の電子式モジュール。
- 電気伝導体(14,24)は、アルミ製リボンであることを特徴とする請求項1〜5のいずれか1項に記載の電子式モジュール。
- ケーシング(11,21)は、アルミ製であることを特徴とする請求項1〜7のいずれか1項に記載の電子式モジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1057648A FR2965447B1 (fr) | 2010-09-23 | 2010-09-23 | Boitier electronique pour vehicule |
FR1057648 | 2010-09-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012124459A true JP2012124459A (ja) | 2012-06-28 |
JP6082180B2 JP6082180B2 (ja) | 2017-02-15 |
Family
ID=43919955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011207205A Expired - Fee Related JP6082180B2 (ja) | 2010-09-23 | 2011-09-22 | 車両用電子式モジュール |
Country Status (7)
Country | Link |
---|---|
US (1) | US9167709B2 (ja) |
EP (1) | EP2434849B1 (ja) |
JP (1) | JP6082180B2 (ja) |
KR (1) | KR20120031262A (ja) |
CN (1) | CN102573371B (ja) |
BR (1) | BRPI1105443A2 (ja) |
FR (1) | FR2965447B1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3086495B1 (fr) * | 2018-09-24 | 2023-01-20 | Valeo Vision | Connexion electrique pour un module d'eclairage a fonction dynamique d'un vehicule automobile |
DE102019215842A1 (de) * | 2019-10-15 | 2021-04-15 | Baumüller Nürnberg GmbH | Antrieb |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0722576A (ja) * | 1993-07-05 | 1995-01-24 | Mitsubishi Electric Corp | 半導体パワーモジュールおよび複合基板、並びに半導体パワーモジュールの製造方法 |
JP2002315358A (ja) * | 2001-04-17 | 2002-10-25 | Hitachi Ltd | インバータ装置 |
JP2004087735A (ja) * | 2002-08-26 | 2004-03-18 | Toshiba Corp | 半導体装置 |
JP2004140072A (ja) * | 2002-10-16 | 2004-05-13 | Fuji Electric Device Technology Co Ltd | パワー半導体装置のワイヤボンディング方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003318568A (ja) * | 2002-04-23 | 2003-11-07 | Hitachi Unisia Automotive Ltd | 電子部品装置 |
US20060163315A1 (en) * | 2005-01-27 | 2006-07-27 | Delsman Mark A | Ribbon bonding tool and process |
JP5065864B2 (ja) * | 2007-11-27 | 2012-11-07 | 京セラ株式会社 | 電力制御モジュール |
US8130499B2 (en) * | 2007-11-30 | 2012-03-06 | Panasonic Corporation | Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board |
JP4954356B1 (ja) * | 2011-10-12 | 2012-06-13 | 日本碍子株式会社 | 大容量モジュールの周辺回路用の回路基板、及び当該回路基板を用いる周辺回路を含む大容量モジュール |
-
2010
- 2010-09-23 FR FR1057648A patent/FR2965447B1/fr not_active Expired - Fee Related
-
2011
- 2011-09-22 US US13/239,557 patent/US9167709B2/en not_active Expired - Fee Related
- 2011-09-22 BR BRPI1105443-3A patent/BRPI1105443A2/pt not_active Application Discontinuation
- 2011-09-22 JP JP2011207205A patent/JP6082180B2/ja not_active Expired - Fee Related
- 2011-09-23 KR KR1020110096357A patent/KR20120031262A/ko not_active Application Discontinuation
- 2011-09-23 CN CN201110384758.6A patent/CN102573371B/zh not_active Expired - Fee Related
- 2011-09-23 EP EP11182445.4A patent/EP2434849B1/fr not_active Not-in-force
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0722576A (ja) * | 1993-07-05 | 1995-01-24 | Mitsubishi Electric Corp | 半導体パワーモジュールおよび複合基板、並びに半導体パワーモジュールの製造方法 |
JP2002315358A (ja) * | 2001-04-17 | 2002-10-25 | Hitachi Ltd | インバータ装置 |
JP2004087735A (ja) * | 2002-08-26 | 2004-03-18 | Toshiba Corp | 半導体装置 |
JP2004140072A (ja) * | 2002-10-16 | 2004-05-13 | Fuji Electric Device Technology Co Ltd | パワー半導体装置のワイヤボンディング方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6082180B2 (ja) | 2017-02-15 |
US20120075811A1 (en) | 2012-03-29 |
CN102573371B (zh) | 2016-06-01 |
EP2434849A1 (fr) | 2012-03-28 |
EP2434849B1 (fr) | 2015-12-02 |
FR2965447A1 (fr) | 2012-03-30 |
BRPI1105443A2 (pt) | 2013-02-19 |
KR20120031262A (ko) | 2012-04-02 |
FR2965447B1 (fr) | 2012-08-31 |
US9167709B2 (en) | 2015-10-20 |
CN102573371A (zh) | 2012-07-11 |
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