CN102573371B - 用于交通工具的电子模块 - Google Patents
用于交通工具的电子模块 Download PDFInfo
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- CN102573371B CN102573371B CN201110384758.6A CN201110384758A CN102573371B CN 102573371 B CN102573371 B CN 102573371B CN 201110384758 A CN201110384758 A CN 201110384758A CN 102573371 B CN102573371 B CN 102573371B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Casings For Electric Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
一种用于交通工具的电子模块(10),该模块包括容纳至少两个电路板(12,13)的壳体(11),所述电路板通过至少一个电导体(14)连接在一起,该导体的一端结合于一个电路板,该导体的另一端结合于另一个电路板的另一端,导体的该端部通过“楔形结合”技术结合,该壳体还容纳覆盖该电导体的至少一个被结合端的保护树脂(17)。该保护树脂是聚氨基甲酸乙酯树脂。
Description
技术领域
本发明涉及一种电子模块,其被设计为安装在交通工具中,特别是汽车中。其涉及在机电一体化(mechatronic)环境中、载于交通工具的电子设备上的安装在金属或塑料壳体(电力(power)电子设备,控制电子设备)上的电路板或PCBs(印刷电路板(PrintedCircuitBoard))的任何组件。尽管一种具体应用是汽车,但本发明可应用于具有相近或类似使用要求的领域。
背景技术
现在,安装在汽车上的电子模块遭受热冲击和振动,其取决于每个制造者各自的技术规范。为了适应每个制造者的质量要求,尺寸合适的(fitted)电路板(电力和控制)固定在壳体中,它们之间的连接通过各种技术提供,特别是通过称为“楔形结合(wedgebonding)”的技术。
“楔形结合”技术进行如下定义。线材(最通常由铝制造)通过工具(叫做针管或针状体)被插入,其应用于要被结合的垫片。线材与要被连接的区域之间的连接通过将压力和超声振动组合而实现。其所涉及结合方式叫做“冷”结合。软化线材的是超声能量,相似于通过温度增加所获得的效果。然后线材通过工具引导到第二垫片上,并执行结合。该线材可具有75μm至650μm的直径。
为了保护这些结合部免受氧化、热冲击、振动和阻尼热,利用了环氧基或丙烯酸基树脂或硅树脂胶。树脂借助分配器局部沉积。它们在炉内聚合,或通过UV聚合。硅树脂胶被浇注在连接线材被结合的保持区域。
环氧或丙烯酸树脂以及硅树脂胶具有好的热、电和机械绝缘性能。但是,它们在载于交通工具的电子模块中的使用造成了这些模块花费过多,特别是对于汽车制造者来说。
发明内容
为了弥补上面解释的花费问题,提出用聚氨基甲酸乙酯树脂代替位于壳体中的电路板的保护材料(环氧树脂、丙烯酸树脂、硅树脂胶)。聚氨基甲酸乙酯树脂具有与现有技术中的材料(环氧树脂、丙烯酸树脂、硅树脂胶)等同的热、电和机械绝缘性能,但是材料和其应用导致的经济节省是非常大的。
通过其机械性能和热膨胀(220.10-6m/℃),本发明有利地应用到直径大于或等于250μm的铝线和铝带。
本发明的目的因此是一种电子模块,其被设计为安装在交通工具中,该模块包括容纳至少两个电路板的壳体,所述电路板通过至少一个电导体连接在一起,该导体的一端结合于一个电路板,且该导体的另一端结合于另一个电路板,该导体的端部通过“楔形结合”技术结合,该壳体还容纳覆盖该电导体的至少一个被结合端的保护树脂,其特征在于,该保护树脂为聚氨基甲酸乙酯树脂。
两个电路板中的一个可为电力板,另一个电路板可为控制板。
根据第一个实施例,该保护树脂完全覆盖该电路板。
根据第二个实施例,该保护树脂仅仅覆盖电力电路板。在这种情况下,控制板可搁置在该覆盖树脂上。
该电导体可为具有超过250μm直径的铝线。它也可以是铝带。
该壳体有利地由铝制造。
附图说明
通过阅读下面作为非限定例子给出的说明并结合附图将更好地理解本发明且其它优点和具体特征将被展现,其中:
图1展现了本发明的包括电力电路板和控制电路板的电子模块的第一实施例,
图2展现了本发明的包括电力电路板和控制电路板的电子模块的第二实施例。
具体实施方式
图1展现了电子模块10,作为例子,其被设计为安装在汽车中。该模块包括壳体11,例如由铝制造,其容纳两个电路板12和13。该电路板12和13(或者“印刷电路板”,PCBs)通过未示出的附连方式(如间隔件、螺纹杆和螺母)附连到壳体11。
电路板12例如是电力板,电路板13是控制板。为了简化的目的,在图1中仅一个电导体14被示出用于在两个电路板12和13之间进行连接,但也可有多个。相似地,模块10可包含超过两个的电路板,每个板能够通过一个或多个电导体连接到另一板。
电导体14将电路板12的导电垫片15电连接到电路板13的导电垫片16。电导体14的端部使用“楔形结合”技术被结合到垫片15和16。因此,电路板12的一个或多个电子元件被连接到电路板13的一个或多个电子元件。
如图1所示,覆盖树脂17已被浇注和聚合在壳体11中以覆盖两个电路板。因此,电导体14的被结合端被保护不受氧化、热冲击、振动和湿热(dampheat)。
图1示出了本发明的一个实施例,其中电路板被树脂完全覆盖,其也具有保护定位在电路板上的元件和电路板本身的效果,它们特别承受振动应力。
保护树脂也可分布在电导体的仅一个被结合端上,或这个电导体的两端上。
图2展现了本发明的第二个示例性实施例。在这个例子中,电子模块20包括容纳两个电路板22和23的壳体21。如在先前的例子中,电路板22和23通过未示出的附连方式附连到壳体21。同样如上,电路板22是电力板,电路板23是控制板。电导体24将电路板22的导电垫片25电连接到电路板23的导电垫片26。电导体24的端部使用“楔形结合”技术被结合于垫片25和26。
在图2示出的模块的情况下,覆盖树脂27已被浇注并聚合在壳体21中,从而仅覆盖电路板22。
用于实施本发明的聚氨基甲酸乙酯(polyurethane)树脂可以是由SEGDiélectriques销售的并在环境温度可聚合的树脂。因此,可以获得能抵抗-40℃至+125℃的热冲击并通过超过30g振动的振动测试的电子模块。
聚氨基甲酸乙酯树脂允许以0.4W/m.℃的速率向模块的金属壳体释放被电力电路板产生的热量。
聚氨基甲酸乙酯树脂的使用使得可避免使用聚合炉。在图1所示的电子模块中,连接电导体被完全覆盖在树脂中,该电子模块具有不需要树脂沉积自动机以及包括UV灯和光纤引导件的组件用于聚合的好处。制造周期被缩短。
聚氨基甲酸乙酯树脂的价格也有优势。因此,对于图1所示的例子,可估算出与使用环氧树脂相比实施费用减少75%。此外,聚氨基甲酸乙酯树脂促进了热量的释放。
聚氨基甲酸乙酯树脂例如是属于肖氏硬度计的标尺A的材料。
本发明还涉及一种电力模块,包括至少一个电力元件。该电力模块包括壳体,壳体中安装有该电力元件,且容纳用于保护该元件的聚氨基甲酸乙酯树脂,如先前的电子模块所述。该电力元件例如是电子模。优选地,该电力元件通过电导体14电链接到导电垫片15、16、15、26或到另一电力元件,该电导体通过如前所述的“楔形结合”技术结合。电导体14结合在该元件的相应结合垫片上。
在一个实施例中,导体14和该元件的结合垫片或者导电垫片15、16、25、26具有特征,该特征允许电导体14的改善其在聚氨基甲酸乙酯树脂上的保持性的形状,特别是机械方面。特别地,电导体14在导电垫片15、16、25、26或结合垫片的附近具有弯曲形状。
例如,导体14结合在每一端处,两个结合部之间的水平距离超过或等于6mm。两个结合部之间的垂直距离小于或等于10mm;导体14的长度可小于或等于值150xD,其中D是导体14的直径。优选地,导体14的直径D包括在300到500μm之间。这些特征改善了导体14在聚氨基甲酸乙酯树脂中的保持性(maintain)。
Claims (8)
1.一种电子模块(10,20),其被设计为安装在交通工具中,该模块包括容纳至少两个电路板(12,13;22,23)的壳体(11,21),所述电路板通过至少一个电导体(14,24)连接在一起,该导体的一端结合于一个电路板,该导体的另一端结合于另一个电路板,导体的端部通过“楔形结合”技术结合,该壳体还容纳覆盖该电导体的至少一个被结合端的保护树脂(17,27),其特征在于,该保护树脂是聚氨基甲酸乙酯树脂,且
该导体的直径在300至500μm之间。
2.根据权利要求1的电子模块,其中,两个电路板中的一个(12,22)是电力板,另一个电路板(13,23)是控制板。
3.根据权利要求2的电子模块,其中,保护树脂(17)完全覆盖该两个电路板。
4.根据权利要求2的电子模块,其中,保护树脂(27)仅仅覆盖电力板(22)。
5.根据权利要求4的电子模块,其中,控制板(23)搁置在保护树脂(27)上。
6.根据权利要求1至5任一个的电子模块,其中,该电导体(14,24)是直径超过250μm的铝线。
7.根据权利要求1至5任一个的电子模块,其中,该电导体(14,24)是铝带。
8.根据权利要求1至5任一个的电子模块,其中,壳体(11,21)由铝制造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1057648A FR2965447B1 (fr) | 2010-09-23 | 2010-09-23 | Boitier electronique pour vehicule |
FR1057648 | 2010-09-23 |
Publications (2)
Publication Number | Publication Date |
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CN102573371A CN102573371A (zh) | 2012-07-11 |
CN102573371B true CN102573371B (zh) | 2016-06-01 |
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Application Number | Title | Priority Date | Filing Date |
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CN201110384758.6A Expired - Fee Related CN102573371B (zh) | 2010-09-23 | 2011-09-23 | 用于交通工具的电子模块 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9167709B2 (zh) |
EP (1) | EP2434849B1 (zh) |
JP (1) | JP6082180B2 (zh) |
KR (1) | KR20120031262A (zh) |
CN (1) | CN102573371B (zh) |
BR (1) | BRPI1105443A2 (zh) |
FR (1) | FR2965447B1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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FR3086495B1 (fr) * | 2018-09-24 | 2023-01-20 | Valeo Vision | Connexion electrique pour un module d'eclairage a fonction dynamique d'un vehicule automobile |
DE102019215842A1 (de) * | 2019-10-15 | 2021-04-15 | Baumüller Nürnberg GmbH | Antrieb |
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JP2003318568A (ja) * | 2002-04-23 | 2003-11-07 | Hitachi Unisia Automotive Ltd | 電子部品装置 |
JP2009130230A (ja) * | 2007-11-27 | 2009-06-11 | Kyocera Corp | 電力制御モジュール |
EP2120263A1 (en) * | 2007-11-30 | 2009-11-18 | Panasonic Corporation | Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board |
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JP2912526B2 (ja) * | 1993-07-05 | 1999-06-28 | 三菱電機株式会社 | 半導体パワーモジュールおよび複合基板 |
JP3646665B2 (ja) * | 2001-04-17 | 2005-05-11 | 株式会社日立製作所 | インバータ装置 |
JP2004087735A (ja) * | 2002-08-26 | 2004-03-18 | Toshiba Corp | 半導体装置 |
JP3882734B2 (ja) * | 2002-10-16 | 2007-02-21 | 富士電機デバイステクノロジー株式会社 | パワー半導体装置のワイヤボンディング方法 |
US20060163315A1 (en) * | 2005-01-27 | 2006-07-27 | Delsman Mark A | Ribbon bonding tool and process |
CN103168355B (zh) * | 2011-10-12 | 2017-04-05 | 日本碍子株式会社 | 大容量模块的外围电路用的电路基板及包含使用该电路基板的外围电路的大容量模块 |
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2010
- 2010-09-23 FR FR1057648A patent/FR2965447B1/fr not_active Expired - Fee Related
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2011
- 2011-09-22 JP JP2011207205A patent/JP6082180B2/ja not_active Expired - Fee Related
- 2011-09-22 BR BRPI1105443-3A patent/BRPI1105443A2/pt not_active Application Discontinuation
- 2011-09-22 US US13/239,557 patent/US9167709B2/en not_active Expired - Fee Related
- 2011-09-23 CN CN201110384758.6A patent/CN102573371B/zh not_active Expired - Fee Related
- 2011-09-23 KR KR1020110096357A patent/KR20120031262A/ko not_active Application Discontinuation
- 2011-09-23 EP EP11182445.4A patent/EP2434849B1/fr not_active Not-in-force
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JP2003318568A (ja) * | 2002-04-23 | 2003-11-07 | Hitachi Unisia Automotive Ltd | 電子部品装置 |
JP2009130230A (ja) * | 2007-11-27 | 2009-06-11 | Kyocera Corp | 電力制御モジュール |
EP2120263A1 (en) * | 2007-11-30 | 2009-11-18 | Panasonic Corporation | Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board |
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KR20120031262A (ko) | 2012-04-02 |
EP2434849A1 (fr) | 2012-03-28 |
FR2965447B1 (fr) | 2012-08-31 |
JP6082180B2 (ja) | 2017-02-15 |
US20120075811A1 (en) | 2012-03-29 |
US9167709B2 (en) | 2015-10-20 |
JP2012124459A (ja) | 2012-06-28 |
FR2965447A1 (fr) | 2012-03-30 |
EP2434849B1 (fr) | 2015-12-02 |
CN102573371A (zh) | 2012-07-11 |
BRPI1105443A2 (pt) | 2013-02-19 |
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