JP2012101428A - Paste supplying apparatus and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a paste supplying apparatus and a method that can supply the paste of a high aspect ratio on an electrode of a substrate of the paste which has been difficult in a conventional method.SOLUTION: The paste supplying apparatus includes a head 13 includes a block-shape mask 14 having an opening 14a that is disposed corresponding to the electrodes 3 of the substrate 2 at a lower end, and expresses the paste 4 from the opening 14a of the mask 14. The paste supplying apparatus relatively moves the substrate 2 and the head 13 and positions the substrate 2 and the head 13 so that the opening 14a of the mask 14 and the electrodes 3 of the substrate 2 retained by a substrate retaining part 12 match vertically. Subsequently, the paste supplying apparatus vertically separates the substrate 2 and the head 13 while extruding the paste 4 via the opening 14a of the mask 14 from the head 13 so that the paste 4 (paste pillar 4a) higher than the Mt of the opening 14a of the mask 14 is supplied to the electrodes 3.

Description

  The present invention relates to a paste supply apparatus and a paste supply method for supplying a paste to an electrode of a substrate through an opening of a mask.

  Various substrates such as a substrate incorporated in an IC chip and a printed wiring board on which an IC chip or the like is mounted are provided with a plurality of electrodes, and each electrode is bonded to an electrode of another substrate or another substrate In order to form bumps to be bonded to the electrodes, a paste such as solder or conductive paste is supplied. The paste supply apparatus used for supplying paste to the electrode of the substrate is provided with a substrate holding unit that holds the substrate, and is provided above the substrate holding unit so as to be movable relative to the substrate holding unit. A plate-shaped mask having correspondingly arranged openings and a head part for filling the paste in the mask opening in contact with the substrate, and the substrate and the paste in a state in which the paste is filled in the mask opening By separating the mask from the mask, the paste is removed from the opening of the mask to transfer the paste onto the electrodes of the substrate.

  There are two types of paste supply devices, a squeegee type and a pressure type. In the squeegee type, the head portion includes a squeegee, and the squeegee is placed on the mask while the mask is in contact with the substrate. And the paste on the mask is filled in the opening. On the other hand, in the pressurization method, the head portion has a mechanism for extruding the paste, and the head portion is pressed against the mask while the mask is in contact with the substrate, and the paste is pushed out from the head portion into the opening of the mask. The paste is filled (for example, Patent Document 1).

JP 2001-225443 A

  However, in the above-described conventional paste supply apparatus, the aspect ratio of the paste supplied to the electrode of the substrate is determined by the thickness of the mask and the opening length of the opening. For this reason, for example, when it is necessary to increase the aspect ratio of the paste supplied to the electrode, such as when it is desired to increase the height of the bump formed on the electrode, the conventional method for supplying the paste uses the mask opening. The mask thickness must be increased with respect to the opening length of the mask, it is difficult to remove the paste from the mask opening, and it is difficult to supply a high aspect ratio paste onto the electrode. was there.

  Therefore, an object of the present invention is to provide a paste supply apparatus and a paste supply method that can supply a high aspect ratio paste onto an electrode of a substrate, which has been difficult with a conventional paste supply method.

  The paste supply apparatus according to claim 1 is provided with a substrate holding unit for holding the substrate on which the electrodes are formed, and a substrate holding unit which is disposed above the substrate holding unit so as to be relatively movable with respect to the substrate holding unit. A head portion that has a block-shaped mask having openings arranged at the lower end and presses the paste out of the openings in the mask, and the openings in the mask and the substrate electrodes held in the substrate holding portion are vertically So that the substrate and the head portion are relatively moved so as to match the position of the substrate and the head portion are aligned, and then a paste having a height higher than the thickness of the opening of the mask is supplied onto the electrode. Then, the paste is pushed out from the head portion through the opening of the mask while the substrate and the head portion are separated from each other up and down, and then the extrusion of the paste from the head portion is stopped, and then the substrate is moved up and down with respect to the head portion. Direction And control means for performing plate exit causes control a paste from the aperture of the mask by separating the substrate and the head portion while little by little back and forth relative movement in a direction horizontal to the vertical.

  According to a second aspect of the present invention, there is provided a paste supply method comprising: a substrate holding unit that holds a substrate on which electrodes are formed; and a substrate holding unit that is provided above the substrate holding unit so as to be movable relative to the substrate holding unit. A paste supply method using a paste supply device comprising a block-shaped mask having an opening arranged at the lower end and a head portion for extruding the paste from the mask opening, the mask opening and the substrate The step of aligning the substrate and the head unit by relatively moving the substrate and the head unit so that the electrode of the substrate held by the holding unit matches the vertical direction, and the alignment of the substrate and the head unit Then, the substrate and the head part are moved up and down while pushing the paste from the head part through the mask opening part so that the paste having a height higher than the thickness of the opening part of the mask is supplied onto the electrode. Separation And the step of stopping the extrusion of the paste from the head unit after the substrate and the head unit are separated from each other in the vertical direction, and the extrusion of the paste from the head unit are stopped, and then the substrate is And a step of removing the paste from the opening of the mask by vertically separating the substrate and the head portion while reciprocally moving relative to each other in the vertical direction or in the horizontal plane.

  In the present invention, after aligning the substrate and the head portion so that the opening of the mask and the electrode of the substrate held by the substrate holding portion are aligned in the vertical direction, the thickness is higher than the thickness of the opening of the mask. The paste is pushed out from the opening of the mask by separating the substrate and the head from above and below while pushing the paste from the head through the opening of the mask so that a high-paste paste is supplied onto the electrode. Since the paste is stretched below the mask, the height of the paste supplied onto the electrode can be adjusted according to the distance separating the substrate and the head portion, and the conventional paste supply A high aspect ratio paste, which was difficult with the method, can be supplied onto the electrode.

  In addition, after the substrate and the head portion are separated from each other in the vertical direction, the extrusion of the paste from the head portion is stopped, and then the substrate is reciprocally moved relative to the head portion in the vertical direction or in the horizontal plane direction. The paste is removed from the opening of the mask by separating the substrate and the head part up and down, so the removed paste is supplied to the substrate electrode in a stable state without falling down. The

The block diagram of the paste supply apparatus in one embodiment of this invention The flowchart which shows the procedure of the paste supply operation | work performed by the paste supply apparatus in one embodiment of this invention (A) (b) (c) Operation | movement explanatory drawing when performing the paste supply operation | work of the paste supply apparatus in one embodiment of this invention (A) (b) Operation | movement explanatory drawing when performing the paste supply operation | work of the paste supply apparatus in one embodiment of this invention (A) (b) Operation | movement explanatory drawing when performing the paste supply operation | work of the paste supply apparatus in one embodiment of this invention (A) (b) The bottom view of the board | substrate with which the paste was supplied by the paste supply apparatus in one embodiment of this invention Operation | movement explanatory drawing when performing the paste supply operation | work of the paste supply apparatus in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. A paste supply apparatus 1 shown in FIG. 1 is an apparatus that supplies paste 4 such as solder or conductive paste to an electrode 3 provided on a substrate 2, and holds the substrate on a base 10 via a substrate holding part moving mechanism 11. Part 12 is attached. The substrate holding unit 12 holds the substrate 2 on which the electrodes 3 are formed, and is moved three-dimensionally by an interlocking operation of the horizontal movement mechanism unit 11a and the vertical movement mechanism unit 11b constituting the substrate holding unit moving mechanism 11. In the present embodiment, as shown in the enlarged view of FIG. 1, it is assumed that the substrate 2 is a peripheral type substrate for an IC chip having an electrode 3 only in the peripheral portion.

  A head unit 13 is provided above the substrate holding unit 12 so as to be movable relative to the substrate holding unit 12. The head unit 13 includes a block-shaped mask 14 having an opening 14 a disposed corresponding to the electrode 3 of the substrate 2 at the lower end, and a paste pressing mechanism that presses the paste 4 from the opening 14 a of the mask 14. 15 is provided.

  A camera 16 is provided on the side of the head unit 13 with the imaging field of view facing downward. The camera 16 moves integrally with the head unit 13 and images the positioning mark 2 a on the substrate 2 held by the substrate holding unit 12.

  The paste press-out mechanism 15 includes a paste storage chamber 20 formed in the head portion 13, a pressure plate 21 that moves up and down in the paste storage chamber 20, and a pressure cylinder that lowers the pressure plate 21 in the paste storage chamber 20. 22. The paste 4 is stored in the paste storage chamber 20. When the pressure plate 21 is lowered in the paste storage chamber 20 by the pressurizing cylinder 22 and the paste 4 is pressurized in the paste storage chamber 20, the paste 4 is added. The pressed paste 4 is pressed out below the head portion 13 (below the mask 14) through an opening 14 a provided in the mask 14.

  In FIG. 1, the movement operation of the substrate holding unit 12 (that is, the substrate 2) is performed by the control device 30 provided in the paste supply device 1 to control the operation of the horizontal movement mechanism unit 11 a and the vertical movement mechanism unit 11 b of the substrate holding unit movement mechanism 11. The press operation of the paste 4 by the head unit 13 is performed by the control device 30 controlling the operation of the pressure cylinder 22. The imaging operation of the camera 16 is controlled by the control device 30, and image data obtained by the imaging operation of the camera 16 is transmitted to the control device 30.

  Next, with reference to the flowchart shown in FIG. 2, the execution procedure of the paste supply operation | work which supplies the paste 4 to the electrode 3 on the board | substrate 2 hold | maintained at the board | substrate holding | maintenance part 12 with the paste supply apparatus 1 is demonstrated. In the paste supply operation, the control device 30 first controls the operation of the horizontal movement mechanism unit 11 a and the vertical movement mechanism unit 11 b of the substrate holding unit movement mechanism 11 to move the substrate 2 below the head unit 13, and uses the camera 16. While acquiring the image data of the positioning mark 2a on the substrate 2, the substrate 2 and the head unit 13 are aligned. At this time, the substrate 2 is moved with respect to the head portion 13 (that is, the substrate 2 and the head portion 13 are moved relative to each other) so that the opening 14a of the mask 14 and the electrode 3 of the substrate 2 are aligned vertically. 2 is brought into contact with the lower surface of the mask 14 of the head portion 13 so that the electrode 3 enters the opening 14a of the mask 14 (or the upper surface of the electrode 3 and the lower surface of the mask 14 have the same height). (FIG. 3A. Positioning step of step ST1 shown in FIG. 2). In addition, the position of the board | substrate 2 in the state aligned with the head part 13 in this way is hereafter called an initial position.

  When the control device 30 aligns the substrate 2 and the head unit 13 and positions the substrate 2 in the initial position, the control device 30 controls the operation of the pressurizing cylinder 22 to push down the pressurizing plate 21 in the paste storage chamber 20. (Arrow A shown in FIG. 3B), while the paste 4 is pushed out from the head portion 13 through the opening 14a of the mask 14, the operation of the vertical movement mechanism portion 11b is controlled to move the substrate 2 to the head portion 13. (Ie, the substrate 2 and the head portion 13 are vertically separated) (arrow B1 shown in FIG. 3B), and the paste 4 extruded from the head portion 13 extends below the mask 14. (FIG. 3 (b). Step ST2 shown in FIG. 2).

  When the control device 30 separates the substrate 2 and the head portion 13 from each other in the vertical direction, the control device 30 controls the operation of the pressure cylinder 22 and stops the downward movement of the pressure plate 21, thereby pushing out the paste 4 from the head portion 13. (FIG. 3 (c). Paste extrusion stopping step of step ST3 shown in FIG. 2).

  Thereby, a columnar paste 4 (hereinafter referred to as paste column 4a) is formed on the electrode 3 of the substrate 2, and the height H of the paste column 4a from the upper surface of the electrode 3 (FIG. 3C). Can be adjusted according to the distance Lm (FIG. 3C) that separates the substrate 2 from the head portion 13.

  After stopping the extrusion of the paste 4 from the head unit 13, the control device 30 controls the operation of the substrate holding unit moving mechanism 11, and reciprocally moves the substrate 2 reciprocally in the horizontal plane direction relative to the head unit 13. While the substrate 2 is separated downward from the head portion 13 (that is, the substrate 2 and the head portion 13 are vertically separated) (arrow B1 and arrow C shown in FIG. 4A), the opening of the mask 14 is obtained. The paste 4 is removed from the portion 14a (FIG. 4 (a) → FIG. 4 (b). The plate removal step of step ST4 shown in FIG. 2). As a result, the paste 4 that has fallen out of the plate is supplied onto the electrode 3 of the substrate 2 in a stable state without falling down.

  As described above, the paste pillar 4a separated from the head portion 13 is formed on each electrode 3 of the substrate 2 by the plate removal process in step ST4, but it is caused by the variation in physical properties with the aging of the material of the paste 4 Then, when the state of the paste 4 (paste column 4a) being removed from the opening 14a of the mask 14 at the time of releasing the plate is not stable, as shown in FIG. A part of the paste 4 (paste column 4a) to be supplied to 3 remains in the opening 14a of the mask 14, or a part of the paste 4 to remain in the opening 14a of the mask 14 is a paste on the electrode 3. 4 may stick to you. For this reason, the control device 30 brings the substrate 2 into the initial position by being relatively close (raised) to the head portion 13 again (arrow B2 shown in FIG. 5A), and is supplied onto the electrode 3. The upper end of the paste 4 (paste column 4 a) is brought into contact with the lower end of the paste 4 in the opening 14 a of the mask 14, and then the substrate 2 is reciprocally moved relative to the head portion 13 in the horizontal plane direction. And the head portion 13 are vertically separated (lowered) (arrow B1 and arrow C shown in FIG. 5B). The proximity separation step of step ST5 shown in FIG. This corrects the height of the paste 4 on the electrode 3 that has become insufficiency or excess when the plate is removed, thereby ensuring the necessary height of the paste 4 on the electrode 3 of the substrate 2 (FIG. 5 ( b)).

  The reciprocal relative movement of the substrate 2 with respect to the head unit 13 may be in the vertical direction instead of the horizontal plane direction described above, or a combination of vertical movement and horizontal plane movement may be combined.

  Thereby, the paste 4 (paste column 4a) is formed on the electrode 3 of the substrate 2, and the paste supply operation onto the electrode 3 of the substrate 2 by the paste supply device 1 is completed (FIG. 6A).

  The substrate 2 on which the paste 4 is supplied to the electrode 3 by the paste supply operation is sent to a reflow furnace (not shown) and subjected to a reflow process. By this reflow process, the paste column 4a on each electrode 3 is melted to form ball-shaped bumps Bp (FIG. 6B).

  In the paste supplying operation, when it is desired to increase the height of the bump Bp formed after the reflow process by increasing the height of the paste 4 of the paste column 4a formed on each electrode 3, the step ST2 In the separation step, the distance Lm for separating the substrate 2 from the head portion 13 may be increased, and when it is desired to increase the width of the bump Bp, the paste extrusion step (FIG. 3 (c)) in step ST3 is followed by an addition. The pressure plate 21 may be lowered to further press the paste 4 from the head portion 13 (FIG. 7, arrow A shown in the figure).

  As described above, the paste supply apparatus 1 according to the present embodiment has the substrate holding unit 12 that holds the substrate 2 on which the electrode 3 is formed, and the relative movement with respect to the substrate holding unit 12 above the substrate holding unit 12. A head portion 13 which is provided freely and is provided with a block-like mask 14 having an opening portion 14a arranged corresponding to the electrode 3 of the substrate 2 at the lower end and presses the paste 4 from the opening portion 14a of the mask 14; The substrate 2 and the head unit 13 are moved relative to each other so that the opening 14a of the mask 14 and the electrode 3 of the substrate 2 held by the substrate holding unit 12 are aligned in the vertical direction. After the alignment, the opening 14a of the mask 14 is changed from the head portion 13 so that the paste 4 (paste column 4a) having a height higher than the thickness Mt of the opening 14a of the mask 14 is supplied onto the electrode 3. Through Then, the substrate 2 and the head portion 13 are separated vertically while extruding the paste 4, and then the extrusion of the paste 4 from the head portion 13 is stopped, and then the substrate 2 is moved vertically or horizontally with respect to the head portion 13. Control means (control device 30) is provided for controlling the removal of the paste 4 from the opening portion 14a of the mask 14 by vertically moving the substrate 2 and the head portion 13 while reciprocally moving relative to each other in small increments. It has become a thing.

  Further, the paste supply method in the present embodiment is a paste supply method by the paste supply device 1, and the opening 14a of the mask 14 and the electrode 3 of the substrate 2 held by the substrate holding part 12 are aligned in the vertical direction. The step of aligning the substrate 2 and the head unit 13 by relatively moving the substrate 2 and the head unit 13 (the alignment step of step ST1), and the alignment of the substrate 2 and the head unit 13 are performed. After that, the paste 4 (paste column 4 a) having a height higher than the thickness Mt of the opening 14 a of the mask 14 is supplied onto the electrode 3 from the head 13 through the opening 14 a of the mask 14. 4, the substrate 2 and the head portion 13 are separated from each other in the vertical direction (step ST2 separation step), and the substrate 2 and the head portion 13 are separated from each other in the vertical direction. After stopping the extrusion of the paste 4 from the paste 13 (paste extrusion stopping step of the step ST3) and stopping the extrusion of the paste 4 from the head portion 13, the substrate 2 is moved in the vertical direction or the horizontal plane with respect to the head portion 13. Including a step of removing the paste 4 from the opening portion 14a of the mask 14 by moving the substrate 2 and the head portion 13 up and down while relatively reciprocally moving inward in small increments (a plate removal step of step ST4). It has become.

  In the paste supply apparatus 1 (paste supply method) according to the present embodiment, the substrate 2 and the head portion so that the opening 14a of the mask 14 and the electrode 3 of the substrate 2 held by the substrate holding portion 12 are aligned vertically. 13, after the alignment with 13, the head portion 13 forms the mask 14 so that the paste 4 (paste column 4 a) having a height higher than the thickness Mt of the opening 14 a of the mask 14 is supplied onto the electrode 3. The paste 4 extruded from the opening 14a of the mask 14 is extended below the mask 14 by separating the substrate 2 and the head portion 13 up and down while extruding the paste 4 through the opening 14a. Therefore, the height of the paste 4 (paste column 4a) supplied onto the electrode 3 can be adjusted according to the distance Lm separating the substrate 2 and the head portion 13 from each other. Can be supplied onto the electrodes 3 a paste which was difficult high aspect ratio of 4 (Paste pillars 4a) is a method of supplying the paste 4.

  Further, in the paste supply apparatus 1 (paste supply method) in the present embodiment, after the substrate 2 and the head portion 13 are separated from each other in the vertical direction, the extrusion of the paste 4 from the head portion 13 is stopped, and then the head The paste 2 is removed from the opening 14a of the mask 14 by vertically separating the substrate 2 and the head portion 13 while reciprocally moving the substrate 2 in a vertical direction or in a horizontal plane direction with respect to the portion 13. As a result, the paste 4 that has fallen through the plate is supplied onto the electrode 3 of the substrate 2 in a stable state without falling down.

  Although the embodiment of the present invention has been described so far, the present invention is not limited to the above. For example, in the above-described embodiment, the relative movement between the substrate 2 and the head unit 13 is performed by moving the substrate 2 with respect to the head unit 13. It is good also as a structure which performs relative movement between the board | substrate 2 and the head part 13 by moving the part 13. FIG. In the above-described embodiment, the substrate 2 is a peripheral substrate having the electrodes 3 only around the substrate 2, but this is only an example, and the arrangement of the electrodes 3 with respect to the substrate 2 is not particularly limited. The substrate 2 is not limited to an IC chip substrate, and may be a printed wiring board or the like.

  Provided are a paste supply apparatus and a paste supply method capable of supplying a paste having a high aspect ratio onto an electrode of a substrate, which has been difficult with a conventional paste supply method.

DESCRIPTION OF SYMBOLS 1 Paste supply apparatus 2 Board | substrate 3 Electrode 4 Paste 12 Board | substrate holding part 13 Head part 14 Mask 14a Opening part 30 Control apparatus (control means)
Mt Mask opening thickness

Claims (2)

A substrate holder for holding the substrate on which the electrodes are formed;
A block-shaped mask is provided above the substrate holding portion so as to be movable relative to the substrate holding portion, and has an opening portion corresponding to the electrode of the substrate, and the paste is pressed from the opening portion of the mask. A head part to be taken out,
After aligning the substrate and the head portion by relatively moving the substrate and the head portion so that the opening of the mask and the electrode of the substrate held by the substrate holding portion are aligned vertically, the opening of the mask The substrate and the head part are separated from each other up and down while pushing the paste from the head part through the opening of the mask so that a paste having a height higher than the thickness of the part is supplied onto the electrode. Paste from the opening of the mask by stopping the extrusion of the paste and separating the substrate and the head portion up and down while reciprocally moving the substrate relative to the head portion in the vertical direction or in the horizontal plane direction. A paste supply apparatus comprising: control means for performing control to remove the plate. A substrate holding unit for holding a substrate on which an electrode is formed, and a block-like shape having an opening disposed above the substrate holding unit so as to be relatively movable with respect to the substrate holding unit and arranged corresponding to the electrode of the substrate A paste supply method by a paste supply apparatus provided with a head at a lower end and a head portion for extruding the paste from an opening of the mask,
A step of aligning the substrate and the head portion by relatively moving the substrate and the head portion so that the opening of the mask and the electrode of the substrate held by the substrate holding portion are aligned vertically;
After aligning the substrate and the head part, the paste is extruded from the head part through the mask opening so that a paste having a height higher than the thickness of the mask opening is supplied onto the electrode. While separating the substrate and the head portion up and down,
A step of stopping the extrusion of the paste from the head portion after separating the substrate and the head portion from above and below;
After stopping the extrusion of the paste from the head portion, the substrate opening is separated from the head portion in the vertical direction while moving the substrate back and forth relative to the head portion in the vertical direction or in the horizontal plane direction. And a step of removing the paste from the plate.

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