JP2012084884A - Electronic device housing and manufacturing method thereof - Google Patents
Electronic device housing and manufacturing method thereof Download PDFInfo
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- JP2012084884A JP2012084884A JP2011223057A JP2011223057A JP2012084884A JP 2012084884 A JP2012084884 A JP 2012084884A JP 2011223057 A JP2011223057 A JP 2011223057A JP 2011223057 A JP2011223057 A JP 2011223057A JP 2012084884 A JP2012084884 A JP 2012084884A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2715/00—Condition, form or state of preformed parts, e.g. inserts
- B29K2715/006—Glues or adhesives, e.g. hot melts or thermofusible adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/0026—Transparent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0087—Wear resistance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Casings For Electric Apparatus (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本発明は、電子装置用ハウジング及びその製造方法に関するものである。 The present invention relates to a housing for an electronic device and a method for manufacturing the same.
現在、携帯電話等の電子装置のハウジングは、殆んどプラスチック或いは金属材料により形成される。金属製ハウジングは機械強度が高いが、金属材料が電磁波を遮蔽（Ｓｈｉｅｌｄ）する性質を有し、高周波（Ｒａｄｉｏ Ｆｒｅｑｕｅｎｃｙ）の送受信を行う携帯電話或いはワイヤレスインターネット（Ｗｉｒｅｌｅｓｓｌｅｓｓ Ｉｎｔｅｒｎｅｔ）機能を有するパソコン等の電子装置に対して、高周波数の要求を満たすことができない。一方、プラスチック製ハウジングは、高周波数に関する要求を満たすが、金属質感に欠ける。 Currently, the housing of an electronic device such as a cellular phone is mostly made of plastic or metal material. The metal housing has high mechanical strength, but the metal material has the property of shielding electromagnetic waves, and it is an electronic device such as a mobile phone that performs transmission and reception of high frequency (Radio Frequency) or a personal computer having a wireless Internet (Wireless Internet) function. The device cannot meet the high frequency requirements. On the other hand, plastic housings meet the requirements for high frequencies but lack a metallic texture.
プラスチック製ハウジングの表面に金属質感を付与するため、通常前記プラスチック製ハウジングに対して真空蒸着処理を行う。しかし、それによるコーティング層が電子装置のハウジングの外面に形成されるため、長時間にわたって使用されると、摩損され易く或いは脱落する恐れがあり、前記ハウジングの外観の美観を損なう。 In order to give a metallic texture to the surface of the plastic housing, a vacuum deposition process is usually performed on the plastic housing. However, since the coating layer is formed on the outer surface of the housing of the electronic device, it may be easily worn away or fall off when used for a long time, and the appearance of the housing is deteriorated.
本発明は、上記の問題点を解消するためのもので、金属の外観効果を有し且つ摩損されにくい電子装置用ハウジング及びその製造方法を提供することを目的とする。 An object of the present invention is to solve the above-described problems, and to provide a housing for an electronic device that has a metal appearance effect and is not easily worn out, and a method for manufacturing the same.
上記の目的を達成するために、本発明に係る電子装置用ハウジングは、プラスチック基体及び前記プラスチック基体の表面に接合される加飾膜を備える。前記加飾膜は、透明なプラスチック薄膜と、前記プラスチック薄膜の表面に形成され且つ金属状の視覚効果を有する真空蒸着層と、前記真空蒸着層の表面に形成されるワニス層と、前記ワニス層の表面に形成されるカラー層と、前記カラー層の表面に形成される保護層と、前記保護層の表面に形成されるバインダー層と、を備える。前記プラスチック基体は、射出成形によって前記加飾膜のバインダー層に接合される。 In order to achieve the above object, an electronic device housing according to the present invention includes a plastic substrate and a decorative film bonded to the surface of the plastic substrate. The decorative film includes a transparent plastic thin film, a vacuum deposited layer formed on the surface of the plastic thin film and having a metallic visual effect, a varnish layer formed on the surface of the vacuum deposited layer, and the varnish layer A color layer formed on the surface of the protective layer, a protective layer formed on the surface of the color layer, and a binder layer formed on the surface of the protective layer. The plastic substrate is bonded to the binder layer of the decorative film by injection molding.
また、上記の目的を達成するために、本発明に係る電子装置用ハウジングの製造方法は、透明なプラスチック薄膜と、前記プラスチック薄膜の表面に形成され且つ金属状の視覚効果を有する真空蒸着層と、前記真空蒸着層の表面に形成されるワニス層と、前記ワニス層の表面に形成されるカラー層と、前記カラー層の表面に形成される保護層と、前記保護層の表面に形成されるバインダー層と、を備える加飾膜を用意するステップと、前記加飾膜を所定の形状に裁断するステップと、上記成形された加飾膜を射出成形金型内にセットして、前記射出成形金型のキャビティに溶融状態のプラスチックを射出注入して、前記加飾膜のバインダー層に接合されるプラスチック基体を成形するステップと、を備える。 In order to achieve the above object, a method of manufacturing a housing for an electronic device according to the present invention includes a transparent plastic thin film, and a vacuum deposited layer formed on the surface of the plastic thin film and having a metallic visual effect. The varnish layer formed on the surface of the vacuum deposition layer, the color layer formed on the surface of the varnish layer, the protective layer formed on the surface of the color layer, and formed on the surface of the protective layer A step of preparing a decorative film comprising a binder layer, a step of cutting the decorative film into a predetermined shape, and setting the molded decorative film in an injection mold, the injection molding Injection-injecting molten plastic into the mold cavity and molding a plastic substrate to be bonded to the binder layer of the decorative film.
従来の技術と比較して、本発明の方法により得られた電子装置用ハウジングの外面の図案或いは符号等のマークは、金属色を有する真空蒸着膜からなるので、光沢度が高く且つ金属状質感を有するため、視覚効果が顕著であり、優れた耐摩耗性を有する。 Compared to the prior art, the marks on the outer surface of the electronic device housing obtained by the method of the present invention or the marks such as symbols are made of a vacuum-deposited film having a metallic color, so that the glossiness is high and the metallic texture Therefore, the visual effect is remarkable and the wear resistance is excellent.
図１に示したように、本発明に係る電子装置用ハウジング１００は、プラスチック基体１０及びこのプラスチック基体１０の表面に接合される加飾膜２０を備える。 As shown in FIG. 1, an electronic device housing 100 according to the present invention includes a plastic substrate 10 and a decorative film 20 bonded to the surface of the plastic substrate 10.
前記加飾膜２０は、プラスチック薄膜２１、真空蒸着層２３、透明なワニス層２５、カラー層２６、保護層２７及びバインダー層２８を備える。 The decorative film 20 includes a plastic thin film 21, a vacuum deposition layer 23, a transparent varnish layer 25, a color layer 26, a protective layer 27 and a binder layer 28.
前記プラスチック薄膜２１は、透明なプラスチックからなり、その裏面には前記真空蒸着層２３が形成される。前記真空蒸着層２３が非導電性且つ不連続の膜に形成されることによって、前記電子装置用ハウジング１００を採用した電子装置の高周波数での送受信機能は制限されない。前記真空蒸着層２３は、光透過性及び金属状の外観効果を有する。前記真空蒸着層２３を形成する材料は、錫（Ｓｎ）、インジウム（Ｉｎ）等のような金属及びその合金、或いは金属状外観を有するシリカ（ＳｉＯ２）及び酸化アルミニウム等のような非金属材料とすることができる。前記真空蒸着層２３は、スパッタリング法或いは真空蒸着法等により形成されることも可能である。本発明の実施形態では、スパッタリング法を採用する。 The plastic thin film 21 is made of transparent plastic, and the vacuum deposition layer 23 is formed on the back surface thereof. Since the vacuum deposition layer 23 is formed as a non-conductive and discontinuous film, the high frequency transmission / reception function of the electronic device employing the electronic device housing 100 is not limited. The vacuum deposition layer 23 has light transmittance and a metallic appearance effect. The material for forming the vacuum deposition layer 23 is a metal such as tin (Sn), indium (In), or an alloy thereof, or a non-metallic material such as silica (SiO 2) having a metallic appearance, aluminum oxide, or the like. can do. The vacuum deposition layer 23 can be formed by sputtering or vacuum deposition. In the embodiment of the present invention, a sputtering method is employed.
前記ワニス層２５は、前記真空蒸着層２３の裏面に形成され、主に樹脂及び他の添加剤からなり、且つ顔料を含有しない。前記カラー層２６は、前記ワニス層２５の裏面に形成され、且つインクからなり、前記電子装置用ハウジング１００に外観色彩を付与する。前記保護層２７は、前記カラー層２６の裏面に形成され、且つインクからなり、前記カラー層２６を保護するために用いられる。前記バインダー層２８は、前記保護層２７の裏面に形成され、前記加飾膜２０と前記プラスチック基体１０との間の接合力を増強するために用いられる。前記バインダー層２８は、エポキシ系樹脂、ポリウレタン系樹脂或いはアクリレート系樹脂等のバインダーからなる。 The varnish layer 25 is formed on the back surface of the vacuum vapor-deposited layer 23, is mainly composed of a resin and other additives, and does not contain a pigment. The color layer 26 is formed on the back surface of the varnish layer 25 and is made of ink, and gives an appearance color to the electronic device housing 100. The protective layer 27 is formed on the back surface of the color layer 26 and is made of ink, and is used to protect the color layer 26. The binder layer 28 is formed on the back surface of the protective layer 27 and is used to enhance the bonding force between the decorative film 20 and the plastic substrate 10. The binder layer 28 is made of a binder such as an epoxy resin, a polyurethane resin, or an acrylate resin.
前記プラスチック基体１０は、射出成形により前記加飾膜２０のバインダー層２８に接合される。これにより、前記真空蒸着層２３、前記ワニス層２５、前記カラー層２６、前記保護層２７及び前記バインダー層２８は、前記プラスチック基体１０と前記プラスチック薄膜２１との間に位置する。 The plastic substrate 10 is bonded to the binder layer 28 of the decorative film 20 by injection molding. Accordingly, the vacuum deposition layer 23, the varnish layer 25, the color layer 26, the protective layer 27, and the binder layer 28 are located between the plastic substrate 10 and the plastic thin film 21.
本発明に係る電子装置用ハウジング１００によると、前記プラスチック基体１０の上面にカラー層２６及び真空蒸着層２３が下から上へ順に積層されているので、前記電子装置用ハウジング１００全体がきれいな金属状質感を呈する。しかも、前記真空蒸着層２３は、その上面に被覆される前記プラスチック薄膜２１により保護されるため、摩損されにくい。さらに、前記真空蒸着層２３と前記カラー層２６との間には、両者の接合力を増強する透明なワニス層２５が形成されているため、前記電子装置用ハウジング１００を使用する過程において、前記真空蒸着層２３は、衝撃或いは熱衝撃を受けた際に前記カラー層２６からの剥離が発生しない。また、前記カラー層２６の上面に保護層２７が被覆されているため、前記プラスチック基体１０を射出する際に前記カラー層２６が溶融状態のプラスチックにより破損されることが防止される。 According to the electronic device housing 100 according to the present invention, the color layer 26 and the vacuum deposition layer 23 are laminated on the upper surface of the plastic substrate 10 in order from bottom to top. Presents a texture. In addition, since the vacuum deposition layer 23 is protected by the plastic thin film 21 covered on the upper surface thereof, it is not easily worn out. Further, since a transparent varnish layer 25 is formed between the vacuum deposition layer 23 and the color layer 26 to enhance the bonding force between the two, in the process of using the electronic device housing 100, The vacuum deposition layer 23 does not peel off from the color layer 26 when subjected to an impact or thermal shock. Further, since the upper surface of the color layer 26 is covered with the protective layer 27, the color layer 26 is prevented from being damaged by the molten plastic when the plastic substrate 10 is injected.
本発明の電子装置用ハウジング１００の製造方法は、以下のようなステップを含む。 The method of manufacturing the electronic device housing 100 of the present invention includes the following steps.
まず、順に積層されるプラスチック薄膜２１、真空蒸着層２３、透明なワニス層２５、カラー層２６、保護層２７及びバインダー層２８を備える加飾膜２０を用意する。前記真空蒸着層２３は、スパッタリング法或いは真空蒸着法等により形成される。前記ワニス層２５、前記カラー層２６及び前記保護層２７は、印刷により形成される。 First, a decorative film 20 including a plastic thin film 21, a vacuum deposition layer 23, a transparent varnish layer 25, a color layer 26, a protective layer 27, and a binder layer 28 that are sequentially laminated is prepared. The vacuum deposition layer 23 is formed by sputtering or vacuum deposition. The varnish layer 25, the color layer 26, and the protective layer 27 are formed by printing.
次に、前記加飾膜２０を所定の形状に裁断する。 Next, the decorative film 20 is cut into a predetermined shape.
最後に、所定の形状の加飾膜２０を射出成形金型内にセットしてから、前記射出成形金型のキャビティに溶融状態のプラスチックを射出注入してプラスチック基体１０を成形し、前記プラスチック基体１０を前記加飾膜２０のバインダー層２８に接合させて、前記真空蒸着層２３、前記透明なワニス層２５、前記カラー層２６、前記保護層２７及び前記バインダー層２８を前記プラスチック基体１０と前記プラスチック薄膜２１との間に位置させる。 Finally, after the decorative film 20 having a predetermined shape is set in the injection mold, the molten plastic is injected and injected into the cavity of the injection mold to mold the plastic base 10, and the plastic base 10 is bonded to the binder layer 28 of the decorative film 20, and the vacuum deposition layer 23, the transparent varnish layer 25, the color layer 26, the protective layer 27, and the binder layer 28 are bonded to the plastic substrate 10 and the It is located between the plastic thin film 21.
上記の方法により得られた電子装置用ハウジング１００に対して熱衝撃テスト、温湿度衝撃テスト及び紫外線照射テストを行った。以下、各テストの条件及び結果について詳細に説明する。 The electronic device housing 100 obtained by the above method was subjected to a thermal shock test, a temperature / humidity impact test, and an ultraviolet irradiation test. Hereinafter, the conditions and results of each test will be described in detail.
熱衝撃テストの条件及び結果：８５℃の条件下において２時間測定し、−４０℃の条件下において２時間測定し、温度移行時間（温度が８５℃から−４０℃へ変化する時間）を３分とし、５回サイクル且つ総合で２０時間測定した結果、前記プラスチック薄膜２１と前記プラスチック基体１０との間の各膜には、互い分離する現象が発生しなかった。 Thermal shock test conditions and results: measured at 85 ° C for 2 hours, measured at -40 ° C for 2 hours, temperature transition time (time for temperature to change from 85 ° C to -40 ° C) is 3 As a result of measuring for 5 minutes and measuring for 20 hours in total, each film between the plastic thin film 21 and the plastic substrate 10 was not separated from each other.
温湿度衝撃テストの条件及び結果：湿度が９７％〜９９％の環境下で、２５℃の条件下において９時間測定し、６５℃の条件下において９時間測定し、温度移行時間（温度が２５℃から６５℃へ変化する時間）を３時間とし、１８回サイクル且つ総合で１８日間測定した結果、前記プラスチック薄膜２１と前記プラスチック基体１０との間の各膜には、互い分離する現象が発生しなかった。 Conditions and results of temperature and humidity impact test: Measured for 9 hours under the condition of 25 ° C. under an environment where the humidity is 97% to 99%, measured for 9 hours under the condition of 65 ° C., and the temperature transition time (temperature is 25 As a result of 18 cycles and a total of 18 days, the film between the plastic thin film 21 and the plastic substrate 10 is separated from each other. I did not.
紫外線照射テストの条件及び結果：紫外線を４時間照射し（放射照度が０．３６Ｗ／ｍ２／ｎｍであり、紫外線波長が３４０ｎｍである）、温度を６０℃とする。それから、４時間で光照射を停止し、温度を５０℃とする。上記の条件下において１２回サイクル且つ総合で４日間測定した結果、前記プラスチック薄膜２１と前記プラスチック基体１０との間の各膜には、互い分離する現象が発生しなかった。 Conditions and results of UV irradiation test: UV irradiation is performed for 4 hours (irradiance is 0.36 W / m2 / nm, UV wavelength is 340 nm), and the temperature is 60 ° C. Then, light irradiation is stopped in 4 hours, and the temperature is set to 50 ° C. As a result of measurement for 12 cycles and a total of 4 days under the above-mentioned conditions, no separation phenomenon occurred in each film between the plastic thin film 21 and the plastic substrate 10.
以上、本発明の好適な実施形態について詳細に説明したが、本発明は前記実施形態に制限されるものではなく、本発明の範囲内で種々の変形又は修正が可能であり、該変形又は修正もまた、本発明の特許請求の範囲内に含まれるものであることは、いうまでもない。 The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications or corrections are possible within the scope of the present invention. Needless to say, it is also included in the scope of the claims of the present invention.
１０ プラスチック基体
２０ 加飾膜
２１ プラスチック薄膜
２３ 真空蒸着層
２５ ワニス層
２６ カラー層
２７ 保護層
２８ バインダー層
１００ 電子装置用ハウジング
DESCRIPTION OF SYMBOLS 10 Plastic base | substrate 20 Decorating film 21 Plastic thin film 23 Vacuum deposition layer 25 Varnish layer 26 Color layer 27 Protection layer 28 Binder layer 100 Housing for electronic devices
Claims (3)
前記加飾膜は、透明なプラスチック薄膜と、前記プラスチック薄膜の表面に形成され且つ金属状の視覚効果を有する真空蒸着層と、前記真空蒸着層の表面に形成されるワニス層と、前記ワニス層の表面に形成されるカラー層と、前記カラー層の表面に形成される保護層と、前記保護層の表面に形成されるバインダー層と、を備え、
前記プラスチック基体は、射出成形によって前記加飾膜のバインダー層に接合されることを特徴とする電子装置用ハウジング。 A housing for an electronic device comprising a plastic substrate and a decorative film bonded to the surface of the plastic substrate,
The decorative film includes a transparent plastic thin film, a vacuum deposited layer formed on the surface of the plastic thin film and having a metallic visual effect, a varnish layer formed on the surface of the vacuum deposited layer, and the varnish layer A color layer formed on the surface, a protective layer formed on the surface of the color layer, and a binder layer formed on the surface of the protective layer,
The electronic device housing is characterized in that the plastic substrate is bonded to the binder layer of the decorative film by injection molding.
前記加飾膜を所定の形状に裁断するステップと、
上記所定の形状の加飾膜を射出成形金型内にセットしてから、前記射出成形金型のキャビティに溶融状態のプラスチックを射出注入して、前記加飾膜のバインダー層に接合されるプラスチック基体を成形するステップと、
を含むことを特徴とする電子装置用ハウジングの製造方法。 A transparent plastic thin film, a vacuum deposited layer formed on the surface of the plastic thin film and having a metallic visual effect, a varnish layer formed on the surface of the vacuum deposited layer, and formed on the surface of the varnish layer Preparing a decorative film comprising a color layer, a protective layer formed on the surface of the color layer, and a binder layer formed on the surface of the protective layer;
Cutting the decorative film into a predetermined shape;
The plastic that is bonded to the binder layer of the decorative film after the decorative film having the predetermined shape is set in the injection mold and then the molten plastic is injected and injected into the cavity of the injection mold. Forming a substrate;
The manufacturing method of the housing for electronic devices characterized by the above-mentioned.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105027233A CN102448261A (en) | 2010-10-11 | 2010-10-11 | Electronic device casing and manufacturing method thereof |
| CN201010502723.3 | 2010-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2012084884A true JP2012084884A (en) | 2012-04-26 |
Family
ID=45925355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011223057A Pending JP2012084884A (en) | 2010-10-11 | 2011-10-07 | Electronic device housing and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20120088047A1 (en) |
| JP (1) | JP2012084884A (en) |
| CN (1) | CN102448261A (en) |
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|---|---|---|---|---|
| WO2014069760A1 (en) * | 2012-11-01 | 2014-05-08 | Samsung Electronics Co., Ltd. | Case frame and manufacturing method thereof |
| CN104883831A (en) * | 2014-02-28 | 2015-09-02 | 联想(北京)有限公司 | Electronic device housing processing method, housing and electronic device |
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| CN104754079B (en) * | 2013-12-30 | 2018-09-11 | 比亚迪精密制造有限公司 | Phone housing and preparation method thereof |
| CN104754081B (en) * | 2013-12-30 | 2019-01-11 | 比亚迪股份有限公司 | Phone housing and preparation method thereof |
| EP3162843A1 (en) * | 2015-10-30 | 2017-05-03 | Aluminium Féron GmbH & Co. KG | Coloured surfaces material and object including the same |
| DE102017004028A1 (en) | 2017-04-26 | 2018-10-31 | Aluminum Féron GmbH & Co. KG | Surface material and article provided therewith |
| WO2018201348A1 (en) * | 2017-05-03 | 2018-11-08 | 广东欧珀移动通信有限公司 | Mobile terminal housing, preparation method and mobile terminal |
| CN108174543A (en) * | 2017-12-07 | 2018-06-15 | 广东欧珀移动通信有限公司 | Plank and preparation method thereof, housing, mobile terminal |
| CN110324995B (en) * | 2018-03-29 | 2021-04-20 | 比亚迪股份有限公司 | Electronic equipment shell and electronic equipment |
| CN111615274B (en) * | 2019-02-22 | 2024-05-10 | 华为技术有限公司 | Shell, terminal equipment and manufacturing method of shell |
| CN113858533A (en) * | 2020-06-29 | 2021-12-31 | 北京小米移动软件有限公司 | Shell preparation method, shell and terminal |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1186125A (en) * | 1996-12-25 | 1998-07-01 | 宝鸡市斯瑞商贸科技有限责任公司 | Process for plating on calabash |
| EP1785268A1 (en) * | 2005-11-12 | 2007-05-16 | Hueck Folien Ges.m.b.H | Decorative sheet |
| US20070257398A1 (en) * | 2006-05-04 | 2007-11-08 | Moncrieff Scott E | Laminated electronic components for insert molding |
| CN101096768A (en) * | 2006-06-30 | 2008-01-02 | 深圳富泰宏精密工业有限公司 | Case and surface treating method thereof |
| CN101554823A (en) * | 2008-04-11 | 2009-10-14 | 深圳富泰宏精密工业有限公司 | Manufacturing method of casing and casing manufactured therefrom |
| CN101730409A (en) * | 2008-10-17 | 2010-06-09 | 深圳富泰宏精密工业有限公司 | Housing and method for making same |
| CN101754611A (en) * | 2008-12-17 | 2010-06-23 | 深圳富泰宏精密工业有限公司 | Electronic device casing and manufacturing method thereof |
| CN101945546A (en) * | 2009-07-06 | 2011-01-12 | 深圳富泰宏精密工业有限公司 | Manufacturing method of shell and shell obtained by same |
-
2010
- 2010-10-11 CN CN2010105027233A patent/CN102448261A/en active Pending
-
2011
- 2011-05-26 US US13/116,301 patent/US20120088047A1/en not_active Abandoned
- 2011-10-07 JP JP2011223057A patent/JP2012084884A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014069760A1 (en) * | 2012-11-01 | 2014-05-08 | Samsung Electronics Co., Ltd. | Case frame and manufacturing method thereof |
| KR20140055690A (en) * | 2012-11-01 | 2014-05-09 | 삼성전자주식회사 | Case frame and manufacturing method thereof |
| US9867298B2 (en) | 2012-11-01 | 2018-01-09 | Samsung Electronics Co., Ltd. | Case frame and manufacturing method thereof |
| KR102051583B1 (en) * | 2012-11-01 | 2019-12-03 | 삼성전자주식회사 | Case frame and manufacturing method thereof |
| CN104883831A (en) * | 2014-02-28 | 2015-09-02 | 联想(北京)有限公司 | Electronic device housing processing method, housing and electronic device |
| CN104883831B (en) * | 2014-02-28 | 2018-08-31 | 联想(北京)有限公司 | Processing method, shell and the electronic equipment of a kind of electronic equipment shell |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102448261A (en) | 2012-05-09 |
| US20120088047A1 (en) | 2012-04-12 |
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