JP5647581B2 - Radiography equipment - Google Patents

Description

  The present invention relates to a radiation imaging apparatus having a radiation conversion panel for acquiring radiation image information of a subject by detecting radiation transmitted through the subject.

  In recent years, in the medical field, a so-called DR (Digital Radiography) system is used in which a subject is irradiated with radiation, the radiation transmitted through the subject is converted into an electrical signal by a radiation conversion panel, and a radiation image is immediately read out and displayed. A radiography system has been developed.

  The radiation imaging system includes a radiation imaging apparatus configured by housing the radiation conversion panel in a housing.

  As this type of radiographic apparatus, the radiation conversion panel is supported in the casing by directly adhering the radiation conversion panel to the inner surface (irradiation part inner surface) of the region irradiated with radiation with an adhesive. There has been proposed a technical idea for reducing the weight by omitting a member for the purpose (see Patent Document 1).

  The radiation imaging apparatus may be deformed (damaged) or soiled by placing a subject on the casing. Further, when the radiation imaging apparatus is of a portable type (so-called cassette), the casing and the radiation conversion panel may be damaged by dropping the radiation imaging apparatus during transportation or use. And when the case or the radiation conversion panel is damaged, it is necessary to replace it.

  A radiation imaging apparatus used in a DR radiation imaging system has a radiation conversion panel including a large number of electrical components. For this reason, if even one point of the electrical component becomes defective, accurate interpretation becomes difficult, so that the radiation conversion panel needs to be repaired and replaced.

  In order to repair the radiation conversion panel, a technical idea has been proposed in which the plate-shaped radiation conversion panel bonded to the support is separated from the support using a separating means (see, for example, Patent Document 2). ).

US Patent Application Publication No. 2009/0122959 JP 2007-325924 A

  However, in the invention according to Patent Document 1 described above, since the radiation conversion panel is directly bonded to the inner surface of the irradiation part of the housing, the radiation conversion panel is replaced when the housing or the radiation conversion panel is replaced. Must be peeled from the inner surface of the irradiation site.

  When peeling the radiation conversion panel from the inner surface of the irradiation site, for example, if the end of the radiation conversion panel is gripped and pulled with the housing fixed, excessive bending stress acts on the radiation conversion panel and the The radiation conversion panel may be damaged. In fact, the radiation conversion panel often has a fragile glass substrate or the like, and has a structure that is easily damaged by the action of external stress.

  On the other hand, by applying the invention according to Patent Document 2 described above to the invention according to Patent Document 1, it is possible to peel off the radiation conversion panel in a state where bending stress acting on the radiation conversion panel is reduced. However, in this case, since the separation means is used, the cost is high, and the separation means may hit the radiation conversion panel or the casing, and the radiation conversion panel or the casing may be damaged.

  In order to reduce the bending stress, if the adhesive strength between the radiation conversion panel and the irradiation part inner surface is set to be weak, the radiation conversion panel is peeled off from the irradiation part inner surface due to an external impact such as when the radiation imaging apparatus is dropped. There is a problem. Further, if the casing and the radiation conversion panel are exchanged together, there is a problem that the cost increases.

  The present invention has been made in consideration of such a problem, and can prevent the radiation conversion panel from being peeled off from the housing due to an impact such as when the radiation imaging apparatus is dropped. Provided a radiographic apparatus that can be separated from the casing without damaging the radiation conversion panel without using a separating means or the like when replacing the casing, thereby preventing an increase in cost. The purpose is to do.

[1] A radiation imaging apparatus according to the present invention includes a radiation conversion panel that detects radiation transmitted through a subject and converts the radiation into radiation image information, an intermediate member provided in the radiation conversion panel, the radiation conversion panel, and the intermediate And a first adhesive member for adhering the intermediate member or the radiation conversion panel in a peelable state to an inner surface of an irradiation site irradiated with the radiation in the housing. The radiation conversion panel includes a substrate made of glass, and the intermediate member has higher bending rigidity than the radiation conversion panel .

  According to the radiation imaging apparatus of the present invention, the intermediate member is provided on the radiation conversion panel, and the radiation conversion panel or the intermediate member is bonded to the irradiation site inner surface of the housing by the first adhesive member in a peelable state. ing. Therefore, for example, when an operator or the like holds and pulls the intermediate member in a state where the casing is fixed, the bending stress acting on the radiation conversion panel is reduced as compared with the case where the intermediate member is not provided. Can be reduced.

Thus, for example, even when the adhesive strength between the intermediate member (or radiation conversion panel) and the inner surface of the irradiation site is such that it does not peel off due to external impact such as when the radiation imaging apparatus is dropped, the radiation conversion panel or housing When replacing the body, the radiation conversion panel can be separated from the housing without being damaged. In addition, since it is not necessary to use a special separating means or the like, it is possible to prevent an increase in cost. Furthermore, since the bending rigidity of the intermediate member is higher than the bending rigidity of the radiation conversion panel, the bending stress acting on the radiation conversion panel can be further reduced. Thereby, even if it is a case where a radiation conversion panel contains the board | substrate comprised with glass, it can isolate | separate from a housing | casing, without damaging a radiation conversion panel.

[2] In the above radiographic apparatus, the radiographic apparatus includes a second adhesive member for adhering the intermediate member to the radiation conversion panel, and the first adhesive member and the second adhesive member include the radiation conversion panel and The adhesive strength between the intermediate members may be set to be greater than the adhesive strength between the irradiation site inner surface and the intermediate member or between the irradiation site inner surface and the radiation conversion panel.

  According to such a configuration, the adhesive strength between the radiation conversion panel and the intermediate member is made larger than the adhesive strength between the inner surface of the irradiation site and the intermediate member (or the radiation conversion panel). Thereby, it can suppress that this radiation conversion panel peels from this intermediate member by external impacts, such as at the time of the fall of a radiography apparatus.

[3] In the above radiographic apparatus, the adhesion area between the radiation conversion panel and the intermediate member is an adhesion area between the irradiation site inner surface and the intermediate member, or an adhesion area between the irradiation site inner surface and the radiation conversion panel. May be larger.

  According to such a configuration, when the intermediate member is bonded to the inner surface of the irradiation site, if the bonding area between the radiation conversion panel and the intermediate member is larger than the bonding area between the inner surface of the irradiation site and the intermediate member, the radiation The adhesive strength between the conversion panel and the intermediate member can be easily made larger than the adhesive strength between the inner surface of the irradiation site and the intermediate member. On the other hand, when the radiation conversion panel is bonded to the inner surface of the irradiation site, if the bonding area between the radiation conversion panel and the intermediate member is larger than the bonding area between the inner surface of the irradiation site and the radiation conversion panel, the radiation conversion panel and The adhesive strength between the intermediate members can be easily made larger than the adhesive strength between the inner surface of the irradiation site and the radiation conversion panel.

[4] In the above radiographic apparatus, the adhesive force of the second adhesive member may be larger than the adhesive force of the first adhesive member.

  According to such a configuration, when the adhesive force of the second adhesive member is greater than the adhesive force of the first adhesive member, the adhesive strength between the radiation conversion panel and the intermediate member is set to be between the irradiation site inner surface and the intermediate member. The adhesive strength or the adhesive strength between the irradiation site inner surface and the radiation conversion panel can be easily increased.

[5] In the radiation imaging apparatus, the intermediate member may be bonded to the inner surface of the irradiation site with the first adhesive member.

  According to such a configuration, since the intermediate member is disposed between the irradiation part inner surface and the radiation conversion panel, an impact is applied to the radiation imaging apparatus as compared with the case where the radiation conversion panel is bonded to the irradiation part inner surface. The impact force acting on the radiation conversion panel can be suppressed. Thereby, even if it is a case where a radiation conversion panel is comprised including the member (for example, scintillator comprised by CsI etc.) weak to an impact, it becomes possible to suppress the damage suitably.

[6] In the above radiographic apparatus, the intermediate member is formed in a flat plate shape, the first adhesive member is disposed along an outer periphery of one surface of the intermediate member, and the second adhesive member May be disposed on the other surface of the intermediate member.

  According to such a configuration, since the first adhesive member is disposed on the outer periphery of one surface of the intermediate member, the outer periphery of one surface of the intermediate member can be firmly bonded to the inner surface of the irradiation site. . Thereby, it can suppress effectively that this intermediate member peels from this irradiation part inner surface by external impacts, such as at the time of the fall of a radiography apparatus. In addition, the first adhesive member can be positioned outside the radiographic image capturing range, and in this case, the first adhesive member can be prevented from affecting the image quality of the radiographic image. Furthermore, by disposing the second adhesive member on the other surface of the intermediate member, the radiation conversion panel can be efficiently bonded to the intermediate member.

[7] In the above radiographic apparatus, the first adhesive member may be disposed so as to include a central portion of one surface of the intermediate member.

  According to such a configuration, since the first adhesive member is disposed so as to include the central portion of one surface of the intermediate member, the intermediate member and the radiation conversion are caused by an external impact such as when the radiation imaging apparatus is dropped. It can suppress that the center part of a panel bends excessively and this radiation conversion panel is damaged.

[8] In the radiation imaging apparatus, the intermediate member may be provided with a grip portion.

  According to such a configuration, an operator or the like can pull the intermediate member while holding the grip portion. Thereby, it becomes easy to peel an intermediate member from an irradiation site | part inner surface. Further, as compared with the case where no gripping portion is provided, it is possible to suitably suppress damage of the radiation conversion panel due to the human hand hitting the edge of the radiation conversion panel when replacing the casing or the radiation conversion panel.

[9] In the above-described radiation imaging apparatus, the gripping part may protrude beyond the radiation conversion panel on the side opposite to the side where the irradiation site inner surface is located.

  According to such a configuration, the gripping part protrudes on the opposite side of the radiation conversion panel from the side on which the inner surface of the irradiation site is located, so that an operator or the like can easily grip the gripping part.

[10] In the above radiographic apparatus, the intermediate member is formed in a rectangular shape in a plan view, and the grip portion is a lateral side of the intermediate member or a longitudinal side of the intermediate member It may be provided in the part.

  According to such a configuration, when the grip portion is provided on the lateral side of the intermediate member, the intermediate member can be easily peeled off in the longitudinal direction. On the other hand, when the grip portion is provided on the side portion in the longitudinal direction of the intermediate member, the intermediate member can be easily peeled off in the lateral direction. And the direction which peels an intermediate member to a transversal direction can suppress the bending stress which acts on a radiation conversion panel rather than the case where an intermediate member is peeled to a longitudinal direction.

[11] In the above radiographic apparatus, the grip portion may be provided at a corner portion of the intermediate member or in the vicinity thereof.

  According to such a structure, since the grip part is provided in the corner | angular part of the intermediate member, or its vicinity, the corner | angular part of an intermediate member can be peeled from the irradiation site | part inner surface preferentially. In this case, it becomes easier to peel the intermediate member from the inner surface of the irradiated region.

[12] In the above radiographic apparatus, the grip portion may be formed in a rectangular tube shape and provided at an edge portion of the intermediate member.

  According to such a configuration, since the square cylindrical gripping portion is provided at the edge of the intermediate member, it is possible to further suppress the human hand from hitting the edge of the radiation conversion panel when replacing the housing or the radiation conversion panel. .

[13] In the above radiographic apparatus, a control unit that controls the radiation conversion panel, a flexible substrate that electrically connects the radiation conversion panel and the control unit, and an IC unit provided on the flexible substrate, The flexible substrate may be configured to be detachable from the radiation conversion panel, and the grip portion may be provided at a position other than the position corresponding to the position of the flexible substrate in the intermediate member. .

  According to such a configuration, since the grip portion is provided at a position other than the position corresponding to the position of the flexible substrate in the intermediate member, the grip portion becomes an obstacle when the flexible substrate is mounted (or removed). Never become.

[14] In the radiation imaging apparatus, a control unit that controls the radiation conversion panel, a flexible substrate that electrically connects the radiation conversion panel and the control unit, and an IC unit provided on the flexible substrate, The flexible substrate or the IC part may be fixed to the grip part.

  According to such a configuration, it is possible to prevent the flexible substrate or the IC unit from shaking and hitting the radiation conversion panel or the like when the radiation imaging apparatus is used. Thereby, while being able to suppress that a noise generate | occur | produces in a radiographic image by the impact which acts on a flexible substrate or IC part, it can suppress that a flexible substrate, IC part, or a radiation conversion panel is damaged.

[15] In the above radiographic apparatus, the gripping part may be formed so as to cover the IC part from the inner side of the irradiation site.

  According to such a configuration, since the grip portion is formed so as to cover the IC portion from the inner surface side of the irradiation site, the radiation dose irradiated to the IC portion can be reduced. Thereby, it can suppress that the said IC part is damaged by radiation.

[16] In the radiation imaging apparatus, the housing may be made of a metal material, and the grip portion may be made of a conductive material while being in contact with the housing. .

  According to such a configuration, the reference potential of the control unit, the flexible substrate, and the IC unit can be set to the potential of the housing. That is, the housing can be grounded. Thereby, the noise resistance of the IC part or the like can be improved.

[17] In the radiation imaging apparatus, the grip portion may be formed integrally with the intermediate member.

  According to such a configuration, since the grip portion is integrally formed with the intermediate member, it is possible to prevent the grip portion from being separated from the intermediate member when the grip portion is pulled.

[18] In the above radiographic apparatus, the gripping part is formed separately from the intermediate member, a fixing part fixed to one surface of the intermediate member, and a gripping part continuous to the fixing part And a main body.

  According to such a configuration, since the fixed portion is fixed to one surface of the intermediate member, the intermediate member can be effectively peeled from the inner surface of the irradiation site by gripping and pulling the grip portion main body.

[19] In the above radiographic apparatus, the intermediate member may include a plurality of plate members, and the plurality of plate members may be provided on the radiation conversion panel in a state of being separated from each other.

  According to such a configuration, since the plurality of plate members are provided in the radiation conversion panel in a state of being separated from each other, for example, when the intermediate member is configured as a single plate having the same size as the radiation conversion panel In comparison, the intermediate member can be lightened.

[20] In the above radiation imaging apparatus, the radiation conversion panel includes a scintillator that converts the radiation into visible light, and a photoelectric conversion unit that converts the visible light into an electrical signal corresponding to the radiation image information. You may do it.

  According to such a configuration, since the radiation conversion panel includes the scintillator and the photoelectric conversion unit, a high-quality radiation image can be obtained.

[21] In the radiation imaging apparatus, the radiation conversion panel may be stacked in the order of the photoelectric conversion unit and the scintillator along an irradiation direction of the radiation.

  According to such a configuration, since the photoelectric conversion unit and the scintillator are stacked in this order along the radiation direction, the radiation can be efficiently detected.

[22] In the above-described radiation imaging apparatus, the scintillator may include a columnar crystal structure.

  According to such a configuration, the scintillator includes a columnar crystal structure. Thereby, radiation can be detected more efficiently. Moreover, even if it includes a fragile columnar crystal structure, it can be separated from the housing without damaging the radiation conversion panel.

[23] In the radiation imaging apparatus, the bending rigidity of the intermediate member may be larger than the bending rigidity of the scintillator or the bending rigidity of the photoelectric conversion unit.

  According to such a configuration, since the bending rigidity of the intermediate member is made larger than the bending rigidity of the scintillator or the photoelectric conversion unit, the bending stress acting on the radiation conversion panel can be further reduced.

[24] In the radiation imaging apparatus, the photoelectric conversion unit may have a thickness of 20 μm to 300 μm.

  According to such a configuration, since the photoelectric conversion portion is thin, the amount of radiation that is transmitted through the photoelectric conversion portion and guided to the scintillator can be increased.

[25] In the above radiographic apparatus, the casing is formed in a U-shaped cross section and includes the irradiation part inner surface, and the intermediate member and the radiation are attached to the first case. And a second case forming a chamber for storing the conversion panel.

  According to such a configuration, since the first case of the housing is formed in a U-shaped cross section, for example, when the intermediate member (or radiation conversion panel) is bonded to the irradiation site inner surface by the first adhesive member Further, foreign matter such as dust can be suitably prevented from entering between the intermediate member (or radiation conversion panel) and the inner surface of the irradiation site.

[26] In the above radiographic apparatus, the intermediate member is bonded to the inner surface of the irradiation site by the first adhesive member, and the second adhesive member is fixed to the intermediate member main body. And a first buffer member bonded to the radiation conversion panel.

  According to such a configuration, since the intermediate member has the first buffer member, the first buffer member can absorb an external impact such as when the radiation imaging apparatus is dropped or an external load by the patient. . Thereby, it can suppress further that a radiation conversion panel is damaged.

[27] The radiation imaging apparatus may include a reinforcing member provided on a surface of the radiation conversion panel opposite to a side on which the irradiation portion inner surface is located.

  According to such a configuration, since the reinforcing member is provided on the surface opposite to the side where the irradiation site inner surface is located in the radiation conversion panel, it acts on the radiation conversion panel when peeling the intermediate member from the irradiation site inner surface. It is possible to effectively suppress bending stress. Moreover, since it is possible to form the intermediate member thin in a state where bending stress acting on the radiation conversion panel is suppressed, the radiation transmittance of the intermediate member can be improved. Thereby, the radiation which permeate | transmitted the to-be-photographed object can be efficiently irradiated to a radiation conversion panel.

[28] In the above-described radiation imaging apparatus, a second buffer member provided on a surface of the radiation conversion panel opposite to a side on which the irradiation portion inner surface is located, and a reinforcing member provided on the second buffer member And may be provided.

  According to such a configuration, since the second buffer member is provided, an external impact such as when the radiation imaging apparatus is dropped can be absorbed by the second buffer member. Therefore, damage to the radiation conversion panel can be further suppressed. Moreover, when the reinforcing member is provided, the bending stress acting on the radiation conversion panel can be effectively suppressed when the intermediate member is peeled off from the inner surface of the irradiated region.

[29] The radiation imaging apparatus may further include a support member that supports the second buffer member and the reinforcing member.

  According to such a configuration, since the second buffer member and the reinforcing member can be supported by the support member, it is possible to suitably suppress the second buffer member and the reinforcing member from being peeled off from the radiation conversion panel. . Moreover, the impact resistance and load resistance of the radiation conversion panel can be improved.

[30] In the above radiographic apparatus, the support member includes a support plate that contacts the other surface of the reinforcing member, a third buffer member interposed between the support plate and the housing, You may have.

  According to such a configuration, since the third buffer member is interposed between the support plate and the housing, it is possible to absorb an impact when the radiation imaging apparatus is dropped by the third buffer member. . Therefore, the impact which acts on a radiation conversion panel can be reduced.

[31] In the radiation imaging apparatus, the intermediate member may include a reflective layer that reflects the visible light emitted from the scintillator.

  According to such a configuration, since the intermediate member has the reflection layer, the transmitted light that has passed through the photoelectric conversion unit out of the visible light emitted by the scintillator is reflected by the reflection layer and guided to the photoelectric conversion unit. be able to. Thereby, the visible light emitted from the scintillator in the photoelectric conversion unit can be efficiently converted into an electrical signal corresponding to the radiation image information.

[32] In the above radiographic apparatus, the intermediate member may have a thermal diffusion layer bonded to the radiation conversion panel by the second adhesive member.

  By the way, the housing | casing which comprises a radiography apparatus may be heated by a patient's body temperature, for example, when image | photographing outside a medical institution (hospital), it may be heated by sunlight. When the casing is heated in this way, the heat is transmitted to the radiation conversion panel via the intermediate member. And when this radiation conversion panel is comprised including material with low heat conductivity, such as glass, a temperature difference may arise in this radiation conversion panel. As a result, the amount of dark current generated in the radiation conversion panel increases or decreases in accordance with the temperature difference, which may cause unevenness in the radiation image.

  However, according to said structure, since the radiation conversion panel and the heat | fever diffusion layer are adhere | attached with the 2nd adhesion member, the heat | fever of this radiation conversion panel can be diffused in this heat | fever diffusion layer. Thereby, since the temperature difference which arises in a radiation conversion panel can be made small, the nonuniformity of a radiographic image can be reduced.

[33] In the radiation imaging apparatus, the intermediate member includes a conductive layer bonded to the radiation conversion panel by the second adhesive member, and a connection member that grounds the conductive layer to ground. May be.

  According to such a configuration, since the electric charge charged between the intermediate member and the radiation conversion panel can flow to the ground through the conductive layer and the connection member, the radiation conversion panel malfunctions or deteriorates due to the electric charge. Can be prevented.

[34] In the above radiographic apparatus, the intermediate member may have a heat insulating layer. According to such a configuration, since the intermediate member has the heat insulation layer, even when the housing (irradiation site inner surface) is heated by the patient's body temperature, sunlight, or the like, the heat is transmitted to the radiation conversion panel. This can be suitably suppressed. Therefore, unevenness of the radiation image can be reduced.

[35] In the radiation imaging apparatus, the photoelectric conversion unit includes a solid detection element containing amorphous silicon, and the intermediate member includes a reset light source unit that irradiates the solid detection element with reset light. It may be.

  By the way, when the photoelectric conversion part has a solid-state detection element made of amorphous silicon (a-Si), a part of electric charges (electrons) converted from light emitted from the scintillator is a-Si impurity level ( Once trapped (defect). When long-time shooting such as moving image shooting is performed in this state, the temperature of the radiation conversion panel or the like rises in the housing, so that charges trapped in the impurity level of a-Si are easily released (darkness). Current increases). In other words, since the dark current varies between frames of moving image shooting, it is difficult to perform correction in consideration of the dark current.

  According to such a configuration, the reset light source unit can irradiate the solid-state detection element containing amorphous silicon (a-Si) with the reset light, so that the impurity level of the a-Si before the radiation is irradiated. Can be pre-filled with electrons. Thereby, it is possible to prevent charges converted from light emitted from the scintillator during irradiation of radiation from being captured by the impurity levels. Therefore, for example, even when the temperature of the radiation conversion panel or the like rises in the housing due to moving image shooting, the dark current of each frame is made constant (the variation in dark current between frames is reduced). Therefore, it is possible to perform correction in consideration of the dark current (dark current noise can be fixed noise).

[36] In the radiation imaging apparatus, the intermediate member includes a light guide member that guides the visible light emitted by the scintillator, and a light detection unit that detects the visible light guided by the light guide member; And a control unit that controls the photoelectric conversion unit, and the control unit may switch a control mode of the photoelectric conversion unit based on a detection result of the light detection unit.

  According to such a configuration, the visible light emitted from the scintillator is guided by the light guide member and detected by the light detection unit, and the control mode of the photoelectric conversion unit is switched based on the detection result. The mode switching timing can easily correspond to the radiation irradiation timing.

[37] In the above radiation imaging apparatus, the intermediate member is made of soda glass, the radiation conversion panel corresponds to a scintillator that converts the radiation into visible light, and the visible light corresponds to the radiation image information. A photoelectric conversion unit for converting into an electrical signal, the photoelectric conversion unit including a sensor substrate bonded to the intermediate member and made of alkali-free glass, and a solid-state detection element including amorphous silicon. You may go out.

  According to such a configuration, since the intermediate member is made of soda glass and the sensor substrate is made of alkali-free glass, sodium contamination of a-Si by soda glass can be suitably suppressed, The amount of radiation absorbed by the member and the sensor substrate can be reduced.

[38] In the above radiographic apparatus, a warp deformation suppressing portion that suppresses a warp deformation caused by a difference in thermal expansion coefficient from the radiation conversion panel may be formed on the intermediate member.

  According to such a configuration, even when the case is heated by the patient's body temperature, sunlight, or the like, even when the heat is transmitted to the intermediate member, the warp deformation suppressing portion is formed in the intermediate member. Therefore, the warp deformation of the intermediate member can be suitably suppressed.

  As described above, according to the radiation imaging apparatus of the present invention, the radiation conversion panel is provided with the intermediate member, and the radiation conversion panel or the intermediate member is peeled off from the irradiation part inner surface of the housing by the first adhesive member. For example, if the adhesive strength between the intermediate member (or radiation conversion panel) and the inner surface of the irradiated area is such that it does not peel off due to an external impact such as when the radiation imaging device is dropped. However, when replacing the radiation conversion panel or the casing, the radiation conversion panel can be separated from the casing without being damaged. In addition, since it is not necessary to use a special separating means or the like, it is possible to prevent an increase in cost.

It is a block diagram of a radiography system provided with the radiography apparatus which concerns on one Embodiment of this invention. It is a perspective view of the radiography apparatus shown in FIG. It is a disassembled perspective view of the radiography apparatus shown in FIG. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. FIG. 5A is a plan view of the intermediate member in a state where the first adhesive member is disposed, and FIG. 5B is a bottom view of the intermediate member in a state where the second adhesive member is disposed. It is a top view which shows the state before peeling an intermediate member from an irradiation site | part inner surface at the time of replacement | exchange of a 1st case or a radiation conversion panel. It is sectional drawing which followed the VII-VII line of FIG. 6 which shows the state which has peeled off the intermediate member from the irradiation site | part inner surface. FIG. 8A is a plan view of the intermediate member in a state in which the first adhesive member according to the first configuration example is disposed, and FIG. 8B is a state in which the first adhesive member according to the second configuration example is disposed. It is a top view of an intermediate member. FIG. 9A is a plan view of the intermediate member in a state where the first adhesive member according to the third configuration example is disposed, and FIG. 9B is a state in which the first adhesive member according to the fourth configuration example is disposed. It is a top view of an intermediate member. FIG. 10A is a plan view of the intermediate member in a state where the first adhesive member according to the fifth configuration example is disposed, and FIG. 10B is a state in which the first adhesive member according to the sixth configuration example is disposed. FIG. 10C is a plan view of the intermediate member in a state where the first adhesive member according to the seventh configuration example is disposed. It is a bottom view of the intermediate member in the state where the 2nd adhesion member concerning another example of composition was stuck. It is a disassembled perspective view of the radiography apparatus which concerns on a 1st modification. It is sectional drawing along the XIII-XIII line | wire of FIG. It is sectional drawing which shows the state which has peeled off the intermediate member which comprises the radiography apparatus which concerns on a 1st modification from the irradiation site | part inner surface. It is a disassembled perspective view of the radiography apparatus which concerns on a 2nd modification. It is a disassembled perspective view of the radiography apparatus which concerns on a 3rd modification. It is a disassembled perspective view of the radiography apparatus which concerns on a 4th modification. It is sectional drawing along the XVIII-XVIII line | wire of FIG. It is a disassembled perspective view of the radiography apparatus which concerns on a 5th modification. It is sectional drawing along the XX-XX line of FIG. It is a disassembled perspective view of the radiography apparatus which concerns on a 6th modification. It is sectional drawing along the XXII-XXII line | wire of FIG. It is a disassembled perspective view of the radiography apparatus which concerns on a 7th modification. FIG. 24 is a partially transparent bottom view of the intermediate member, the second adhesive member, and the radiation conversion panel shown in FIG. 23. FIG. 25A is a plan view of the intermediate member and the radiation conversion panel in a state in which the first adhesive member according to the first configuration example of the seventh modification is disposed, and FIG. 25B is a second configuration of the seventh modification. FIG. 25C is a plan view of the intermediate member and the radiation conversion panel in a state in which the first adhesive member according to the example is provided, and FIG. 25C is provided with the first adhesive member according to the third configuration example of the seventh modified example. It is a top view of the intermediate member and radiation conversion panel of a state. It is a disassembled perspective view of the radiography apparatus which concerns on an 8th modification. FIG. 27 is a partially transparent bottom view of the intermediate member, the second adhesive member, and the radiation conversion panel shown in FIG. 26. It is a top view which shows the intermediate member which concerns on another structural example of an 8th modification. It is sectional drawing of the radiography apparatus which concerns on a 9th modification. It is sectional drawing of the radiography apparatus which concerns on a 10th modification. It is sectional drawing of the radiography apparatus which concerns on an 11th modification. It is sectional drawing of the radiography apparatus which concerns on a 12th modification. It is sectional drawing of the radiography apparatus for demonstrating the 1st structural example of the supporting member shown in FIG. It is sectional drawing of the radiography apparatus which concerns on a 13th modification. It is sectional drawing of the radiography apparatus for demonstrating one structural example of the intermediate member shown in FIG. It is sectional drawing of the radiography apparatus for demonstrating the 2nd structural example of the intermediate member shown in FIG. It is sectional drawing of the radiography apparatus which concerns on a 14th modification. It is sectional drawing of the radiography apparatus for demonstrating the structural example of the intermediate member shown in FIG. It is sectional drawing of the radiography apparatus which concerns on a 15th modification. It is sectional drawing of the radiography apparatus which concerns on a 16th modification. It is a top view of the intermediate member shown in FIG. It is a block diagram of the cassette control part shown in FIG. It is sectional drawing of the radiography apparatus which concerns on a 17th modification. It is the graph which showed the relationship between glass plate thickness and X-ray transmittance. It is a top view of the intermediate member which comprises the radiography apparatus which concerns on an 18th modification. FIG. 46 is a cross-sectional view taken along line XLVI-XLVI in FIG. 45. It is sectional drawing of the radiography apparatus which concerns on a 19th modification. It is sectional drawing of the radiography apparatus which concerns on a 20th modification. It is sectional drawing for demonstrating the casing which concerns on a 1st structural example. It is sectional drawing for demonstrating the casing which concerns on a 2nd structural example. It is sectional drawing for demonstrating the casing which concerns on a 3rd structural example. It is sectional drawing for demonstrating the casing which concerns on a 4th structural example. It is a figure which shows roughly the structure for 3 pixels of the radiation conversion panel which concerns on a modification. FIG. 54 is a schematic configuration diagram of a TFT and a charge storage section shown in FIG. 53.

  Hereinafter, a preferred embodiment of the radiation imaging apparatus according to the present invention will be described in detail in relation to a radiation imaging system including the radiation imaging apparatus, with reference to the accompanying drawings.

  First, a radiation imaging system 10 including a radiation imaging apparatus 20A according to an embodiment of the present invention will be described. The radiation imaging system 10 according to the present embodiment is a so-called DR-type radiation imaging system, as shown in FIG. 1, in accordance with the imaging table 12 placed on the floor of a hospital and the imaging conditions. A radiation source 18 for irradiating a subject, for example, a patient 16 with radiation 14 comprising a dose; a radiation imaging apparatus 20A for detecting the radiation 14 placed on the imaging table 12 and transmitted through the patient 16; and the radiation A display device 22 that displays a radiation image based on the radiation 14 detected by the imaging device 20A, and a control device 24 that controls the radiation source 18, the radiation imaging device 20A, and the display device 22 are provided.

  Between each of the radiation source 18, the radiation imaging apparatus 20 </ b> A and the display device 22 and the control device 24, for example, UWB (Ultra Wide Band), IEEE802.11. Signals are transmitted and received by wireless communication using WiFi (Wireless Fidelity) such as a / g / n or millimeter waves. In addition, you may make it transmit a signal by connecting each of the radiation source 18, the radiography apparatus 20A, and the display apparatus 22, and the control apparatus 24 with a conducting wire.

  The radiation imaging apparatus 20A is a portable electronic cassette, and is used not only for the above-described position shooting but also for the standing position shooting or the special shooting.

  As shown in FIGS. 2 to 4, the radiation imaging apparatus 20 </ b> A includes a casing (housing) 26 made of a material that can transmit the radiation 14. The casing 26 includes a first case 28 and a second case 30, and the first case 28 is formed in a substantially rectangular shape in plan view and is irradiated with radiation 14, and the first plate portion 32. The second case 30 includes a second flat plate portion 36 having a shape corresponding to the first flat plate portion 32, and the second flat plate portion 36. And a second side wall portion 38 standing on the periphery.

  The first case 28 is configured to be detachable with respect to the second case 30, and a closed space 40 (see FIG. 4) is formed inside the casing 26 with the first case 28 attached to the second case 30. It is formed.

  Each of the first case 28 and the second case 30 constituting the casing 26 is made of composite material such as carbon fiber reinforced plastic (CFRP), engineer plastic, biomass material, aluminum, in order to reduce the weight of the entire radiographic apparatus 20A. , Aluminum alloy, magnesium, magnesium alloy or resin. In this case, the first case 28 and the second case 30 may be made of the same material, or may be made of different materials. FIG. 4 shows an example in which each of the first case 28 and the second case 30 is configured integrally with CFRP.

  As shown in FIG. 3, inside the casing 26, a battery 42 as a power source of the radiation imaging apparatus 20 </ b> A, a transmitter / receiver 44 that transmits / receives a signal including radiation image information and the like to / from the control device 24, and will be described later. A rectangular radiation conversion panel 46 that is supported by the first flat plate portion 32 via the intermediate member 72 in plan view, and a shielding plate 50 that is disposed in the mounting groove 48 formed on the inner surface of the second side wall portion 38. A cassette control unit 52 that is provided between the shielding plate 50 and the second flat plate portion 36 and drives and controls the radiation conversion panel 46 is disposed.

  The battery 42 supplies power to the transceiver 44, the radiation conversion panel 46, and the cassette control unit 52. The battery 42 and the transmitter / receiver 44 are juxtaposed along the short direction of the casing 26. In addition, it is desirable to arrange a lead plate (shielding plate) or the like (not shown) between the battery 42 and the first flat plate portion 32 and between the transceiver 44 and the first flat plate portion 32. This is because it is possible to prevent the battery 42 and the transmitter / receiver 44 from being irradiated with the radiation 14 and the battery 42 and the transmitter / receiver 44 from being deteriorated.

  As the radiation conversion panel 46, the radiation 14 that has passed through the patient 16 is temporarily converted into visible light by the scintillator 54, and the converted visible light is converted into an analog electrical signal by the photoelectric conversion unit 56. (Including a front side reading method and a back side reading method) can be used.

  An ISS (Iradiation Side Sampling) type radiation conversion panel 46 that is a surface reading method has a configuration in which a photoelectric conversion unit 56 and a scintillator 54 are sequentially arranged along the irradiation direction of the radiation 14. A PSS (Penetration Side Sampling) type radiation detector, which is a back side reading method, has a configuration in which a scintillator 54 and a photoelectric conversion unit 56 are sequentially arranged along the irradiation direction of the radiation 14.

  The radiation conversion panel 46 according to the present embodiment is configured as an ISS type radiation conversion panel. Normally, the scintillator 54 emits light more strongly on the irradiation surface side of the radiation 14 than on the back surface side. Therefore, in the ISS radiation conversion panel 46, the light emitted by the scintillator 54 is photoelectrically compared to the PSS radiation conversion panel. The distance to reach the converter 56 can be shortened. Thereby, since the diffusion / attenuation of the light can be suppressed, the resolution of the radiation image can be increased.

  Further, as the radiation conversion panel 46, in addition to the indirect conversion type radiation conversion panel described above, direct conversion in which the dose of the radiation 14 is directly converted into an electric signal by a solid detection element made of a substance such as amorphous selenium (a-Se). A type of radiation conversion panel can also be employed.

  The scintillator 54 is formed on the base plate by, for example, depositing cesium iodide (CsI: Tl) in a columnar crystal structure by a vacuum deposition method. Thereby, since the radiation 14 can be detected efficiently, the resolution of the radiation image can be further increased.

Note that the scintillator 54, on the base plate, for _{example, GOS (Gd 2 O 2 S} : Tb) may be formed by depositing. Even in this case, the radiation 14 can be converted into visible light. The base plate is made of, for example, CFRP, aluminum, aluminum alloy, magnesium, magnesium alloy, or resin.

  The photoelectric conversion unit 56 is laminated on one surface of the scintillator 54 (the surface on which the first flat plate portion 32 is located), and is a thin film transistor (TFT: Thin Film Transistor) deposited on a TFT substrate made of glass or the like. In this array, solid detection elements made of a substance such as amorphous silicon (a-Si) are arranged in a matrix. In addition, the thickness of the photoelectric conversion unit 56 is set to 20 [μm] to 700 [μm]. Furthermore, by setting the thickness to 20 [μm] to 300 [μm], it is possible to increase the amount of radiation 14 that is transmitted to the scintillator 54 through the photoelectric conversion unit 56.

  The photoelectric conversion unit 56 and the cassette control unit 52 are electrically connected by flexible substrates 58 and 60. The flexible substrate 58 is provided with a gate IC 62 that drives the TFT based on a signal from the cassette control unit 52. The flexible substrate 60 amplifies an analog electrical signal output from the solid-state detection element and also digital signals. An ASIC (Application Specific Integrated Circuit) 64 is provided for conversion into an ASIC. The flexible substrate 58 is detachably connected to the side portion in the longitudinal direction of the photoelectric conversion unit 56, and the flexible substrate 60 is detachably connected to the side portion in the short direction of the photoelectric conversion unit 56. .

  The shielding plate 50 is made of a material that absorbs back scattered radiation of the radiation conversion panel 46, for example, lead. Thereby, it is possible to prevent the backscattered rays of the radiation conversion panel 46 from being irradiated to the cassette control unit 52 and the cassette control unit 52 from being deteriorated. The shielding plate 50 is formed with a notch 66 for disposing the flexible substrate 58 and a notch 68 for disposing the flexible substrate 60. The cassette control unit 52 is supported by the shielding plate 50 via a plurality of brackets 70 (see FIG. 4).

  A plate-shaped intermediate member 72 is provided between the first flat plate portion 32 and the radiation conversion panel 46. The intermediate member 72 is formed to be slightly larger than the radiation conversion panel 46 in plan view. The size of the intermediate member 72 is desirably equal to or larger than the imaging range for the patient 16 in order to reduce the influence on the radiation image (radiation image unevenness and the like). Note that the intermediate member 72 may be formed to be the same size or slightly smaller than the radiation conversion panel 46 as long as it is not less than the imaging range.

  The intermediate member 72 has a bending rigidity higher than that of the radiation conversion panel 46. Thereby, when peeling the intermediate member 72 from the irradiation site | part inner surface 76 mentioned later, the bending stress which acts on the radiation conversion panel 46 can be reduced effectively. The intermediate member 72 may have a bending rigidity higher than the bending rigidity of the scintillator 54 or the bending rigidity of the photoelectric conversion unit 56. Also in this case, the bending stress can be reduced (see FIG. 4).

  Moreover, it is desirable that the intermediate member 72 is made of a material that has good permeability to the radiation 14. This is because the radiation 14 transmitted through the patient 16 can be efficiently irradiated onto the radiation conversion panel 46.

  Further, if the intermediate member 72 is made of a material having a high thermal diffusion effect, the heat transmitted from the patient 16 through the first flat plate portion 32 can be dispersed, so that the radiation image quality by the heat transmitted from the patient 16 is improved. The influence of can be reduced.

  Furthermore, if the intermediate member 72 is made of a material having a linear expansion coefficient similar to the linear expansion coefficient of the radiation conversion panel 46, it is preferable to prevent the radiation conversion panel 46 from being deformed (damaged) due to thermal strain of the intermediate member 72. be able to. The intermediate member 72 is made of, for example, CFRP, aluminum, aluminum alloy, magnesium, magnesium alloy, or resin.

  As shown in FIG. 5A, the intermediate member 72 can be peeled from the irradiation portion inner surface 76 (see FIG. 4) of the first flat plate portion 32 on one surface (first bonding surface) 74 of the intermediate member 72. A first adhesive member 78 for bonding in a state is provided.

  The first adhesive member 78 is composed of a belt-like double-sided tape, and is disposed on the outer periphery of the first adhesive surface 74. Specifically, the first adhesive member 78 extends along a pair of wide tapes 79 and 80 extending along the short sides of the first adhesive surface 74 and the long sides of the first adhesive surface 74. And a pair of narrow tapes 81 and 82. The wide tapes 79 and 80 are located at the corners of the first adhesive surface 74.

  The first adhesive member 78 may be configured such that a belt-like double-sided tape is attached in a square shape along the outer periphery of the first adhesive surface 74. In this case, it is preferable that the double-sided tape is formed with a first adhesive surface 74, an irradiation site inner surface 76, and a communication path that communicates the internal space surrounded by the double-sided tape and the closed space 40 in the casing 26. . By doing this, even when the pressure in the internal space becomes higher than the pressure in the closed space 40 due to the usage environment of the radiation imaging apparatus 20A, the intermediate member 72 is peeled off from the irradiation part inner surface 76 due to the pressure difference. It is because it can suppress suitably.

  The communication path is preferably bent (has a labyrinth structure). This is because foreign matters such as metal pieces that absorb the radiation 14 can be suitably prevented from entering the internal space from the closed space 40 through the communication path. The configuration of such a double-sided tape is described in Japanese Patent Application No. 2009-220935, and detailed illustration and description thereof will be omitted.

  In this way, by arranging the first adhesive member 78 on the outer periphery of the first adhesive surface 74, the outer periphery of the first adhesive surface 74 can be firmly adhered to the irradiation site inner surface 76, so the radiographic apparatus 20A. It is possible to suitably prevent the intermediate member 72 from being peeled off from the irradiated portion inner surface 76 due to an external impact such as when falling.

  Here, if the first adhesive member 78 is disposed outside the radiographic image capturing range, the first adhesive member 78 can be prevented from affecting the image quality of the radiographic image.

  The adhesive force of the wide tapes 79 and 80 is set to be the same as the adhesive force of the narrow tapes 81 and 82. The adhesive force can be arbitrarily set, but is preferably less than 1 [N / cm] at 180 ° peel adhesive force, for example. In this case, the intermediate member 72 adhered to the irradiation site inner surface 76 by the first adhesive member 78 can be peeled off with an appropriate force.

  The first adhesive member 78 may have the same adhesive force on both surfaces of the tape, or may have different adhesive force on both surfaces of the tape. In the latter case, it is necessary that the surface on the weak adhesive side is less than 1 [N / cm] in terms of 180 ° peel adhesive strength. Examples of the first adhesive member 78 include 4591HL (Sumitomo 3M Limited) double-sided tape and the like.

  The bonding area of the first bonding member 78 with respect to the first bonding surface 74 of the intermediate member 72 is desirably 1/2 or less of the total area of the first bonding surface 74. This is because if the bonding area is larger than ½ of the total area of the first bonding surface 74, it is difficult to peel the intermediate member 72 from the irradiation site inner surface 76.

  The tape width of the first adhesive member 78 can be arbitrarily set, but the adhesive strength between the intermediate member 72 and the irradiated portion inner surface 76 is such that the adhesive strength is not peeled off by an external impact such as when the radiation imaging apparatus 20A is dropped. The width is set to be Specifically, the tape width of the first adhesive member 78 is preferably set so that the peeling force when the corner of the intermediate member 72 is lifted is in the range of 1 [N] to 25 [N]. In this case, the intermediate member 72 is not peeled off from the irradiated portion inner surface 76 due to an external impact such as when the radiation imaging apparatus 20A is dropped, and when the first case 28 or the radiation conversion panel 46 of the casing 26 is replaced, the intermediate member 72 is removed. This is because it can be peeled off from the irradiated portion inner surface 76 with an appropriate force.

  As shown in FIGS. 5B and 6, the radiation conversion panel 46 is placed on the other surface (second bonding surface) 84 of the intermediate member 72 (the side on which the second flat plate portion 36 is located) with respect to the intermediate member 72. A second adhesive member 86 for bonding is provided.

  The second adhesive member 86 is composed of a double-sided tape having an adhesive force stronger than that of the first adhesive member 78, and a pair of wide tapes 87 extending along the short sides of the second adhesive surface 84. , 88 and a pair of narrow tapes 90, 91 extending along each long side of the second adhesive surface 84. That is, the disposition position of the second adhesive member 86 with respect to the second adhesive surface 84 is the same as the disposition position of the first adhesive member 78 with respect to the first adhesive surface 74 described above.

  The second adhesive member 86 may be configured such that a belt-like double-sided tape is attached in a square shape along the outer periphery of the second adhesive surface 84. The double-sided tape can have the same configuration as the quadrangular double-sided tape described for the first adhesive member 78 described above.

  Here, if the second adhesive member 86 is disposed outside the radiographic image capturing range, the second adhesive member 86 can be prevented from affecting the image quality of the radiographic image.

  The adhesive force of the wide tapes 87 and 88 is set to be the same as the adhesive force of the narrow tapes 90 and 91. The adhesive force can be arbitrarily set, and for example, it is preferably 1 [N / cm] or more at 180 ° peel adhesive force.

  This is because the adhesive strength between the intermediate member 72 and the radiation conversion panel 46 can be made larger than the adhesive strength between the intermediate member 72 and the irradiation site inner surface 76. In this case, the radiation conversion panel 46 can be reliably prevented from being peeled off from the intermediate member 72 due to an external impact such as when the radiation imaging apparatus 20A is dropped.

  The second adhesive member 86 may have the same adhesive force on both surfaces of the tape, or may have different adhesive force on both surfaces of the tape. In the latter case, the surface on the weak adhesive side needs to be 1 [N / cm] or more at 180 ° peel adhesive strength. As the second adhesive member 86, no. 5605 (manufactured by Nitto Denko Corporation) is exemplified.

  The tape width of the second adhesive member 86 is preferably set so that the peeling force when the corner of the radiation conversion panel 46 is lifted is 5 [N] or more. In this case, it is possible to prevent the radiation conversion panel 46 from being peeled off from the intermediate member 72 due to an external impact such as when the radiation imaging apparatus 20A is dropped.

  By the way, in the radiation imaging apparatus 20 </ b> A, when the patient 16 lies on the first flat plate portion 32 of the casing 26, the first flat plate portion 32 may be deformed (damaged) or soiled. Further, when the radiation imaging apparatus 20A is dropped, the casing 26 and the radiation conversion panel 46 may be damaged. For example, when the first flat plate portion 32 is damaged, the first case 28 of the casing 26 must be replaced. When the radiation conversion panel 46 is damaged, the radiation conversion panel 46 is replaced ( Repair).

  In the DR-type radiation imaging system 10, the quality of the radiation conversion panel 46 is normally confirmed by actually capturing a radiation image after assembling the radiation imaging apparatus 20A. Therefore, even when an abnormality is found in the radiation conversion panel 46 at this stage, it is necessary to replace the radiation conversion panel 46.

  Therefore, an example of replacing the first case 28 constituting the radiation imaging apparatus 20A according to the present embodiment will be described. First, the operator removes the first case 28 from the second case 30. Then, the flexible substrates 58 and 60 are removed from the radiation conversion panel 46, and the first case 28 is fixed on a work table (not shown) so that the irradiation part inner surface 76 of the first flat plate portion 32 of the first case 28 faces upward. (See FIG. 6).

  Subsequently, the operator grips the end of the intermediate member 72 with the hand H and pulls the end of the intermediate member 72 along the short-side direction to peel off the intermediate member 72 from the irradiated portion inner surface 76 (see FIG. 7). At this time, since the radiation conversion panel 46 is bonded to the intermediate member 72 by the second bonding member 86, the radiation conversion panel 46 is compared with the case where the radiation conversion panel 46 is directly bonded to the irradiation portion inner surface 76. The bending stress acting on the can be reduced.

  Thereby, even when the adhesive strength between the intermediate member 72 and the irradiated portion inner surface 76 is set so as not to be peeled off by an external impact such as when the radiation imaging apparatus 20A is dropped, the radiation conversion panel can be used when the first case 28 is replaced. 46 can be separated from the first case 28 without damage. It is particularly effective when the radiation conversion panel 46 includes a fragile CsI columnar crystal structure as in the present embodiment.

  Thereafter, the intermediate member 72 once peeled off on the inner surface of the irradiation part of the new first case is adhered by the first adhesive member 78, and the first case is attached to the second case 30. At this stage, the replacement of the first case 28 constituting the radiation imaging apparatus 20A according to the present embodiment is completed.

  Next, an example in which the radiation conversion panel 46 constituting the radiation imaging apparatus 20A according to the present embodiment is replaced will be described. In the description of the procedure for replacing the radiation conversion panel 46, the procedure up to the step of removing the intermediate member 72 from the irradiated portion inner surface 76 is the same as the procedure for replacing the first case 28 described above. Omitted.

  After peeling the intermediate member 72 from the inner surface 76 of the irradiation site, the radiation conversion panel 46 separated from the first case 28 is repaired, and the intermediate member 72 to which the repaired radiation conversion panel is bonded is attached to the first adhesive member 78. Then, the first case 28 is attached to the second case 30. At this stage, the exchange of the radiation conversion panel 46 constituting the radiation imaging apparatus 20A according to the present embodiment is completed.

  In the replacement procedure of the first case 28 or the radiation conversion panel 46 as described above, the direction in which the intermediate member 72 is pulled (the peeling direction) is not limited to the short direction of the intermediate member 72 and may be arbitrarily determined.

  According to the radiation imaging apparatus 20A according to the present embodiment, when the first case 28 or the radiation conversion panel 46 is damaged, only the damaged member can be replaced, thereby preventing the cost from rising. be able to.

  Moreover, since the intermediate member 72 is peeled from the irradiation site inner surface 76 along the short direction, the radiation conversion panel 46 is compared with the case where the intermediate member 72 is peeled from the irradiation site inner surface 76 along the longitudinal direction. The acting bending stress can be reduced.

  In the radiation imaging apparatus 20 </ b> A according to the present embodiment, the first case 28 of the casing 26 is configured by the first flat plate portion 32 and the first side wall portion 34. In other words, the first case 28 is formed in a U-shaped cross section. Thereby, for example, when the intermediate member 72 is bonded to the irradiation site inner surface 76 by the first adhesive member 78, it is preferable to prevent foreign matters such as dust from entering between the intermediate member 72 and the irradiation site inner surface 76. Can do.

  By the way, in the field of liquid crystal display, it is known that the liquid crystal display and the touch panel are separated by cutting an optical adhesive bonding layer that adhesively bonds the liquid crystal display and the touch panel with a separating device (separating means). (See, for example, Utility Model Registration No. 3148774).

  However, in the radiation imaging apparatus 20A according to the present embodiment, since the first case 28 is formed in a U-shaped cross section, the intermediate member 72 cannot be peeled off from the irradiation part inner surface 76 by the separating means as described above. . Further, in the radiation imaging apparatus 20A, it is necessary to check the operation of the radiation conversion panel 46 in a state where the radiation conversion panel 46 is assembled in the casing 26 (a state in which the radiation imaging apparatus 20A is a complete body) as described above. The technology in the liquid crystal display cannot be applied to the radiation imaging apparatus 20A according to the present embodiment.

  In this way, when the first case 28 is formed in a U-shaped cross section, bending stress is easily applied to the radiation conversion panel 46 when the intermediate member 72 is peeled off from the irradiation portion inner surface 76. However, as described above, since the bending stress acting on the radiation conversion panel 46 can be suppressed by the intermediate member 72, the radiation conversion panel 46 is not damaged when the first case 28 or the radiation conversion panel 46 is replaced. .

  The radiation imaging apparatus 20A according to the present embodiment is not limited to the above-described configuration, and can be changed to various configurations. For example, the adhesive force of the second adhesive member 86 may be smaller than the adhesive force of the first adhesive member 78. In this case, the adhesive strength between the intermediate member 72 and the radiation conversion panel 46 is smaller than the adhesive strength between the intermediate member 72 and the irradiation site inner surface 76. As described above, even if the adhesive force of the second adhesive member 86 is set to be relatively smaller than the adhesive force of the first adhesive member 78, the radiation conversion panel 46 is caused by an external impact such as when the radiation imaging apparatus 20A is dropped. If it does not peel from the intermediate member 72, there is no problem.

  The 1st adhesion member 78 is not limited to the composition mentioned above, for example, the 1st adhesion members 78a-78g shown in Drawing 8A-Drawing 10C may be sufficient.

  In the first adhesive member 78a according to the first configuration example shown in FIG. 8A, compared to the first adhesive member 78 shown in FIG. 5A, the first adhesive member 78a is provided at a substantially central portion of the first adhesive surface 74 (including the central portion). A central tape 92) is added. The central tape 92 is formed by cutting the same double-sided tape as the wide tapes 79 and 80 described above into a square shape.

  In this case, since the adhesive strength at the center of the first adhesive surface 74 is smaller than the adhesive strength at the outer periphery of the first adhesive surface 74, the intermediate member 72 can be easily peeled off from the irradiated portion inner surface 76.

  Further, since the first adhesive member 78a has the central tape 92, the central portion of the intermediate member 72 and the radiation conversion panel 46 is excessively bent by an external impact such as when the radiation imaging apparatus 20A is dropped, and the radiation conversion is performed. The panel 46 can be prevented from being damaged. In addition, the same effect is show | played also in the 1st adhesion members 78b-78g which concern on the 2nd-7th structural example mentioned later.

  In the first adhesive member 78b according to the second configuration example shown in FIG. 8B, the narrow tapes 81 and 82 are omitted as compared with the first adhesive member 78a shown in FIG. 8A.

  In the first adhesive member 78c according to the third configuration example shown in FIG. 9A, the wide tapes 79 and 80 are omitted and at the four corners of the first adhesive surface 74, compared to the first adhesive member 78b shown in FIG. 8B. Four corner tapes 96, 98, 100, 102 are provided. Each corner tape 96, 98, 100, 102 has the same configuration as the central tape 92 described above.

  In the first adhesive member 78d according to the fourth configuration example shown in FIG. 9B, the intermediate tape 104 and the corner tape 96 adhered between the corner tape 96 and the corner tape 100 are compared with the first adhesive member 78c shown in FIG. 9A. An intermediate tape 106 attached between the tape 98 and the corner tape 102 is added. The intermediate tapes 104 and 106 are positioned so as to sandwich the central tape 92 along the short direction of the intermediate member 72. The intermediate tapes 104 and 106 have the same configuration as the central tape 92 described above.

  In the first adhesive member 78e according to the fifth configuration example shown in FIG. 10A, the central tape extends in the short direction of the intermediate member 72 instead of the central tape 92, as compared with the first adhesive member 78b shown in FIG. 8B. 108 is used. The central tape 108 has the same configuration as the wide tapes 79 and 80.

  In the first adhesive member 78f according to the sixth configuration example shown in FIG. 10B, the widths of the wide tapes 79 and 80 are about twice the width of the central tape 108 as compared to the first adhesive member 78e shown in FIG. 10A. ing.

  In the first adhesive member 78g according to the seventh configuration example shown in FIG. 10C, the wide tapes 79 and 80 are omitted and the narrow tape 81 and the narrow tape are compared with the first adhesive member 78 shown in FIG. 5A. A central tape 110 extending along the longitudinal direction of the intermediate member 72 is provided in the middle of 82. The central tape 110 has the same configuration as the narrow tapes 81 and 82.

  Here, the bonding area of the first bonding member 78f to the first bonding surface 74 is set to be the same as the bonding area of the first bonding member 78e described above. In this case, the widths of the narrow tapes 81 and 82 and the central tape 110 (the length along the short direction of the intermediate member 72) are the same as the widths of the wide tapes 79 and 80 and the central tape 108 (the intermediate member 72). The length along the longitudinal direction) is sufficiently narrower. Therefore, the peeling force necessary to peel off the intermediate member 72 bonded by the first bonding member 78g from the irradiation site inner surface 76 along the longitudinal direction of the intermediate member 72 bonded by the first bonding member 78e. It becomes smaller than the peeling force required to peel from the irradiation site inner surface 76 along the short direction.

  The second adhesive member 86 is not limited to the configuration described above, and may be, for example, the second adhesive member 86a shown in FIG. In the second adhesive member 86a shown in FIG. 11, instead of the wide tapes 87 and 88 and the narrow tapes 90 and 91 described above, a full surface tape 111 provided on substantially the entire one surface of the radiation conversion panel 46 is used. . In this case, the adhesion area between the second adhesion surface 84 and the radiation conversion panel 46 is larger than the adhesion area between the first adhesion surface 74 and the irradiation site inner surface 76. Therefore, the adhesive strength between the intermediate member 72 and the radiation conversion panel 46 can be easily made larger than the adhesive strength between the intermediate member 72 and the first case 28.

  The adhesion area between the second adhesion surface 84 and the radiation conversion panel 46 is preferably at least twice the adhesion area between the first adhesion surface 74 and the irradiation part inner surface 76. In this case, it is possible to effectively suppress the radiation conversion panel 46 from being peeled off from the intermediate member 72 due to an external impact such as when the radiation imaging apparatus 20A is dropped.

  By the way, in the radiation conversion panel 46 of the ISS system, the thickness of the photoelectric conversion unit (substrate of the photoelectric conversion unit) 56 is reduced in order to increase the amount of the radiation 14 irradiated to the scintillator 54 and improve the quality of the radiation image. It is desirable to do. However, when the thickness of the photoelectric conversion unit 56 is reduced, the radiation conversion panel 46 is easily bent.

  Therefore, for example, when the second adhesive member 86 is provided only on the outer periphery of the second adhesive surface 84 of the intermediate member 72, the center of the radiation conversion panel 46 bends when an impact is applied to the radiation imaging apparatus 20A. There is. As a result, the outer peripheral portion of the radiation conversion panel 46 may be damaged, or the central portion of the radiation conversion panel 46 and / or the cassette control unit 52 may be damaged when the radiation conversion panel 46 hits the cassette control unit 52. There is also.

  Although the detailed illustration is omitted, the second adhesive member 86 constituting the radiation imaging apparatus 20A according to the present embodiment is provided at a substantially central portion of the second adhesive surface 84 in addition to the double-sided tape shown in FIG. 5B. It may also have a central tape (arranged to include the central part). That is, the arrangement of the double-sided tape of the second adhesive member 86 may be the same as the arrangement of the double-sided tape of the first adhesive members 78a to 78g shown in FIGS. 8A to 10C described above.

  In this case, when an impact is applied to the radiation imaging apparatus 20 </ b> A, it is possible to suitably suppress the central portion of the radiation conversion panel 46 from being bent. Further, since the intermediate member 72 is disposed between the irradiation part inner surface 76 and the radiation conversion panel 46, it is possible to suppress the radiation conversion panel 46 from being rattled by the impact. Thereby, it can suppress that the scintillator 54 comprised with CsI weak to an impact breaks. In addition, it is preferable that the intermediate member 72 is comprised with organic materials, such as CFRP etc., with a material with the high transmittance | permeability of the radiation (X-ray | X_line) 14 rather than glass.

  Next, modifications (first modification to twentieth modification) of the radiation imaging apparatus 20A described above will be described with reference to FIGS. Note that, in these modified examples, the same reference numerals are assigned to configurations common to the above-described embodiment, and detailed description thereof is omitted.

(First modification)
First, a radiation imaging apparatus 20B according to a first modification will be described with reference to FIGS. As shown in FIGS. 12 and 13, in the radiation imaging apparatus 20 </ b> B according to this modification, from the side of the intermediate member 72 corresponding to the side where the flexible substrate 58 is not positioned in the short direction of the radiation conversion panel 46. A protruding portion (gripping portion) 112 that protrudes toward the second flat plate portion 36 is provided.

  The protrusion 112 has a rectangular cross section and is formed integrally with the intermediate member 72. The protruding portion 112 extends along the longitudinal direction of the intermediate member 72, and both end surfaces in the extending direction of the protruding portion 112 are flush with both end surfaces in the longitudinal direction of the intermediate member 72. In addition, the end surface of the protruding portion 112 on the second flat plate portion 36 side extends further downward than the radiation conversion panel 46 and terminates immediately above the shielding plate 50 (see FIG. 13).

  As shown in FIG. 14, in the radiation imaging apparatus 20 </ b> B according to this modification, the operator can pull the intermediate member 72 while holding the protruding portion 112. Thereby, it becomes easier to peel the intermediate member 72 from the irradiation part inner surface 76 further. Further, as compared with the case where the projecting portion 112 is not provided, when the first case 28 or the radiation conversion panel 46 is replaced, the human hand H hits the edge of the radiation conversion panel 46 and the radiation conversion panel (scintillator 54) 46 is damaged. It can suppress suitably. In addition, since the protrusion part 112 protrudes to the 2nd flat plate part 36 side rather than the radiation conversion panel 46, an operator tends to hold | grip this protrusion part 112. FIG.

  According to the radiation imaging apparatus 20B according to the present modification, the projecting portion 112 is provided on the side portion on the side where the flexible substrate 58 is not positioned in the longitudinal direction of the intermediate member 72. It becomes easy to peel the intermediate member 72 along the short side direction while holding the 112. When the flexible substrate 58 is attached to (or removed from) the radiation conversion panel 46, the protrusion 112 does not get in the way.

  Further, when a portion corresponding to the corner portion of the intermediate member 72 or the vicinity thereof in the protruding portion 112 is gripped, the corner portion of the intermediate member 72 can be peeled off from the irradiation portion inner surface 76 with priority. In this case, it becomes easier to peel the intermediate member 72 from the irradiation part inner surface 76.

(Second modification)
Next, a radiation imaging apparatus 20C according to a second modification will be described with reference to FIG. As shown in FIG. 15, in the radiation imaging apparatus 20 </ b> C according to this modification, the protruding portion protrudes toward the second flat plate portion 36 from the side portion where the flexible substrate 60 is not positioned in the short direction of the intermediate member 72. 114 is provided.

  The protrusion 114 has a rectangular cross section and is formed integrally with the intermediate member 72. The protruding portion 114 extends in the short direction of the intermediate member 72, and each end surface in the extending direction of the protruding portion 114 is flush with each of both end surfaces in the short direction of the intermediate member 72. ing. Further, the end surface of the protruding portion 114 on the second flat plate portion 36 side is located closer to the second flat plate portion 36 than the radiation conversion panel 46.

  In this case, since the protruding portion 114 is provided on the side portion of the intermediate member 72 on the side where the flexible substrate 60 is not located, the operator holds the protruding portion 114 in the longitudinal direction while holding the protruding portion 114 in the longitudinal direction. It becomes easy to peel along the direction.

(Third Modification)
Next, a radiation imaging apparatus 20D according to a third modification will be described with reference to FIG. As shown in FIG. 16, in the radiation imaging apparatus 20 </ b> D according to this modification, a protruding portion 116 is provided so as to protrude from the edge of the intermediate member 72 toward the second flat plate portion 36. The protrusion 116 is integrally formed with the intermediate member 72 in a square tube shape, and the end surface of the protrusion 116 on the second flat plate portion 36 side is located closer to the second flat plate portion 36 than the radiation conversion panel 46. Yes. In this case, it is possible to further prevent the human hand H from hitting the edge of the radiation conversion panel 46 when the first case 28 or the radiation conversion panel 46 is replaced.

(Fourth modification)
Next, a radiation imaging apparatus 20E according to a fourth modification will be described with reference to FIGS. As shown in FIG. 17, in the radiation imaging apparatus 20E according to this modification, a pair of protrusions 118 and 120 are added to the intermediate member 72, compared to the radiation imaging apparatus 20B according to the first modification in FIG. ing.

  The protrusion 118 is disposed at a position corresponding to the position of the flexible substrate 58 in the intermediate member 72. The protruding amount of the protruding portion 118 is the same as the protruding amount of the protruding portion 112, and the width of the protruding portion 118 (the length in the longitudinal direction of the intermediate member 72) is slightly longer than the width of the flexible substrate 58. Yes. Further, the end surface of the gate IC 62 is in contact with or pressed against the protrusion 118 (see FIG. 18).

  The protruding portion 120 is disposed at a position corresponding to the position of the flexible substrate 60 in the intermediate member 72. Since the shape of the protrusion 120 is the same as the shape of the protrusion 118, detailed description thereof is omitted. Although not shown in detail, the end surface of the ASIC 64 is in contact with or pressed against the protrusion 120.

  According to the radiation imaging apparatus 20E according to this modification, the end surface of the gate IC 62 is in contact with or pressed against the protruding portion 118, so that the flexible substrate 58 and the gate IC 62 are shaken when the radiation imaging apparatus 20E is used. It is possible to suppress hitting the conversion panel 46 and the like. Thereby, it is possible to suppress the generation of noise in the radiation image due to the impact acting on the flexible substrate 58 or the gate IC 62, and it is possible to suppress the damage of the flexible substrate 58, the gate IC 62 or the radiation conversion panel 46.

  In addition, since the end face of the ASIC 64 is in contact with or pressed against the protrusion 120, it is possible to prevent the flexible substrate 60 and the ASIC 64 from shaking and hitting the radiation conversion panel 46 or the like when using the radiation imaging apparatus 20E. Thereby, it is possible to suppress the generation of noise in the radiation image due to the impact acting on the flexible substrate 60 or the ASIC 64, and it is possible to suppress the flexible substrate 60, the ASIC 64, or the radiation conversion panel 46 from being damaged.

  In this modification, the flexible substrate 58 may be brought into contact with or pressed against the protruding portion 118 instead of the gate IC 62, and the flexible substrate 60 may be brought into contact with or pressed against the protruding portion 120 instead of the ASIC 64. Even in this case, the same effects as described above can be obtained.

(5th modification)
Next, a radiation imaging apparatus 20F according to a fifth modification will be described with reference to FIGS. As shown in FIG. 19, in the radiation imaging apparatus 20 </ b> F according to this modification, a rectangular cylindrical handle (gripping part) 122 is provided on the side surface of the intermediate member 72 so as to surround the intermediate member 72. The end surface on the second flat plate portion 36 side of the handle portion 122 is located closer to the second flat plate portion 36 than the radiation conversion panel 46 (see FIG. 20). The handle portion 122 is formed of a member having a shock absorbing property (shock absorbing property) such as rubber.

  According to the radiation imaging apparatus 20F according to the present modification, the handle portion 122 made of a buffering member is provided. Therefore, when the radiation imaging apparatus 20F is used, the flexible substrates 58 and 60, the gate IC 62 or the ASIC 64 are used. Even if it hits the handle part 122, the impact can be absorbed by the handle part 122. Thereby, it can suppress that the flexible substrates 58 and 60, gate IC62, or ASIC64 are damaged.

(Sixth Modification)
Next, a radiation imaging apparatus 20G according to a sixth modification will be described with reference to FIGS. As shown in FIGS. 21 and 22, in the radiation imaging apparatus 20 </ b> G according to this modification, the casing 26 is made of a metal material, and the intermediate member 72 has three handles (gripping parts) 124, 126, and 128. Is provided.

  The handle portion 124 includes a fixing portion 130 that is fixed to the first adhesive surface 74, and a bending portion (gripping portion main body) 132 that can be held by the human hand H continuously from the fixing portion 130. In addition, although the handle part 124 may be comprised with arbitrary materials, in this modification, it is comprised with the same material as the handle parts 126 and 128 demonstrated later.

  The fixing portion 130 is provided over the entire length of the side portion on the side where the flexible substrate 58 is not positioned in the short direction of the intermediate member 72. The curved portion 132 is gradually formed thinner toward the fixed portion 130. Further, the end portion of the bending portion 132 opposite to the fixing portion 130 is located closer to the second flat plate portion 36 than the radiation conversion panel 46 and is rounded.

  The handle portion 126 has a configuration in which the width of the handle portion 124 (the length in the longitudinal direction of the intermediate member 72) is shortened, and is made of a conductive material that hardly transmits the radiation 14, for example, a metal material such as copper. It is configured.

  Further, the fixing portion 134 of the handle portion 126 is fixed at a position corresponding to the position of the flexible substrate 58 on the first bonding surface 74. The curved portion 136 of the handle portion 126 is formed so as to contact the first side wall portion 34 of the casing 26 and cover the flexible substrate 58 and the gate IC 62 from the first flat plate portion 32 side (see FIG. 22). Note that the gate IC 62 is fixed to the bending portion 136 in an electrically connected state.

  The handle portion 128 has the same configuration as the handle portion 126, and includes a fixing portion 138 fixed at a position corresponding to the position of the flexible substrate 60 on the first adhesive surface 74, and the flexible substrate 60 and the ASIC 64 in the first flat plate portion. And a curved portion 140 covering from the 32 side. Although not shown in detail, the ASIC 64 is fixed to the bending portion 140 that contacts the first side wall portion 34 of the casing 26 in an electrically connected state.

  According to the radiation imaging apparatus 20G according to the present modification, the handle portion 126 is provided so as to cover the flexible substrate 58 and the gate IC 62 from the side where the first flat plate portion 32 is located, so that the flexible substrate 58 and the gate IC 62 are irradiated. The amount of radiation 14 applied can be reduced. Thereby, it is possible to prevent the flexible substrate 58 and the gate IC 62 from being damaged by the radiation 14.

  Further, since the gate IC 62 is electrically connected to the casing 26 through the handle portion 126, the reference potential of the gate IC 62 and the flexible substrate 58 (cassette control unit 52) can be set to the potential of the casing 26. That is, the casing 26 can be a ground. Thereby, noise resistance of the gate IC 62 and the like can be improved.

  Similarly, since the handle portion 128 is provided so as to cover the flexible substrate 60 and the ASIC 64 from the side where the first flat plate portion 32 is located, it is possible to prevent the flexible substrate 60 and the ASIC 64 from being damaged by the radiation 14. It is.

  Furthermore, since the ASIC 64 is electrically connected to the casing 26 via the handle portion 128, the noise resistance of the ASIC 64 and the like can be improved.

(Seventh Modification)
Next, a radiation imaging apparatus 20H according to a seventh modification will be described with reference to FIGS. As shown in FIG. 23, in the radiation imaging apparatus 20H according to the present modification, an intermediate member 141 is used instead of the intermediate member 72. The intermediate member 141 has three plate members 142, 144, and 146 having the same configuration, and each plate member 142, 144, and 146 is 1/5 with respect to the length in the longitudinal direction of the intermediate member 72 described above. It has a certain width and is formed in a rectangular parallelepiped shape.

  The plate member 142 is disposed on the side where the flexible substrate 60 is positioned in the longitudinal direction of the radiation conversion panel 46, the plate member 144 is disposed in the center in the longitudinal direction of the radiation conversion panel 46, and the plate member 146 is The flexible substrate 60 is disposed on the side where the radiation conversion panel 46 is not located in the longitudinal direction. The plate members 142, 144, and 146 extend over the entire length of the radiation conversion panel 46 in the end-hand direction and are separated from each other (see FIG. 25).

  A first adhesive member 154 is provided on one surface (first adhesive surface) 148, 150, 152 of the plate members 142, 144, 146. The first adhesive member 154 is composed of the same type of double-sided tape as the first adhesive member 78 described above, and is a rectangular long tape 156 provided on the first adhesive surface 148 and an abbreviation of the first adhesive surface 150. A square tape 158 provided in the center and a rectangular long tape 160 provided on the first adhesive surface 152 are provided.

  A second adhesive member 168 (see FIG. 24) is provided on the other surface (second adhesive surface) 162, 164, 166 of the plate members 142, 144, 146.

  The second adhesive member 168 is made of the same type of double-sided tape as the above-described second adhesive member 86, and the entire surface tape 170 attached to the substantially entire surface of the second adhesive surface 162 and the second adhesive surface 164. A full-face tape 172 attached to substantially the entire surface and a full-face tape 174 attached to substantially the entire surface of the second adhesive surface 166 are provided.

  In the radiation imaging apparatus 20H according to this modification, when the first case 28 or the radiation conversion panel 46 is replaced, the operator peels the plate members 142, 144, and 146 from the irradiation portion inner surface 76 along the longitudinal direction thereof. Is preferred. This is because the bending stress acting on the radiation conversion panel 46 can be reduced as compared with the case where the plate members 142, 144, and 146 are peeled off from the irradiation site inner surface 76 along the short direction. In addition, when it is difficult to distinguish the extending direction of the plate members 142, 144, and 146, the extending direction may be displayed by a display unit or the like at a position where the operator can easily recognize the extending direction.

  In the radiation imaging apparatus 20H according to this modification, image correction may be performed in order to reduce the influence of the plate members 142, 144, and 146 on the radiation image. Specifically, the radiation image data of the plate members 142, 144, and 146 may be acquired in advance, and the difference between the actual radiation image data and the radiation image data of the plate members 142, 144, and 146 may be taken.

  According to the radiographic apparatus 20H according to this modification, instead of the above-described intermediate member 72, plate members 142, 144, and 146 having a width of about 1/5 with respect to the length in the longitudinal direction of the intermediate member 72. Therefore, the radiation imaging apparatus 20H can be reduced in weight.

  In the radiation imaging apparatus 20H according to this modification, the first adhesive member 154 is not limited to the above-described configuration, and may be, for example, first adhesive members 154a to 154c illustrated in FIGS. 25A to 25C.

  As shown in FIG. 25A, the first adhesive member 154a according to the first configuration example of the present modification is the same as the long tape 156 instead of the square tape 158 as compared with the first adhesive member 154 shown in FIG. A structured long tape 176 is used.

  As shown in FIG. 25B, in the first adhesive member 154b according to the second configuration example of the present modified example, the length of the plate member 142 is replaced with the long tape 156 as compared with the first adhesive member 154 shown in FIG. Square tapes 178 and 180 provided at both ends in the direction are used, and square tapes 182 and 184 provided at both ends in the longitudinal direction of the plate member 146 are used instead of the long tape 160.

  As shown in FIG. 25C, in the first adhesive member 154c according to the third configuration example of this modification, the square tape 158 is sandwiched in the longitudinal direction of the plate member 144 as compared with the first adhesive member 154b shown in FIG. 25B. Thus, square tapes 186 and 188 are added. The square tape 186 is located between the square tape 178 and the square tape 182, and the square tape 188 is located between the square tape 180 and the square tape 184.

(Eighth modification)
Next, a radiation imaging apparatus 20I according to an eighth modification will be described with reference to FIGS. As shown in FIG. 26, in the radiation imaging apparatus 20I according to this modification, an intermediate member 190 is used instead of the intermediate member 72. The intermediate member 190 has three plate members 192, 194, 196 having the same configuration, and each plate member 192, 194, 196 is about 1/5 of the length of the intermediate member 72 in the short direction. And has a rectangular parallelepiped shape.

  The plate member 192 is disposed on the side where the flexible substrate 58 is positioned in the short direction of the radiation conversion panel 46, and the plate member 194 is disposed in the approximate center of the radiation conversion panel 46 in the short direction. Is disposed on the side of the radiation conversion panel 46 where the flexible substrate 58 is not located. Each plate member 192, 194, 196 extends over the entire length of the radiation conversion panel 46.

  A first adhesive member 203 is provided on one surface (first adhesive surface) 198, 200, 202 of the plate members 192, 194, 196. The first adhesive member 203 is composed of the same type of double-sided tape as the first adhesive member 78 described above, and square tapes 204 and 208 provided on both ends in the longitudinal direction of the first adhesive surface 198, A square tape 206 provided substantially at the center of the adhesive surface 198, a square tape 210 provided substantially at the center of the first adhesive surface 200, and a square tape 212 provided on both ends in the longitudinal direction of the first adhesive surface 202. 216 and a square tape 214 provided substantially at the center of the first adhesive surface 202.

  A second adhesive member 223 (see FIG. 27) is provided on the other surface (second adhesive surface) 218, 220, 222 of the plate members 192, 194, 196. The second adhesive member 223 is made of the same type of double-sided tape as the second adhesive member 86 described above, and the full-surface tape 224 provided on the substantially entire surface of the second adhesive surface 218 and the approximate of the second adhesive surface 220. A full-face tape 226 provided on the entire surface and a full-face tape 228 provided on substantially the entire surface of the second adhesive surface 222 are provided.

  The radiation imaging apparatus 20I according to this modification has the same effects as the radiation imaging apparatus 20H according to the seventh modification described above. In this modification, when exchanging the first case 28 or the radiation conversion panel 46, the operator peels off each plate member 192, 194, 196 from the irradiation part inner surface 76 along the longitudinal direction.

  In the radiation imaging apparatus 20I according to this modification, the intermediate member 190 is not limited to the above-described configuration, and may be, for example, the intermediate member 230 in which the plate member 194 is omitted (see FIG. 28).

(Ninth Modification)
Next, a radiation imaging apparatus 20J according to a ninth modification will be described with reference to FIG. As shown in FIG. 29, in the radiation imaging apparatus 20J according to this modification, an intermediate member 240 is used instead of the intermediate member 72. The intermediate member 240 is bonded to the radiation member inner surface 76 by the first bonding member 78, and is fixed to the intermediate member main body 242 and bonded to the radiation conversion panel 46 by the second bonding member 86. And a buffer member 244.

  The intermediate member main body 242 is made of the same material as the intermediate member 72 described above. The buffer member 244 is made of, for example, rubber, foam material, resin, or the like. Examples of the foam material include a sponge.

  According to the radiation imaging apparatus 20J according to this modification, the buffer member 244 is disposed between the intermediate member main body 242 and the radiation conversion panel 46. The load can be absorbed by the buffer member. In other words, the intermediate member 240 can increase the resistance of the load from the first flat plate portion 32 as compared with the intermediate member 72. Thereby, it can suppress further that the radiation conversion panel 46 is damaged. The configuration of the intermediate member 240 is particularly effective when the scintillator 54 is formed of CsI.

  Thus, since the material of each laminated body can be arbitrarily changed by making the intermediate member 240 have a laminated structure, radiation (X-ray) is improved while improving the impact resistance and load resistance of the intermediate member 240. It is easily achieved to reduce the absorption of.

(10th modification)
Next, a radiation imaging apparatus 20K according to a tenth modification will be described with reference to FIG. As shown in FIG. 30, in the radiation imaging apparatus 20 </ b> K according to this modification, an intermediate member 246 that is thinner than the intermediate member 72 is used instead of the intermediate member 72 and is fixed to the other surface of the radiation conversion panel 46. A reinforcing member 248 is added.

  The reinforcing member 248 has a bending rigidity higher than that of the radiation conversion panel 46. Thereby, when peeling the intermediate member 246 from the irradiation part inner surface 76, the bending stress which acts on the radiation conversion panel 46 can be suppressed further.

  Further, if the intermediate member 246 is made of a material having a linear expansion coefficient comparable to that of the radiation conversion panel 46, it is preferable to prevent the radiation conversion panel 46 from being deformed (damaged) due to thermal distortion of the intermediate member 246. Can do. The intermediate member 246 is made of, for example, CFRP, aluminum, an aluminum alloy, magnesium, a magnesium alloy, or a resin.

  In the radiation imaging apparatus 20K according to this modification, since the reinforcing member 248 is provided on the other surface of the radiation conversion panel 46, the bending acting on the radiation conversion panel 46 when the intermediate member 246 is peeled from the irradiated portion inner surface 76 is provided. Stress can be effectively suppressed. Further, since the intermediate member 246 can be formed thinner than the above-described intermediate member 72 in a state where bending stress acting on the radiation conversion panel 46 is suppressed, the transmittance of the intermediate member 246 for the radiation 14 can be improved. it can. Thereby, the radiation 14 which permeate | transmitted the patient 16 can be irradiated to the radiation conversion panel 46 efficiently.

(Eleventh modification)
Next, a radiation imaging apparatus 20L according to an eleventh modification will be described with reference to FIG. As shown in FIG. 31, in the radiation imaging apparatus 20 </ b> L according to this modification, an intermediate member 250 is used instead of the intermediate member 72, and a plate-shaped buffer member 252 fixed to the other surface of the radiation conversion panel 46. In addition, a reinforcing member 254 fixed to the other surface of the buffer member 252 is added.

  The intermediate member 250 is bonded to the radiation member inner surface 76 by the first bonding member 78, and is fixed to the intermediate member main body 256 and bonded to the radiation conversion panel 46 by the second bonding member 86. And a buffer member 258.

  The intermediate member main body 256 has the same configuration as the above-described intermediate member main body 242, the buffer member 258 and the buffer member 252 have the same configuration as the above-described buffer member 244, and the reinforcing member 254 has the same configuration as the above-described reinforcing member 248. is there. Therefore, detailed description of the intermediate member main body 256 and the buffer member 244 is omitted.

  According to the radiation imaging apparatus 20L according to this modification, since the buffer members 252 and 258 are provided, external shocks such as when the radiation imaging apparatus 20L is dropped can be absorbed by the buffer members 252 and 258. Thereby, it can suppress further that the radiation conversion panel 46 is damaged. In addition, since the reinforcing member 254 is provided, the bending stress acting on the radiation conversion panel 46 can be effectively suppressed when the intermediate member 250 is peeled off from the irradiated portion inner surface 76.

(Twelfth modification)
Next, a radiation imaging apparatus 20M according to a twelfth modification will be described with reference to FIGS. As shown in FIG. 32, the radiographic apparatus 20M according to this modification is different from the radiographic apparatus 20L according to the eleventh modification in that a support member 300 is used instead of the shielding plate 50.

  The support member 300 includes a support plate 302 formed in a rectangular shape in plan view, and a buffer member (provided on the side surface of the support plate 302 and fixed to the inner surface of the second side wall portion 38 constituting the second case 30). (Third buffer member) 304. A reinforcing member 254 is in contact with one surface of the support plate 302, and a cassette control unit 52 is provided on the other surface of the support plate 302 via brackets 70 and 70.

  The support plate 302 can be made of any material. For example, the support plate 302 may be made of aluminum or the like from the viewpoint of reducing the weight of the radiation imaging apparatus 20M, or may be made of lead or the like from the viewpoint of preventing irradiation of the radiation 14 to the cassette control unit 52. .

  According to this modification, since the support member 300 is provided, the impact resistance and load resistance of the radiation conversion panel 46 can be improved. Moreover, since the weight of the buffer member 252 and the reinforcing member 254 can be received by the support member 300, it is possible to suitably suppress the buffer member 252 and the reinforcing member 254 from being peeled off from the radiation conversion panel 46.

  Furthermore, since the buffer member 304 is interposed between the support plate 302 and the second side wall portion 38, the shock when the radiation imaging apparatus 20M is dropped can be absorbed by the buffer member 304. Therefore, the impact acting on the radiation conversion panel 46 and the cassette control unit 52 can be reduced.

  The support member 300 of the present modification is not limited to the configuration described above, and may be the support member 300a according to the first configuration example shown in FIG. In the support member 300a according to this configuration example, legs 306 are provided instead of the buffer member 304. The leg part 306 protrudes from the side part (edge part) of the support plate 302 toward the second flat plate part 36 side. Further, the lower surface of the leg portion 306 is in contact with the inner surface of the second flat plate portion 36, and the side surface of the leg portion 306 is in contact with the inner surface of the second side wall portion 38. Even in this configuration example, the weight of the buffer member 252 and the reinforcing member 254 can be suitably received by the support member 300a.

(13th modification)
Next, a radiation imaging apparatus 20N according to a thirteenth modification will be described with reference to FIGS. As shown in FIG. 34, in the radiation imaging apparatus 20N according to this modification, an intermediate member 308 is used instead of the intermediate member 72. The intermediate member 308 is attached to the irradiation part inner surface 76 by the first adhesive member 78, and the intermediate member 308 is provided on the intermediate member main body 310 and adhered to the radiation conversion panel 46 by the second adhesive member 86. A metal layer (reflective layer, heat diffusion layer, conductive layer) 312.

  The intermediate member main body 310 is configured similarly to the intermediate member main body 242 constituting the radiation imaging apparatus 20J according to the ninth modification shown in FIG. The metal layer 312 can reflect the light (visible light) emitted from the scintillator 54, and is more preferably composed of, for example, aluminum or copper having a small amount of radiation 14 absorbed.

  Such a metal layer 312 may be formed by vapor-depositing a metal on the intermediate member body 310, or may be formed by fixing a metal plate (metal film, metal foil) or the like to the intermediate member body 310. Good.

  In this modification, the scintillator 54 is made of CsI (Tl) having an emission peak wavelength of 565 nm. The photoelectric conversion unit 56 includes a flexible substrate 314 in which TFTs including an oxide semiconductor (IGZO) are arranged in a matrix, and amorphous silicon (a-Si) provided on the TFT array. A solid-state detection element 316.

  In such a case, the oxide semiconductor (IGZO) has sensitivity only to light having a wavelength of less than 460 nm, and thus it is possible to suitably suppress generation of switching noise due to light emitted from the scintillator 54.

  According to this modification, since the metal layer 312 is interposed between the intermediate member main body 310 and the flexible substrate 314, the transmitted light that has passed through the photoelectric conversion unit 56 out of the light emitted from the scintillator 54 is transmitted to the metal layer. The light can be reflected at 312 and guided to the solid state detection element 316. Thereby, the light emitted from the scintillator 54 can be efficiently detected by the solid state detection element 316.

  Incidentally, the casing 26 (the first flat plate portion 32 of the first case 28) constituting the radiation imaging apparatus 20N is heated by the patient's body temperature, for example, when photographing outside a medical institution (hospital), sunlight is used. May be heated. When the first flat plate portion 32 is heated in this way, the heat is transmitted to the flexible substrate 314 via the intermediate member 308. If the flexible substrate 314 is made of a material having low thermal conductivity such as glass, a temperature difference may occur in the flexible substrate 314. Then, the amount of dark current generated in the solid state detection element 316 is increased or decreased according to the temperature difference, so that there is a possibility that the radiation image is uneven.

  However, according to this modification, since the metal layer 312 and the flexible substrate 314 are bonded by the second adhesive member 86, the heat of the flexible substrate 314 can be diffused to the metal layer 312. Thereby, since the temperature difference which arises in this flexible substrate 314 can be made small, the nonuniformity of a radiographic image can be reduced. Such an effect can also be achieved when a thermal diffusion layer made of graphite or the like is provided instead of the metal layer 312.

  As shown in FIG. 35, a connection member (grounding member) 318 for grounding the metal layer 312 to the ground may be connected to the metal layer 312 according to this modification. In this case, since the electric charge charged to the flexible substrate 314 by the irradiation of the radiation 14 can flow to the ground through the metal layer 312 and the connection member 318, the radiation conversion panel 46 malfunctions or deteriorates due to the electric charge. This can be prevented. Such an effect can also be achieved when a conductive layer made of graphite or the like is provided instead of the metal layer 312.

  This modification is not limited to the configuration described above. For example, the intermediate member 308 may be configured by omitting the intermediate member main body 310 and bonding the metal layer 312 to the irradiation site inner surface 76 with the first bonding member 78 (see FIG. 36).

(14th modification)
Next, a radiation imaging apparatus 20O according to a fourteenth modification will be described with reference to FIGS. As shown in FIG. 37, the radiographic apparatus 20O according to the present modified example uses an intermediate member 320 in place of the intermediate member 308, as compared with the radiographic apparatus 20N according to the thirteenth modified example shown in FIG. Is different. Specifically, the intermediate member 320 of this modification includes a heat insulating layer 322 instead of the metal layer 312 of the intermediate member 308. The heat insulation layer 322 is made of, for example, glass wool.

  According to this modification, since the heat insulating layer 322 is interposed between the intermediate member main body 310 and the flexible substrate 314, the heat of the first flat plate portion 32 heated by the patient's body temperature, sunlight, or the like is transmitted to the flexible substrate. It is possible to suitably suppress transmission to 314. Thereby, the nonuniformity of a radiographic image can be reduced.

  This modification is not limited to the configuration described above. For example, the intermediate member 308 may be configured by omitting the intermediate member main body 310 and bonding the heat insulating layer 322 to the irradiation site inner surface 76 with the first adhesive member 78 (see FIG. 38).

(15th modification)
Next, a radiation imaging apparatus 20P according to a fifteenth modification will be described with reference to FIG. As shown in FIG. 39, the radiographic apparatus 20P according to the present modified example uses an intermediate member 324 instead of the intermediate member 308, as compared with the radiographic apparatus 20N according to the thirteenth modified example shown in FIG. Is different. Specifically, the intermediate member 324 of this modification includes a reset light source unit 326 instead of the metal layer 312 of the intermediate member 308.

  The reset light source unit 326 includes a rectangular light emitting layer 328 that emits reset light, a metal electrode 330 interposed between the light emitting layer 328 and the intermediate member body 310, the light emitting layer 328, and the radiation conversion panel 46. A transparent electrode 332 that is interposed between them and is capable of transmitting reset light; a metal electrode 330; and a power source 334 that is electrically connected to the transparent electrode 332 and a switch 336.

  As the light emitting layer 328, for example, organic electroluminescence (organic EL) or inorganic electroluminescence (inorganic EL) is used. The metal electrode 330 is preferably made of a material having a high transmittance of the radiation 14 and a high reflectance of the reset light, and can be made of, for example, aluminum. The transparent electrode 332 can be made of, for example, ITO or the like.

  In the present modification, the cassette control unit 52 controls the power source 334 and the switch 336 that configure the reset light source unit 326 before radiography to emit reset light from the light emitting layer 328.

  By the way, when the photoelectric conversion unit 56 has the solid-state detection element 316 made of a-Si, a part of the charges (electrons) converted from the light emitted from the scintillator 54 is a-Si impurity level (defects). ) Once trapped. When long-time shooting such as moving image shooting is performed in this state, the temperature of the radiation conversion panel 46 and the like rises in the casing 26, so that charges trapped in the a-Si impurity level are easily released. (Dark current increases). In other words, since the dark current varies between frames of moving image shooting, it is difficult to perform correction in consideration of the dark current.

  According to this modification, the cassette control unit 52 can control the power source 334 and the switch 336 to emit reset light from the light emitting layer 328 before radiation imaging (between frames and between imaging). The solid detection element 316 can be irradiated with light. As a result, charges can be pre-filled in the impurity level of a-Si, so that the charge converted from the light emitted by the scintillator 54 when irradiated with radiation 14 is prevented from being trapped in the impurity level. can do. Therefore, for example, even when the temperature of the radiation conversion panel 46 or the like rises in the casing 26 due to moving image shooting, the dark current of each frame is made constant (the variation in dark current between frames). Therefore, it is possible to perform correction in consideration of the dark current (dark current noise can be fixed).

(16th modification)
Next, a radiation imaging apparatus 20Q according to a sixteenth modification will be described with reference to FIGS. As shown in FIG. 40, in the radiation imaging apparatus 20Q according to this modification, an intermediate member 340 is used instead of the intermediate member 308, as compared with the radiation imaging apparatus 20N according to the thirteenth modification shown in FIG. Is different.

  The intermediate member 340 includes a light guide plate (light guide member) 342 formed in a rectangular shape in plan view, a light detection unit 344 provided on a side surface of the light guide plate 342, and one surface (irradiation site) of the light guide plate 342. A reflective sheet 346 surrounding the side surface of the light guide plate 342 and a translucent reflective sheet surrounding the other surface of the light guide plate 342 (surface on the side where the radiation conversion panel 46 is located). 348.

  The light guide plate 342 is for guiding light emitted from the scintillator 54 to the light detection unit 344, and is made of glass, resin, or the like. The light detection unit 344 includes a plurality of solid-state detection elements (photodiodes) 350 arranged along one side (short side) of the light guide plate 342 (see FIG. 41).

  As shown in FIG. 42, in this modification, the cassette control unit 52 includes a determination unit 352 and a switching unit 354. The determination unit 352 determines whether or not the radiation 14 has been applied to the radiation imaging apparatus 20Q based on the output signal (detection result) from the light detection unit 344. The switching unit 354 switches the control of the photoelectric conversion unit 56 from the shooting mode to the reading mode based on the determination result of the determination unit 352.

  Here, the imaging mode refers to a mode in which charges generated in the solid state detection element 316 of the photoelectric conversion unit 56 are accumulated in a storage capacitor (not shown), and the readout mode refers to charges accumulated in the storage capacitor as radiation image information. Read mode.

  Next, the operation of the radiation imaging apparatus 20Q according to this modification will be described. In the state before photographing, the control of the photoelectric conversion unit 56 by the cassette control unit 52 is in the photographing mode.

  First, a radiographer or the like controls the control device 24 to emit radiation 14 from the radiation source 18 (see FIG. 1). Then, the radiation 14 passes through the patient 16 and is guided to the scintillator 54, so that the scintillator 54 emits light. The light emitted from the scintillator 54 is converted into electric charge by the solid state detection element 316 of the photoelectric conversion unit 56 and stored in the storage capacitor.

  On the other hand, the transmitted light that has passed through the photoelectric conversion unit 56 out of the light emitted from the scintillator 54 is further transmitted through the semi-transmissive reflection sheet 348 and is transmitted through the light guide plate 342 and is guided to the solid state detection element 350 of the light detection unit 344. . At this time, the light detection unit 344 outputs an electrical signal to the cassette control unit 52.

  Subsequently, the determination unit 352 determines whether or not the radiation imaging apparatus 20 </ b> Q has been irradiated with the radiation 14 based on the electrical signal output from the cassette control unit 52. When the determination unit 352 determines that the radiation 14 is not irradiated, the cassette control unit 52 maintains the control of the photoelectric conversion unit 56 in the imaging mode. This is because before or during radiography.

  When the determination unit 352 determines that the radiation 14 has been irradiated, the switching unit 354 switches the control of the photoelectric conversion unit 56 from the imaging mode to the reading mode. At this stage, the charges accumulated in the accumulation capacitor are read out as radiation image information. The read radiation image information is transmitted to the control device 24 by the transceiver 44 and displayed on the display device 22 as a radiation image. Note that the switching unit 354 switches the control of the photoelectric conversion unit 56 to the imaging mode after the reading of the radiation image information is completed. This is to cope with the next shooting.

  According to this modification, a part of the transmitted light that has passed through the photoelectric conversion unit 56 out of the light emitted from the scintillator 54 is detected by the light detection unit 344, and the photoelectric conversion is performed using the signal output from the light detection unit 344. Since the control of the conversion unit 56 is switched from the photographing mode to the reading mode, the charge can be read from the photoelectric conversion unit 56 with good timing (efficiently). In other words, the switching timing of the control mode of the photoelectric conversion unit 56 can easily correspond to the irradiation timing of the radiation 14.

(17th modification)
Next, a radiation imaging apparatus 20R according to a seventeenth modification will be described with reference to FIGS. As shown in FIG. 43, in the radiation imaging apparatus 20R according to this modification, an intermediate member 360 made of inexpensive soda glass is used instead of the intermediate member 72. In addition, the photoelectric conversion unit 56 according to this modification includes a TFT substrate (sensor substrate) 362 made of non-alkali glass, and solid detection elements 364 arranged on the TFT substrate 362 in a matrix. .

  The TFT substrate 362 is formed thin (20 μm to 300 μm) by polishing one surface thereof (the back surface, the surface on which the solid state detection element 364 is not disposed). The solid state detection element 364 includes a-Si.

  The second adhesive member 86 is formed of an adhesive member that can be decomposed by irradiation with light (ultraviolet rays). As such an adhesive member, for example, polyperoxide obtained by radical copolymerization of a diene monomer and oxygen is used. Thereby, the intermediate member 360 and the TFT substrate 362 can be easily separated. That is, it is possible to prevent the TFT substrate 362 from being peeled off from the intermediate member 360 due to an impact such as when the radiation imaging apparatus 20R is dropped. For example, even when the radiation conversion panel 46 needs to be replaced, The intermediate member 360 can be easily used.

  According to the radiographic apparatus 20R according to this modification, the TFT substrate 362 made of non-alkali glass is formed thin, and the intermediate member 360 is made of soda glass. As a result, sodium contamination of a-Si by soda glass can be suitably suppressed, and the amount of radiation absorbed by the intermediate member 360 and the TFT substrate 362 can be reduced.

  Next, the effect of this modification will be described with reference to FIG. FIG. 44 is a graph showing the relationship between the thickness of a glass plate and the transmittance of radiation (X-rays). In FIG. 44, a line segment A represents a non-alkali glass plate, and a line segment B represents a soda glass plate. ing.

  As can be seen from FIG. 44, the soda glass plate has a higher radiation transmittance than the non-alkali glass plate. Therefore, as in this modification, the TFT substrate 362 made of non-alkali glass is formed thin and soda glass is used as the intermediate member 360, so that the amount of radiation absorbed by the intermediate member 360 and the TFT substrate 362 is reduced. .

(18th modification)
Next, a radiation imaging apparatus 20S according to an eighteenth modification will be described with reference to FIGS. As shown in FIG. 45, in the radiation imaging apparatus 20S according to this modification, an intermediate member 370 is used instead of the intermediate member 72. The intermediate member 370 is formed with a warp deformation suppressing portion 372 for suppressing warp deformation caused by a difference in thermal expansion coefficient from the radiation conversion panel 46.

  The warp deformation suppressing portion 372 is a groove (cut) formed on one surface of the intermediate member 370, and has four cross grooves 374 formed at each corner and the vicinity of the central portion of the short side of the intermediate member 370. A pair of short grooves 376 extending along the short side and positioned near the center of the long side of the intermediate member 370 and a pair of long grooves 378 extending along the long side. . Each cross groove 374 has one side located on a diagonal line of the intermediate member 370 and the other side extending along a direction perpendicular to the diagonal line.

  As shown in FIG. 46, the groove depth d1 of the cross groove 374 can be arbitrarily set. For example, when the thickness of the intermediate member 370 is d, it is set to be in the range of 0.2d ≦ d1. can do. Thus, by setting the groove depth d1 of the cross groove 374 to 20% or more of the thickness d of the intermediate member 370, warp deformation due to heat of the intermediate member 370 can be suitably suppressed. The groove depths of the short groove 376 and the long groove 378 are set in the same manner as the groove depth of the cross groove 374.

  In this modification, the cross groove 374, the short groove 376, and the long groove 378 are disposed outside the radiographic image capturing range. As a result, the grooves 374, 376, and 378 can be prevented from affecting the image quality of the radiation image.

  By the way, when the intermediate member 370 is bonded to the irradiation site inner surface 76, for example, when the first flat plate portion 32 is heated by a patient's body temperature, sunlight, or the like, the heat is easily transmitted to the intermediate member 370. Then, since the radiation conversion panel 46 is bonded to the intermediate member 370, the intermediate member 370 may be warped and deformed due to thermal expansion (thermal contraction). Such warp deformation of the intermediate member 370 becomes more prominent as the difference in coefficient of thermal expansion between the intermediate member 370 and the radiation conversion panel 46 increases.

  However, in this modification, since the cross groove 374, the short groove 376, and the long groove 378 are formed on one surface of the intermediate member 370, the thermal expansion (thermal heat) of the radiation conversion panel 46 is caused by these grooves 374, 376, and 378. The difference between the amount of contraction) and the amount of thermal expansion (thermal contraction) of the intermediate member 370 can be reduced. Therefore, warp deformation due to heat of the intermediate member 370 can be suitably suppressed.

  Further, according to the present modification, the cross member 370, the short groove 376, and the long groove 378 are formed corresponding to the portion of the intermediate member 370 where the thermal stress is relatively large. It can be suppressed efficiently.

  In the present modification, the shape or arrangement of the grooves constituting the warp deformation suppressing portion 372 can be arbitrarily set. For example, grooves may be formed in a lattice pattern on one entire surface of the intermediate member 370. Further, the warp deformation suppressing portion 372 may be configured by an uneven portion formed by embossing instead of the groove described above. Even in this case, it is possible to suppress warping deformation of the intermediate member 370 due to heat.

  The intermediate member 370 according to this modification is not limited to the above-described example. For example, when the intermediate member 370 is made of a material having a glass transition temperature, the intermediate member 370 may be formed by preheating above the glass transition temperature. In this case, the amount of warp deformation due to the heat of the intermediate member 370 can be suppressed as compared with the case where the preheating is not performed above the glass transition temperature. Thereby, the increase in the material variation which can be selected as the intermediate member 370 can be aimed at.

(19th modification)
Next, a radiation imaging apparatus 20T according to a nineteenth modification will be described with reference to FIG. As shown in FIG. 47, in the radiation imaging apparatus 20T according to this modification, an intermediate member 380 is used instead of the intermediate member 72. The intermediate member 380 is entirely composed of a cushioning material. As the buffer material, rubber, foam material (sponge), resin, or the like is used.

  According to this modification, since the entire intermediate member 380 is made of a buffer material, the intermediate member 380 can absorb an impact when the radiation imaging apparatus 20T is dropped. Therefore, the impact acting on the radiation conversion panel 46 can be reduced.

(20th modification)
Next, a radiation imaging apparatus 20U according to a twentieth modification will be described with reference to FIG. As shown in FIG. 48, in the radiation imaging apparatus 20U according to the twentieth modified example, the position of the radiation conversion panel 46 and the position of the intermediate member 72 are oppositely arranged as compared with the radiation imaging apparatus 20A. That is, the radiation conversion panel 46 is adhered to the irradiation site inner surface 76 by the first adhesive member 78 provided on one surface thereof, and the intermediate member 72 is radiation-converted by the second adhesive member 86. The panel 46 is bonded to the other surface.

  According to the radiation imaging apparatus 20 </ b> U according to this modification, the intermediate member 72 is bonded to the radiation conversion panel 46 by the second bonding member 86. Therefore, compared with the case where only the radiation conversion panel 46 is directly adhered to the irradiation site inner surface 76, the bending stress acting on the radiation conversion panel 46 when the radiation conversion panel 46 is peeled off from the irradiation site inner surface 76 is reduced. Can be made. Therefore, even when the adhesive strength between the intermediate member 72 and the irradiated portion inner surface 76 is set so as not to be peeled off by an external impact such as when the radiation imaging apparatus 20U is dropped, the first case 28 or the radiation conversion panel 46 is replaced. The radiation conversion panel 46 can be separated from the first case 28 without damage.

  The radiation conversion panel 46 constituting the radiation imaging apparatus 20 </ b> U according to this modification may be configured such that the scintillator 54 is slightly smaller than the photoelectric conversion unit 56. Then, the first adhesive member 78 may be disposed on the outer periphery of the one surface of the photoelectric conversion unit 56 (the part where the scintillator 54 is not located), and the radiation conversion panel 46 may be adhered to the irradiation part inner surface 76. Thereby, compared with the case where the 1st adhesion member 78 is arranged in scintillator 54, when removing radiation conversion panel 46 from irradiation part inner surface 76, it can control that scintillator 54 is damaged.

  In radiation imaging apparatus 20A according to the present embodiment, casing 26 is not limited to the configuration described above, and may be casings 260a to 260d shown in FIGS. 49 to 52, for example.

  As shown in FIG. 49, in the casing 260a according to the first configuration example, a first case 262 is used instead of the first case 28, and the first flat plate portion 264 of the first case 262 has a first flat plate on the outer surface. A mounting recess 268 into which the surface plate 266 that is slightly smaller than the portion 264 is fitted is formed.

  The surface plate 266 is formed in a size larger than the radiographic image capturing range, and is made of a material that can transmit the radiation 14 such as CFRP.

  As shown in FIG. 50, in the casing 260 b according to the second configuration example, a flat plate-like first case 270 is used instead of the first case 28, and a second case 272 is used instead of the second case 30. .

  The first case 270 is made of a material that can transmit the radiation 14 such as CFRP. The second case 272 has a second side wall portion 274 that stands on the periphery of the second flat plate portion 36 and has a height higher than that of the second side wall portion 38. The first case 270 is attached to the upper end surface of the second side wall portion 274.

  As shown in FIG. 51, in the casing 260c according to the third configuration example, a first case 276 is used instead of the first case 270, as compared with the casing 260b shown in FIG. The first case 276 includes a first side wall portion 278 that protrudes downward from the periphery of the first flat plate portion 32. The lower end surface of the first side wall portion 278 and the outer surface of the second flat plate portion 36 are flush with each other.

  As shown in FIG. 52, in the casing 260d according to the fourth configuration example, a flat plate-like second case 280 is used instead of the second case 272, as compared with the casing 260c shown in FIG. The second case 280 is mounted in a state in contact with the lower end surface of the first side wall portion 278.

  The present invention is not limited to the above-described embodiment, and it is naturally possible to adopt various configurations without departing from the gist of the present invention.

  A 1st adhesive member and a 2nd adhesive member may replace with a double-sided tape, and a surface fastener, an adhesive agent, or a suction cup may be used. As an adhesive agent, the adhesive agent which can adjust adhesive force by heating, for example may be sufficient. For example, when an adhesive that can weaken the adhesive strength by heating is used as the first adhesive member, the adhesive strength when the adhesive strength of the adhesive is weakened to the maximum is 1 [N / cm] is preferable. This is because the intermediate member or the radiation conversion panel can be peeled off from the inner surface of the irradiation site with an appropriate force.

  The radiation conversion panel may be provided on the intermediate member by a fixing means different from the second adhesive member.

  The radiation conversion panel may be the radiation conversion panel 600 according to the modification shown in FIGS. 53 and 54. FIG. 53 is a schematic cross-sectional view schematically showing a configuration of three pixel portions of the radiation conversion panel 600 according to the modification.

  The radiation conversion panel 600 is formed by sequentially stacking a signal output unit 604, a sensor unit 606, and a scintillator 608 on an insulating substrate 602, and a pixel unit is configured by the signal output unit 604 and the sensor unit 606. ing. The pixel units are arranged in a matrix on the substrate 602, and the signal output unit 604 and the sensor unit 606 in each pixel unit are configured to overlap each other.

  The scintillator 608 is formed on the sensor unit 606 via a transparent insulating film 610, and converts the radiation 14 incident from above (the side opposite to the side where the substrate 602 is located) into light and emits light. The body is formed into a film. The wavelength range of light emitted by the scintillator 608 is preferably a visible light range (wavelength 360 nm to 830 nm), and in order to enable monochrome imaging by the radiation conversion panel 600, the wavelength range of green is included. Is more preferable.

  Specifically, the phosphor used in the scintillator 608 preferably contains cesium iodide (CsI) when imaging using X-rays as the radiation 14, and the emission spectrum at the time of X-ray irradiation is 420 nm to 700 nm. It is particularly preferred to use some CsI (Tl) (cesium iodide with thallium added). Note that the emission peak wavelength of CsI (Tl) in the visible light region is 565 nm.

  The scintillator 608 may be formed, for example, by vapor-depositing CsI (Tl) having a columnar crystal structure on a vapor deposition base. When the scintillator 608 is formed by vapor deposition as described above, Al is often used as the vapor deposition substrate from the viewpoint of X-ray transmittance and cost, but is not limited thereto. Note that in the case where GOS is used as the scintillator 608, the scintillator 608 may be formed by applying GOS to the surface of the TFT active matrix substrate without using a vapor deposition substrate. Alternatively, after the GOS is applied to the resin base to form the scintillator 608, the scintillator 608 may be bonded to the TFT active matrix substrate. As a result, the TFT active matrix substrate can be preserved even if GOS application fails.

  The sensor unit 606 includes an upper electrode 612, a lower electrode 614, and a photoelectric conversion film 616 disposed between the upper electrode 612 and the lower electrode 614.

Since the upper electrode 612 needs to make the light generated by the scintillator 608 incident on the photoelectric conversion film 616, it is preferable that the upper electrode 612 is made of a conductive material that is transparent at least with respect to the emission wavelength of the scintillator 608. It is preferable to use a transparent conductive oxide (TCO) having a high transmittance for visible light and a small resistance value. Note that although a metal thin film such as Au can be used as the upper electrode 612, a resistance value tends to increase when the transmittance of 90% or more is obtained, so that the TCO is preferable. For example, ITO, IZO, AZO, FTO, SnO ₂ , TiO ₂ , ZnO _{2 and the} like can be preferably used, and ITO is most preferable from the viewpoint of process simplicity, low resistance, and transparency. Note that the upper electrode 612 may have a single configuration common to all the pixel portions, or may be divided for each pixel portion.

  The photoelectric conversion film 616 includes an organic photoconductor (OPC), absorbs light emitted from the scintillator 608, and generates a charge corresponding to the absorbed light. If the photoelectric conversion film 616 includes an organic photoconductor (organic photoelectric conversion material), the photoelectric conversion film 616 has a sharp absorption spectrum in the visible light region, and electromagnetic waves other than light emitted by the scintillator 608 are almost absorbed by the photoelectric conversion film 616. In addition, noise generated when the radiation 14 is absorbed by the photoelectric conversion film 616 can be effectively suppressed. Note that the photoelectric conversion film 616 may be configured to include amorphous silicon instead of the organic photoconductor. In this case, it has a wide absorption spectrum and can efficiently absorb light emitted by the scintillator 608.

  The organic photoconductor constituting the photoelectric conversion film 616 preferably has a peak wavelength closer to the emission peak wavelength of the scintillator 608 in order to absorb light emitted by the scintillator 608 most efficiently. Ideally, the absorption peak wavelength of the organic photoconductor coincides with the emission peak wavelength of the scintillator 608. However, if the difference between the two is small, the light emitted from the scintillator 608 can be sufficiently absorbed. . Specifically, the difference between the absorption peak wavelength of the organic photoconductor and the emission peak wavelength of the scintillator 608 with respect to the radiation 14 is preferably within 10 nm, and more preferably within 5 nm.

  Examples of organic photoconductors that can satisfy such conditions include quinacridone organic compounds and phthalocyanine organic compounds. For example, since the absorption peak wavelength in the visible region of quinacridone is 560 nm, if quinacridone is used as the organic photoconductor and CsI (Tl) is used as the material of the scintillator 608, the difference in peak wavelength can be made within 5 nm. Thus, the amount of charge generated in the photoelectric conversion film 616 can be substantially maximized.

  The sensor unit 606 is configured to stack or mix a site that absorbs electromagnetic waves, a photoelectric conversion site, an electron transport site, a hole transport site, an electron blocking site, a hole blocking site, a crystallization prevention site, an electrode, and an interlayer contact improvement site. It is comprised including the organic layer formed by. The organic layer preferably contains an organic p-type compound (organic p-type semiconductor) or an organic n-type compound (organic n-type semiconductor).

  An organic p-type semiconductor is a donor organic semiconductor (compound) typified by a hole-transporting organic compound and refers to an organic compound having a property of easily donating electrons. More specifically, an organic compound having a smaller ionization potential when two organic materials are used in contact with each other. Therefore, any organic compound can be used as the donor organic compound as long as it is an electron-donating organic compound.

  An organic n-type semiconductor is an acceptor organic semiconductor (compound) typified by an electron-transporting organic compound and refers to an organic compound having a property of easily accepting electrons. More specifically, the organic compound having the higher electron affinity when two organic compounds are used in contact with each other. Therefore, as the acceptor organic compound, any organic compound can be used as long as it is an electron-accepting organic compound.

  The materials applicable as the organic p-type semiconductor and the organic n-type semiconductor and the configuration of the photoelectric conversion film 616 are described in detail in Japanese Patent Application Laid-Open No. 2009-32854, and thus the description thereof is omitted. Note that the photoelectric conversion film 616 may be formed by further containing fullerenes or carbon nanotubes.

  The thickness of the photoelectric conversion film 616 is preferably as large as possible in terms of absorbing light from the scintillator 608. However, when the thickness is larger than a certain level, the photoelectric conversion film 616 is generated in the photoelectric conversion film 616 by a bias voltage applied from both ends of the photoelectric conversion film 616. Since electric field strength is reduced and charges cannot be collected, the thickness is preferably 30 nm to 300 nm, more preferably 50 nm to 250 nm, and particularly preferably 80 nm to 200 nm.

  The photoelectric conversion film 616 has a single-layer configuration common to all the pixel portions, but may be divided for each pixel portion. The lower electrode 614 is a thin film divided for each pixel portion. However, the lower electrode 614 may have a single configuration common to all the pixel portions. The lower electrode 614 can be made of a transparent or opaque conductive material, and aluminum, silver, or the like can be preferably used. The thickness of the lower electrode 614 can be, for example, 30 nm or more and 300 nm or less.

  In the sensor unit 606, by applying a predetermined bias voltage between the upper electrode 612 and the lower electrode 614, one of charges (holes, electrons) generated in the photoelectric conversion film 616 is moved to the upper electrode 612. The other can be moved to the lower electrode 614. In the radiation conversion panel 600 according to this modification, a wiring is connected to the upper electrode 612, and a bias voltage is applied to the upper electrode 612 through the wiring. In addition, the polarity of the bias voltage is determined so that electrons generated in the photoelectric conversion film 616 move to the upper electrode 612 and holes move to the lower electrode 614, but this polarity is opposite. May be.

  The sensor unit 606 constituting each pixel unit only needs to include at least the lower electrode 614, the photoelectric conversion film 616, and the upper electrode 612. In order to suppress an increase in dark current, the electron blocking film 618 and the hole blocking are included. It is preferable to provide at least one of the films 620, and it is more preferable to provide both.

  The electron blocking film 618 can be provided between the lower electrode 614 and the photoelectric conversion film 616. When a bias voltage is applied between the lower electrode 614 and the upper electrode 612, electrons are transferred from the lower electrode 614 to the photoelectric conversion film 616. It is possible to suppress the dark current from increasing due to the injection of.

  An electron-donating organic material can be used for the electron blocking film 618. The material actually used for the electron blocking film 618 may be selected according to the material of the adjacent electrode, the material of the adjacent photoelectric conversion film 616, and the like, and 1.3 eV or more from the work function (Wf) of the material of the adjacent electrode. A material having a large electron affinity (Ea) and an Ip equivalent to or smaller than the ionization potential (Ip) of the material of the adjacent photoelectric conversion film 616 is preferable. Since the material applicable as the electron donating organic material is described in detail in Japanese Patent Application Laid-Open No. 2009-32854, description thereof is omitted.

  The thickness of the electron blocking film 618 is preferably 10 nm or more and 200 nm or less, more preferably 30 nm or more and 150 nm or less, and particularly preferably, in order to surely exhibit the dark current suppressing effect and prevent a decrease in photoelectric conversion efficiency of the sensor unit 606. It is good to set it to 50 nm or more and 100 nm or less.

  The hole blocking film 620 can be provided between the photoelectric conversion film 616 and the upper electrode 612. When a bias voltage is applied between the lower electrode 614 and the upper electrode 612, the hole blocking film 620 is applied from the upper electrode 612 to the photoelectric conversion film 616. It is possible to suppress the increase in dark current due to the injection of holes.

  An electron-accepting organic material can be used for the hole blocking film 620. The thickness of the hole blocking film 620 is preferably 10 nm or more and 200 nm or less, more preferably 30 nm or more and 150 nm or less, and particularly preferably, in order to reliably exhibit the dark current suppressing effect and prevent a decrease in photoelectric conversion efficiency of the sensor unit 606. Is preferably 50 nm to 100 nm.

  The material actually used for the hole blocking film 620 may be selected according to the material of the adjacent electrode, the material of the adjacent photoelectric conversion film 616, and the like, and 1.3 eV from the work function (Wf) of the material of the adjacent electrode. As described above, it is preferable that the ionization potential (Ip) is large and the Ea is equal to or larger than the electron affinity (Ea) of the material of the adjacent photoelectric conversion film 616. Since the material applicable as the electron-accepting organic material is described in detail in Japanese Patent Application Laid-Open No. 2009-32854, description thereof is omitted.

  Note that, among the charges generated in the photoelectric conversion film 616, when a bias voltage is set so that holes move to the upper electrode 612 and electrons move to the lower electrode 614, the electron blocking film 618 and the hole blocking are set. The position of the film 620 may be reversed. Further, it is not necessary to provide both the electron blocking film 618 and the hole blocking film 620. If either one is provided, a certain dark current suppressing effect can be obtained.

  As shown in FIG. 54, the signal output unit 604 is provided on the surface of the substrate 602 corresponding to the lower electrode 614 of each pixel unit, and the storage capacitor 622 for storing the electric charge moved to the lower electrode 614, The TFT 624 converts the electric charge accumulated in the accumulation capacitor 622 into an electric signal and outputs the electric signal. The region where the storage capacitor 622 and the TFT 624 are formed has a portion that overlaps with the lower electrode 614 in plan view. With such a structure, the signal output unit 604 and the sensor unit 606 in each pixel unit are connected to each other. There will be overlap in the thickness direction. If the signal output unit 604 is formed so as to completely cover the storage capacitor 622 and the TFT 624 with the lower electrode 614, the plane area of the radiation conversion panel 600 (pixel unit) can be minimized.

  The storage capacitor 622 is electrically connected to the corresponding lower electrode 614 through a wiring made of a conductive material formed through an insulating film 626 provided between the substrate 602 and the lower electrode 614. Thereby, the charge collected by the lower electrode 614 can be moved to the storage capacitor 622.

  The TFT 624 includes a gate electrode 628, a gate insulating film 630, and an active layer (channel layer) 632, and a source electrode 634 and a drain electrode 636 are formed on the active layer 632 with a predetermined interval. The active layer 632 can be formed of, for example, amorphous silicon, amorphous oxide, organic semiconductor material, carbon nanotube, or the like. Note that the material forming the active layer 632 is not limited thereto.

The amorphous oxide that can form the active layer 632 is preferably an oxide containing at least one of In, Ga, and Zn (for example, In—O-based), and at least two of In, Ga, and Zn. Oxides containing one (for example, In—Zn—O, In—Ga—O, and Ga—Zn—O) are more preferable, and oxides including In, Ga, and Zn are particularly preferable. As the In—Ga—Zn—O-based amorphous oxide, an amorphous oxide whose composition in a crystalline state is represented by InGaO ₃ (ZnO) _m (m is a natural number less than 6) is preferable, and InGaZnO is particularly preferable. ₄ is more preferable. Note that the amorphous oxide that can form the active layer 632 is not limited thereto.

  Examples of the organic semiconductor material that can form the active layer 632 include, but are not limited to, phthalocyanine compounds, pentacene, vanadyl phthalocyanine, and the like. In addition, about the structure of a phthalocyanine compound, since it describes in detail in Unexamined-Japanese-Patent No. 2009-212389, description is abbreviate | omitted.

  If the active layer 632 of the TFT 624 is formed of an amorphous oxide, an organic semiconductor material, or a carbon nanotube, the radiation 14 such as X-rays is not absorbed, or even if it is absorbed, a very small amount remains. Generation of noise in the unit 604 can be effectively suppressed.

  In addition, when the active layer 632 is formed of carbon nanotubes, the switching speed of the TFT 624 can be increased, and a TFT 624 having a low light absorption in the visible light region can be formed. In addition, when the active layer 632 is formed of carbon nanotubes, the performance of the TFT 624 is remarkably deteriorated only by mixing a very small amount of metallic impurities into the active layer 632, so that extremely high purity carbon nanotubes are separated by centrifugation or the like.・ It needs to be extracted and formed.

  Here, any of the above-described amorphous oxide, organic semiconductor material, carbon nanotube, and organic photoconductor can be formed at a low temperature. Therefore, the substrate 602 is not limited to a substrate having high heat resistance such as a semiconductor substrate, a quartz substrate, and a glass substrate, and a flexible substrate such as plastic, aramid, or bionanofiber can also be used. Specifically, flexible substrates such as polyesters such as polyethylene terephthalate, polybutylene phthalate, polyethylene naphthalate, polystyrene, polycarbonate, polyethersulfone, polyarylate, polyimide, polycycloolefin, norbornene resin, polychlorotrifluoroethylene, etc. Can be used. If such a plastic flexible substrate is used, it is possible to reduce the weight, which is advantageous for carrying around, for example.

  In addition, the photoelectric conversion film 616 is formed from an organic photoconductor, and the TFT 624 is formed from an organic semiconductor material, whereby the photoelectric conversion film 616 and the TFT 624 are formed at a low temperature on a plastic flexible substrate (substrate 602). This makes it possible to reduce the thickness and weight of the radiation conversion panel 600 as a whole. Accordingly, the casing 26 that accommodates the radiation conversion panel 600 can be made thinner and lighter, and convenience in use outside the hospital is improved. In addition, since the base material of the photoelectric conversion portion is made of a flexible material unlike general glass, damage resistance during carrying and use of the device can be improved.

  In addition, the substrate 602 is provided with an insulating layer for ensuring insulation, a gas barrier layer for preventing permeation of moisture and oxygen, an undercoat layer for improving flatness or adhesion to electrodes, and the like. May be.

  Since aramid can be applied at a high temperature process of 200 ° C. or more, the transparent electrode material can be cured at a high temperature to reduce the resistance, and can also be used for automatic mounting of a driver IC including a solder reflow process. Moreover, since aramid has a thermal expansion coefficient close to that of ITO (indium tin oxide) or a glass substrate, warping after production is small and it is difficult to crack. In addition, aramid can form a substrate thinner than a glass substrate or the like. Note that the substrate 602 may be formed by stacking an ultrathin glass substrate and an aramid.

  The bionanofiber is a composite of a cellulose microfibril bundle (bacterial cellulose) produced by bacteria (acetobacterium Xylinum) and a transparent resin. The cellulose microfibril bundle has a width of 50 nm and a size of 1/10 of the visible light wavelength, and has high strength, high elasticity, and low thermal expansion. By impregnating and curing a transparent resin such as an acrylic resin or an epoxy resin in bacterial cellulose, a bio-nanofiber having a light transmittance of about 90% at a wavelength of 500 nm can be obtained while containing 60-70% of the fiber. Bionanofiber has a low coefficient of thermal expansion (3-7ppm) comparable to silicon crystals, and is as strong as steel (460MPa), highly elastic (30GPa), and flexible. The substrate 602 can be formed thin.

  In this modification, a signal output unit 604, a sensor unit 606, and a transparent insulating film 610 are sequentially formed on a substrate 602, and a scintillator 608 is attached to the substrate 602 using an adhesive resin having low light absorption. Thus, the radiation conversion panel 600 is formed.

  In the radiation conversion panel 600 according to the above-described modification, the photoelectric conversion film 616 is made of an organic photoconductor, and the active layer 632 of the TFT 624 is made of an organic semiconductor material. At 604, the radiation 14 is hardly absorbed. Thereby, the fall of the sensitivity with respect to the radiation 14 can be suppressed.

  Both the organic semiconductor material constituting the active layer 632 of the TFT 624 and the organic photoconductor constituting the photoelectric conversion film 616 can be formed at a low temperature. Therefore, the substrate 602 can be formed of a plastic resin, aramid, or bionanofiber that absorbs less radiation 14. Thereby, the fall of the sensitivity with respect to the radiation 14 can be suppressed further.

  In addition, for example, when the radiation conversion panel 600 is attached to the inner surface of the irradiation site irradiated with the radiation 14 and the substrate 602 is formed of a highly rigid plastic resin, aramid, or bionanofiber, the rigidity of the radiation conversion panel 600 itself is reduced. Since it can be made high, the irradiation part of a casing can be formed thinly. Further, when the substrate 602 is formed of a highly rigid plastic resin, aramid, or bionanofiber, the radiation conversion panel 600 itself has flexibility, so that the radiation conversion panel 600 is not easily damaged even when an impact is applied to the irradiated part. .

  The radiation detector 600 described above may be configured as follows.

  (1) The photoelectric conversion film 616 may be formed of an organic photoelectric conversion material, and a layer of the TFT 624 (TFT layer) using a CMOS sensor may be formed. In this case, since only the photoelectric conversion film 616 is made of an organic material, the TFT layer including the CMOS sensor may not have flexibility.

(2) The photoelectric conversion film 616 may be made of an organic photoelectric conversion material, and a flexible TFT layer may be realized by a CMOS circuit including a TFT 624 made of an organic material. In this case, pentacene may be adopted as the material of the p-type organic semiconductor used in the CMOS circuit, and copper fluoride phthalocyanine (F ₁₆ CuPc) may be adopted as the material of the n-type organic semiconductor. As a result, a flexible TFT layer capable of having a smaller bending radius can be realized. In addition, by configuring the TFT layer in this way, the gate insulating film can be significantly thinned, and the driving voltage can be lowered. Furthermore, the gate insulating film, the semiconductor, and each electrode can be manufactured at room temperature or 100 ° C. or lower. Furthermore, a CMOS circuit can be directly formed over the flexible substrate 602. Moreover, the TFT 624 made of an organic material can be miniaturized by a manufacturing process in accordance with a scaling law. Note that when the polyimide precursor is applied to a thin polyimide substrate by a spin coat method and heated, the polyimide precursor changes to polyimide, so that a flat substrate without unevenness can be realized.

  (3) Applying a self-alignment placement technique (Fluidic Self-Assembly method) that places a plurality of micron-order device blocks at specified positions on a substrate 602, a photoelectric conversion film 616 and a TFT 624 made of crystalline Si are formed on a resin substrate You may arrange | position on the board | substrate 602 which consists of. In this case, the photoelectric conversion film 616 and TFT 624 as micro device blocks of micron order are fabricated in advance on another substrate and then separated from the substrate, and the photoelectric conversion film 616 and TFT 624 in the liquid are placed on the substrate 602 as the target substrate. Sprinkle on and place statistically. The substrate 602 is processed in advance to be adapted to the device block, and the device block can be selectively placed on the substrate 602. Therefore, an optimal device block (photoelectric conversion film 616 and TFT 624) made of an optimal material can be integrated on an optimal substrate (semiconductor substrate, quartz substrate, glass substrate, etc.), and is not a crystal. It is also possible to integrate device blocks (photoelectric conversion film 616 and TFT 624) optimum for a substrate (flexible substrate such as plastic).

  In the radiation conversion panel 600 according to the above-described modification, the light emitted from the scintillator 608 is converted into charges by the sensor unit 606 (photoelectric conversion film 616) located on the side opposite to the side where the radiation source 18 is located. Although it is configured as a so-called back side scanning method (PSS (Penetration Side Sampling) method) for reading an image, the present invention is not limited to this configuration.

  For example, the radiation conversion panel may be configured as a so-called surface reading method (ISS (Irradiation Side Sampling) method). In this case, the substrate 602, the signal output unit 604, the sensor unit 606, and the scintillator 608 are stacked in this order along the irradiation direction of the radiation 14, and the light emitted from the scintillator 608 is sensor unit on the side where the radiation source 18 is positioned. At 606, the radiation image is read after being converted into electric charges. In general, the scintillator 608 emits light on the irradiation surface side of the radiation 14 more strongly than the back side. Therefore, in the radiation conversion panel configured by the front surface reading method, compared to the radiation conversion panel 600 configured by the back surface reading method, The distance until the light emitted from the scintillator 608 reaches the photoelectric conversion film 616 can be shortened. Thereby, since the diffusion / attenuation of the light can be suppressed, the resolution of the radiation image can be increased.

10. Radiation imaging system 14 ... Radiation 16 ... Patient (subject)
18 ... Radiation sources 20A to 20U ... Radiation imaging device 22 ... Display device 24 ... Control device 26, 260a-260d ... Casing (housing)
28, 262, 270, 276 ... first case 30, 272, 280 ... second case 46 ... radiation conversion panel 52 ... cassette control section (control section)
58, 60 ... Flexible substrate 62 ... Gate IC (IC part)
64 ... ASIC (IC part)
72, 141, 190, 240, 246, 250, 308, 320, 324, 340, 360, 370, 380 ... Intermediate member 74, 148, 150, 152, 198, 200, 202 ... First adhesive surface 76 ... Irradiation site Inner surfaces 78, 78a to 78g, 154, 154a to 154c, 203 ... first adhesive members 84, 162, 164, 166, 218, 220, 222 ... second adhesive surfaces 86, 86a, 168, 223 ... second adhesive members 112 , 114, 116, 118, 120... Projection (gripping part)
122, 124, 126, 128 ... handle part (gripping part)
130, 134, 138... Fixing part 132, 136, 140... Bending part (gripping part main body)
242, 256, 310 ... intermediate member main body 244, 258 ... shock absorbing member (first shock absorbing member)
248, 254 ... Reinforcing member 252 ... Buffer member (second buffer member)
300, 300a ... support member 302 ... support plate 304 ... buffer member (third buffer member)
312 ... Metal layer (reflection layer, thermal diffusion layer, conductive layer)
316 ... Solid state detection element 322 ... Heat insulation layer 326 ... Reset light source unit 342 ... Light guide plate (light guide member)
344... Light detection unit 362... TFT substrate (sensor substrate)
372 ... Warpage deformation suppressing portion

Claims (38)

A radiation conversion panel that detects radiation transmitted through the subject and converts it into radiation image information; and
An intermediate member provided in the radiation conversion panel;
A housing for housing the radiation conversion panel and the intermediate member;
And a first adhesive member for adhering the intermediate member or the radiation conversion panel peelably state to the irradiation site inside surface where the radiation is irradiated in said housing,
The radiation conversion panel includes a substrate made of glass,
The radiographic apparatus according to claim 1, wherein the intermediate member has higher bending rigidity than the radiation conversion panel . The radiographic apparatus according to claim 1,
A second adhesive member for adhering the intermediate member to the radiation conversion panel;
In the first adhesive member and the second adhesive member, the adhesive strength between the radiation conversion panel and the intermediate member is such that the adhesive strength between the irradiation site inner surface and the intermediate member or between the irradiation site inner surface and the radiation conversion panel. A radiation imaging apparatus, wherein the radiation imaging apparatus is set so as to be larger than the adhesive strength. The radiation imaging apparatus according to claim 2,
Radiation imaging, wherein an adhesion area between the radiation conversion panel and the intermediate member is larger than an adhesion area between the irradiation site inner surface and the intermediate member or an adhesion area between the irradiation site inner surface and the radiation conversion panel apparatus. The radiographic apparatus according to claim 2 or 3,
The radiographic apparatus according to claim 1, wherein an adhesive force of the second adhesive member is larger than an adhesive force of the first adhesive member. The radiographic apparatus according to any one of claims 2 to 4,
The radiation imaging apparatus, wherein the intermediate member is bonded to the inner surface of the irradiation site by the first adhesive member. The radiation imaging apparatus according to claim 5.
The intermediate member is formed in a flat plate shape,
The first adhesive member is disposed along an outer periphery of one surface of the intermediate member,
The radiographic apparatus, wherein the second adhesive member is disposed on the other surface of the intermediate member. The radiation imaging apparatus according to claim 6, wherein
The radiation imaging apparatus, wherein the first adhesive member is disposed so as to include a central portion of one surface of the intermediate member. In the radiography apparatus of any one of Claims 5-7,
A radiation imaging apparatus, wherein the intermediate member is provided with a grip portion. The radiation imaging apparatus according to claim 8, wherein
The radiographic apparatus according to claim 1, wherein the grip portion protrudes from the radiation conversion panel to a side opposite to a side where the irradiation site inner surface is located. The radiographic apparatus according to claim 9, wherein
The intermediate member is formed in a rectangular shape in plan view,
The radiation imaging apparatus according to claim 1, wherein the grip portion is provided on a lateral side of the intermediate member or a longitudinal side of the intermediate member. The radiation imaging apparatus according to claim 10.
The radiographic apparatus according to claim 1, wherein the gripping portion is provided at or near a corner of the intermediate member. The radiographic apparatus according to claim 10 or 11,
The radiographic apparatus according to claim 1, wherein the grip portion is formed in a rectangular tube shape and provided at an edge portion of the intermediate member. The radiation imaging apparatus according to claim 10.
A control unit for controlling the radiation conversion panel;
A flexible substrate that electrically connects the radiation conversion panel and the control unit;
An IC portion provided on the flexible substrate,
The flexible substrate is configured to be detachable from the radiation conversion panel,
The radiation imaging apparatus according to claim 1, wherein the grip portion is provided at a position other than the position corresponding to the position of the flexible substrate in the intermediate member. The radiation imaging apparatus according to claim 10.
A control unit for controlling the radiation conversion panel;
A flexible substrate that electrically connects the radiation conversion panel and the control unit;
An IC portion provided on the flexible substrate,
The radiographic apparatus characterized in that the flexible substrate or the IC part is fixed to the gripping part. The radiographic apparatus according to claim 14, wherein
The radiographic apparatus according to claim 1, wherein the grip portion is formed so as to cover the IC portion from the inner side of the irradiation site. The radiographic apparatus according to claim 15, wherein
The housing is made of a metal material,
The radiographic apparatus characterized in that the grip portion is provided in contact with the housing and is made of a conductive material. The radiation imaging apparatus according to any one of claims 8 to 16,
The radiographic apparatus characterized in that the grip portion is formed integrally with the intermediate member. The radiation imaging apparatus according to any one of claims 8 to 16,
The grip portion is formed separately from the intermediate member,
A fixing portion fixed to one surface of the intermediate member;
A radiation imaging apparatus comprising: a gripping part main body continuous to the fixing part. The radiation imaging apparatus according to claim 5.
The intermediate member has a plurality of plate members,
The radiation imaging apparatus, wherein the plurality of plate members are provided on the radiation conversion panel in a state of being separated from each other. In the radiography apparatus of any one of Claims 1-19,
The radiation conversion panel includes a scintillator that converts the radiation into visible light;
A radiation imaging apparatus comprising: a photoelectric conversion unit that converts the visible light into an electrical signal corresponding to the radiation image information. The radiographic apparatus according to claim 20, wherein
The radiation imaging apparatus, wherein the radiation conversion panel is laminated in the order of the photoelectric conversion unit and the scintillator along an irradiation direction of the radiation. The radiation imaging apparatus according to claim 21, wherein
A radiation imaging apparatus, wherein the scintillator includes a columnar crystal structure. The radiation imaging apparatus according to any one of claims 20 to 22,
The radiation imaging apparatus according to claim 1, wherein the bending rigidity of the intermediate member is larger than the bending rigidity of the scintillator or the bending rigidity of the photoelectric conversion unit. The radiation imaging apparatus according to claim 21 or 22,
A radiation imaging apparatus, wherein the photoelectric conversion portion has a thickness of 20 μm to 300 μm. In the radiography apparatus of any one of Claims 1-24,
The housing is formed in a U-shaped cross-section and includes a first case including the irradiation site inner surface,
A radiation imaging apparatus comprising: a second case that forms a chamber for housing the intermediate member and the radiation conversion panel by being attached to the first case. In the radiography apparatus of any one of Claims 5-19,
The intermediate member is an intermediate member main body bonded to the inner surface of the irradiation site by the first adhesive member;
A radiation imaging apparatus comprising: a first buffer member that is bonded to the radiation conversion panel by the second adhesive member in a state of being fixed to the intermediate member main body. In the radiography apparatus of any one of Claims 5-19 and 26,
A radiation imaging apparatus comprising: a reinforcing member provided on a surface of the radiation conversion panel opposite to a side where the inner surface of the irradiation site is located. The radiographic apparatus according to claim 26, wherein
A second buffer member provided on a surface opposite to the side on which the irradiation site inner surface is located in the radiation conversion panel;
And a reinforcing member provided on the second buffer member. The radiation imaging apparatus according to claim 28, wherein
The radiation imaging apparatus further comprising a support member that supports the second buffer member and the reinforcing member. The radiation imaging apparatus according to claim 29,
The support member includes a support plate that contacts the other surface of the reinforcing member;
A radiation imaging apparatus comprising: a third buffer member interposed between the support plate and the housing. The radiographic apparatus according to claim 20, wherein
The radiographic apparatus according to claim 1, wherein the intermediate member includes a reflective layer that reflects the visible light emitted from the scintillator. The radiation imaging apparatus according to claim 5.
The radiographic apparatus according to claim 1, wherein the intermediate member includes a thermal diffusion layer bonded to the radiation conversion panel by the second adhesive member. The radiation imaging apparatus according to claim 5.
The intermediate member includes a conductive layer bonded to the radiation conversion panel by the second adhesive member;
A radiation imaging apparatus comprising: a connection member that grounds the conductive layer to ground. The radiation imaging apparatus according to claim 5.
The intermediate member has a heat insulating layer. The radiographic apparatus according to claim 20, wherein
The photoelectric conversion unit has a solid detection element containing amorphous silicon,
The radiographic apparatus according to claim 1, wherein the intermediate member includes a reset light source unit that irradiates reset light to the solid state detection element. The radiographic apparatus according to claim 20, wherein
The intermediate member is a light guide member that guides the visible light emitted by the scintillator;
A light detection unit that detects the visible light guided by the light guide member,
A control unit for controlling the photoelectric conversion unit;
The radiographic apparatus, wherein the control unit switches a control mode of the photoelectric conversion unit based on a detection result of the light detection unit. The radiation imaging apparatus according to claim 5.
The intermediate member is made of soda glass,
The radiation conversion panel includes a scintillator that converts the radiation into visible light;
A photoelectric conversion unit that converts the visible light into an electrical signal corresponding to the radiation image information,
The photoelectric conversion unit is a sensor substrate made of non-alkali glass bonded to the intermediate member,
And a solid-state detection element containing amorphous silicon. The radiation imaging apparatus according to claim 5.
The radiographic apparatus according to claim 1, wherein a warp deformation suppressing portion that suppresses a warp deformation caused by a difference in thermal expansion from the radiation conversion panel is formed on the intermediate member.

Images