JP2012118621A - Color filter integrated touch panel sensor, display device with touch panel function and manufacturing method of polygonal work substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a color filter integrated touch panel sensor in which a touch panel sensor unit can be prevented from being impaired by static electricity.SOLUTION: On one side 11a of a substrate 11 of a color filter integrated touch panel sensor 20, a touch panel sensor unit 10 and an electricity removal pattern 23 having electroconductivity are provided. The electricity removal pattern 23 reaches an outer edge of the substrate 11 at least partially, and is not brought into contact with electrode patterns 13 and 15 of the touch panel sensor unit 10, a terminal unit 17 and conductive patterns 14 and 16. Furthermore, the electricity removal pattern 23 includes a tapered area 24 which is tapered inward, and a tip portion 24a of the tapered area 24 is covered with a protecting layer 22. Therefore, even when the protecting layer 22 is charged with static electricity, charges of the protecting layer 22 can be released to the electricity removal pattern 23.

Description

  The present invention relates to a color filter integrated touch panel sensor including a touch panel sensor section and a color filter section. The present invention also relates to a display device with a touch panel function including a color filter integrated touch panel sensor and a display substrate. The present invention also relates to a method for manufacturing a multi-sided work substrate to which a plurality of color filter integrated touch panel sensors are assigned.

  As a touch panel sensor for realizing a touch panel function, a capacitive touch panel sensor is known. In a capacitively coupled touch panel sensor, a change in capacitance generated when an external conductor such as a human finger contacts (approaches) the touch panel sensor is used to detect the external conductor such as a human finger on the touch panel sensor. Detect position. Capacitive touch panel sensors include a surface type and a projection type. The projection type is attracting attention because it is suitable for multi-touch recognition (multi-point recognition).

  As a form of such a touch panel sensor, a color filter integrated touch panel sensor in which a touch panel sensor and a color filter are formed on one substrate is known. For example, Patent Document 1 proposes a color filter integrated touch panel sensor including a substrate, a touch panel sensor portion provided on one surface of the substrate, and a color filter portion provided on the other surface of the substrate. .

  By the way, the touch panel sensor and the color filter generally apply a coating solution on a substrate first, then solidify the coating solution on the substrate to form a layer, and then use a method such as etching the layer. Manufactured by processing. Here, in the step of applying the coating liquid on the substrate, for example, the coating liquid is applied to the substrate fixed on the support base. In the step of solidifying the coating solution on the substrate, for example, the coating solution is solidified by heating using a hot plate. Further, when the wet etching method is used as the etching method, the liquid remaining in the processed layer is removed by an air knife.

  It is known that static electricity can be generated due to various causes when manufacturing a touch panel sensor and a color filter on a substrate. Examples of the cause of the generation of static electricity include peeling electrification when the substrate is peeled off from the support base or the hot plate, and friction electrification when draining using an air knife. When such static electricity is discharged, the layer formed on the substrate may be damaged.

  In order to prevent damage to the layer due to static electricity, Patent Document 2 proposes that the volume resistivity of the black matrix layer of the color filter be set to a predetermined value or less, thereby reducing the generation of static electricity.

JP 2010-160745 A JP 2001-147314 A

  In the manufacturing process of a color filter integrated touch panel sensor, generally, a touch panel sensor portion is first formed on one surface of a substrate, and then a color filter portion is formed on the other surface of the substrate. In general, in the step of forming the color filter portion, the substrate is transported with one side of the substrate facing downward. For this reason, it is conceivable that static electricity is generated in the touch panel sensor portion formed on one surface of the substrate when the substrate is transported. For this reason, it is necessary to provide some mechanism for suppressing the generation of static electricity on one side of the substrate.

  Further, not only static electricity is generated in the touch panel sensor unit when the substrate is transported, but also dielectric polarization occurs in predetermined components of the touch panel sensor unit when the touch panel sensor unit is formed, thereby generating static electricity. It is also possible. For example, when the formation process of the touch panel sensor part includes a photocuring process for a predetermined component, it is considered that polarization occurs on the surface and inside of the predetermined component due to the molecules being excited by light. It is done. In this case, it is conceivable that the touch panel sensor unit is damaged by the discharge of electric charges due to dielectric polarization.

  An object of the present invention is to provide a color filter integrated touch panel sensor and a display device with a touch panel function that can effectively solve such problems. It is another object of the present invention to provide a method for manufacturing a multi-sided work substrate to which a plurality of color filter integrated touch panel sensors are assigned.

  1st this invention is equipped with the board | substrate, the touch-panel sensor part provided on the one surface of the said board | substrate, and the color filter part provided on the other surface of the said board | substrate and having a colored layer of multiple colors, The touch panel sensor unit includes a plurality of electrode patterns provided in a predetermined pattern on the one surface of the substrate, a plurality of terminal portions provided on the one surface of the substrate, each corresponding to each electrode pattern, and the substrate. A plurality of conductive patterns that are electrically connected between each electrode pattern and each terminal portion, and each electrode pattern and each conductive pattern are provided on the one surface so as to cover each electrode pattern and each conductive pattern. A conductive neutralization pattern is further provided on the one surface of the substrate, and the neutralization pattern at least partially reaches the outer edge of the substrate. And the electrode pattern, the terminal portion and the conductive pattern are not in contact with each other, the static elimination pattern includes a tapered region tapering inward, the tip of the tapered region, The color filter integrated touch panel sensor is covered with the protective layer.

  In the color filter integrated touch panel sensor according to the first aspect of the present invention, the tapered region of the static elimination pattern may extend from the outer edge of the substrate to the protective layer and taper toward the protective layer.

  In the color filter integrated touch panel sensor according to the first aspect of the present invention, the static elimination pattern further includes a linear region reaching the outer edge of the substrate and partially extending parallel to the outer edge, and each tapered region includes the line You may protrude from the said linear area | region so that it may cross | intersect the extending direction of a linear area | region.

  In the color filter integrated touch panel sensor according to the first aspect of the present invention, preferably, the thickness of the protective layer on the tip of the tapered region is equal to or less than the thickness of the protective layer on the electrode pattern and the conductive pattern. ing.

  In the color filter-integrated touch panel sensor according to the first aspect of the present invention, the electrode pattern is located between a plurality of x electrode units connected in the x direction via x connection parts, and between the x electrode units, and y in the y direction. A plurality of y electrode units connected via a connection portion, and the x connection portion and the y connection portion are arranged so as to overlap each other when viewed from the normal direction of the base material, and the x connection An insulating layer may be interposed between the portion and the y connection portion. In this case, preferably, the static elimination pattern is formed by laminating the same material as the x connection portion and the same material as the y connection portion.

  In the color filter integrated touch panel sensor according to the first aspect of the present invention, the tip portion of the tapered region of the static elimination pattern is interposed between the same material as the x connection portion and the same material as the y connection portion. In addition, the same material as that of the insulating layer may be further included.

  In the color filter integrated touch panel sensor according to the first aspect of the present invention, the touch panel sensor portion is provided on the protective layer and overlaps at least a tip portion of the tapered region of the static elimination pattern when viewed from the normal direction of the substrate. You may further have an antistatic film. In this case, preferably, the surface resistance of the antistatic film is smaller than the surface resistance of the protective layer and larger than the surface resistance of the electrode pattern and the surface resistance of the conductive pattern.

  According to a second aspect of the present invention, there is provided a touch panel function, comprising: the color filter integrated touch panel sensor described above; and a display substrate provided on the color filter portion side of the color filter integrated touch panel sensor. It is a display device.

According to a third aspect of the present invention, in the method for manufacturing a multi-sided work substrate in which a plurality of color filter integrated touch panel sensors are assigned, the work substrate has one side and the other side, and the one side and the other side of the multi-sided work substrate Is divided into a plurality of chip portions on which the color filter integrated touch panel sensor is formed, and an outer frame portion surrounding each chip portion, and a method for manufacturing a multi-faceted work substrate includes a step of preparing a work substrate, Forming the touch panel sensor part on each chip part on one surface of the work substrate;
A step of forming the static elimination pattern on each chip portion on one surface of the work substrate, and an outer frame static elimination pattern electrically connected to each static elimination pattern and having conductivity on the outer frame portion on one surface of the work substrate. A method of manufacturing a multi-faced work substrate, comprising: a step of forming; and a step of forming the color filter portion on each chip portion on the other surface of the work substrate.

  In the method for manufacturing a multi-sided work substrate according to the third aspect of the present invention, the electrode pattern is located between the plurality of x electrode units connected in the x direction via the x connection portions, and between the x electrode units, and in the y direction. a plurality of y electrode units connected via a y connection portion, and the x connection portion and the y connection portion are arranged so as to overlap each other when viewed from the normal direction of the base material, An insulating layer may be interposed between the connection portion and the y connection portion. Further, the step of forming the touch panel sensor unit includes a step of providing a transparent electrode material on one surface of the work substrate, and a patterning of the provided transparent electrode material to form the x electrode unit, the y electrode unit, and the x A step of forming a connection portion, a step of forming the insulating layer on the x-direction connection portion, a step of providing a conductive material on one surface of the work substrate, and patterning the provided conductive material, forming a y-connection portion. In this case, it is preferable that the outer frame static elimination pattern and the static elimination pattern include a transparent electrode material layer formed simultaneously with the x electrode unit, the y electrode unit, and the x connection portion when patterning the transparent electrode material. And a conductive material layer formed on the transparent electrode material layer simultaneously with the y-connecting portion when patterning the conductive material.

In the method for manufacturing a multi-sided work substrate according to the third aspect of the present invention, the electrode pattern is located between the plurality of x electrode units connected in the x direction via the x connection portions, and between the x electrode units, and in the y direction. a plurality of y electrode units connected via a y connection portion, and the x connection portion and the y connection portion are arranged so as to overlap each other when viewed from the normal direction of the base material, An insulating layer may be interposed between the connection portion and the y connection portion. Further, the step of forming the touch panel sensor unit includes a step of providing a conductive material on one surface of the work substrate,
Patterning the provided conductive material to form the y connection portion, forming the insulating layer on the y connection portion, and providing a transparent electrode material on one surface of the work substrate; ,
And patterning the provided transparent electrode material to form the x electrode unit, the y electrode unit, and the x connection part. In this case, preferably, the outer frame static elimination pattern and the static elimination pattern are formed when the conductive material layer is formed simultaneously with the y connection portion when patterning the conductive material and when the transparent electrode material is patterned. A transparent electrode material layer formed on the conductive material layer simultaneously with the x electrode unit, the y electrode unit, and the x connection portion.

  The manufacturing method of the multi-sided work substrate according to the third aspect of the present invention may further include a step of forming an antistatic film on a protective layer provided in each chip portion. In this case, preferably, the surface resistance of the antistatic film is smaller than the surface resistance of the protective layer and larger than the surface resistance of the electrode pattern and the surface resistance of the conductive pattern.

  According to the first and second aspects of the present invention, the touch panel sensor section and the conductive neutralization pattern are provided on one surface of the color filter integrated touch panel sensor. The static elimination pattern reaches at least a part of the outer edge of the substrate, and does not contact any of the electrode pattern, the terminal part, and the conductive pattern of the touch panel sensor part. Further, the static elimination pattern includes a tapered region that tapers inward, and the tip of the tapered region is covered with a protective layer. For this reason, even when the protective layer is charged by static electricity, the charge of the protective layer can be released to the charge removal pattern. In addition, by forming a static elimination pattern using a tapered region that tapers inward, the charge of the protective layer is easily collected at the tip of the tapered region. For this reason, the electric charge of a protective layer can be more reliably released to a static elimination pattern. This can suppress an increase in the charge amount of the protective layer. As a result, it is possible to prevent the occurrence of static electricity discharge, thereby preventing the electrode pattern, the terminal portion and the conductive pattern from being damaged. Moreover, even if discharge occurs, by providing a charge removal pattern, the place where discharge occurs can be a charge removal pattern instead of the touch panel sensor unit. This can prevent the touch panel sensor unit from being damaged.

  According to a third aspect of the present invention, there is provided a method for manufacturing a multi-sided work substrate, the step of forming a touch panel sensor portion on each chip portion on one surface of the work substrate, and a charge removal pattern having conductivity on each chip portion on the one surface of the work substrate. Forming an electrically conductive outer frame neutralization pattern electrically connected to each static elimination pattern on the outer frame portion on one surface of the work substrate, and each chip portion on the other surface of the work substrate. And a step of forming a color filter portion. For this reason, static electricity that can be generated on the work substrate can be reduced while the color filter portion is formed on the other surface of the work substrate. Thereby, it is possible to prevent the occurrence of static electricity discharge, thereby preventing the touch panel sensor unit from being damaged. Further, even if a discharge occurs, by providing the charge removal pattern and the outer frame charge removal pattern, the place where the discharge occurs can be the charge removal pattern or the outer frame charge removal pattern instead of the touch panel sensor unit. This can prevent the touch panel sensor unit from being damaged.

FIG. 1 is a plan view showing a color filter integrated touch panel sensor according to the first embodiment. 2A is a longitudinal sectional view of the color filter integrated touch panel sensor of FIG. 1 as viewed from the IIA-IIA direction. 2B is a longitudinal sectional view of the color filter integrated touch panel sensor of FIG. 1 as viewed from the IIB-IIB direction. 2C is a longitudinal sectional view of the color filter integrated touch panel sensor of FIG. 1 as viewed from the IIC-IIC direction. 3A is a longitudinal sectional view showing the display device according to the first embodiment of the present invention, and FIG. 3B shows the color filter portion of the display device of FIG. 3A from arrows IIIb-IIIb. FIG. 3C is a view of the display substrate of the display device of FIG. 3A as viewed from the arrows IIIc-IIIc. FIG. 4A is a plan view showing a process of forming an x electrode unit, a y electrode unit, and an x connection portion on a work substrate using a transparent electrode material. FIG. 4B is an enlarged view showing a chip portion of the work substrate of FIG. 4A. 4C is a longitudinal sectional view of the work substrate of FIG. 4B as seen from the IVC-IVC direction. FIG. 5A is a plan view showing a step of forming an insulating layer on the work substrate. FIG. 5B is a longitudinal sectional view of the work substrate of FIG. 5A viewed from the VB-VB direction. FIG. 6A is a plan view showing a process of forming a conductive pattern, a terminal portion, and a y connection portion on a work substrate using a conductive material. 6B is an enlarged view showing a chip portion of the work substrate of FIG. 6A. 6C is a longitudinal sectional view of the work substrate of FIG. 6B as seen from the VIC-VIC direction. FIG. 7A is a plan view showing a process of forming a protective layer on the work substrate. FIG. 7B is a longitudinal sectional view of the work substrate of FIG. 7A as viewed from the VIIB-VIIB direction. FIG. 8 is a diagram illustrating a method for forming a color filter portion. FIGS. 9A and 9B are views showing a state where the work substrate is peeled from the support base. FIG. 10 is a diagram showing a modification of the shape of the static elimination pattern in the first embodiment. FIG. 11A is a diagram showing a modification of the layer configuration of the static elimination pattern in the first exemplary embodiment. FIG. 11B is a diagram showing another modification of the layer configuration of the static elimination pattern in the first exemplary embodiment. FIG. 11C is a diagram showing a modification of the layer configuration of the touch panel sensor unit in the first embodiment. FIG. 12A is a plan view showing a touch panel sensor unit formed on one surface of a work substrate in the second embodiment. 12B is a longitudinal sectional view of the work substrate 70 of FIG. 12A as viewed from the XIIB-XIIB direction. FIG. 13A is a plan view showing a color filter integrated touch panel sensor according to a third embodiment of the present invention. 13B is a longitudinal sectional view of the color filter integrated touch panel sensor of FIG. 13A as viewed from the XIIIB-XIIIB direction. FIG. 14A is a diagram showing a modification of the shape of the static elimination pattern in the third exemplary embodiment. 14B is a longitudinal sectional view of the work substrate of FIG. 14A viewed from the XIVB-XIVB direction. FIG. 15A is a plan view showing a touch panel sensor unit in the fourth embodiment. FIG. 15B is a longitudinal sectional view of the touch panel sensor portion of FIG. 15A as viewed from the XVB-XVB direction. FIG. 16 is a diagram illustrating a modification of the shape of the static elimination pattern in the fourth embodiment.

  Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 9A and 9B. First, the entire display device 60 with a touch panel function in this embodiment will be described with reference to FIGS. In the present embodiment, a liquid crystal display device with a touch panel function is shown as an example of the display device 60 with a touch panel function. However, the present invention is not limited to this, and in the case of other display devices having a touch panel function, such as an organic EL display and a plasma display, by applying the present invention, a liquid crystal display device with a touch panel function can be used. Similar effects can be obtained.

Display Device As shown in FIG. 3A, a display device 60 with a touch panel function includes a color filter integrated touch panel sensor 20 and a TFT substrate (display substrate) provided to face the color filter integrated touch panel sensor 20. 50. As shown in FIG. 3A, the color filter integrated touch panel sensor 20 is provided on the substrate 11, the touch panel sensor unit 10 provided on the one surface 11 a of the substrate 11, and the other surface 11 b of the substrate 11. And a color filter unit 30. The TFT substrate 50 is provided so as to face the color filter portion 30 of the color filter integrated touch panel sensor 20. That is, the other surface 11b side of the substrate 11 is the display substrate (TFT substrate) side, and the one surface 11a side of the substrate 11 is the observer side.

  As shown in FIG. 3A, a liquid crystal 40 is filled between the color filter portion 30 and the TFT substrate 50, and the liquid crystal 40 is sealed with a sealing material 41. Although not shown, a transparent protective cover may be provided on the touch panel sensor unit 10 of the color filter integrated touch panel sensor 20 via a transparent adhesive or the like. The protective cover is for protecting the touch panel sensor unit 10 and the display device 60, and functions as an input surface (touch surface, contact surface) of the display device 60 with a touch panel function.

  FIG. 3C is a diagram showing a case where the TFT substrate 50 of the display device 60 shown in FIG. 3A is viewed from the direction of arrows IIIc-IIIc. As shown in FIG. 3C, the TFT substrate 50 includes a substrate 51, a plurality of transparent electrode portions 52 that control a voltage applied to the liquid crystal 40, and a wiring portion 53 that applies a control voltage to the transparent electrode portion 52. And have. Among these, each of the transparent electrode portions 52 corresponds to a unit pixel of the display device 60.

Color Filter Integrated Touch Panel Sensor Next, the color filter integrated touch panel sensor 20 will be described with reference to FIGS. 1 to 2C and FIGS. 3 (a) and 3 (b). As described above, the color filter integrated touch panel sensor 20 includes the substrate 11, the touch panel sensor unit 10 provided on one surface 11 a of the substrate 11, and the color filter unit 30 provided on the other surface 11 b of the substrate 11. ,have.

  As shown in FIG. 1, the substrate 11 has a rectangular shape composed of four sides. However, the shape of the substrate 11 is not limited to a rectangle, and a polygon, a circle, or the like can be appropriately selected as the shape of the substrate 11. The material of the substrate 11 is not particularly limited as long as the light emission of the TFT substrate 50 can be taken out and moisture and oxygen can be effectively blocked. For example, glass, polymer, etc. excellent in light transmittance, stability and durability can be used.

Color Filter Unit Next, the color filter unit 30 will be described with reference to FIGS. FIG. 3B is a diagram illustrating a case where the color filter unit 30 of the display device 60 illustrated in FIG. 3A is viewed from the direction of arrows IIIb-IIIb. As shown in FIG. 3B, the color filter unit 30 includes a substrate 11, a black matrix layer 31 provided on the other surface 11b of the substrate 11, and a space between the black matrix layer 31 on the other surface 11b of the substrate 11. A plurality of colored layers 32 provided on the substrate.

  The black matrix layer 31 of the color filter unit 30 is disposed so as to overlap the wiring unit 53 of the TFT substrate 50 described above when viewed from the normal direction of the color filter unit 30. As the black matrix layer 31, a layer made of a light-shielding material is used. For example, a thin metal film made of chromium or the like having a thickness of about 1000 to 2000 mm is formed by sputtering, vacuum deposition, or the like, and this thin film is patterned, and light-shielding particles such as carbon fine particles and metal oxides are contained. Forming a resin layer of polyimide resin, acrylic resin, epoxy resin, etc., patterning this resin layer, and forming a photosensitive resin layer containing light-shielding particles such as carbon fine particles and metal oxides And what has light-shielding property, such as what was formed by patterning this photosensitive resin layer, may be used. The thickness of the black matrix layer 31 is appropriately adjusted according to the required light shielding properties.

The multi-colored colored layer 32 adjusts the color of light that has passed through the TFT substrate 50 and the liquid crystal 40, and includes at least a red colored layer, a blue colored layer, and a green colored layer.
Among these, examples of the colorant used in the red colored layer include perylene pigments, lake pigments, azo pigments, quinacridone pigments, anthraquinone pigments, anthracene pigments, and isoindoline pigments. These pigments may be used alone or in combination of two or more.
Examples of the colorant used in the blue colored layer include copper phthalocyanine pigments, anthraquinone pigments, indanthrene pigments, indophenol pigments, cyanine pigments, dioxazine pigments, and the like. These pigments may be used alone or in combination of two or more.
Examples of the colorant used in the green coloring layer include phthalocyanine pigments such as halogen polysubstituted phthalocyanine pigments or halogen polysubstituted copper phthalocyanine pigments, triphenylmethane basic dyes, isoindoline pigments, and isoindolinone pigments. And pigments. These pigments or dyes may be used alone or in combination of two or more.
The colored layers 32 of a plurality of colors are not limited to the above-described red colored layer, blue colored layer, and green colored layer, and other colored layers, for example, a yellow colored layer may be included.

  A protective film (not shown) may be provided between the black matrix layer 31 and the colored layer 32 and the liquid crystal 40. Examples of the material for the protective film include a transparent material made of an oxide or oxynitride of silicon, aluminum, zinc or tin, or an organic insulating film such as an acrylic resin. Further, a common transparent electrode (not shown) for pixel display may be provided on the surfaces of the black matrix layer 31 and the colored layer 32. Furthermore, a spacer (not shown) may be provided on the black matrix layer 31 for holding a gap between the color filter unit 30 and the TFT substrate 50.

Touch Panel Sensor Unit Next, the touch panel sensor unit 10 will be described with reference to FIGS. 1 to 2C. FIG. 1 is a plan view showing a color filter integrated touch panel sensor 20 as viewed from the touch panel sensor unit 10 side. 2A to 2C are longitudinal sectional views of the color filter integrated touch panel sensor 20 of FIG. 1 as viewed from the IIA-IIA direction to the IIC-IIC direction, respectively.

  The touch panel sensor unit 10 includes a plurality of electrode patterns 13 and 15 provided in a predetermined pattern on one surface 11 a of the substrate 11, a plurality of terminal portions 17 provided on the one surface 11 a of the substrate 11, and one surface 11 a of the substrate 11. And a plurality of conductive patterns 14 and 16 provided thereon. Among these, the plurality of terminal portions 17 are provided so as to correspond to the electrode patterns 13 and 15 on a one-to-one basis. The plurality of conductive patterns 14 and 16 are provided so as to electrically connect the electrode patterns 13 and 15 and the terminal portions 17, respectively. A protective layer 22 that covers the electrode patterns 13 and 15 and the conductive patterns 14 and 16 is further provided on the one surface 11 a of the substrate 11. In FIG. 1, for convenience of description, the protective layer 22 is represented by a one-dot chain line.

  In the touch panel sensor unit 10, a region where the plurality of electrode patterns 13 and 15 are provided is a display region where an image is displayed when the touch panel sensor unit 10 is incorporated in the display device 60. On the other hand, the region where the plurality of conductive patterns 14 and 16 and the terminal portion 17 are provided is a non-display region where no image is displayed.

(Electrode pattern)
First, the electrode patterns 13 and 15 will be described in detail. As shown in FIG. 1, the plurality of electrode patterns 13 and 15 are composed of a plurality of x electrode patterns 13 extending in the x direction and a plurality of y electrode patterns 15 extending in the y direction. Among these, each x electrode pattern 13 includes a plurality of x electrode units 13a having a substantially square shape, and an x connection portion 13b for connecting adjacent x electrode units 13a. Similarly, each y electrode pattern 15 includes a plurality of y electrode units 15a having a substantially square shape, and a y connection portion 15b that connects between adjacent y electrode units 15a.

  The dimensions of the x electrode unit 13a and the y electrode unit 15a are determined by the necessary resolution for a finger, a pen, or the like detected by the touch panel sensor unit 10, and are, for example, 5 mm × 5 mm. The shape of the x electrode unit 13a and the y electrode unit 15a is not limited to a square, and various shapes such as a polygon and a circle can be appropriately selected. The dimensions of the x connection portion 13b and the y connection portion 15b are set so as to connect the x electrode units 13a and the y electrode units 15a with low resistance. For example, the widths of the x connection part 13b and the y connection part 15b are in the range of 5 to 200 μm, and the lengths of the x connection part 13b and the y connection part 15b are in the range of 100 to 200 μm.

  As shown in FIGS. 2A and 2B, the x connection portion 13b is formed on the same plane as the x electrode unit 13a and the y electrode unit 15a. On the other hand, the y connection portion 15b is disposed above the x electrode unit 13a and the y electrode unit 15a. Further, the x connection portion 13 b and the y connection portion 15 b are arranged so as to overlap each other when viewed from the normal direction of the substrate 11. Further, in order to prevent the x connection portion 13b and the y connection portion 15b from coming into contact with each other and thereby conducting between the x electrode pattern 13 and the y electrode pattern 15, the gap between the x connection portion 13b and the y connection portion 15b is prevented. Insulating layer 18 is interposed. For convenience of explanation, the display of the insulating layer 18 is omitted in FIG.

  Each of the x electrode unit 13a, the x connecting portion 13b, and the y electrode unit 15a is made of a transparent electrode material that is conductive and transparent. Examples of transparent electrode materials include indium tin oxide (ITO), zinc oxide, indium oxide, antimony-added tin oxide, fluorine-added tin oxide, aluminum-added zinc oxide, potassium-added zinc oxide, silicon-added zinc oxide, and zinc oxide. Metal oxides such as tin oxide, indium oxide-tin oxide, and zinc oxide-indium oxide-magnesium oxide are used. Two or more of these metal oxides may be combined.

  On the other hand, the y connection portion 15 b is formed using the same material as that of the conductive patterns 14 and 16 and the terminal portion 17. The y connection portion 15b will be described in detail later.

(Conductive pattern and terminal part)
Next, the conductive patterns 14 and 16 and the terminal portion 17 will be described. As shown in FIG. 1, the plurality of conductive patterns 14 and 16 include an x conductive pattern 14 that electrically connects the x electrode pattern 13 and the terminal portion 17, and a space between the y electrode pattern 15 and the terminal portion 17. And y conductive pattern 16 for electrically connecting the two.

  As described above, the x conductive pattern 14, the y conductive pattern 16, and the terminal portion 17 are provided in the non-display area of the color filter integrated touch panel sensor 20. For this reason, the electroconductive material which comprises the x conductive pattern 14, the y conductive pattern 16, and the terminal part 17 may have transparency, or does not need to have transparency. That is, as the conductive material of the x conductive pattern 14, the y conductive pattern 16, and the terminal portion 17, a transparent material such as ITO may be used in the same manner as the transparent electrode material described above, or from the transparent electrode material described above. A metal material having a high electrical conductivity may be used. Examples of the metal material used as the conductive material of the x conductive pattern 14, the y conductive pattern 16, and the terminal portion 17 include metals such as aluminum, molybdenum, palladium, silver, chromium, copper, and alloys containing them as a main component, Or the laminated body containing those alloys is mentioned.

  Although FIG. 1 shows an example in which the width of the terminal portion 17 is larger than the width of the x conductive pattern 14 and the y conductive pattern 16, the present invention is not limited to this. The purpose of providing the terminal portion 17 is to provide a portion for appropriately transmitting signals from the electrode patterns 13 and 15 transmitted through the conductive patterns 14 and 16 to the outside. In the present embodiment, the terminal portion 17 is defined as a portion that is electrically connected to the conductive patterns 14 and 16 and is not covered with the protective layer 22.

(Y connection part)
Next, the y connection portion 15b will be described in detail. As described above, the y connection portion 15 b is formed of the same conductive material as the conductive patterns 14 and 16 and the terminal portion 17. For this reason, as will be described later, the y-connection portion 15b can be formed simultaneously with the conductive patterns 14 and 16 and the terminal portion 17. Thereby, compared with the case where the y connection part 15b, the conductive patterns 14 and 16, and the terminal part 17 are formed in a separate process, the touch panel sensor part 10 can be manufactured with fewer man-hours.

In addition, although the point which the width | variety of the y connection part 15b is in the range of 5-200 micrometers was demonstrated in the above-mentioned, the width | variety of the y connection part 15b may be set according to the material of the y connection part 15b.
That is, when a transparent material such as ITO is used as the conductive material of the conductive patterns 14 and 16, the terminal portion 17, and the y connection portion 15b, the width of the y connection portion 15b is, for example, It may be in the range of 20 to 200 μm. Moreover, when the metal material which has a higher electrical conductivity than the above-mentioned transparent electrode material is used as the conductive material of the conductive patterns 14 and 16, the terminal portion 17 and the y connection portion 15b, the width of the y connection portion 15b is, for example, It may be in the range of 5 to 20 μm.

  When a metal material is used as the conductive material of the conductive patterns 14 and 16, the terminal portion 17, and the y connection portion 15 b, the y connection portion 15 b is preferably a normal line of the substrate 11 as shown in FIGS. 2A to 2C. It is provided so as to overlap the black matrix layer 31 of the color filter portion 30 when viewed from the direction. Accordingly, even when the y connection portion 15b is formed from a metal material that does not have transparency, it is possible to prevent the display of the liquid crystal display device 60 from being hindered by the y connection portion 15b. In this case, the width of the black matrix layer 31 in the x direction is appropriately set according to the thickness of the base material 11, the width of the y connection portion 15b in the x direction, the viewing angle of the liquid crystal display device 60, and the like. It is in the range of ~ 100 μm.

(Protective layer)
Next, the protective layer 22 will be described. The protective layer 22 is a layer for protecting the electrode patterns 13 and 15 and the conductive patterns 14 and 16 from the outside. For example, as will be described later, when the color filter unit 30 is provided on the other surface 11 b of the substrate 11, the electrode patterns 13 and 15 and the conductive patterns 14 of the touch panel sensor unit 10 that are already provided on the one surface 11 a of the substrate 11. , 16 is a layer for preventing damage. The protective layer 22 also plays a role of shielding external moisture. As a material constituting such a protective layer 22, an insulating material is used, and for example, a photocurable acrylic resin is used.

  Next, further components of the color filter integrated touch panel sensor 20 will be described. As shown in FIGS. 1 to 2B, a plurality of static elimination patterns 23 having conductivity are further provided on the one surface 11 a of the substrate 11. Hereinafter, the static elimination pattern 23 will be described in detail.

As shown in FIG. 1, each static elimination pattern 23 is provided so as to at least partially reach the outer edge of the substrate 11 and not to contact any of the electrode patterns 13 and 15, the terminal portion 17, and the conductive patterns 14 and 16. It has been. Each static elimination pattern 23 includes a tapered region 24 that tapers inward, and a tip 24 a of the tapered region 24 is covered with a protective layer 22. Here, “to taper inward” means that the width of the tapered region 24 becomes narrower from the non-display region of the touch panel sensor unit 10 toward the display region.

  The static elimination pattern 23 is provided in order to prevent the electrode patterns 13 and 15 and the conductive patterns 14 and 16 from being damaged by static electricity. For example, it is considered that the charge amount to the protective layer 22 can be reduced by providing such a charge removal pattern 23. In addition, by connecting this static elimination pattern 23 to an appropriate conductor (not shown) provided outside the color filter integrated touch panel sensor 20, the electricity charged in the protective layer 22 is changed to the static elimination pattern 23. It is thought that it can escape appropriately. Furthermore, even if the static electricity of the protective layer 22 is discharged, the static electricity path at the time of discharge is not the electrode patterns 13, 15 and the conductive patterns 14, 16 but the static elimination pattern 23. 15 and the conductive patterns 14 and 16 can be protected.

  In addition, as described above, by forming the static elimination pattern 23 using the tapered region 24 that tapers inward, the tapered region 24 can function as a so-called lightning rod. Accordingly, the charges of the protective layer 22 are likely to collect at the tip 24 a of the tapered region 24. For this reason, the electric charge of the protective layer 22 can be more reliably released to the static elimination pattern 23. Thereby, it is possible to more reliably suppress an increase in the charge amount of the protective layer 22.

  Preferably, the angle θ (see FIG. 1) of the distal end portion 24a of the tapered region 24 is set to be greater than 0 degree and 90 degrees or less. That is, the angle θ of the distal end portion 24a is an acute angle or a right angle. Thereby, the function as a lightning rod of the taper area | region 24 can be improved more.

  Next, a specific layer configuration of the static elimination pattern 23 will be described. The static elimination pattern 23 can be configured in various ways as long as at least a portion of the static elimination pattern 23 that is in contact with the protective layer 22 has conductivity. For example, as shown in FIGS. 2A and 2C, the static elimination pattern 23 includes a transparent electrode material layer 27 and a conductive material layer 29. In addition to the transparent electrode material layer 27 and the conductive material layer 29, the tip portion 24 a of the tapered region 24 of the static elimination pattern 23 further includes a tip portion insulating layer 28. As a result, the tip 24a of the tapered region 24 can be protruded upward with respect to the other portions. Thus, the tapered region 24 can function as a so-called lightning rod not only in a direction parallel to the one surface 11a of the substrate 11 but also in a direction perpendicular to the one surface 11a. For this reason, the electric charge of the protective layer 22 can be more reliably released to the static elimination pattern 23. Thereby, it is possible to more reliably suppress an increase in the charge amount of the protective layer 22.

  Next, the material which comprises each layer 27,28,29 of the static elimination pattern 23 is demonstrated. As will be described later, the transparent electrode material layer 27 is made of the same material as that forming the x electrode unit 13a, the x connection part 13b, and the y electrode unit 15a, and the x electrode unit 13a, the x connection part 13b and the y electrode. It is formed simultaneously with the unit 15a. The tip insulating layer 28 is formed simultaneously with the insulating layer 18 from the same material as that for forming the insulating layer 18 described above. The conductive material layer 29 is formed simultaneously with the y connection portion 15b from the same material as that for forming the y connection portion 15b. As a result, it is possible to form the static elimination pattern 23 with fewer man-hours.

Preferably, the thickness of the protective layer 22 on the tip 24a of the tapered region 24 is substantially the same as the thickness of the protective layer 22 on the electrode patterns 13, 15 and the conductive patterns 14, 16, or the electrode pattern 13 and 15 and the thickness of the protective layer 22 on the conductive patterns 14 and 16 is smaller. For example, in FIG. 2A, and the thickness of the protective layer 22 on the front end portion 24a of the tapered region 24 is represented by _{t 1,} the thickness of the protective layer 22 on the y-connecting portion 15b is represented by _{t 2.} Preferably, the thickness t ₁ of the protective layer 22 on the tip 24 a is substantially the same as the thickness t ₂ of the protective layer 22 on the y connection portion 15 b or the protective layer 22 on the y connection portion 15 b. It is smaller than the thickness t _2.

By the way, the transparent electrode material layer 27, the tip insulating layer 28 and the conductive material layer 29 at the tip 24a of the tapered region 24 are respectively connected to the x electrode unit 13a, the insulating layer 18 and the y connection 15b as described above. It is formed simultaneously with the x electrode unit 13a, the insulating layer 18 and the y connection portion 15b from the same material. For this reason, the thickness of the front end portion 24a of the tapered region 24 is substantially the same as the thickness of the laminated body including the x electrode unit 13a, the insulating layer 18, and the y connection portion 15b. Therefore, generally, it is considered that the thickness t ₁ of the protective layer 22 provided on the tip portion 24 a is substantially the same as the thickness t ₂ of the protective layer 22 provided on the y connection portion 15 b.
Here, as described above, the tapered region 24 has an appropriate pattern to function as a lightning rod. For this reason, if the thickness t ₁ and the thickness t ₂ are substantially the same, even if a discharge occurs due to the charge of the protective layer 22, the discharge path is not the path through the y connection portion 15 b, but the static elimination pattern 23. The route can be through. Thereby, it is possible to prevent the electrode patterns 13 and 15 and the conductive patterns 14 and 16 of the touch panel sensor unit 10 from being damaged.

Tendency route discharge is a path through the neutralization pattern 23 rather than the route through the y connection portion 15b has a thickness t ₁ of the protective layer 22 on the front end portion 24a of the tapered region 24, the protection of the y connection part 15b It can be considered that the thickness becomes stronger when the thickness is smaller than the thickness t _{2 of the} layer 22. This is because it is considered that the insulator withstand voltage is smaller as the thickness of the protective layer 22 is smaller. Therefore, preferably, the thickness t ₁ of the protective layer 22 on the tip portion 24 a of the tapered region 24 is smaller than the thickness t ₂ of the protective layer 22 on the y connection portion 15 b. The thickness t ₁ of the protective layer 22 on the tip portion 24a, will be described in detail later how to less than the thickness t ₂ of the protective layer 22 on the y-connecting portion 15b.

  Next, the shape of the static elimination pattern 23 will be described in more detail. As described above, the static elimination pattern 23 extends at least partially to the outer edge of the substrate 11. Specifically, the tapered region 24 of the static elimination pattern 23 extends from the outer edge of the substrate 11 to the protective layer 22. For this reason, the static elimination pattern 23 can be easily connected to an appropriate conductor provided outside the color filter integrated touch panel sensor 20. For example, as will be described later, in the process of forming the color filter unit 30, each static elimination pattern 23 can be connected to an outer frame static elimination pattern 74 (described later).

  Next, the operation of the present embodiment having such a configuration will be described. Here, a manufacturing method of the color filter integrated touch panel sensor 20 and the display device 60 will be described.

Manufacturing Method of Color Filter Integrated Touch Panel Sensor Here, a method of manufacturing a multi-sided work substrate to which a plurality of color filter integrated touch panel sensors are assigned will be described.

  First, a work substrate 70 to which a plurality of color filter integrated touch panel sensors 20 are assigned is prepared. The work substrate 70 has one surface 70a and another surface 70b. Further, one surface 70 a and the other surface 70 b of the work substrate 70 are partitioned into a plurality of chip portions 71 on which the color filter integrated touch panel sensor 20 is formed, and an outer frame portion 72 surrounding each chip portion 71. 4A to 7B to be described later, a portion surrounded by a dotted line is a chip portion 71.

As will be described later, in the method for manufacturing a multi-sided work substrate, first, the touch panel sensor unit 10 is formed on each chip portion 71 on one surface 70a of the work substrate 70, and then each of the other surfaces 70b on the work substrate 70 is formed. The color filter unit 30 is formed on the chip unit 71. Then, the color filter integrated touch panel sensor 20 is obtained by cutting out each chip portion 71 as necessary. In this case, the cut work substrate 70 becomes the substrate 11 of the color filter integrated touch panel sensor 20. Further, one surface 70 a of the work substrate 70 corresponds to one surface 11 a of the substrate 11, and the other surface 70 b of the work substrate 70 corresponds to the other surface 11 b of the substrate 11.
In addition, before cutting out each chip | tip part 71 from the multi-sided work board | substrate 70, the multi-sided work board | substrate 70 and the TFT substrate 50 may be bonded together and a liquid crystal cell may be assembled. In this case, individual liquid crystal cells are cut out from the assembly in which the multi-sided work substrate 70 and the TFT substrate 50 are bonded together.

(Manufacturing method of touch panel sensor part)
Hereinafter, a method of forming the touch panel sensor unit 10 on the one surface 70a of the work substrate 70 will be described with reference to FIGS. 4A to 7B.

[Formation process of x electrode unit, x connection part and y electrode unit]
First, a process of forming the x electrode unit 13a, the x connection part 13b, and the y electrode unit 15a on each chip part 71 on the one surface 70a of the work substrate 70 will be described with reference to FIGS. 4A to 4C. 4A is a plan view showing one surface 70a of the work board 70, FIG. 4B is an enlarged view showing the chip portion 71 of the work board 70 shown in FIG. 4A, and FIG. 4C is the work board of FIG. 4B. It is the longitudinal cross-sectional view which looked at 70 from the IVC-IVC direction.

  First, a transparent electrode material such as ITO is provided on one surface 70a of the work substrate 70. A method for providing the transparent electrode material is not particularly limited, and a method such as sputtering is appropriately used.

  Next, as shown in FIGS. 4A to 4C, the transparent electrode material provided on the one surface 70a of the work substrate 70 is patterned, and the x electrode units 13a, 13a, The x connection portion 13b and the y electrode unit 15a are formed. At the same time, as shown in FIGS. 4A to 4C, the transparent electrode material layer 27 made of a transparent electrode material is formed on the portion of the chip portion 71 where the static elimination pattern 23 will be provided later and on the outer frame portion 72.

  The method for patterning the transparent electrode material is not particularly limited, and various known patterning methods can be used. For example, a photolithography method can be used.

[Insulating layer formation process]
Next, the process of forming the insulating layer 18 will be described with reference to FIGS. 5A and 5B. 5A is an enlarged view of the chip portion 71 of the work substrate 70, and FIG. 5B is a longitudinal sectional view of the work substrate 70 of FIG. 5A viewed from the VB-VB direction.

  First, a material for forming the insulating layer 18, for example, an acrylic resin is provided on the one surface 70 a of the work substrate 70, and then the provided material is patterned. As a result, as shown in FIGS. 5A and 5B, the insulating layer 18 is formed on the x connection portion 13b. At the same time, as shown in FIGS. 5A and 5B, a tip insulating layer made of the same material as that of the insulating layer 18 is formed on a portion of the chip portion 71 that will later become the tip 24a of the tapered region 24 of the static elimination pattern 23. 28 is formed.

[Process for forming conductive pattern, terminal portion and y connection portion]
Next, a process of forming the x conductive pattern 14, the y conductive pattern 16, the terminal portion 17, and the y connection portion 15b on each chip portion 71 on the one surface 70a of the work substrate 70 will be described with reference to FIGS. 6A to 6C. To do. 6A is a plan view showing one surface 70a of the work substrate 70, FIG. 6B is an enlarged view of the chip portion 71 of the work substrate 70 shown in FIG. 6A, and FIG. 6C is the work substrate of FIG. 6B. It is the longitudinal cross-sectional view which looked at 70 from the VIC-VIC direction.

  First, a conductive material, for example, a metal material such as aluminum is provided on one surface 70a of the work substrate 70. The method for providing the conductive material is not particularly limited, and for example, a method such as sputtering is appropriately used.

Next, as shown in FIGS. 6A to 6C, the conductive material provided on the one surface 70a of the work substrate 70 is patterned, and the x conductive patterns 14, The y conductive pattern 16, the terminal part 17, and the y connection part 15b are formed. At the same time, as shown in FIGS. 6A to 6C, the conductive material layer 29 made of a conductive material is formed on the portion of the chip portion 71 where the static elimination pattern 23 will be provided later and on the outer frame portion 72.
Thereby, as shown in FIG. 6B and FIG. 6C, the static elimination pattern 23 including the transparent electrode material layer 27 and the conductive material layer 29 is formed on each chip portion 71 on the one surface 70 a of the work substrate 70. As shown in FIG. 6B, the static elimination pattern 23 includes a tapered region 24 that reaches the outer edge of the chip portion 71 and tapers toward the inside of the chip portion 71. Further, the tip 24 a of the tapered region 24 includes a tip insulating layer 28 in addition to the transparent electrode material layer 27 and the conductive material layer 29 as shown in FIG. 6C. For this reason, the front-end | tip part 24a protrudes upwards with respect to another part among the taper area | regions 24. FIG.
Also, as shown in FIGS. 6A to 6C, an outer frame static elimination pattern 74 including the transparent electrode material layer 27 and the conductive material layer 29 is formed on the outer frame portion 72 on the one surface 70 a of the work substrate 70. The outer frame static elimination pattern 74 is preferably formed as a pattern having as large an area as possible. Further, the outer frame static elimination pattern 74 is connected to the static elimination pattern 23 of each chip portion 71 as shown in FIGS. 6B and 6C. Each static elimination pattern 23 and outer frame static elimination pattern 74 function as a static elimination unit 73 that reduces the amount of charge on the one surface 70a side of the work substrate 70, as will be described later.

[Protective layer formation process]
Next, the process of forming the protective layer 22 will be described with reference to FIGS. 7A and 7B. 7A is an enlarged view of the chip portion 71 of the work substrate 70, and FIG. 7B is a longitudinal sectional view of the work substrate 70 of FIG. 7A as viewed from the VIIB-VIIB direction.

  First, a material for forming the protective layer 22, for example, an acrylic resin is provided on the one surface 70a of the work substrate 70, and then the provided material is patterned. As a result, as shown in FIGS. 7A and 7B, a protective layer 22 that covers the electrode patterns 13 and 15 and the conductive patterns 14 and 16 is formed. At this time, the patterning is performed such that the protective layer 22 covers at least the tip 24 a of the tapered region 24 in the static elimination pattern 23. In this way, the touch panel sensor unit 10 is formed on each chip unit 71 on the one surface 70a of the work substrate 70.

  Incidentally, as shown in FIGS. 7A and 7B, in the present embodiment, the protective layer 22 is provided only in each chip portion 71. That is, the protective layer 22 is not provided on the outer frame portion 72. The outer frame portion 72 is formed with a conductive outer frame charge removal pattern 74. For this reason, the area of the protective layer 22 on the one surface 70a of the work substrate 70 is smaller than when the protective layer is provided over the entire surface 70a of the work substrate 70. Thereby, the charge amount of the protective layer 22 can be reduced in the formation process of the color filter portion 30 described later.

  The specific method for patterning the protective layer 22 is not particularly limited, and various patterning methods are used as appropriate. For example, when a photocurable acrylic resin is used as the material constituting the protective layer 22 as described above, a photolithography method is used as the patterning method.

(Manufacturing method of color filter part)
Next, a method for forming the color filter portion 30 on the other surface 70b of the work substrate 70 will be described with reference to FIG. FIG. 8 is a diagram illustrating an apparatus used in a process performed when the color filter unit 30 is formed. This apparatus includes a coating unit 81, a drying unit 82, a pre-baking unit 83, an exposure / development unit 84, and a draining unit 85.

  As shown in FIG. 8, first, the work substrate 70 is turned upside down so that one surface 70a on which the plurality of touch panel sensor units 10 are formed faces downward. Next, as shown in FIG. 8, a coating liquid containing a material constituting the black matrix layer 31 is applied to the chip portion 71 on the other surface 70 b of the work substrate 70 by the application unit 81. At this time, as shown in FIG. 8, the work substrate 70 is sucked and supported by the support base 86 with the one surface 70 a on which the touch panel sensor unit 10 is formed facing downward.

  Next, as shown in FIG. 8, in the drying means 82, the solvent contained in the coating liquid is removed by drying under reduced pressure. As a means for conveying the work substrate 70 from the coating means 81 to the drying means 82, for example, a rotating conveyance roller 87 is used as shown in FIG. In this case, the work substrate 70 is transported by the transport roller 87 while the touch panel sensor unit 10 formed on the one surface 70 a of the work substrate 70 is in contact with the transport roller 87.

  Thereafter, as shown in FIG. 8, in the pre-baking means 83, the material for the black matrix layer 31 formed on the other surface 70b is heated by using, for example, a hot plate. Thereby, the material for the black matrix layer 31 formed on the other surface 70b is dried. Next, in the exposure / development means 84, the material for the black matrix layer 31 formed on the other surface 70b is patterned. As a result, the black matrix layer 31 having a predetermined pattern as shown in FIG. 3B is formed on the other surface 70b. Thereafter, in the draining means 85, the liquid remaining on the black matrix layer 31 is removed by an air knife.

  Next, a colored layer 32 is formed between the black matrix layers 31. In this way, the color filter portion 30 is formed on each chip portion 71 on the other surface 70b of the work substrate 70. As a result, the color filter integrated touch panel sensor 20 is formed on each chip 71 of the work substrate 70. In addition, the process performed when forming the colored layer 32 is substantially the same as the process performed when forming the above-described black matrix layer 31 except that the material used is different. Therefore, detailed description of the process of forming the colored layer 32 is omitted.

(Function and effect when peeling)
By the way, in the coating means 81 and the like, the work substrate 70 is supported by a support base 86 having a plurality of suction holes 88 as shown in FIG. Here, FIG. 9B is a diagram showing a state in which the work substrate 70 is about to be peeled off from the support base 86. In this case, it is conceivable that the protective layer 22 of the touch panel sensor unit 10 is charged due to peeling charging at the time of peeling. Here, according to the present embodiment, as described above, the static elimination pattern 23 connected to the protective layer 22 and the outer frame static elimination pattern 74 connected to the static elimination pattern 23 are provided on the one surface 70a of the work substrate 70. Is provided. For this reason, the static electricity stored in the protective layer 22 can be accepted by the static elimination pattern 23 and the outer frame static elimination pattern 74. As a result, the amount of charge in the protective layer 22 can be reduced, which can prevent static discharge. Thereby, when the work substrate 70 is peeled off from the support base 86, it is possible to prevent the touch panel sensor unit 10 from being damaged by electrostatic discharge.

  Further, according to the present embodiment, as described above, the static elimination pattern 23 includes the tapered region 24 that tapers inward, and the distal end portion 24 a of the tapered region 24 is covered with the protective layer 22. . For this reason, the taper area | region 24 can be functioned as what is called a lightning rod. Accordingly, the charges of the protective layer 22 are likely to collect at the tip 24 a of the tapered region 24. Thereby, the charge amount in the protective layer 22 can be reduced more reliably.

  Further, according to the present embodiment, the distal end portion 24a of the tapered region 24 of the static elimination pattern 23 protrudes upward with respect to the other portions. As a result, the function of the tapered region 24 as a lightning rod is further enhanced. Therefore, the charge of the protective layer 22 is easily collected by the tip end portion 24a of the tapered region 24, and this makes it possible to more reliably reduce the charge amount in the protective layer 22.

  Further, even if a discharge occurs between the work substrate 70 and the support base 86, it is considered that the discharge occurs at a location having a larger area and a lower electric resistance. That is, it is considered that a discharge occurs in the outer frame static elimination pattern 74 that is provided in a pattern having a large area on the outer frame portion 72 of the work substrate 70 and is not covered by the protective layer 22. For this reason, even if discharge occurs, it is considered that damage due to discharge is likely to occur not in the touch panel sensor unit 10 but in the outer frame charge removal pattern 74. That is, by providing the outer frame static elimination pattern 74, it is possible to prevent the touch panel sensor unit 10 from being damaged.

Moreover, even if a discharge occurs in the protective layer 22 of the touch panel sensor unit 10, it is considered that the discharge occurs through a path having a lower electrical resistance. Here, according to the present embodiment, as described above, the thickness t ₁ of the protective layer 22 on the tip 24 a of the tapered region 24 of the static elimination pattern 23 is set on the electrode patterns 13 and 15 and the conductive patterns 14 and 16. and it has a thickness t ₂ of the protective layer 22 below. That is, in the thickness direction of the protective layer 22, the electrical resistance of the protective layer 22 on the tip 24 a of the tapered region 24 is smaller than the electrical resistance of the protective layer 22 on the polar patterns 13 and 15 and the conductive patterns 14 and 16. It has become. For this reason, even if discharge occurs, it is considered that the discharge path is not a path that passes through the electrode patterns 13 and 15 or the conductive patterns 14 and 16 but a path that passes through the tip 24a of the tapered region 24 of the static elimination pattern 23. It is done. For this reason, even if a discharge occurs in the protective layer 22, it is considered that damage due to the discharge is likely to occur not in the electrode patterns 13, 15 or the conductive patterns 14, 16 but in the charge removal pattern 23. That is, by providing the static elimination pattern 23, it is possible to prevent the touch panel sensor unit 10 from being damaged.

When the work substrate 70 is peeled from the support base 86, generally, the entire work substrate 70 is not peeled from the support base 86 at the same time, but a part of the work substrate 70 is peeled off before other portions. For example, the end portion of the work substrate 70 (one end portion and the other end portion on the opposite side of the one end portion) is peeled off before the center portion of the work substrate 70. Alternatively, one end portion of the work substrate 70 is first peeled off, then the central portion of the work substrate 70 is peeled off, and finally the other end portion of the work substrate is peeled off. In this way, peeling each part of the work substrate 70 with a time difference is performed for the purpose of reducing peeling charging.
Here, as shown in FIG. 9B, consider the case where the vicinity of the outer edge of the work substrate 70 is in contact with the support base 86 to the end. At this time, if static discharge occurs, it is considered that this discharge occurs near the outer edge of each touch panel sensor unit 10. Here, according to the present embodiment, as described above, the static elimination pattern 23 is provided in a region closer to the outer edge of the touch panel sensor unit 10 than the electrode patterns 13 and 15 and the conductive patterns 14 and 16. For this reason, even if static electricity discharge occurs, it is considered that damage due to the discharge is likely to occur not in the electrode patterns 13 and 15 or the conductive patterns 14 and 16 but in the charge removal pattern 23. That is, according to the present embodiment, by peeling each part of the work substrate 70 with a time difference, not only the peeling charge can be reduced, but also damage due to discharge can easily occur in the static elimination pattern 23. This can more reliably prevent the electrode patterns 13 and 15 and the conductive patterns 14 and 16 from being damaged.

  Preferably, when the work substrate 70 is peeled from the support base 86, the outer frame static elimination pattern 74 on one surface 70a of the work substrate 70 is grounded by an appropriate means or connected to an appropriate external conductor. As a result, the charge of the static elimination pattern 23 and the outer frame static elimination pattern 74 can be released to the outside, and thereby, the static electricity stored in the protective layer 22 is further accepted by the static elimination pattern 23 and the outer frame static elimination pattern 74. Is possible. As a result, the amount of charge in the protective layer 22 can be further reduced, which can more reliably prevent the occurrence of static electricity discharge.

  Specific means for releasing the charges of the static elimination pattern 23 and the outer frame static elimination pattern 74 to the outside are not particularly limited, and various means can be used. For example, consider a case where lift pins (not shown) that protrude upward from the support base 86 and lift the work board 70 on the support base 86 are used as means for separating the work board 70 from the support base 86. In this case, the lift pin is formed using a conductive material, the lift pin is grounded, and the lift pin is brought into contact with the charge removal pattern 23 or the outer frame charge removal pattern 74, thereby removing the charge removal pattern 23 and the outer frame charge removal pattern. 74 charges can be released to the outside. Further, by configuring the support base 86 itself with a conductive material and grounding the support base 86, the charges of the static elimination pattern 23 and the outer frame static elimination pattern 74 can be released to the outside.

(Effects during transport)
Further, when the work substrate 70 is transported by the rotating transport roller 87, it is conceivable that the protective layer 22 of the touch panel sensor unit 10 is charged due to the transport roller 87. For example, it is conceivable that the transport roller 87 is charged when the transport roller 87 idles and this electricity is conducted to the protective layer 22 of the touch panel sensor unit 10. Also in this case, the static electricity stored in the protective layer 22 can be accepted by the static elimination pattern 23 and the outer frame static elimination pattern 74 as in the case of the above-described peeling charging. As a result, the amount of charge in the protective layer 22 can be reduced, which can prevent static discharge.

  Further, even if a discharge occurs between the work substrate 70 and the transport roller 87, it is considered that the discharge is likely to occur in the outer frame charge removal pattern 74 or the charge removal pattern 23 as in the case of the above-described peeling charging. That is, by providing the outer frame static elimination pattern 74 and the static elimination pattern 23, it is possible to prevent the touch panel sensor unit 10 from being damaged.

  Preferably, when the work substrate 70 is transported by the transport roller 87, the outer frame static elimination pattern 74 on the one surface 70a of the work substrate 70 is grounded by an appropriate means or connected to an appropriate external conductor. As a result, the charge of the static elimination pattern 23 and the outer frame static elimination pattern 74 can be released to the outside, and thereby, the static electricity stored in the protective layer 22 is further accepted by the static elimination pattern 23 and the outer frame static elimination pattern 74. Is possible. As a result, the amount of charge in the protective layer 22 can be further reduced, which can more reliably prevent the occurrence of static electricity discharge.

(Effects when draining liquid)
Further, when removing the liquid on the work substrate 70 using the air knife in the draining means 85, it is conceivable that the protective layer 22 of the touch panel sensor unit 10 is charged by frictional charging with the atmosphere by the air knife. Also in this case, the static electricity stored in the protective layer 22 can be accepted by the static elimination pattern 23 and the outer frame static elimination pattern 74 as in the case of the above-described peeling charging. As a result, the amount of charge in the protective layer 22 can be reduced, which can prevent static discharge.

  Further, even if discharge occurs due to frictional charging, it is considered that the discharge is likely to occur in the outer frame charge removal pattern 74 or the charge removal pattern 23 as in the case of the above-described peeling charge. That is, by providing the outer frame static elimination pattern 74 and the static elimination pattern 23, it is possible to prevent the touch panel sensor unit 10 from being damaged.

(Other effects)
It is also conceivable that the protective layer 22 is already charged in the process of forming the touch panel sensor unit 10, not during the process of forming the color filter unit 30. For example, when the protective layer 22 of the touch panel sensor unit 10 is made of a photocurable acrylic resin, polarization may occur on the surface and inside of the protective layer 22 due to the molecules being excited by light during the photocuring process. Conceivable. Here, according to the present embodiment, as described above, the static elimination pattern 23 and the outer frame static elimination pattern 74 connected to the static elimination pattern 23 are provided on the one surface 70 a of the work substrate 70. Among these, the static elimination pattern 23 includes a tapered region 24 that tapers inward, and the tip 24 a of the tapered region 24 is covered with a protective layer 22. For this reason, the charge inside the protective layer 22 can be collected at the tip 24 a of the tapered region 24 of the static elimination pattern 23 and escaped to the outer frame static elimination pattern 74. As a result, the amount of charge in the protective layer 22 can be reduced, which can prevent discharge from occurring. Thereby, even if polarization occurs on the surface and inside of the protective layer 22 due to the formation process of the touch panel sensor unit 10, it is possible to prevent the touch panel sensor unit 10 from being damaged by discharge.

Manufacturing Method of Display Device Next, the color filter integrated touch panel sensors 20 are taken out one by one from the multi-sided work substrate 70 to which the plurality of color filter integrated touch panel sensors 20 are assigned. The specific method in this case is not particularly limited, and the color filter integrated touch panel sensor 20 is taken out by cutting, for example. Here, preferably, the protective layer 22 is provided only in the chip portion 71 on the one surface 70 a of the work substrate 70. For this reason, the protective layer 22 is not cut when the work substrate 70 is cut. That is, an excessive force is not applied to the protective layer 22 at the time of cutting. Accordingly, it is possible to prevent the protective layer 22 from being peeled off from the one surface 70a of the work substrate 70 at the time of cutting.

  The taken out color filter integrated touch panel sensor 20 is combined with the liquid crystal 40 and the TFT substrate 50 as shown in FIGS. Further, as necessary, a protective cover (not shown) is provided on the touch panel sensor unit 10 via a transparent adhesive or the like. In this way, the display device 60 with a touch panel function is manufactured.

  According to the present embodiment, as described above, the touch panel sensor unit 10 and the conductive charge removal pattern 23 are provided on the one surface 11 a of the substrate 11 of the color filter integrated touch panel sensor 20. The static elimination pattern 23 reaches the outer edge of the substrate 11 at least partially, and does not contact any of the electrode patterns 13 and 15, the terminal portion 17, and the conductive patterns 14 and 16 of the touch panel sensor unit 10. In addition, the static elimination pattern 23 includes a tapered region 24 that tapers inward, and a tip portion 24 a of the tapered region 24 is covered with a protective layer 22. For this reason, even when the protective layer 22 is charged by static electricity, the charge of the protective layer 22 can be released to the charge removal pattern 23. In addition, by forming the static elimination pattern 23 using the tapered region 24 that tapers inward, the charges of the protective layer 22 are easily collected at the tip 24 a of the tapered region 24. For this reason, the electric charge of the protective layer 22 can be more reliably released to the static elimination pattern 23, and thereby, it is possible to suppress an increase in the charge amount of the protective layer 22. As a result, it is possible to prevent the occurrence of static electricity discharge, thereby preventing the electrode patterns 13 and 15, the terminal portion 17, and the conductive patterns 14 and 16 from being damaged. Even if a discharge occurs, by providing the charge removal pattern 23, the place where the discharge occurs can be the charge removal pattern 23 instead of the touch panel sensor unit 10. This can prevent the touch panel sensor unit 10 from being damaged.

  In addition, according to the present embodiment, when manufacturing the multi-sided work substrate 70 to which the plurality of color filter integrated touch panel sensors 20 are assigned, the outer frame portion 72 on the one surface 70 a of the work substrate 70 is applied to the static elimination pattern 23. A connected outer frame neutralization pattern 74 is provided. For this reason, the charge of the protective layer 22 can be accepted by the outer frame charge removal pattern 74 via the charge removal pattern 23, thereby suppressing an increase in the charge amount of the protection layer 22. As a result, it is possible to prevent the occurrence of static electricity discharge, thereby preventing the electrode patterns 13 and 15, the terminal portion 17, and the conductive patterns 14 and 16 from being damaged.

  Further, according to the present embodiment, the static elimination pattern 23 and the outer frame static elimination pattern 74 are formed simultaneously with the x electrode unit 13a, the y electrode unit 15a, and the x connection portion 15b when patterning the transparent electrode material. The layer 27 and the conductive material layer 29 formed on the transparent electrode material layer 27 at the same time as the y-connecting portion 15b when the conductive material is patterned are included. For this reason, the static elimination part 73 which consists of the static elimination pattern 23 and the outer frame static elimination pattern 74 can be formed by the same man-hour as the man-hour when forming only the touch panel sensor part 10 in the work substrate 70. Thus, the color filter integrated touch panel sensor 20 including the charge eliminating unit 73 can be easily manufactured.

  Further, according to the present embodiment, the tip 24 a of the tapered region 24 of the static elimination pattern 23 is interposed between the transparent electrode material layer 27 and the conductive material layer 29 and is the same as the insulating layer 18 simultaneously with the insulating layer 18. It further includes a tip insulating layer 28 formed of the above material. For this reason, the static elimination pattern 23 which consists of the taper area | region 24 containing the front-end | tip part 24a protruded upwards can be formed with the same man-hour as the man-hour when forming only the touch panel sensor part 10 in the work board | substrate 70. FIG. Thereby, the color filter integrated touch panel sensor 20 including the static eliminating portion 73 whose function as a lightning rod is further enhanced can be easily manufactured.

Variations of the shape of the charge removal pattern The specific shape and number of the charge removal patterns 23 are not particularly limited, and a desired number of charge removal patterns 23 having various shapes can be provided. For example, as shown in FIG. 10, each static elimination pattern 23 may include a plurality of tapered regions 24 that taper inward. As a result, it is possible to increase the number of parts that function as a lightning rod, and thereby it is possible to more reliably collect the charge of the protective layer 22 in the static elimination pattern 23.

In the modification example of the layer configuration of the static elimination pattern and the formation process of the touch panel sensor unit 10 according to the present embodiment, the x electrode unit 13a, the x connection unit 13b, and the y electrode unit 15a are formed first, and then on the x connection unit 13b. The example in which the insulating layer 18 is formed and the y connection portion 15b is formed thereafter is shown. However, the present invention is not limited to this. As shown in FIG. 11A, the y connection portion 15b is formed first, and then the insulating layer 18 is formed on the y connection portion 15b, and then the x electrode units 13a and x connection are formed. The portion 13b and the y electrode unit 15a may be formed.

  Specifically, first, a conductive material is provided on one surface 70 a of the work substrate 70. Next, the y connection portion 15b is formed by patterning the provided conductive material. Thereafter, the insulating layer 18 is formed on the y connection portion 15b. Next, a transparent electrode material is provided on one surface 70 a of the work substrate 70. Then, the x electrode unit 13a, the x connection part 13b, and the y electrode unit 15a are formed by patterning the provided transparent electrode material. Thereby, the touch panel sensor unit 10 is formed.

  In this case, as shown in FIG. 11A, the outer frame static elimination pattern 74 and the static elimination pattern 23 are formed by patterning the conductive material layer 29 formed simultaneously with the y connection portion 15b when patterning the conductive material, and the transparent electrode material. In this case, the transparent electrode material layer 27 formed on the conductive material layer 29 at the same time as the x electrode unit 13a, the x connection portion 13b, and the y electrode unit 15a is included. As shown in FIG. 11A, the tip 24a of the tapered region 24 of the static elimination pattern 23 is interposed between the transparent electrode material layer 27 and the conductive material layer 29, and is the same as the insulating layer 18 simultaneously with the insulating layer 18. It further includes a tip insulating layer 28 made of a material.

Other variations of the layer structure of the static elimination pattern and in the present embodiment, the distal end portion 24a of the tapered region 24 of the static elimination pattern 23 is interposed between the transparent electrode material layer 27 and the conductive material layer 29. An example including the insulating layer 28 is shown. However, the present invention is not limited to this, and as shown in FIG. 11B, the tip end portion 24 a of the tapered region 24 may be composed of only the transparent electrode material layer 27 and the conductive material layer 29. That is, the tip 24a of the tapered region 24 may not protrude upward with respect to other portions.
Further, in the present embodiment, an example in which the outer frame static elimination pattern 74 and the static elimination pattern 23 include both the transparent electrode material layer 27 and the conductive material layer 29 has been shown. However, the present invention is not limited to this, and the outer frame static elimination pattern 74 and the static elimination pattern 23 may be formed of only one of the transparent electrode material layer 27 and the conductive material layer 29. Alternatively, the outer frame static elimination pattern 74 and the static elimination pattern 23 may be formed of another conductive material different from the transparent electrode material layer 27 or the conductive material layer 29.
Even in these cases, the tapered region 24 that tapers inward can function as a so-called lightning rod, and for this reason, the charge of the protective layer 22 can be collected at the tip 24 a of the tapered region 24. .

The modification example of the manufacturing method of the color filter integrated touch panel sensor and the present embodiment show an example in which the photolithography method is used as a patterning method when forming the protective layer 22. In this case, patterning of the protective layer 22 may be implemented as a thickness t ₁ of the protective layer 22 on the front end portion 24a of the tapered region 24 is smaller than the thickness t ₂ of the protective layer 22 on the y-connecting portion 15b.
For example, when a negative photosensitive resin material is used as the material of the protective layer 22, the transmittance at the portion corresponding to the tip portion 24a of the tapered region 24 is smaller than the transmittance at the portion corresponding to the y connection portion 15b. The protective layer 22 may be patterned by a photolithography method using a halftone mask. In this case, the intensity of the exposure light applied to the portion corresponding to the tip 24a of the tapered region 24 is smaller than the intensity of the exposure light applied to the portion corresponding to the y connection portion 15b. Therefore, the thickness _{t 1} of the protective layer 22 formed on the distal end portion 24a of the tapered region 24 is smaller than the thickness _{t 2} of the protective layer 22 formed on the y connection portion 15b. Thereby, as described above, the tendency that the discharge path is not the path passing through the y connection portion 15b but the path passing through the static elimination pattern 23 can be further strengthened.
Alternatively, when a positive photosensitive resin material is used as the material of the protective layer 22, the transmittance at the portion corresponding to the tip portion 24a of the tapered region 24 is larger than the transmittance at the portion corresponding to the y connection portion 15b. The protective layer 22 may be patterned by a photolithography method using a halftone mask. In this case, the intensity of the exposure light applied to the portion corresponding to the tip portion 24a of the tapered region 24 is greater than the intensity of the exposure light applied to the portion corresponding to the y connection portion 15b. Therefore, the thickness _{t 1} of the protective layer 22 formed on the distal end portion 24a of the tapered region 24 is smaller than the thickness _{t 2} of the protective layer 22 formed on the y connection portion 15b. Thereby, as described above, the tendency that the discharge path is not the path passing through the y connection portion 15b but the path passing through the static elimination pattern 23 can be further strengthened.

  Note that a normal photomask includes a photomask transparent base material and a light shielding member such as a metal thin film provided in a predetermined pattern on the photomask transparent base material. The normal photomask is a two-tone photomask having a transmission part (a part where the photomask transparent substrate is exposed) and a light shielding part (a part where the light shielding member is formed). On the other hand, the above-described halftone mask has an intermediate transmittance portion having a transmittance intermediate between the transmission portion and the light shielding portion in addition to the transmission portion and the light shielding portion. Therefore, the halftone mask is a photomask having three or more gradations. The intermediate transmittance portion is formed of a semi-permeable thin film or the like.

In another modification of the method for manufacturing the color filter integrated touch panel sensor or the above-described modification of the method for manufacturing the color filter integrated touch panel sensor, the thickness t _{1 of the} protective layer 22 formed on the tip portion 24a of the tapered region 24. the order smaller than the thickness t ₂ of the protective layer 22 formed on the y connection portion 15b, patterning the protective layer 22 is an example carried out by photolithography using a halftone mask. However, the method for less than the thickness t ₂ of the protective layer 22 formed of the thickness t ₁ of the protective layer 22 formed on the distal end portion 24a of the tapered region 24 on the y-connecting portion 15b is limited to There is no. For example, by patterning the insulating layer 18 and the tip insulating layer 28 by photolithography using a halftone mask, the thickness t ₁ of the protective layer 22 formed on the tip 24a of the tapered region 24 is reduced. it can be made smaller than the thickness t ₂ of the protective layer 22 formed on the y connection portion 15b. Hereinafter, the case where the insulating layer 18 and the tip insulating layer 28 are patterned by a photolithography method using a halftone mask will be described with reference to FIG. 11C. In FIG. 11C, the shape of the protective layer 22 is represented in consideration of the leveling effect of the protective layer 22 itself when the protective layer 22 is applied.

For example, when a negative photosensitive resin material is used as the material of the insulating layer 18 and the tip insulating layer 28, the transmittance at the portion corresponding to the tip 24a of the tapered region 24 is the transmittance at the portion corresponding to the y connection portion 15b. Patterning of the insulating layer 18 and the tip insulating layer 28 may be performed by a photolithography method using a halftone mask that is larger than the ratio. In this case, the intensity of the exposure light applied to the portion corresponding to the tip portion 24a of the tapered region 24 is greater than the intensity of the exposure light applied to the portion corresponding to the y connection portion 15b. Therefore, as shown in FIG. 11C, the thickness t ₃ of the tip portion for the insulating layer 28 formed on the distal end portion 24a of the tapered region 24, than the thickness t ₄ of the insulating layer 18 formed on the y connection part 15b growing. Thereafter, the conductive material layer 29 and the y-connecting portion 15b are provided on the tip insulating layer 28 and the insulating layer 18, and the protective layer 22 is further provided. In this case, the distance from the one surface 11a of the substrate 11 to the surface (one side surface) of the conductive material layer 29 is larger than the distance from the one surface 11a of the substrate 11 to the surface (one side surface) of the y connection portion 15b. It is getting bigger. Therefore, due to the leveling effect of the protective layer 22 itself, as shown in FIG. 11C, the thickness t _{1 of the} protective layer 22 formed on the conductive material layer 29, that is, the tip 24a of the tapered region 24 is smaller than the thickness _{t 2} of the protective layer 22 formed on the part 15b. As a result, the tendency that the discharge path is not the path passing through the y connection portion 15b but the path passing through the static elimination pattern 23 can be further strengthened.
In addition, as shown in FIG. 11C, with regard distance from one surface 11a of the substrate 11 to the surface (surface of one side) of the protective layer 22, towards the distance _{t 5} at the distal end 24a of the tapered region 24, y connecting portion 15b It is larger than the distance t ₆ in. For this reason, the protective layer 22 on the front-end | tip part 24a of the taper area | region 24 protrudes compared with the protective layer 22 in another position. For this reason, when the work substrate 70 is peeled from the support base 86 as described above in the manufacturing process of the color filter section 30, the protective layer 22 on the tip 24a of the tapered region 24 is finally separated from the support base 86. Become. Thus, even if discharge occurs during peeling, the discharge path is a path that passes through the static elimination pattern 23. This can prevent the touch panel sensor unit 10 from being damaged.

Alternatively, when a positive photosensitive resin material is used as the material of the insulating layer 18 and the tip insulating layer 28, the transmittance at the portion corresponding to the tip 24a of the tapered region 24 is the transmittance at the portion corresponding to the y connection portion 15b. The insulating layer 18 and the tip insulating layer 28 may be patterned by a photolithography method using a halftone mask that is smaller than the ratio. In this case, the intensity of the exposure light applied to the portion corresponding to the tip 24a of the tapered region 24 is smaller than the intensity of the exposure light applied to the portion corresponding to the y connection portion 15b. Therefore, as shown in FIG. 11C, the thickness t ₃ of the tip portion for the insulating layer 28 formed on the distal end portion 24a of the tapered region 24, than the thickness t ₄ of the insulating layer 18 formed on the y connection part 15b growing. Thereby, due to the leveling effect of the protective layer 22 itself, the thickness t ₁ of the protective layer 22 formed on the distal end portion 24a of the tapered region 24 is made larger than the thickness t _{2 of the} protective layer 22 formed on the y connection portion 15b. Can be small. As a result, the tendency that the discharge path is not the path passing through the y connection portion 15b but the path passing through the static elimination pattern 23 can be further strengthened.

Also in this modification, patterning of the protective layer 22 may be performed by a photolithography method using a halftone mask, as in the case of the modification of the method for manufacturing the color filter integrated touch panel sensor described above. This can the thickness t ₁ of the protective layer 22 formed on the distal end portion 24a of the tapered region 24, even smaller than the thickness t ₂ of the protective layer 22 formed on the y connection portion 15b. As a result, it is possible to further strengthen the tendency that the discharge path is not the path passing through the y connection portion 15b but the path passing through the static elimination pattern 23.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. 12A and 12B. Here, FIG. 12A is a plan view showing the touch panel sensor unit formed on the work substrate in the second embodiment, and FIG. 12B is a view of the work substrate of FIG. 12A from the XIIB-XIIB direction. FIG.

  The second embodiment shown in FIGS. 12A and 12B is different only in that an antistatic film is provided on the protective layer of the touch panel sensor unit, and other configurations are shown in FIGS. 1 to 11B. This is substantially the same as the first embodiment. In the second embodiment shown in FIGS. 12A and 12B, the same parts as those in the first embodiment shown in FIGS. 1 to 11B are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 12A and 12B, the touch panel sensor unit 10 of the color filter integrated touch panel sensor 20 further includes a transparent antistatic film 22 a provided on the protective layer 22. The antistatic film 22a is formed as a solid layer covering the entire protective layer 22, for example, as shown in FIG. 12A. However, the shape of the antistatic film 22a is not limited to the shape shown in FIG. 12A. The antistatic film 22 a may be provided so as to overlap at least the tip 24 a of the tapered region 24 of the static elimination pattern 23 when viewed from the normal direction of the substrate 11.

  The surface resistance of the antistatic film 22 a is smaller than the surface resistance of the protective layer 22 and larger than the surface resistances of the electrode patterns 13 and 15 and the x conductive patterns 14 and 16. By providing such an antistatic film 22a, the horizontal direction of charges charged in the protective layer 22, that is, the surface of the protective layer 22, without disturbing the signals passing through the electrode patterns 13, 15 and the conductive patterns 14, 16 It is possible to promote movement in a direction parallel to. For example, the charge existing near the center of the surface of the protective layer 22 can be moved to the vicinity of the static elimination pattern 23 via the antistatic film 22a, and the charge can be released to the static elimination pattern 23. As a result, the amount of charge in the protective layer 22 can be reduced, which can prevent static discharge. Thereby, it is possible to prevent the touch panel sensor unit 10 from being damaged by electrostatic discharge.

The value of the surface resistance of each layer will be described more specifically. The surface resistance of the protective layer 22 is, for example, 10 ¹⁴ Ω / □ or more, and the surface resistances of the x electrode unit 13a, the x connection portion 13b, and the y electrode unit 15a are, for example, 10 ² Ω / □ or less. Yes. On the other hand, the surface resistance of the antistatic film 22a is in the range of, for example, 10 ⁵ to 10 ¹³ Ω / □. The thickness and material of the antistatic film 22a are appropriately selected so that the value of the surface resistance is within the above range. For example, an acrylic resin containing conductive fine particles of a metal, a metal oxide, or an organic compound can be used as the material of the antistatic film 22a.

  In the present embodiment, the specific layer configuration of the static elimination pattern 23 and the outer frame static elimination pattern 74 is not limited to the example shown in FIG. 12B, and is a modification of the first embodiment shown in FIG. 11A or FIG. 11B. As in the case of the example, the static elimination pattern 23 and the outer frame static elimination pattern 74 can be formed of various layers.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIGS. 13A and 13B. Here, FIG. 13A is a plan view showing the color filter integrated touch panel sensor according to the third embodiment, and FIG. 13B shows the color filter integrated touch panel sensor of FIG. 13A viewed from the XIIIB-XIIIB direction. It is a longitudinal cross-sectional view.

  The third embodiment shown in FIGS. 13A and 13B is different only in that the charge removal pattern of the touch panel sensor unit includes a linear region, and other configurations are the same as those in the first embodiment shown in FIGS. 1 to 11B. The form is substantially the same. In the third embodiment shown in FIGS. 13A and 13B, the same parts as those in the first embodiment shown in FIGS. 1 to 11B are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 13A and 13B, the static elimination pattern 23 further includes a linear region 25 in addition to the tapered region 24 that tapers inward. As shown in FIG. 13A, the linear region 25 reaches the outer edge of the substrate 11 over the entire region and extends in parallel to the outer edge of the substrate 11. In this case, as shown in FIG. 13A, each tapered region 24 protrudes from the linear region 25 so as to intersect the extending direction of the linear region 25. Here, “crossing the extending direction of the linear region 25” means that the extending direction of the linear region 25 and the protruding direction of the tapered region 24 are not parallel. For example, in the example shown in FIG. 13A, the extending direction of the linear region 25 and the protruding direction of the tapered region 24 are orthogonal to each other.

  Although not shown, in the manufacturing process of the color filter integrated touch panel sensor 20, the linear region 25 shown in FIG. 13A is connected to the outer frame neutralization pattern 74 formed on the outer frame portion 72 of the work substrate 70 over the entire area. Yes. For this reason, the electric charge charged in the protective layer 22 can be released to the outer frame neutralization pattern 74 side with a lower electric resistance. Thereby, it is possible to more reliably prevent the electrode patterns 13 and 15, the terminal portion 17, the conductive patterns 14 and 16, and the protective layer 22 from being damaged by electrostatic discharge.

In the present embodiment, the linear region 25 reaches the outer edge of the substrate 11 over the entire region. However, the present invention is not limited to this, and it is sufficient that the linear region 25 reaches the outer edge of the substrate 11 (the outer edge of the chip portion 71) at least partially.

  14A is a diagram showing the touch panel sensor unit 10, the static elimination pattern 23, and the outer frame static elimination pattern 74 formed on one surface 70a of the work substrate 70 in a modification of the present embodiment, and FIG. 14B is a diagram of FIG. 14A. It is the longitudinal cross-sectional view which looked at the work board | substrate 70 from the XIVB-XIVB direction. In the example shown in FIG. 14A and FIG. 14B, only the end of the linear region 25 of the static elimination pattern 23 reaches the outer edge of the rectangular substrate 11 (chip portion 71), and the outer frame static elimination pattern of the outer frame portion 72 74. As a result, the charge charged on the protective layer 22 can be released to the outer frame charge removal pattern 74 via the charge removal pattern 23. 14A and 14B, the static elimination pattern 23 further includes a tapered region 24 protruding outward from the linear region 25 in addition to the tapered region 24 protruding inward from the linear region 25. It is out. Each tapered region 24 is covered with a protective layer 22. As a result, it is possible to increase the number of parts that function as a lightning rod, and thereby it is possible to more reliably collect the charge of the protective layer 22 in the static elimination pattern 23. In addition, according to the present embodiment, the neutralization pattern 23 can have an effect of suppressing noise from being superimposed on the conductive patterns 14 and 16 by appropriately designing the pattern of the linear region 25. .

  In the present embodiment and the modification, the specific layer configuration of the static elimination pattern 23 and the outer frame static elimination pattern 74 is not limited to the example shown in FIG. 13B or FIG. 14B, and the first configuration shown in FIG. 11A or FIG. As in the case of the modification of the embodiment, the static elimination pattern 23 and the outer frame static elimination pattern 74 can be formed of various layers.

  Moreover, in this Embodiment and the modification, the example which the linear area | region 25 extended linearly was shown. However, the present invention is not limited to this, and the linear region 25 may include a portion extending in a curved shape.

Fourth Embodiment Next, a fourth embodiment of the present invention will be described with reference to FIGS. 15A and 15B. Here, FIG. 15A is a plan view showing the color filter integrated touch panel sensor according to the fourth embodiment, and FIG. 15B is a view of the color filter integrated touch panel sensor of FIG. 15A viewed from the XVB-XVB direction. It is a longitudinal cross-sectional view.

  The fourth embodiment shown in FIGS. 15A and 15B is different only in that the static elimination pattern of the touch panel sensor unit includes a narrow width region, and the other configurations are the first embodiment shown in FIGS. 1 to 11B. The form is substantially the same. In the fourth embodiment shown in FIGS. 15A and 15B, the same parts as those in the first embodiment shown in FIGS. 1 to 11B are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 15A, each static elimination pattern 23 at least partially reaches the outer edge of the substrate 11 (chip portion 71) and contacts any of the electrode patterns 13, 15, the terminal portion 17, and the conductive patterns 14, 16. It is provided not to. Each static elimination pattern 23 includes a narrow region 26 extending inward, and a tip end portion 26 a of the narrow region 26 is covered with a protective layer 22. Here, “extends inward” means that the narrow area 26 extends from the non-display area of the touch panel sensor unit 10 toward the display area.

  Here, the background of the present embodiment will be described. As a result of extensive research by the present inventors, in the manufacturing process of the color filter integrated touch panel sensor 20, the discharge caused by static electricity generated in the protective layer 22 of the touch panel sensor unit 10 is a pattern covered with the protective layer 22. Of these, it has been found that it tends to occur in narrower patterns. Here, in the touch panel sensor unit 10 of the conventional color filter integrated touch panel sensor 20, the narrowest pattern is, for example, a y connection unit 15b shown in FIGS. 15A and 15B.

  Various causes can be considered as the cause of the discharge caused by the static electricity generated in the protective layer 22 in a narrower pattern. For example, it is conceivable that the narrower the pattern width, the easier it is for the pattern to function as a lightning rod and collect charges.

Based on such a background, in the present embodiment, the narrow region 26 of the static elimination pattern 23 is formed as a pattern having the narrowest width. For example, the width _{w 1} of the reduced width region 26 of the neutralization pattern 23 is smaller than the width _{w 2} of the y connection portion 15b. Specifically, when the width _{w 2} of the y connection portion 15b is in the range from 10 to 20 [mu] m, the width _{w 1} of the reduced width region 26 is in the range of 5 to 20 [mu] m. As a result, even if static discharge of the protective layer 22 occurs, the place where the discharge occurs can be the static elimination pattern 23 instead of the touch panel sensor unit 10. This can prevent the touch panel sensor unit 10 from being damaged.

Modification of the shape of the charge removal pattern The specific shape of the charge removal pattern 23 is not particularly limited. In the present embodiment, each static elimination pattern 23 only needs to include at least one narrow region 26 that extends inward while at least partially reaching the outer edge of the substrate 11 (chip portion 71). Further, the number of static elimination patterns 23 provided is not particularly limited. For example, as shown in FIG. 16, each static elimination pattern 23 may be formed by joining a large number of narrow regions 26. As a result, it is possible to increase the number of parts that function as a lightning rod, and thereby it is possible to more reliably collect the charge of the protective layer 22 in the static elimination pattern 23.

  Further, in the present embodiment, an example in which the width of the narrow region 26 of the static elimination pattern 23 is smaller than the width of the y connection portion 15b is shown. However, the present invention is not limited to this, and the width of the narrow region 26 is appropriately set according to the configuration of the electrode patterns 13 and 15 or the conductive patterns 14 and 16. For example, as in the modification of the first embodiment shown in FIG. 11A, when the x connection portion 13b is disposed above the y connection portion 15b, the width of the narrow region 26 of the static elimination pattern 23 is y You may set so that it may become smaller than the width | variety of the connection part 15b.

DESCRIPTION OF SYMBOLS 10 Touch panel sensor part 11 Board | substrate 11a The one surface 11b of the board | substrate Other surfaces 13 x electrode pattern 13a x electrode unit 13b x connection part 14 x conductive pattern 15 y electrode pattern 15a y electrode unit 15b y connection part 16 y conductive pattern 17 Terminal part DESCRIPTION OF SYMBOLS 18 Insulating layer 20 Color filter integrated touch panel sensor 22 Protective layer 22a Antistatic film 23 Static elimination pattern 24 Tapered area | region 24a Tip part 25 Linear area | region 26 Narrow area | region 26a Tip part 27 Transparent electrode material layer 28 Tip insulating layer 29 Conductivity Material Layer 30 Color Filter Unit 31 Black Matrix Layer 32 Colored Layer 40 Liquid Crystal 41 Sealing Material 50 TFT Substrate 51 Substrate 52 Transparent Electrode Unit 53 Wiring Unit 60 Display Device 70 Work Substrate 70a One Side 70b of the Work Substrate 71 Chip part 72 Outer frame part 73 Static elimination part 74 Outside Frame neutralization pattern 81 Coating means 82 Drying means 83 Pre-baking means 84 Exposure / development means 85 Draining means 86 Support base 87 Conveying roller 88 Adsorption hole

Claims (13)

A substrate,
A touch panel sensor provided on one surface of the substrate;
A color filter portion provided on the other surface of the substrate and having a colored layer of a plurality of colors,
The touch panel sensor unit includes a plurality of electrode patterns provided in a predetermined pattern on the one surface of the substrate, a plurality of terminal portions provided on the one surface of the substrate, each corresponding to each electrode pattern, A plurality of conductive patterns provided on the one surface of the substrate, each electrically connecting between each electrode pattern and each terminal portion, and on the one surface of the substrate so as to cover each electrode pattern and each conductive pattern A protective layer provided,
On the one surface of the substrate, a static elimination pattern having conductivity is further provided,
The static elimination pattern at least partially reaches the outer edge of the substrate, and does not contact any of the electrode pattern, the terminal portion, and the conductive pattern,
The static elimination pattern includes a tapered region that tapers inward,
A color filter integrated touch panel sensor, wherein the tip of the tapered region is covered with the protective layer. 2. The color filter integrated touch panel sensor according to claim 1, wherein a tapered region of the charge removal pattern extends from an outer edge of the substrate to the protective layer and tapers toward the protective layer. The static elimination pattern further includes a linear region reaching the outer edge of the substrate and partially extending parallel to the outer edge,
2. The color filter integrated touch panel sensor according to claim 1, wherein each tapered region protrudes from the linear region so as to intersect with a direction in which the linear region extends. The thickness of the said protective layer on the front-end | tip part of the said taper area | region is below the thickness of the said protective layer on the said electrode pattern and the said conductive pattern, The Claim 1 thru | or 3 characterized by the above-mentioned. Color filter integrated touch panel sensor. The electrode pattern includes a plurality of x electrode units connected in the x direction via x connection parts, and a plurality of y electrode units located between the x electrode units and connected in the y direction via y connection parts. Have
The x connection portion and the y connection portion are arranged so as to overlap each other when viewed from the normal direction of the base material,
An insulating layer is interposed between the x connection portion and the y connection portion,
4. The color filter according to claim 1, wherein the static elimination pattern is formed by laminating the same material as the x connection portion and the same material as the y connection portion. Body type touch panel sensor.   The tip portion of the tapered region of the static elimination pattern further includes the same material as the insulating layer interposed between the same material as the x connection portion and the same material as the y connection portion. The color filter-integrated touch panel sensor according to claim 5. The touch panel sensor unit is further provided on the protective layer, and further includes an antistatic film that overlaps at least a tip of the tapered region of the static elimination pattern when viewed from the normal direction of the substrate.
The surface resistance of the antistatic film is smaller than the surface resistance of the protective layer, and larger than the surface resistance of the electrode pattern and the surface resistance of the conductive pattern. The color filter integrated touch panel sensor according to any one of the above. The color filter integrated touch panel sensor according to claim 1;
A display device with a touch panel function, comprising: a display substrate provided on the color filter unit side of the color filter integrated touch panel sensor. In the manufacturing method of the multi-surface mounting work board in which the color filter integrated touch panel sensor according to claim 1 is assigned a plurality,
The work substrate has one surface and the other surface, and the one surface and the other surface of the multi-sided work substrate include a plurality of chip portions on which the color filter integrated touch panel sensor is formed, and an outer frame portion surrounding each chip portion. Partitioned,
The manufacturing method of the multi-sided work substrate is:
Preparing a work substrate;
Forming the touch panel sensor part on each chip part on one surface of the work substrate;
Forming the static elimination pattern on each chip portion on one surface of the work substrate; and
Forming an electrically conductive outer frame neutralization pattern electrically connected to each static elimination pattern on the outer frame portion on one surface of the work substrate;
And a step of forming the color filter portion on each chip portion on the other surface of the work substrate. The electrode pattern includes a plurality of x electrode units connected in the x direction via x connection parts, and a plurality of y electrode units located between the x electrode units and connected in the y direction via y connection parts. Have
The x connection portion and the y connection portion are arranged so as to overlap each other when viewed from the normal direction of the base material,
An insulating layer is interposed between the x connection portion and the y connection portion,
The step of forming the touch panel sensor unit includes:
Providing a transparent electrode material on one surface of the work substrate;
Patterning the provided transparent electrode material to form the x electrode unit, the y electrode unit, and the x connection part;
forming the insulating layer on the x-direction connecting portion;
Providing a conductive material on one surface of the work substrate;
Patterning the provided conductive material to form the y connection part, and
The outer frame static elimination pattern and the static elimination pattern include the transparent electrode material layer formed simultaneously with the x electrode unit, the y electrode unit and the x connection portion when patterning the transparent electrode material, and the conductive material. The method for manufacturing a multi-faced work substrate according to claim 9, further comprising: a conductive material layer formed on the transparent electrode material layer simultaneously with the y connection portion when patterning. The electrode pattern includes a plurality of x electrode units connected in the x direction via x connection parts, and a plurality of y electrode units located between the x electrode units and connected in the y direction via y connection parts. Have
The x connection portion and the y connection portion are arranged so as to overlap each other when viewed from the normal direction of the base material,
An insulating layer is interposed between the x connection portion and the y connection portion,
The step of forming the touch panel sensor unit includes:
Providing a conductive material on one surface of the work substrate;
Patterning a provided conductive material to form the y-connection part; forming the insulating layer on the y-connection part;
Providing a transparent electrode material on one surface of the work substrate;
Patterning the provided transparent electrode material to form the x electrode unit, the y electrode unit, and the x connection part, and
The outer frame static elimination pattern and the static elimination pattern include a conductive material layer formed simultaneously with the y connection portion when patterning the conductive material, and the x electrode unit when patterning the transparent electrode material, The transparent electrode material layer formed on the said electroconductive material layer simultaneously with a y electrode unit and the said x connection part, The manufacturing method of the multi-sided work board | substrate of Claim 9 characterized by the above-mentioned.   The tip portion of the tapered region of the static elimination pattern is interposed between the transparent electrode material layer and the conductive material layer, and is for the tip portion formed of the same material as the insulating layer simultaneously with the insulating layer. The method for manufacturing a multi-sided work substrate according to claim 10 or 11, further comprising an insulating layer. Further comprising a step of forming an antistatic film on a protective layer provided in each chip part;
13. The surface resistance of the antistatic film is smaller than the surface resistance of the protective layer and larger than the surface resistance of the electrode pattern and the surface resistance of the conductive pattern. The manufacturing method of the multi-surfaced work board | substrate in any one.

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