JP2012114898A - Crystal resonator and crystal oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal resonator capable of holding a crystal piece in a floating state without providing a bump or the like.SOLUTION: A sheet 2 is formed excluding a region where crystal holding terminals 4a, 4b are provided at a recessed part of a ceramic package 1, a level difference is provided between a region where the sheet 2 is formed and a region where it is not formed, the region where the sheet 2 is not formed is relatively recessed, and the crystal holding terminals 4a, 4b are provided in the recessed region. A crystal piece 3 is fixed to the crystal holding terminals 4a, 4b with a conductive adhesive 5, the crystal piece 3 is supported at a corner part at the end of the sheet 2, and thus the crystal resonator holds the crystal piece 3 obliquely to the recessed part bottom surface of the ceramic package.

Description

  The present invention relates to a crystal resonator and a crystal oscillator, and more particularly to a crystal resonator and a crystal oscillator that can be easily held in a floating state when the crystal piece is stored in a package.

[Description of Prior Art]
In a conventional crystal unit and a crystal oscillator using the crystal unit, when the crystal piece is stored in the ceramic package, one short side of the crystal piece is brought into contact with the concave portion of the ceramic package and is provided on the back surface of the crystal piece. The electrode and the crystal holding terminal are fixed with a conductive adhesive. A structure that holds one side of a crystal piece is called a cantilever type.
At that time, in order not to prevent the vibration of the crystal piece, it is necessary to hold the sides other than the one in contact with the ceramic package in a state of floating from the concave surface of the ceramic package.

  In a conventional crystal unit, in order to float the crystal piece, a bump is provided inside the ceramic package or a support part is provided on the crystal piece (clogging clogs). A crystal piece is held as a fulcrum, and the one side is brought into contact with the ceramic package and the other side is floated.

[Related technologies]
As a technique related to the crystal oscillator, Japanese Patent Laid-Open No. 10-22776 “Piezoelectric vibrator” (Applicant: Seiko Epson Corporation, Patent Document 1), Japanese Utility Model Laid-Open No. 5-65199 “Mounting and holding structure of vibrating piece” (Applicant: River Eletech Corporation, Patent Document 2), Japanese Patent Application Laid-Open No. 2005-109794, “Piezoelectric Vibrator” (Applicant: Kyocera Kinseki Corporation, Patent Document 3), Japanese Patent Application Laid-Open Publication No. 2003-78373, “Piezoelectric Vibration” Child manufacturing method "(Applicant: Kinseki Co., Ltd., Patent Document 4).

  In Patent Literature 1, in a piezoelectric vibrator, a connection body is provided with a support, and a joining end portion of the piezoelectric vibrating piece is supported at a position higher than the end edge with a position inside the end edge as a fulcrum. Is described.

  Patent Document 2 describes that a step is provided on an electrode, and Patent Document 3 describes that the thickness of an electrode pad connected to an outer bump group and an inner bump group is changed to prevent a decrease in bonding strength. Patent Document 4 describes that the end surface of the suction mounting nozzle of the vibrator has an angle with respect to the horizontal mounting substrate surface.

Furthermore, as another technique related to the crystal oscillator, Japanese Patent Application Laid-Open No. 2010-103344 (Patent Document 5), Japanese Patent Application Laid-Open No. 2004-356562 (Patent Document 6), Japanese Patent Application Laid-Open No. 2004-129090 (Patent Document 7), No. 2009-124619 (Patent Document 8).
Patent Document 5 describes that a wiring board is provided with a metal plating layer for connecting metal bumps and wiring patterns, and Patent Document 6 describes that the contact pressure between the gold bumps and the conductor pads is set to a certain level or more. Is described.

  Patent Document 7 describes that in a piezoelectric oscillator, a dam layer is formed to protrude on the inner wall of the package to prevent the resin from creeping up, and Patent Document 8 describes that a notch is provided on the inner wall of the package to provide a resin. It is described to prevent the scooping up.

Japanese Patent Laid-Open No. 10-22776 Japanese Utility Model Publication No. 5-65199 JP 2005-109794 A JP 2003-78373 A JP 2010-103344 A Japanese Patent Laid-Open No. 2004-356661 JP 2004-129090 A JP 2009-124619 A

  However, in the conventional crystal oscillator, in order to float the crystal piece in the ceramic package, a protrusion serving as a fulcrum is formed in the vicinity of the joint end, but there is a problem that the formation of the protrusion is complicated. It was.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a crystal oscillator capable of easily floating a crystal piece in a package.

  The present invention for solving the problems of the above-described conventional example is a crystal resonator including a crystal piece mounted in a recess in a ceramic package and having a crystal holding electrode electrically connected to the crystal piece in the recess, The sheet is formed so as to substantially cover the area of the recess where the crystal holding electrode is not provided, the area where the crystal holding electrode is provided is relatively recessed, and the crystal piece is applied onto the crystal holding electrode. In addition to being fixed by the conductive adhesive, the sheet is held obliquely with respect to the bottom surface of the recess by contacting the corner of the sheet on the crystal holding electrode side.

  Further, the present invention is characterized in that, in the crystal resonator, the sheet is formed in a step of contacting the three side surfaces of the ceramic package to form the side surface of the ceramic package.

  The present invention also relates to a crystal unit including a crystal piece mounted in a recess in a ceramic package and having a crystal holding electrode electrically connected to the crystal piece in the recess, wherein the crystal piece is held by a gold bump. It is characterized by being joined to an electrode.

  In addition, the present invention is characterized in that a crystal oscillator includes the above-described crystal resonator.

  In the present invention, the ceramic package is provided with recesses on both sides, a crystal piece is mounted in one recess, an IC chip is mounted in the other recess, and the recess in which the IC chip is mounted is filled with resin. A crystal oscillator having a mold structure is characterized in that a groove portion that goes around the inner wall of the side surface is provided in the middle of the side surface of the ceramic package.

  In the present invention, the ceramic package is provided with recesses on both sides, a crystal piece is mounted in one recess, an IC chip is mounted in the other recess, and the recess in which the IC chip is mounted is filled with resin. A crystal oscillator having a mold structure is characterized in that a protrusion is provided in the middle of the side surface of the ceramic package along the inner wall of the side surface.

  In the present invention, the ceramic package is provided with recesses on both sides, a crystal piece is mounted in one recess, an IC chip is mounted in the other recess, and the recess in which the IC chip is mounted is filled with resin. A crystal oscillator having a mold structure is characterized in that a groove portion and a protrusion portion that go around the inner wall of the side surface are provided in the middle of the side surface of the ceramic package.

  The present invention also provides a crystal resonator including a crystal piece mounted in a recess in a ceramic package and having a crystal holding electrode electrically connected to the crystal piece in the recess, the crystal piece being connected to the crystal holding electrode. A portion provided with a protrusion on the surface connected to the crystal holding electrode at the end in the direction to be fixed, the protrusion being fixed by the conductive adhesive applied on the crystal holding electrode, and the protrusion of the crystal piece not being provided Is characterized by being held in a state of floating from the bottom of the recess.

  In the present invention, the ceramic package is provided with recesses on both sides, a crystal piece is mounted in one recess, an IC chip is mounted in the other recess, and the recess in which the IC chip is mounted is filled with resin. In the crystal oscillator having a mold structure, the IC chip is characterized in that an unevenness is formed on a surface opposite to a surface provided with a connection terminal connected to the recess.

  Further, the present invention is characterized in that in the above-mentioned crystal oscillator, the unevenness is a groove formed in a linear shape or a curved shape.

  According to the present invention, there is provided a crystal resonator including a crystal piece mounted in a recess in a ceramic package and having a crystal holding electrode electrically connected to the crystal piece in the recess, the crystal holding electrode being provided in the recess. The sheet is formed so as to substantially cover the non-existing region, the region where the crystal holding electrode is provided is relatively depressed, and the crystal piece is fixed by the conductive adhesive applied on the crystal holding electrode. At the same time, the crystal resonator is held obliquely with respect to the bottom surface of the recess by contacting the corner of the sheet on the crystal holding electrode side, so that the crystal piece can be floated and held without providing bumps. effective.

  Further, according to the present invention, in the crystal resonator, since the sheet is in contact with the three side surfaces of the ceramic package and formed in the step of forming the side surface of the ceramic package, the sheet can be easily formed. There is an effect that can be formed.

  Further, according to the present invention, there is provided a crystal resonator having a crystal piece mounted in a recess in a ceramic package and having a crystal holding electrode electrically connected to the crystal piece in the recess, wherein the crystal piece is formed by a gold bump. Since the crystal resonator is bonded to the crystal holding electrode, a gold-gold bond is provided between the gold-plated crystal holding terminal and the gold bump and between the electrode of the crystal piece and the gold bump, thereby providing good conduction. There is an effect to be obtained.

  In addition, according to the present invention, since the crystal oscillator is provided with a groove part that goes around the inner wall of the side surface in the middle of the side surface of the ceramic package, it prevents the resin from creeping up to the terminal and causing problems. There is an effect that can.

  Further, according to the present invention, since the crystal oscillator is provided with a protrusion part that goes around the inner wall of the side surface in the middle of the side surface of the ceramic package, it is difficult to scoop up the resin and prevent the occurrence of problems. There is an effect that can be done.

  Further, according to the present invention, the crystal piece has a protrusion on the surface connected to the crystal holding electrode at the end in the direction connecting to the crystal holding electrode, and the protrusion is applied on the crystal holding electrode. Since the portion of the crystal piece that is fixed by the adhesive and is not provided with the protruding portion is a crystal resonator that is held in a floating state from the bottom surface of the recess, there is an effect that the crystal piece can be made independent in a floating state.

  In addition, according to the present invention, the IC chip is a crystal oscillator in which unevenness is formed on the surface opposite to the surface provided with the connection terminal connected to the recess, so that the contact between the back surface of the IC chip and the resin There is an effect that the resin can be prevented from repelling by enlarging the area, and unnecessary filling of the resin is unnecessary, thereby preventing the occurrence of problems due to the resin creeping up.

(A) is a top view of the crystal resonator which concerns on the 1st Embodiment of this invention, (b) is sectional drawing. It is sectional drawing of the H-type crystal oscillator using the 1st crystal oscillator. (A) is a top view of the crystal resonator which concerns on the 2nd Embodiment of this invention, (b) is a back view of a crystal piece, (c) is sectional drawing. It is sectional explanatory drawing of the H-type oscillator using a 2nd crystal oscillator. It is a schematic explanatory drawing which shows the mode of resin filling in the conventional crystal oscillator. (A)-(c) is explanatory drawing which shows the structure of the crystal oscillator based on the 3rd Embodiment of this invention. It is a schematic cross-section explanatory drawing of the crystal piece used for the crystal oscillator based on the 4th Embodiment of this invention. It is explanatory drawing which shows the structure of the crystal oscillator based on the 5th Embodiment of this invention. It is explanatory drawing which shows the example of the shape of the groove | channel formed in IC chip 34 of the 5th crystal oscillator of this invention.

Embodiments of the present invention will be described with reference to the drawings.
[Outline of the embodiment]
In the crystal resonator and the crystal oscillator according to the embodiment of the present invention, a step portion is formed between the bottom portion of the package by recessing a portion to which the crystal piece is fixed, and conducting one side of the crystal piece. It is fixed to the crystal holding terminal with the adhesive, and the other side is lifted and held using the corner of the step as a fulcrum, and the crystal piece can be easily lifted and held without providing a bump or the like. It is something that can be done.

  In addition, the crystal resonator and crystal oscillator according to the embodiment of the present invention are provided with an insulating sheet at the bottom of the package, and one side of the crystal piece is fixed to the crystal holding terminal with a conductive adhesive, The other side is lifted and held using the corner of the step formed by the edge of the sheet as a fulcrum, and the crystal piece can be easily floated without providing a bump or the like. is there.

[First Embodiment: FIG. 1]
The configuration of the crystal resonator according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1A is a top view of the crystal resonator according to the first embodiment of the present invention, and FIG. 1B is a cross-sectional view.
As shown in FIGS. 1A and 1B, the crystal resonator (first crystal resonator) according to the first embodiment of the present invention has a sheet in a recess provided in the ceramic package 1. 2, a crystal piece 3, crystal holding terminals 4a and 4b, and conductive adhesives 5a and 5b.

  The crystal holding terminals 4 a and 4 b are metal electrodes formed on the ceramic package 1 and are formed along one short side of the concave portion of the ceramic package 1. And it connects with the electrode provided in the back surface of the crystal piece 2 by the conductive adhesive 5a or 5b.

  The conductive adhesives 5a and 5b electrically connect the electrodes on the back surface of the crystal piece 2 and the crystal holding terminals 4a and 4b, and hold and fix the crystal piece 2 obliquely.

The sheet 2 is a characteristic part of the first crystal unit, is made of the same material (for example, alumina) as the ceramic package 1, and is an area where the crystal holding terminals 4 a and 4 b are not provided in the recess of the ceramic package 1. It is formed so as to cover almost. Specifically, in the sheet 2, a ceramic layer is formed on the substrate 1a constituting the ceramic package 1 so as to have the thickness of the sheet 2, and an area in which the crystal holding terminals 4a and 4b are provided in the ceramic layer. It is formed by etching, and in the example of FIG. 1, part of the three side surfaces of the ceramic package 1 is formed.
By providing the sheet 2, the portion where the crystal holding terminals 4a and 4b are provided has a relatively depressed shape.

  The crystal piece 3 is held at both ends of one short side by the conductive adhesives 5a and 5b, and is held in contact with the corner of the end of the sheet 2 near the short side. It is fixed to make a certain angle. The size (width of the recess) and thickness (height of the step) of the sheet 2 and the application thickness of the conductive adhesives 5a and 5b are adjusted so that the crystal piece 3 is fixed at a desired angle.

  That is, in the first crystal unit, the height of the region where the sheet 2 is not provided is relatively lower than the region where the sheet 2 is provided, and the crystal piece is attached to the conductive adhesive 5 provided in the lower part. By inserting the short side of 2 diagonally, the crystal piece 3 can be floated and held diagonally without providing bumps or the like. Furthermore, by supporting the crystal piece 3 with the end portion of the sheet 2, the crystal piece 3 can be stabilized and reliably held.

[H-type crystal oscillator: Fig. 2]
An H-type crystal oscillator using the first crystal resonator will be described with reference to FIG. FIG. 2 is a cross-sectional view of an H-type crystal oscillator using the first crystal resonator.
As shown in FIG. 2, the H-type oscillator has a downward recess (another part similar to the ceramic package 1 of the first crystal unit 10) on the back surface of the same crystal unit 10 as the crystal unit shown in FIG. 1. A side surface portion 11 is provided to form a concave portion, and the IC chip 12 is stored in the other concave portion. The IC chip 12 is connected to the upper crystal unit 10 by metal wiring.
In this manner, an oscillator can be formed using this vibrator, and the crystal piece can be easily held in a floating state without providing a bump.

[Effect of the first embodiment]
According to the crystal resonator and the crystal oscillator according to the first embodiment of the present invention, the sheet 2 is formed except for the region where the crystal holding terminals 4a and 4b are provided in the recesses of the ceramic package 1, A step is provided between the formed region and the non-formed region, the region where the sheet 2 is not formed is relatively recessed, and the crystal holding terminals 4a and 4b are provided in the recessed region to provide conductivity. Since the adhesive 5 is applied and the crystal piece 3 is inserted into the conductive adhesive 5 at an angle and fixed, and the crystal piece 3 is supported at the corners of the sheet 2, no bumps or the like are provided. In addition, there is an effect that the crystal piece 3 can be easily held in a floating state.

[Second Embodiment: FIG. 3]
Next, a crystal resonator and a crystal oscillator according to a second embodiment of the present invention will be described.
In general, a crystal resonator and a crystal oscillator are configured such that a crystal piece is connected to a crystal holding terminal plated with gold by a conductive adhesive to establish conduction with the package. However, the conductive adhesive and the gold plating are electrically connected. In some cases, it may be difficult to obtain electrical continuity, and problems may occur if manufacturing conditions deteriorate.

Moreover, the structure which obtains a favorable connection by connecting a metal bump and a wiring pattern in an electronic component is described in Patent Document 5 and Patent Document 6 described above.
However, a configuration in which a crystal piece and an electrode on the package side are connected by a gold bump in a crystal resonator is not disclosed.

3A is a top view of the crystal resonator according to the second embodiment of the present invention, FIG. 3B is a back view of the crystal piece, and FIG. 3C is a cross-sectional view.
As shown in FIG. 3A, the crystal resonator (second crystal resonator) according to the second embodiment of the present invention has a crystal piece 22 mounted in the recess of the ceramic package 21. Crystal holding terminals 23a and 23b plated with gold are formed on the bottom surface.

  Excitation electrodes 24 and 25 are formed on the front and back surfaces of the crystal piece 22. The excitation electrodes 24 and 25 are provided with lead electrodes 27a and 27b on the front and back surfaces of the corners of the crystal piece 22 for connection to the crystal holding terminals 23a and 23b, respectively. The lead electrode 27 on the back surface is connected on the side surface of the crystal piece 22.

As a feature of the second crystal unit, as shown in FIGS. 3B and 3C, gold bumps 26a and 26b are respectively formed on the two lead electrodes 27a and 27b provided on the back surface of the crystal piece 22. The crystal piece 22 is formed and connected to the crystal holding terminals 23a and 23b via the gold bumps 26a and 26b.
The gold bump 26 is formed, for example, by melting the tip of a gold wire into a ball shape and pressing it onto the lead electrode with high temperature and high pressure or ultrasonic waves.

As a result, the connection between the gold-plated crystal holding terminals 23a and 23b and the gold bumps 26a and 26b becomes a bond between gold and gold, and an excellent electrical connection can be obtained.
Conventionally, since the crystal piece 22 is large in size and heavy, it is difficult to join the gold bumps due to insufficient bonding force. However, the crystal piece 22 is downsized, and the gold bumps can be sufficiently bonded. It is a thing.

[H-type oscillator using second crystal resonator: FIG. 4]
Next, an oscillator using the second crystal resonator will be described with reference to FIG. FIG. 4 is a cross-sectional explanatory view of an H-type oscillator using a second crystal resonator.
As shown in FIG. 4, the H-type oscillator using the second crystal resonator has another recess formed on the back surface of the second crystal resonator shown in FIG. It is mounted and electrically connected to the crystal unit. Gold bumps 26 are also used at the junction between the IC chip 28 and the electrode formed on the package, in addition to the junction between the crystal piece 3 of the crystal resonator and the crystal holding terminal 24.
As a result, the electrical continuity of the entire oscillator is improved.

[Effect of the second embodiment]
According to the crystal resonator according to the second embodiment of the present invention, the gold bumps 26a and 26b are formed on the lead electrodes 27a and 27b, which are provided on the back surface of the crystal piece 22, and the gold bumps 26a and 26b are interposed therebetween. Since the crystal holding terminals 23a and 23b of the ceramic package 21 are connected to each other, the gold-plated crystal holding terminals 23 and the gold bumps 26 have a gold-gold junction and have an effect of obtaining good conduction.

  3 and 4, the crystal resonator 22 is held substantially parallel to the bottom surface of the ceramic package. However, as in FIGS. 1 and 2, the sheet 2 is disposed to hold the crystal resonator 22 diagonally. It is good also as a structure.

[Third Embodiment]
A crystal oscillator according to the third embodiment of the present invention will be described.
In the crystal oscillator having an H-type structure, a resin is filled in the concave portion of the ceramic package in order to coat the IC chip.

[Resin filling in a conventional crystal oscillator: FIG. 5]
The state of resin filling in a conventional crystal oscillator will be described with reference to FIG. FIG. 5 is a schematic explanatory view showing a state of resin filling in a conventional crystal oscillator.
As shown in FIG. 5, the crystal oscillator of the H-type structure has the crystal piece 32 and the IC chip 34 mounted in the recesses formed on both sides of the ceramic package, and the crystal piece 32 is attached to the electrode by the conductive adhesive 33. Connected and fixed in the recess.
Terminals 35 connected to the outside are provided on the upper and lower portions of the side surface portion 31 of the ceramic package.

When the mounting of the IC chip 34 is completed, the resin 36 is filled in the recess in which the IC chip 34 is stored for coating.
At that time, when the amount of the resin is large or the bottom area of the recess is slightly small, the resin 36 may crawl up to the upper side of the side surface of the ceramic package and cover the terminal 34. There is a risk of shortage.

Although Patent Document 7 describes that a dam layer protruding upward is formed on the inner wall of the package of the oscillator to prevent the resin from creeping up, a layer protruding in the horizontal direction should be formed. Is not listed.
Patent Document 8 describes that notches are provided in the four corners of the side wall portion of the oscillator package, but does not describe forming a groove that goes around the inside of the side wall.

[Crystal Oscillator According to Third Embodiment: FIG. 6]
A crystal oscillator according to a third embodiment of the present invention will be described with reference to FIG. FIGS. 6A to 6C are explanatory views showing the structure of a crystal oscillator according to the third embodiment of the present invention.
The crystal oscillator (third crystal oscillator) according to the third embodiment is provided with a structure for preventing creeping in the upper part of the side surface of the ceramic package in order to prevent the resin from creeping, and (1) a groove is provided. And (2) those provided with protrusions, and (3) those provided with both grooves and protrusions.

As shown in FIG. 6A, in the first type of the third crystal oscillator, a first ceramic layer 37 having a width smaller than that of the side surface portion 31 is provided on the upper surface of the side surface portion 31 of the ceramic package. A second ceramic layer 38 having a width equivalent to that of the side surface portion 31 is laminated thereon, and a terminal 35 is formed on the second ceramic layer 38.
Since the two ceramic layers 37 and 38 are formed, a groove 39 is formed on the inner side of the narrow first ceramic layer 37 along the periphery of the inner wall of the side surface 31 so as to go around the inner wall. Yes.
This prevents excess resin from being absorbed by the groove 39 and creeping up to the terminal 35.

In the second type of the third crystal oscillator, a ceramic layer 40 having a width wider than that of the side surface 31 is provided on the upper side of the side surface 31 of the ceramic package.
Here, the height from the bottom surface of the concave portion of the ceramic package to the ceramic layer 40 is somewhat higher than the height of the groove 39 in the first type.
The ceramic layer 40 is formed so that a flange-like protruding portion 41 that protrudes horizontally along the inner wall of the side surface portion 31 extends around the inner wall to prevent the resin from creeping up to the terminal 35.

The third type of the third crystal oscillator has a configuration in which the first and second types are combined. The first ceramic layer 37 having a width smaller than that of the side surface portion 31 is formed on the upper side surface portion 31 of the ceramic package. And a second ceramic layer 40 having a width wider than that of the side surface portion 31.
Thereby, it becomes the structure provided with both the groove part and the projection part along the inner wall of the side part 31 of a ceramic package, and prevents that resin creeps up to the terminal 35. FIG.

[Effect of the third embodiment]
According to the crystal oscillator according to the third embodiment of the present invention, the groove portion 39 is formed around the inner wall of the side surface portion in the upper portion of the side surface portion 31 of the ceramic package. It is effective in absorbing and preventing the resin from creeping up on the terminal 35.

  Further, according to the crystal oscillator according to the third embodiment of the present invention, since the protruding portion that protrudes horizontally around the inner wall of the side surface portion is formed on the upper portion of the side surface portion 31 of the ceramic package, the terminal 35 has an effect of preventing the resin from creeping up.

[Fourth Embodiment: FIG. 7]
Next, a crystal resonator according to a fourth embodiment of the invention will be described with reference to FIG. FIG. 7 is a schematic cross-sectional explanatory diagram of a crystal piece used in the crystal resonator according to the fourth embodiment of the invention.
The crystal resonator (fourth crystal resonator) according to the fourth embodiment of the present invention is such that the shape of the crystal piece itself can be changed so that it can be easily floated in the ceramic package.

  As shown in FIG. 7, the crystal piece 51 used in the fourth crystal resonator has a shape in which a protruding portion 52 is provided on the back surface of the end portion in the direction in which the crystal holding electrode 54 is connected. It is fixed by a conductive adhesive 55. That is, the thickness of the crystal piece 51 is different between the vicinity of the short side where the protrusion 52 is provided and the other part, and the part where the protrusion 51 is not provided is relatively thin.

Thus, in the fourth crystal resonator, the crystal piece 51 can be floated without having a special configuration for holding the crystal piece 51 obliquely, and the crystal piece 51 is in contact with the inner wall of the ceramic package 50. It can be vibrated without any problems.
A lead electrode is provided on the back surface of the protrusion 52 and is connected to the crystal holding electrode 54 by a conductive adhesive 53.

In the example of FIG. 7, the tip surface of the protrusion 52 is formed substantially at right angles to the protrusion direction, and the crystal piece 51 is fixed substantially horizontally with respect to the bottom surface of the ceramic package. It is also conceivable to hold the crystal piece 51 obliquely by making an angle at the tip of 52.
In addition, a crystal oscillator using a fourth crystal resonator may be formed.

[Effect of the fourth embodiment]
In the crystal resonator according to the fourth embodiment of the present invention, a protrusion 52 is provided at the end of the crystal piece 51 in the direction of connection with the crystal holding electrode 54, and the protrusion 52 is crystallized by the conductive adhesive 53. Since it is fixed so as to be connected to the holding electrode 54, there is an effect that the portion of the crystal piece 51 where the protruding portion 52 is not provided can be floated and held from the package without providing a bump or the like.

[Fifth Embodiment]
Next, a crystal oscillator according to a fifth embodiment of the invention will be described.
The crystal oscillator (fifth crystal oscillator) according to the fifth embodiment prevents the resin from creeping up in the H-type crystal oscillator, similarly to the third crystal oscillator.
In the conventional H-type crystal oscillator shown in FIG. 6, the IC chip 34 includes a circuit pattern such as a connection terminal or a metal wiring on the connection surface of the ceramic package with the substrate, and the terminal is formed in the ceramic package. It is connected to the electrode by a conductive adhesive or the like.

The IC chip 34 in the conventional crystal oscillator of the H-type structure has a mirror surface on the surface opposite to the surface connected to the ceramic package (the surface on which the circuit pattern is not provided). The resin is repelled when the recess 36 is filled with the resin 36.
For this reason, when the resin 36 is filled, a large amount of coating must be applied, and there is a problem that the resin 36 tends to creep up to the terminal 35.

[Configuration of Fifth Crystal Oscillator: FIG. 8]
FIG. 8 is an explanatory diagram showing the configuration of the crystal oscillator according to the fifth embodiment of the present invention.
As shown in FIG. 8, the fifth crystal oscillator has the same basic configuration as the conventional crystal oscillator shown in FIG. 5, but the surface on which the circuit pattern of the IC chip 34 is not formed (in FIG. 8, A number of grooves 61 are formed on the top surface (hereinafter referred to as “IC back surface”), and unevenness is provided on the contact surface with the resin.
The back surface of the IC corresponds to the “surface opposite to the surface provided with the connection terminals connected to the recesses” recited in the claims.

  As a result, in the fifth crystal oscillator, the contact area between the IC chip 34 and the resin 36 is increased to improve the wettability, and sufficient coating can be performed with an appropriate amount of resin. It is not necessary to fill the resin 36 and prevents the resin 36 from creeping up.

The groove 61 on the back surface of the IC is formed before being mounted on the H-type package, and is formed by polishing the back surface of the wafer with a file or the like after forming the circuit pattern in the wafer for manufacturing the IC. .
Usually, the IC chip is thinned (back grind) by scraping the back surface of the wafer on which the circuit pattern of the IC is formed. In the fifth crystal oscillator, a rough file is used at the end of the process. A plurality of grooves 61 are formed.

It is also possible to form the groove 61 by sputtering using argon gas. When argon gas is used, the groove 61 is formed shallower than when cutting with a file.
Although the cross-sectional shape of the groove 61 is shown as a rectangle in FIG. 8, it may be a V-shaped or U-shaped groove.

[Example of groove shape: Fig. 9]
Next, an example of the shape of the groove 61 formed in the IC chip 34 by the fifth crystal oscillator will be described with reference to FIG. FIG. 9 is an explanatory view showing an example of the shape of a groove formed in the IC chip 34 of the fifth crystal oscillator. FIG. 9 shows a state in which the fifth crystal oscillator shown in FIG. 8 is viewed from above.
In FIG. 9A, a plurality of grooves 61 are formed in a straight line in the vertical direction or the horizontal direction, and in FIG. 9B, a curved groove 61 is formed.

  Moreover, the shape of the groove | channel 61 should just improve the contact property of resin 36 and IC back surface, and may be a more irregular arrangement | positioning and shape. In addition to the groove, the IC back surface may be simply roughened to form irregularities. Further, a plurality of small depressed portions (concave portions) and protrusions (convex portions) may be provided on the back surface of the IC.

[Application example of fifth crystal oscillator]
In addition to the configuration shown in FIG. 8, the fifth crystal oscillator can be configured using the package shown in FIG. 6 that prevents the resin from creeping up.
In other words, the package shown in FIG. 6 may have a configuration in which an IC chip having a large number of grooves 61 formed on the back surface of the IC is mounted. Since the groove and the protrusion are provided on the side surface, it is possible to more reliably prevent the resin from creeping up.

  Further, in the H-type oscillator shown in FIG. 2 and the H-type oscillator shown in FIG. 4, the fifth crystal oscillator can be configured by using an IC chip having a groove 61 on the back surface. Can prevent the resin from creeping up.

[Effect of Fifth Embodiment]
According to the crystal oscillator according to the fifth embodiment of the present invention, the concave and convex portions such as the grooves 61 are provided on the surface opposite to the surface on which the circuit pattern of the IC chip is formed. It is possible to prevent the resin from being repelled by increasing the contact area between the resin and the resin, and it is possible to prevent the resin from creeping up to the terminal 35 because it is not necessary to fill the resin.

  INDUSTRIAL APPLICABILITY The present invention is suitable for a crystal resonator and a crystal oscillator that can be easily held in a floating state when the crystal piece is stored in a package.

  1, 21 ... Ceramic package, 2 ... Sheet, 3, 22, 32, 51 ... Crystal piece, 4, 27, 54 ... Crystal holding terminal, 5, 33, 53 ... Conductivity Adhesive, 10 ... first crystal resonator, 11,31 ... side surface portion, 12,28,34 ... IC chip, 24 ... lead electrode, 26 ... gold bump, 35. .. Terminal, 36 ... Resin, 37, 38, 40 ... Ceramic layer, 39 ... Groove, 41 ... Projection, 50 ... Ceramic package, 52 ... Projection, 61. ..groove

Claims (10)

A crystal unit having a crystal piece mounted in a recess in a ceramic package and having a crystal holding electrode electrically connected to the crystal unit in the recess,
Comprising a sheet formed so as to substantially cover the area of the recess where the crystal holding electrode is not provided, and relatively denting the area provided with the crystal holding electrode;
The quartz piece is fixed by a conductive adhesive applied on the quartz holding electrode and is held obliquely with respect to the bottom surface of the recess by contacting a corner of the sheet on the quartz holding electrode side. A crystal resonator characterized by   2. The crystal resonator according to claim 1, wherein the sheet is formed in a step of contacting the three side surfaces of the ceramic package and forming the side surface of the ceramic package. A crystal unit having a crystal piece mounted in a recess in a ceramic package and having a crystal holding electrode electrically connected to the crystal unit in the recess,
A crystal resonator, wherein the crystal piece is bonded to the crystal holding electrode by a gold bump.   A crystal oscillator comprising the crystal resonator according to claim 1. An H-type crystal oscillator in which concave portions are provided on both sides of a ceramic package, a crystal piece is mounted in one concave portion, an IC chip is mounted in the other concave portion, and the concave portion in which the IC chip is mounted is filled with resin. Because
A crystal oscillator comprising a groove portion that goes around the inner wall of the side surface in the middle of the side surface of the ceramic package. An H-type crystal oscillator in which concave portions are provided on both sides of a ceramic package, a crystal piece is mounted in one concave portion, an IC chip is mounted in the other concave portion, and the concave portion in which the IC chip is mounted is filled with resin. Because
A crystal oscillator comprising a protrusion that goes around the inner wall of the side surface in the middle of the side surface of the ceramic package. An H-type crystal oscillator in which concave portions are provided on both sides of a ceramic package, a crystal piece is mounted in one concave portion, an IC chip is mounted in the other concave portion, and the concave portion in which the IC chip is mounted is filled with resin. Because
A crystal oscillator comprising a groove and a protrusion that circulates along the inner wall of the side surface in the middle of the side surface of the ceramic package. A crystal unit having a crystal piece mounted in a recess in a ceramic package and having a crystal holding electrode electrically connected to the crystal unit in the recess,
The crystal piece is provided with a protrusion on a surface connected to the crystal holding electrode at an end in a direction connecting to the crystal holding electrode,
The protruding portion is fixed by a conductive adhesive applied on the crystal holding electrode, and a portion of the crystal piece where the protruding portion is not provided is held in a state of floating from the bottom surface of the recess. A crystal resonator. An H-type crystal oscillator in which concave portions are provided on both sides of a ceramic package, a crystal piece is mounted in one concave portion, an IC chip is mounted in the other concave portion, and the concave portion in which the IC chip is mounted is filled with resin. Because
The IC chip is characterized in that an unevenness is formed on a surface opposite to a surface provided with a connection terminal connected to the recess.   The crystal oscillator according to claim 9, wherein the unevenness is a groove formed in a linear shape or a curved shape.

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