JP2012112699A - Radiation detection panel and radiation imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To seal a scintillator and a photo detection substrate so that at least one of the scintillator and the photo detection substrate can be repaired or exchanged.SOLUTION: In a radiation detection panel (28), a sealing protection film (48) includes cut parts (74) for pulling out a scintillator (46) and a photo detection substrate (44) from the sealing protection film (48) by breaking the sealing protection film (48), and seals at least the scintillator (46) and the photo detection substrate (44) by means of thermal welding so as to avoid the scintillator (46) and the photo detection substrate (44).

Description

  The present invention relates to a radiation detection panel including a scintillator that converts radiation into visible light, and a light detection substrate that converts visible light into an electrical signal, and a radiation imaging apparatus including the radiation detection panel.

  In the medical field, a radiation image of a subject is widely acquired by irradiating the subject with radiation from a radiation source and detecting the radiation transmitted through the subject with a radiation imaging apparatus. In this case, the radiation imaging apparatus includes a radiation detection panel including a scintillator that converts the radiation transmitted through the subject into visible light, and a light detection substrate that converts the visible light into an electrical signal.

  By the way, when the scintillator is made of CsI (cesium iodide), the CsI is sensitive to humidity and has deliquescence. Therefore, in a radiation detection panel using a scintillator made of CsI, it is necessary to securely seal the scintillator. Therefore, Patent Document 1 proposes to seal the scintillator disposed on the substrate after covering it with a protective layer. Further, Patent Document 2 proposes covering and sealing a laminate of a scintillator and a light detection substrate entirely with a resin.

JP 2006-78472 A JP 2010-85266 A

  When a failure occurs in at least one of the scintillator and the light detection substrate constituting the radiation detection panel during manufacture or use of the radiation detection panel, it is necessary to repair or replace the part in which the failure has occurred.

  However, in the techniques of Patent Documents 1 and 2, since emphasis is placed on ensuring the moisture resistance of the scintillator during use, the scintillator is sealed without assuming any repair or replacement of the scintillator or the light detection substrate. Yes.

  The present invention has been made to solve the above-described problem, and radiation capable of sealing the scintillator and the photodetection substrate so that at least one of the scintillator and the photodetection substrate can be repaired or replaced. An object is to provide a detection panel and a radiation imaging apparatus including the radiation detection panel.

In order to achieve the above object, the present invention provides a radiation detection panel comprising:
A scintillator that converts radiation into visible light; a photodetection substrate that converts the visible light into an electrical signal; a sealing protective film that is made of a material that transmits the radiation and seals at least the scintillator and the photodetection substrate; Have
The sealing protective film is provided with a notch for opening the sealing protective film and taking out the scintillator and the light detection substrate from the sealing protective film,
The sealing protective film seals at least the scintillator and the light detection substrate by thermal welding so as to avoid the scintillator and the light detection substrate.

  According to this configuration, the scintillator and the light detection substrate are sealed by thermal welding so as to avoid the scintillator and the light detection substrate. As a result, the scintillator and the light detection substrate are reliably sealed during use of the radiation detection panel, so that the moisture resistance of the scintillator is sufficiently ensured.

  Further, when it is necessary to repair or replace at least one of the scintillator and the light detection substrate, the sealing protective film is simply opened from the sealing protective film through the notch. The scintillator and the light detection substrate can be easily taken out.

  Therefore, according to the present invention, the scintillator and the light detection substrate can be sealed so that at least one of the scintillator and the light detection substrate can be repaired or replaced.

  In the present invention, the scintillator and the light detection substrate may be stacked on a support substrate. At that time, the sealing protective film may seal the scintillator and the light detection substrate as described in (1) or (2) below.

  (1) The sealing protective film is configured in a bag shape in which an opening through which the scintillator, the light detection substrate, and the support substrate can be taken in and out is formed, and the scintillator, the light detection substrate, and the support substrate are After evacuating the inside of the sealing protective film through the opening while being accommodated in the bag-like sealing protective film through the opening, the opening is sealed by heat welding.

  (2) The sealing protective film is configured in a sheet shape that can cover the scintillator and the light detection substrate stacked on the support substrate, and the scintillator and the light detection substrate are stacked on the support substrate. Then, after covering the scintillator and the light detection substrate with the sheet-shaped sealing protective film, the peripheral edge of the sealing protective film is sealed by thermal welding.

  Even when the scintillator, the light detection substrate, and the support substrate are sealed using the bag-shaped sealing protective film as in (1), or as in (2), the sheet-like sealing is performed. Even when only the scintillator and the light detection substrate stacked on the support substrate are sealed using a protective film, the moisture resistance of the scintillator can be ensured.

  In this case, in the plan view, in the vicinity of the outer periphery of the scintillator and the light detection substrate in the sealing protective film or between the scintillator and the light detection substrate and the heat-welded portion of the sealing protective film. It is desirable to provide a recess. Thereby, if the said sealing protective film is opened via the said notch part, the said scintillator and the said optical detection board | substrate can be rapidly taken out from the location of the said notch part opened.

  Further, if a protective member that protects the support substrate when a blade is pressed against the cut portion from the outside at a position facing the cut portion in the support substrate, the support substrate or the like is damaged. The sealing protective film can be opened without any problem.

  Here, the radiation detection panel further includes a connection portion that is electrically connected to the light detection substrate and provided to be drawn out from a heat-welded portion of the sealing protective film. The radiation detection panel further includes an electronic component that is electrically connected to the connection portion and outputs the electrical signal to the outside through the connection portion by driving the light detection substrate.

  At that time, the electronic component is sealed by the sealing protective film together with the scintillator and the light detection substrate, or is provided in the connection portion.

  Further, the connecting portion is a flat cable drawn out from the heat-welded portion, a connector that can be attached to and detached from an external cable, or the flat cable and a tip portion of the flat cable. It is the provided connector.

  In particular, when the connector is provided, the connector is detachable from the external cable, and when the radiation detection panel needs to be repaired or replaced, after removing the connector from the external cable, The radiation detection panel can be quickly taken out from the radiation imaging apparatus.

  In addition, a sheet member may be provided in the connection portion to ensure the rigidity of the connection portion and protect the connection portion.

  Furthermore, when the electronic component is sealed with the sealing protective film, the electronic component may be disposed on the support substrate, and a sheet member may be provided in the vicinity of the electronic component on the support substrate. Thereby, the rigidity of the electronic component is ensured, and the electronic component can be protected from bending or the like.

  In this case, if it is a sheet member having conductivity, the sheet member functions as an electromagnetic shield for the electronic component or the connector, so that electromagnetic noise can be reduced.

  In addition, you may make the sheet | seat member mentioned above function as a thermal radiation member which thermally radiates the heat | fever generated from the said electronic component.

  Further, when the electronic part is provided in the connection part, the electronic part and the heat dissipation member are attached to the connection part, or the electronic part and the heat dissipation member are attached to the connection part. It is desirable to laminate. Thereby, the heat of the electronic component can be efficiently radiated to the outside.

  Furthermore, if the scintillator and the light detection substrate are stacked on the support substrate in a state where they can be separated from each other, the scintillator and the light detection substrate can be used when repairing or replacing at least one of the scintillator and the light detection substrate. The substrate can be easily separated, and repair or replacement work is facilitated.

  The scintillator and the light detection substrate may be laminated in a non-adhesive or non-adhesive state, adhered using a weak adhesive, or adhered using a photo-plastic or thermoplastic adhesive. Thus, separation at the time of repair or replacement is facilitated.

  Furthermore, if the sealing protective film includes a conductive member, both improvement in moisture resistance and reduction in electromagnetic noise can be realized. The conductive member may be, for example, a metal film such as an aluminum foil or a resin film in which a metal filler is kneaded.

  According to the present invention, the scintillator and the light detection substrate can be sealed so that at least one of the scintillator and the light detection substrate can be repaired or replaced.

It is a block diagram of the radiation imaging system using the electronic cassette (radiation imaging device) which concerns on this embodiment. It is a perspective view of the radiation detection panel which concerns on this embodiment. It is a top view inside a radiation detection panel. It is sectional drawing along the IV-IV line of FIG. FIG. 5A is a cross-sectional view showing a state of a radiation detection panel (radiation detector) before sealing, and FIG. 5B is a cross-section showing a state in which the radiation detector is housed in a bag-like sealing protective film (bag body). FIG. FIG. 6A is a cross-sectional view showing a state in which the bag body is exhausted through the opening, and FIG. 6B is a cross-sectional view showing a state in which the opening is thermally welded and sealed. FIG. 7A is a cross-sectional view showing a state of the radiation detection panel before opening by the cutter, and FIG. 7B is a cross-sectional view showing a state in which the blade edge of the cutter is pressed against the cut portion. FIG. 8A is a cross-sectional view showing a state in which the cut portion is cut off by the cutting edge of the cutter, and FIG. 8B is a cross-sectional view showing a state in which the vicinity of the cut portion is opened. It is sectional drawing which shows the state which peels a heat welding part by heating. It is an electrical schematic block diagram of the electronic cassette of FIG. FIG. 11A is a cross-sectional view of a main part showing a case where a part of the sealing protective film is a metal film such as an aluminum foil, and FIG. FIG. 12A and 12B are main part cross-sectional views showing a case where a plurality of cut portions and a sheet member are provided between the light detection substrate and the heat welding portion, respectively. FIG. 13A is a main part sectional view showing a case where an electronic component and a sheet member are connected by a conductive member, and FIG. 13B is a main part sectional view showing a case where the electronic component and the sheet member are arranged on a flat cable. It is. FIG. 14A is a cross-sectional view of a main part showing a case where an electronic component is mounted on a connected connector, and FIG. 14B is a main part showing a case where the connected connector and the electronic part are sealed with a sealing protective film. It is sectional drawing. FIGS. 15A and 15B are cross-sectional views of main parts showing a case where electronic components and sheet members are stacked and arranged on the connection portion. It is sectional drawing which shows the case where it adhere | attached between the support substrate and the photon detection board | substrate, and between the photon detection board | substrate and the scintillator using the contact bonding layer or the adhesion layer, respectively. It is sectional drawing which shows the case where only the upper surface of the support substrate with which the scintillator and the optical detection board | substrate were laminated | stacked was sealed.

  A preferred embodiment of a radiation detection panel and a radiation imaging apparatus according to the present invention will be described in detail with reference to FIGS.

  FIG. 1 is a configuration diagram of a radiation imaging system 10 having an electronic cassette (radiation imaging apparatus) 18 according to the present embodiment.

  The radiation imaging system 10 is detected by a radiation source 16 for irradiating a subject 14 such as a patient with radiation 12 having a dose according to predetermined imaging conditions, an electronic cassette 18 according to the present embodiment, and the electronic cassette 18. A display device 20 for displaying radiation image information based on the emitted radiation 12, and a radiation source 16, an electronic cassette 18, and a console 22 for controlling the display device 20. Between the console 22 and the radiation source 16, the electronic cassette 18, and the display device 20, for example, UWB (Ultra Wide Band), IEEE 802.11. Signal transmission / reception is performed by wireless communication using a wireless LAN (Local Area Network) such as a / g / n or millimeter waves. The console 22 is connected to a radiology information system (RIS) 24 that comprehensively manages radiographic image information and other information handled in the radiology department in the hospital, and the RIS 24 is connected to medical information in the hospital. A medical information system (HIS) 26 for comprehensively managing information is connected.

  The electronic cassette 18 detects radiation 12 that has passed through the subject 14 and converts it into radiation image information, a battery 34 that is a power source of the radiation detection panel 28, and electric power supplied from the battery 34. A control unit 30 that drives and controls the detection panel 28 and a transceiver 32 that transmits and receives a signal including information on the radiation 12 detected by the radiation detection panel 28 to and from the console 22 are accommodated. The battery 34 supplies power to the radiation detection panel 28, the control unit 30, and the transceiver 32.

  The control unit 30 includes an address signal generation unit 36, an image memory 38, and an ID memory 40. The address signal generator 36 supplies an address signal to the radiation detection panel 28 and causes the radiation detection panel 28 to output an image signal (electric signal) indicating radiation image information. The image memory 38 stores radiation image information indicated by the output image signal. The ID memory 40 stores ID information for specifying the electronic cassette 18. The transceiver 32 transmits the ID information stored in the ID memory 40 and the radiation image information stored in the image memory 38 to the console 22 by wireless communication.

  2 to 4, the radiation detection panel 28 includes a scintillator 46 that temporarily converts the radiation 12 that has passed through the subject 14 (see FIG. 1) into visible light, and a light detection board that converts visible light into an electrical signal. 44 and a support substrate 42 such as a glass substrate on which the light detection substrate 44 and the scintillator 46 are disposed. The support substrate 42, the light detection substrate 44, and the scintillator 46 are sealed (sealed) by a sealing protective film 48. Has been. In this case, as shown in FIG. 4, the scintillator 46, the light detection substrate 44, and the support substrate 42 are sequentially arranged along the irradiation direction of the radiation 12. That is, the light detection substrate 44 and the scintillator 46 are sequentially stacked on the support substrate 42.

  Note that the support substrate 42, the light detection substrate 44, and the scintillator 46 can be separated from each other when not sealed by the sealing protective film 48. 2 to 4, the light detection substrate 44 is placed on the support substrate 42, and the scintillator 46 is placed on the light detection substrate 44. In the plan view of FIG. 3, the scintillator 46 is smaller in size than the light detection substrate 44, but it is needless to say that the scintillator 46 and the light detection substrate 44 may be substantially the same size.

The scintillator 46 is made of a phosphor such as CsI: Tl (cesium iodide added with thallium) or GOS (Gd ₂ O ₂ S). FIG. 4 shows a scintillator 46 in which CsI: Tl is formed in a strip-like columnar crystal structure by a vacuum deposition method.

  The photodetection substrate 44 includes a photoelectric conversion layer 50 on which a plurality of solid-state detection elements (hereinafter also referred to as pixels 100 (see FIG. 10)) made of a substance such as amorphous silicon (a-Si), and a thin film transistor (hereinafter, referred to as a pixel). , And a TFT layer 52 on which an array of TFTs 102 (refer to FIG. 10) is formed. That is, the light detection substrate 44 has a structure in which the photoelectric conversion layer 50 in which each pixel 100 is formed is disposed on a TFT layer 52 that is an array of matrix-like TFTs 102. Each pixel 100 converts visible light generated by the scintillator 46 into an electric signal and then accumulates it as an electric charge. Each TFT 102 reads the electric charge as an image signal by sequentially turning it on for each row.

  The sealing protective film 48 is made of a material that covers at least the scintillator 46 and the light detection substrate 44, transmits the radiation 12, and has a light shielding property against at least the sensitivity wavelength (visible light wavelength) of the pixel 100. . Here, “sealing” means to cover a part of the radiation detection panel 28 or to seal the entire radiation detection panel 28 in order to improve the waterproofness, moisture resistance and impact resistance of the radiation detection panel 28. In this embodiment, it is sufficient that at least the scintillator 46 and the light detection substrate 44 can be “sealed”. The radiation detection panel 28 has a configuration as a radiation detector even when the sealing protective film 48 is not present. In the following description, the sealing protective film 48 is removed from the radiation detection panel 28. The generic name of the part is referred to as a radiation detector 68.

  On the support substrate 42, an electronic component 54 such as an ASIC (Application Specific Integrated Circuit) that controls the light detection substrate 44 and reads out an electric signal from the photoelectric conversion layer 50 through the TFT layer 52 is also a COG (Chip on glass) technology. It is arranged by. Therefore, the electronic component 54 is also sealed with the sealing protective film 48.

  A base end portion of a flat cable 56 that is electrically connected to the electronic component 54 is fixed at a location near the electronic component 54 in the support substrate 42. In this case, the flat cable 56 is pulled out from the sealing protective film 48, and the tip portion thereof is electrically connected to the control unit 30 and the battery 34. Accordingly, the flat cable 56 functions as a connection portion 59 that connects the radiation detection panel 28 to the control portion 30 and the battery 34 (see FIG. 1).

  As a result, the battery 34 can supply power to the radiation detection panel 28 via the flat cable 56. The address signal generator 36 of the controller 30 can supply an address signal to the electronic component 54 via the flat cable 56. Furthermore, the electronic component 54 can read an image signal from the light detection board 44 according to the address signal, and can output the read image signal to the control unit 30 via the flat cable 56.

  In addition, the base end part of the flat cable 56 is peeled from the support substrate 42 or the connection between the control part 30 and the battery 34 at the front end part is released, so that the signal between the control part 30 and the radiation detection panel 28 is removed. Transmission / reception and power supply from the battery 34 to the radiation detection panel 28 are stopped, and the radiation detection panel 28 can be easily inserted into and removed from the electronic cassette 18.

  As described above, since the support substrate 42, the light detection substrate 44, the scintillator 46, and the electronic component 54 are sealed in a state of being covered with the sealing protective film 48, as shown in FIGS. The location of the photodetection substrate 44 in the protective film 48 is a bulging portion 71 that bulges outward, and the location of the scintillator 46 further bulges outward from the bulging portion 71 and emits radiation. 12 is a bulging portion 72 to be irradiated. Further, as shown in FIG. 3, since a plurality of electronic components 54 are provided on the support substrate 42, the locations of the electronic components 54 in the sealing protective film 48 are a plurality of bulges that bulge outward. It is set as the exit part 76.

  In the sealing protective film 48, groove-shaped cut portions 74 are formed so as to avoid the bulging portions 71, 72, and 76. 2 to 4 illustrate a case where four linear cut portions 74 are formed in the sealing protective film 48 so as to surround the bulging portions 71 and 72. On the other hand, a protective member 70 made of a sheet of metal such as aluminum is disposed at a position facing each notch 74 in the support substrate 42. The protection member 70 is wider and longer than the cut portion 74 as shown in a plan view of FIG. Further, since the protective member 70 disposed between the scintillator 46 and the light detection substrate 44 and each electronic component 54 is disposed in the vicinity of each electronic component 54, an electromagnetic shield member and heat dissipation for each electronic component 54. It also functions as a member. In addition, the notch part 74 is formed in the depth which does not reach the protection member 70, as shown in FIG.

  Here, sealing (sealing) of the support substrate 42, the light detection substrate 44, the scintillator 46, and the electronic component 54 by the sealing protective film 48 will be described with reference to FIGS. 5A to 6B.

  As shown in FIG. 5B, the sealing protective film 48 originally includes a bag body 90 having an opening 78. Therefore, when sealing the support substrate 42, the light detection substrate 44, the scintillator 46, and the electronic component 54, first, the radiation detector 68 before sealing shown in FIG. 5A is placed inside the bag body 90 through the opening 78. Insert (see FIG. 5B). In this case, the flat cable 56 is drawn out from the opening 78 to the outside.

  Next, the bag body 90 in which the radiation detector 68 is inserted is placed in a vacuum container (not shown), and then the inside of the vacuum container is brought into a negative pressure state (by evacuating the vacuum container). As shown in FIG. 6A, the inside of the bag body 90 is exhausted through the opening 78. As a result, the support substrate 42, the light detection substrate 44, the scintillator 46, the electronic component 54, and the inside of the bag body 90 come into contact (adhere) without interposing the air layer.

  Next, as shown in FIG. 6B, the support substrate 42, the light detection substrate 44, the scintillator 46, and the electronic component 54 are sealed by heat-welding the location of the opening 78 in the sealing protective film 48. Thereby, the opening 78 side of the sealing protective film 48 is formed as the heat welded portions 80 and 82 which are joined to each other by heat welding and become thinner than other portions. In this case, since the flat cable 56 is drawn to the outside through the opening 78, the flat cable 56 is joined to the heat welded portions 80 and 82 while being held between the heat welded portions 80 and 82.

  The notch 74 may be provided in advance on the outer surface of the bag body 90 before the radiation detector 68 is accommodated in the bag body 90, or is not shown after sealing by the heat welding parts 80 and 82. You may provide by cutting or deform | transforming a part of outer surface of the sealing protective film 48 using a tool etc.

  Since the specific material and thickness of the sealing protective film 48 described above are disclosed in Patent Document 2, detailed description thereof is omitted. Moreover, in patent document 2, it heat-welds with respect to the whole radiation detector using the sealing protective film. On the other hand, in this embodiment, since the heat welding parts 80 and 82 are formed only in the opening part 78, when applying the technique of the heat welding of patent document 2, it is only with respect to this opening part 78. What is necessary is just to heat-seal.

  In the radiation detection panel 28 configured as described above, when a problem occurs during manufacture or use of the radiation detection panel 28, specifically, a support substrate 42 and a light detection substrate 44 that configure the radiation detection panel 28. Failure of the scintillator 46, the electronic component 54, and the connecting portion 59 (for example, cracking of the columnar crystal structure of CsI: Tl constituting the scintillator 46, failure of the pixel 100 and TFT 102 constituting the light detection substrate 44, failure of the electronic component 54 Alternatively, when a disconnection of the flat cable 56 constituting the connecting portion 59 occurs, it is necessary to repair or replace the part in which the failure has occurred.

  Therefore, in the present embodiment, by opening the sealing protective film 48 in the order shown in FIGS. 7A to 9, it is possible to quickly take out a part to be repaired or replaced.

  First, as shown in FIG. 7A, the manufacturer or repairer of the radiation detection panel 28 positions a blade 92 such as a cutter knife above any one of the cut portions 74, Next, the blade 92 is lowered, and the cutting edge of the blade 92 is pressed against the protective member 70 through the one notch 74 as shown in FIG. 7B. Thereby, the location between the notch part 74 and the protection member 70 in the sealing protective film 48 to which the blade edge is pressed is torn.

  Next, the contractor presses the cutting edge of the blade 92 against the protective member 70 along the longitudinal direction of the cut portion 74 (longitudinal direction of the cut portion 74 and the protective member 70 shown in FIGS. 2 and 3). The blade 92 is moved. As a result, as shown in FIG. 8A, air enters from the outside and slightly floats at the portion of the sealed protective film 48 that has been torn.

  As described above, the protective member 70 is inserted between the cutting edge of the blade 92 and the support substrate 42, and the protective member 70 is wider than the cut portion 74, and thus protects the cutting edge of the blade 92. Even if the blade 92 is moved along the longitudinal direction of the notch 74 while pressing the member 70 against the protective member 70, the blade edge reaches the support substrate 42, or There is no contact with other parts of the radiation detector 68. Therefore, it is possible to avoid damage to parts other than the protective member 70.

  Then, when the cutting of the cutting portion 74 by the blade 92 is completed and the contractor moves the blade 92 away from the sealing protective film 48 and the protective member 70, the sealing protective film 48 is cut by the intruded air. It floats in the left-right direction of FIG. 8B centering on the part 74 and the protection member 70, and will be in an open state. Finally, as shown in FIG. 9, the heat-welded portions 80 and 82 are heated to separate (separate) the heat-welded portions 80 and 82 from each other. Thereby, the sealing protective film 48 can be peeled off from the radiation detector 68, and it becomes possible to take out a part to be repaired or replaced.

  In addition, since the sealing protective film 48 itself is cheaper than each component constituting the radiation detector 68, the sealing protective film 48 (bag 90) after opening is disposable and after repair or replacement The radiation detector 68 may be sealed again in the order shown in FIGS. 5A to 6B by using a new bag 90 to constitute the radiation detection panel 28. Therefore, an inexpensive moisture-proof structure radiation detection panel 28 can be manufactured.

  Further, the cut portion 74 may not be provided at any location on the outer surface of the sealing protective film 48, and the swell portion 71 formed by the scintillator 46, the light detection substrate 44, and the electronic component 54 ( 72, 76), wiring (not shown) formed on the support substrate 42, and the flat cable 56 must be avoided. That is, if the sealing protective film 48 is provided with the cut portions 74 so as to face these portions, the sealing protective film 48 is opened when the cutting edge of the blade 92 is pressed against the cut portions 74 and the sealing protective film 48 is opened. This is because the damaged parts may be damaged, causing failure or disconnection.

  Therefore, if the notch 74 is provided so as to face the protection member 70, the protection member 70 receives the cutting edge when the cutting edge of the blade 92 is pressed against the notching part 74. Occurrence can be avoided. In other words, when it is desired to provide the cut portion 74 at an arbitrary location in the sealing protective film 48, the protection member 70 is provided at a predetermined location of the radiation detector 68 so as to face the cut portion 74. Just do it. For example, in order to protect the wiring, it is also possible to provide a protective member 70 on the wiring and provide a notch 74 at a predetermined location of the sealing protective film 48 so as to face the protective member 70. is there.

  FIG. 10 is a schematic electrical configuration diagram of the electronic cassette 18 of FIG.

  The electronic cassette 18 further includes a line scan driver 108, an amplifier 112, a sample and hold circuit 114, a multiplexer 116, and an A / D converter 120, and these components are electronic components 54 (see FIGS. 3 and 4). Can be built in. Since a plurality of electronic components 54 are arranged on the support substrate 42 (see FIG. 3), these electronic components 54 are combined with the electronic components 54 for the line scanning drive unit 108, the amplifier 112, and the sample hold circuit. 114, the multiplexer 116, and the electronic component 54 for the A / D converter 120.

  As described above, the light detection substrate 44 has a structure in which the photoelectric conversion layer 50 (see FIGS. 3 and 4) on which the pixels 100 are formed is arranged on the array of TFTs 102 (TFT layer 52). Have. Therefore, as shown in FIG. 10, the TFT 102 connected to each pixel 100 is connected to the gate line 104 extending in parallel to the row direction and the signal line 106 extending in parallel to the column direction. Each gate line 104 is connected to a line scan driver 108, and each signal line 106 is connected to a multiplexer 116. Control signals Von and Voff for controlling on / off of the TFTs 102 arranged in the row direction are supplied from the line scan driving unit 108 to the gate line 104. In this case, the line scan driving unit 108 includes a plurality of switches SW1 that switch the gate lines 104, and an address decoder 110 that outputs a selection signal for selecting one of the switches SW1. An address signal is supplied to the address decoder 110 from the address signal generation unit 36 (see FIG. 1) of the control unit 30 via the connection unit 59 (see FIGS. 2 to 4).

  In addition, the charge held in each pixel 100 flows out to the signal line 106 through the TFTs 102 arranged in the column direction. This charge is amplified by the amplifier 112. A multiplexer 116 is connected to the amplifier 112 via a sample and hold circuit 114. The multiplexer 116 includes a plurality of switches SW2 that switches the signal line 106 and an address decoder 118 that outputs a selection signal for selecting one of the switches SW2. An address signal is supplied from the control unit 30 to the address decoder 118. An A / D converter 120 is connected to the multiplexer 116, and radiation image information converted into a digital signal by the A / D converter 120 is supplied to the control unit 30 via the connection unit 59.

  The electronic cassette 18 including the radiation detection panel 28 according to the present embodiment is basically configured as described above. Note that the operation of the radiation imaging system 10 including the electronic cassette 18, that is, the radiation imaging method for the subject 14 is the same as the imaging method disclosed in Patent Document 2, and a detailed description thereof will be omitted. To do.

  As described above, according to the radiation detection panel 28 and the electronic cassette 18 according to the present embodiment, at least the scintillator 46 and the light detection substrate 44 are sealed by thermal welding so as to avoid the scintillator 46 and the light detection substrate 44. Yes. Accordingly, since the scintillator 46 and the light detection substrate 44 are reliably sealed while the radiation detection panel 28 is in use, the moisture resistance of the scintillator 46 is sufficiently ensured.

  Further, when it is necessary to repair or replace at least one of the scintillator 46 and the light detection substrate 44, the sealing protective film 48 can be opened from the sealing protective film 48 only by opening the sealing protective film 48 through the notch 74. 46 and the light detection substrate 44 can be easily taken out.

  Therefore, according to the present embodiment, the scintillator 46 and the light detection substrate 44 can be sealed so that at least one of the scintillator 46 and the light detection substrate 44 can be repaired or replaced. By configuring the radiation detection panel 28 in this way, the radiation detection panel 28 can be unitized, facilitating manufacturing management and improving assembly suitability.

  In addition, since the sealing protective film 48 seals at least the scintillator 46 and the light detection substrate 44 by heat welding, the scintillator 46 and the light detection substrate 44 can be reliably sealed.

  Specifically, in this embodiment, the scintillator 46, the light detection substrate 44, and the support substrate 42 are accommodated inside the bag body 90 via the opening 78, and the inside of the bag body 90 is interposed via the opening 78. After evacuation, the opening 78 is sealed by thermal welding to form the sealing protective film 48, so that moisture resistance of the scintillator 46 and the like can be easily ensured.

  Further, in plan view, a notch 74 is provided in the sealing protective film 48 in the vicinity of the outer periphery of the scintillator 46 and the light detection substrate 44 or between the scintillator 46 and the light detection substrate 44 and the heat welded portions 80 and 82. Therefore, if the sealing protective film 48 is opened through the cut portion 74, the scintillator 46 and the light detection substrate 44 can be quickly taken out from the opened cut portion 74.

  Furthermore, since the protective member 70 that protects the support substrate 42 when the blade 92 is pressed against the cut portion 74 from the outside is provided at a position facing the cut portion 74 in the support substrate 42. The sealing protective film 48 can be opened without damaging the support substrate 42 and the like. By disposing a protective member 70 made of a metal sheet in the vicinity of the electronic component 54, the protective member 70 functions as an electromagnetic shielding member and a heat radiating member of the electronic component 54. The heat generated from the component 54 can be released.

  Further, since the electronic component 54 is also sealed by the sealing protective film 48, the moisture resistance of the electronic component 54 can be ensured.

  Further, since the scintillator 46 and the light detection substrate 44 are stacked on the support substrate 42 in a state where they can be separated from each other, when at least one of the scintillator 46 and the light detection substrate 44 is repaired or replaced, the scintillator 46 and the light detection substrate 44 44 can be easily separated from each other, and repair or replacement work is facilitated.

  Next, modified examples of the radiation detection panel 28 will be described with reference to FIGS. 11A to 17.

  FIG. 11A illustrates a case where the sealing protective film 48 is configured by laminating a scintillator protective layer 122c, a reflective layer (metal film) 122b, and a reflective protective layer 122a.

  The scintillator protection layer 122c is a resin film used to ensure waterproofness and moisture proofness and electrical insulation between the electronic component 54 and the flat cable 56 and the reflective layer 122b. The reflection layer 122b is made of a metal film such as an aluminum foil, and ensures waterproofness and moisture resistance, reduces electromagnetic noise, reflects visible light converted by the scintillator 46 toward the light detection substrate 44, and external light. And is used to dissipate heat generated from the electronic component 54 to the outside. The reflection protection layer 122a is a resin film used to protect the scintillator protection layer 122c and the reflection layer 122b.

  By configuring the sealing protective film 48 in this way, the moisture resistance of the scintillator 46 and the like is improved, and the sensitivity of each pixel 100 is improved by the incidence of visible light reflected by the reflective layer 122b on the light detection substrate 44, Reduction of electromagnetic noise with respect to the electronic component 54 and heat radiation to the outside of the heat generated from the electronic component 54 can be realized at once.

  In FIG. 11A, a part of the sealing protective film 48 is a reflective layer 122b made of a metal film such as an aluminum foil. However, instead of the reflective layer 122b, a resin film kneaded with a metal filler is used. Alternatively, the sealing protective film 48 may be made of a resin film kneaded with a metal filler. Even in this case, the above-described effects can be obtained.

  FIG. 11B illustrates a case where the heat-welded portions 80 and 82 are formed by thermally welding the sealing protective film 48 from above and below in the peripheral portion of the support substrate 42. Even in this case, moisture resistance of the scintillator 46 and the like can be secured.

  FIG. 12A illustrates the case where the cut portion 74 and the protective member 70 are provided between the electronic component 54 and the heat welding portion 80. Even in this case, each effect of the present embodiment described above can be obtained. In the configuration of FIG. 12A, since the protective members 70 are disposed on both the left and right sides of the electronic component 54, it is possible to achieve further reduction of electromagnetic noise and promotion of heat dissipation from the electronic component 54.

  FIG. 12B shows that a sheet member 124 made of a metal sheet such as aluminum is disposed on the back surface of the support substrate 42 (the surface opposite to the mounting surface of the electronic component 54) so as to face the notch 74. Thus, it is different from the configuration of FIG.

  In this case, there is a possibility that the surface of the support substrate 42 may be damaged when the blade edge of the blade 92 presses the support substrate 42 through the notch 74, but the sheet member 124 is disposed on the back surface of the support substrate 42. As a result, the sheet member 124 functions as a backing member. As a result, the rigidity of the electronic component 54, the connection portion 59, and the support substrate 42 when the blade 92 is pressed against is improved. 59 (flat cable 56) can be appropriately protected from bending or the like. Further, since the sheet member 124 is made of a metal sheet body, it is possible to reduce electromagnetic noise with respect to the electronic component 54 and to dissipate heat from the electronic component 54.

  FIG. 13A shows the configuration of FIG. 12B in that a sheet member 126 made of the same material as the above-described sheet member 124 is disposed on the back surface of the support substrate 42 so as to face the two cut portions 74 and the electronic component 54. Is different.

  In this case, a conductive member 128 that passes through the support substrate 42 and contacts the electronic component 54 is connected to the sheet member 126. Thereby, the effect similar to FIG. 12B mentioned above is acquired. In particular, the sheet member 126 is wider than the sheet member 124 and disposed so as to face the electronic component 54, and is in contact with the electronic component 54 via the conductive member 128, so The electromagnetic noise can be further reduced, and the heat from the electronic component 54 can be radiated more efficiently. Further, since the sheet member 126 is a backing member wider than the sheet member 124, the rigidity of the electronic component 54, the connection portion 59, and the support substrate 42 when the blade 92 is pressed against the electronic component 54 is further improved. And it becomes possible to protect the flat cable 56 from bending etc. reliably.

  In FIG. 13B, an electronic component 54 is disposed on the top surface of the flat cable 56 by a COF (Chip on film, Chip on flexible) technique, and aluminum or the like is disposed on the bottom surface of the flat cable 56 so as to face the electronic component 54. It differs from the structure of FIGS. 1-13A by the point by which the sheet | seat member 136 which consists of a metal sheet body is arrange | positioned.

  Thereby, the heat from the electronic component 54 can be efficiently radiated to the outside via the flat cable 56 and the sheet member 136. Further, electromagnetic noise with respect to the electronic component 54 can also be reduced. Further, since the sheet member 136 also functions as a backing member for the electronic component 54 and the flat cable 56, the rigidity of the electronic component 54 and the flat cable 56 can be improved and appropriately protected from bending or the like.

  In the configuration of FIG. 14A, a connector 58 is provided at the distal end portion of the flat cable 56, and the connection portion 59 is configured by the flat cable 56 and the connector 58.

  In this case, the electronic cassette 18 further includes a flat cable 60 that is electrically connected to the control unit 30 and the battery 34 (see FIG. 1), and a connector 62 is provided at the tip of the flat cable 60. . Therefore, for example, if the connector 62 on the control unit 30 and the battery 34 side is a male terminal and the connector 58 on the radiation detection panel 28 side is a female terminal, the flat cable can be obtained by fitting the connectors 58 and 62 together. 56 and 60 are electrically connected.

  An electronic component 54 is disposed on the upper surface of the connector 58 by COF technology, and a sheet member 130 made of a metal sheet such as aluminum is disposed on the bottom surface of the connector 58. On the other hand, a sheet member 132 made of the same material as the sheet member 130 is also disposed on the bottom surface of the connector 62.

  Here, when the connectors 58 and 62 are fitted, the battery 34 can supply power to the radiation detection panel 28 via the flat cable 60, the connectors 62 and 58, and the flat cable 56. The address signal generator 36 of the control unit 30 can supply an address signal to the electronic component 54 via the flat cable 60, the connectors 62 and 58, and the flat cable 56. Furthermore, the electronic component 54 can read an image signal from the light detection board 44 in accordance with the address signal, and output the read image signal to the control unit 30 via the connectors 58 and 62 and the flat cable 60.

  14A, when the connectors 58 and 62 are fitted, heat from the electronic component 54 can be efficiently radiated to the outside via the connectors 58 and 62 and the sheet members 130 and 132. Furthermore, the electromagnetic noise with respect to the electronic component 54 can also be reduced. Further, since the sheet members 130 and 132 also function as backing members for the electronic component 54, the connectors 58 and 62, and the flat cables 56 and 60, the rigidity of the electronic component 54, the connectors 58 and 62, and the flat cables 56 and 60 is improved. Appropriate protection from bending and the like is possible.

  FIG. 14B is different from the configuration of FIG. 14A in that the connectors 58 and 62 and a part of the flat cable 60 are both sealed by the sealing protective film 48 in a state where the connectors 58 and 62 are fitted.

  In this case, between the connector 58 and the support substrate 42, a sheet made of a metal sheet such as aluminum so as to face the connector 58 and the notch 74 and also functions as the protective member described above. A member 134 is inserted. Accordingly, heat from the electronic component 54 is radiated through the connectors 58 and 62 and the sheet members 132 and 134. Further, since the sheet members 132 and 134 are arranged from the peripheral edge portion to the cut portion 74 in the support substrate 42, the electronic when the cutting edge of the blade 92 is pressed against the sheet member 134 through the cut portion 74. The rigidity of the component 54 and the connectors 58 and 62 can be increased, and the electronic component 54 and the connectors 58 and 62 can be appropriately protected from bending or the like.

  15A is different from the configuration of FIG. 13B in that the electronic component 54 and the sheet member 136 are stacked on the flat cable 56, whereas in FIG. 15B, the connector 58, The electronic component 54 and the sheet member 130 are stacked and disposed, and the connector 62 and the sheet member 132 are stacked and disposed on the flat cable 60, which is different from the configuration of FIG. 14A. Even in the laminated structure as shown in FIGS. 15A and 15B, the same effects as those in the structures shown in FIGS.

  FIG. 16 shows that the support substrate 42 and the light detection substrate 44 are brought into close contact with each other via the weak adhesive layer 140a or the adhesive layer 140b of photo-plasticity or thermoplastic, and the light detection substrate 44 and the scintillator 46 are weakly adhesive layer 142a. Alternatively, it differs from the configuration of FIGS. 1 to 15B in that it is brought into intimate contact via a photo- or thermoplastic adhesive layer 142b.

  In this case, the support substrate 42, the light detection substrate 44, and the scintillator 46 are brought into close contact with each other via the weak adhesive layers 140a and 142a or the adhesive layers 140b and 142b when the radiation detection panel 28 is repaired or replaced. They can be easily separated, and repair or replacement work can be efficiently performed.

  17, the upper surface of the support substrate 42 (the surface on which the scintillator 46 and the light detection substrate 44 are disposed) is covered with a sheet-like sealing protective film 48, and the peripheral portion of the sealing protective film 48 (the support substrate 42). The peripheral edge) is sealed by thermal welding to show the case where the thermal welding part 150 is formed. Therefore, only one side (upper surface side) of the support substrate 42 on which the components of the radiation detector 68 are arranged is sealed with the sealing protective film 48. In this case, the upper surface of the support substrate 42 is covered with the sealing protective film 48 from above, and the peripheral portion of the support substrate 42 is thermally welded in a state where the sealing protective film 48 and each component of the radiation detector 68 are in close contact with each other. By doing so, the heat welding part 150 is formed.

  Also in the configuration of FIG. 17, the effects of the above-described embodiment can be easily obtained. Further, since the sheet-like sealing protective film 48 is used, the sealing protective film 48 is compared with the sealing protective film 48 (see FIGS. 1 to 16) that covers the entire radiation detector 68 with the bag 90. The amount of the sheet used for 48 is reduced, and the sealing protective film 48 can be manufactured at a lower cost.

  Note that the present invention is not limited to the above-described embodiment, and it is needless to say that various configurations can be adopted without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Radiation imaging system 12 ... Radiation 14 ... Subject 18 ... Electronic cassette 28 ... Radiation detection panel 42 ... Support substrate 44 ... Photodetection substrate 46 ... Scintillator 48 ... Sealing protective film 50 ... Photoelectric conversion layer 52 ... TFT layer 54 ... Electron Parts 56, 60 ... Flat cable 58, 62 ... Connector 59 ... Connection part 68 ... Radiation detector 70 ... Protection member 74 ... Notch part 78 ... Opening part 80, 82, 150 ... Thermal welding part 90 ... Bag body 92 ... Cutlery 122b ... Reflective layers 124, 126, 130, 132, 134, 136 ... Sheet member 128 ... Conductive members 140a, 142a ... Weak adhesive layers 140b, 142b ... Adhesive layer

Claims (17)

A scintillator that converts radiation into visible light;
A light detection substrate for converting the visible light into an electrical signal;
A sealing protective film made of a material that transmits the radiation, and sealing at least the scintillator and the light detection substrate;
Have
The sealing protective film is provided with a notch for opening the sealing protective film and taking out the scintillator and the light detection substrate from the sealing protective film,
The radiation detection panel, wherein the sealing protective film seals at least the scintillator and the light detection substrate by thermal welding so as to avoid the scintillator and the light detection substrate. The panel of claim 1.
A support substrate on which the scintillator and the light detection substrate are stacked;
The sealing protective film is configured in a bag shape in which an opening capable of taking in and out the scintillator, the light detection substrate, and the support substrate is formed.
After exhausting the inside of the sealing protective film through the opening in a state where the scintillator, the light detection substrate and the support substrate are accommodated in the bag-shaped sealing protective film through the opening. A radiation detection panel, wherein the opening is sealed by heat welding. The panel of claim 1.
A support substrate on which the scintillator and the light detection substrate are stacked;
The sealing protective film is configured in a sheet shape capable of covering the scintillator and the light detection substrate laminated on the support substrate,
In a state where the scintillator and the light detection substrate are laminated on the support substrate, the scintillator and the light detection substrate are covered with the sheet-shaped sealing protective film, and then a peripheral portion of the sealing protective film is thermally welded. A radiation detection panel characterized by being sealed by the above. The panel according to claim 2 or 3,
The cut portion is, when seen in a plan view, in the vicinity of the outer periphery of the scintillator and the light detection substrate in the sealing protective film, or between the scintillator and the light detection substrate and a heat-welded portion of the sealing protective film. The radiation detection panel characterized by being provided in. The panel of claim 4, wherein
A radiation detector, wherein a protective member that protects the support substrate when a blade is pressed against the cut portion from the outside is disposed at a position facing the cut portion in the support substrate. panel. In the panel of any one of Claims 2-5,
The radiation detection panel further comprising a connection portion that is electrically connected to the light detection substrate and is provided to be drawn out from a heat-welded portion of the sealing protective film. The panel of claim 6,
The radiation detection panel further comprising: an electronic component that is electrically connected to the connection portion and outputs the electric signal to the outside through the connection portion by driving the light detection substrate. The panel of claim 7,
The radiation detection panel, wherein the electronic component is sealed by the sealing protective film together with the scintillator and the light detection substrate, or provided at the connection portion. The panel of claim 8,
The connecting portion is a flat cable drawn out from the heat-welded portion, a connector that can be attached to and detached from an external cable, or provided at the flat cable and a tip portion of the flat cable. A radiation detection panel comprising the connector. The panel of claim 9,
The radiation detection panel according to claim 1, wherein the connection portion is provided with a sheet member that secures the rigidity of the connection portion and protects the connection portion. The panel of claim 8,
When the electronic component is sealed by the sealing protective film, the electronic component is disposed on the support substrate,
The radiation detection panel according to claim 1, wherein a sheet member that secures the rigidity of the electronic component and protects the electronic component is provided near the electronic component on the support substrate. The panel according to claim 10 or 11,
The radiation detection panel, wherein the sheet member has conductivity. The panel according to any one of claims 10 to 12,
The radiation detection panel, wherein the sheet member functions as a heat radiating member that radiates heat generated from the electronic component. The panel of claim 13.
When the electronic component is provided in the connection portion, the electronic component and the heat dissipation member are attached to the connection portion, or the electronic component and the heat dissipation member are attached to the connection portion. A radiation detection panel characterized by being laminated. The panel according to any one of claims 2 to 14,
The radiation detection panel, wherein the scintillator and the light detection substrate are stacked on the support substrate in a state where they can be separated from each other. In the panel of any one of Claims 1-15,
The radiation detection panel, wherein the sealing protective film includes a conductive member. A scintillator that converts radiation into visible light; a photodetection substrate that converts the visible light into an electrical signal; a sealing protective film that is made of a material that transmits the radiation and seals at least the scintillator and the photodetection substrate; A radiation detection panel having
The sealing protective film is provided with a notch for opening the sealing protective film and taking out the scintillator and the light detection substrate from the sealing protective film,
The radiation imaging apparatus, wherein the sealing protective film seals at least the scintillator and the light detection substrate by heat welding so as to avoid the scintillator and the light detection substrate.

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