CN102324904A - Manufacturing method of packaging body for quartz crystal resonator or oscillator - Google Patents
Manufacturing method of packaging body for quartz crystal resonator or oscillator Download PDFInfo
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- CN102324904A CN102324904A CN201110129884A CN201110129884A CN102324904A CN 102324904 A CN102324904 A CN 102324904A CN 201110129884 A CN201110129884 A CN 201110129884A CN 201110129884 A CN201110129884 A CN 201110129884A CN 102324904 A CN102324904 A CN 102324904A
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Abstract
The invention discloses a manufacturing method of a packaging body for a quartz crystal resonator or oscillator, which is characterized by mainly comprising the steps of material selecting, film covering, film cutting, sand blasting and film removing. A common ceramic wafer is used as a base material for manufacturing a ceramic base or an outer cover, and processed by adopting a protective film and a sand blasting technology, so that the common ceramic wafer can also be used as the packaging body for the quartz crystal resonator or oscillator, the short material which is monopolized by Japan is not used again, the ceramic base and the outer cover with low cost can be rapidly and effectively produced on a large scale, and the production costs of the ceramic base and the outer cover can be greatly reduced.
Description
Technical field
The present invention relates to a kind of manufacturing approach that is used for the packaging body of surface sticked quartz crystal resonator or oscillator.More more specifically, the present invention relates to base of ceramic or enclosing cover manufacturing approach.
Background technology
Quartz-crystal resonator and oscillator are because the accuracy of its frequency and stability, outstanding characteristics such as reliability, small size and low cost all are a kind of indispensable very important electronic devices and components in electron trade such as communication in modern times, computer, amusement equipment, Industry Control and other our the related field.
Make quartz-crystal resonator and oscillator operate as normal, must the quartz crystal resonance piece be fixedly mounted in by in pedestal and the formed seal cavity of enclosing cover, so that reduce the negative effect that the quartz crystal resonance piece receives external environment as far as possible.So pedestal and enclosing cover as packaging body are the important component parts of quartz-crystal resonator and oscillator.
Up to the present, China's surface sticked quartz crystal resonator and oscillator are to be made by the multi-layer thin alumina ceramic material with the base of ceramic in the encapsulation.In these stacked structures, thick metal membrane-coating optionally has been plated on some ceramic layers.Point-device production of these stacked structural requirements and plated film.The metal technology such as deposition, metal mixed and ceramet involution that overdo have been used in these stacked structure compositions; This type of base of ceramic needs high-tech to produce; And this type of high-tech is Japan's monopolization; At present by the monopolization control of three tame Japanese firms, this type of base of ceramic also must rely on Japanese import to this type pedestal in the world, and cost is high and lack independence.
Because the complexity of stacked structure, the manufacturing cost of this type base of ceramic is high and occupied the over half of standard quartz crystal resonator or universal timepiece oscillator production cost.As above-mentioned, the production technology of this type of base of ceramic is by the control of three tame Japanese firms, and this has also increased the risk of supply chain.
In the case; If can break away from Japan to this type of technological monopolization; A kind of simple production technology is provided; So that utilization current material production simple structure, cost low, effective durable and the surface sticked quartz crystal resonator of functional equivalent or the pedestal and the enclosing cover of oscillator, then the manufacturing for surface sticked quartz crystal resonator or oscillator presses for.
Summary of the invention
To above-mentioned problem; The present invention proposes a kind of manufacturing approach to surface mount quartz-crystal resonator or oscillator packaging body; This method does not re-use the material of common shortage; And this method can be produced base of ceramic and enclosing cover cheaply quickly and efficiently in enormous quantities, can satisfy the demand aspect low-cost base of ceramic and enclosing cover.
Another object of the present invention is to provide a kind of manufacturing approach that is used for the packaging body of quartz-crystal resonator or oscillator; This method has characteristics such as low, the easy realization of production cost; And the packaging body of manufacturing ... The base of ceramic that comprises base of ceramic and enclosing cover and existing stacked structure and enclosing cover have equivalent technology index, reliability on an equal basis, also can form the characteristics such as base of ceramic and enclosing cover of small size more.
The basic structure of this base of ceramic is one has the potsherd of suitable shape and some metal films that plate through vacuum sputtering and change plating, and enclosing cover is without metal-coated membrane and change plating.
For realizing above-mentioned order ground, the present invention is achieved in that
The manufacturing approach of the packaging body of a kind of quartz-crystal resonator or oscillator is characterized in that this method mainly comprises the steps:
A, selection, the potsherd of choosing suitable shape is as packaging body;
B, overlay film are with covered with protective film on the potsherd;
C, cut film, diaphragm is excised according to processing request;
D, sandblast, to the potsherd with diaphragm, sand impinges upon the potsherd surface that does not have diaphragm, forms recess with sand blasting sand;
E, striping are removed remaining diaphragm;
F, be for further processing.
Described packaging body is any one of base of ceramic or enclosing cover.
Described processing request is size and the position that base of ceramic or enclosing cover need form recess.
Specifically, at first, the present invention chooses the basic structure of a slice potsherd as surface sticked quartz crystal resonator or oscillator base of ceramic or enclosing cover.
Secondly; For processing and manufacturing on the general potsherd that meets pedestal or enclosing cover overall dimension becomes base of ceramic or enclosing cover; Layer protecting film need be closely sticked on surface of general potsherd; Generally, this type of diaphragm can be make and the impact that will withstand follow-up high speed sandblast of plastic material.Diaphragm also can be that rubber or other can bear the material that the high speed sandblast is impacted, as long as be removed than being easier in this diaphragm process afterwards.Diaphragm can be adhesive on the potsherd and this glue can remove in the process afterwards with general.
Cut film; Be meant through laser and remove unwanted part on the diaphragm, adopt laser to remove that unwanted part can directly adopt laser to excise on the diaphragm, also can have the parts of the protectiveness in hole at frock or other that diaphragm loam cake a slice has a hole; Excise with laser again; The hole has definite shape and size, and the periphery of diaphragm is lived in the parts protection of frock and protectiveness, and being exposed to outer diaphragm is exactly the part of being excised.Remove on the diaphragm unwanted part corresponding to the recess of base of ceramic or enclosing cover; The shape and size of removing the area of diaphragm are decided by the designing requirement of base of ceramic or enclosing cover and the specification requirement of product; Perhaps the frock by the hole decides, and the hole shape of hole worker's dress and size are decided by the designing requirement of base of ceramic or enclosing cover and the specification requirement of product.Lasing laser machine can be general model, removes unwanted part on the diaphragm as long as its laser energy is enough powerful.
Spray base of ceramic or enclosing cover with sandblast again, make that to remove that part of potsherd shaping surface that is not protected behind the diaphragm be recess with diaphragm.Sandblast adopts sand-blasting machine to carry out the high speed sandblast, and sand is impinged upon does not have the potsherd surface of diaphragm, up to forming the recess that base of ceramic or enclosing cover require the shape and the degree of depth.Thicker sand can form recess quickly, but the precision of the recess that thinner sand forms is higher.The sandblast of fair speed can form recess quickly, but the precision of the recess that forms than the sandblast of low velocity is higher.Find an individual choice balance point aspect the speed that the speed of thickness and sandblast through control sand can form at recess and the precision, this can confirm through further test, as selects for use and be about between the 100-1000 order the sand; The charging rate of sand-blasting machine generally is about: pedestal: 20 ~ 50mm/ minute; Enclosing cover: 5 ~ 30mm/ minute, blasting pressure generally was about: pedestal: 1.0 ~ 4.0pa, enclosing cover: 1.5 ~ 5.0pa; The speed of sandblast and thickness also will combine concrete diaphragm to confirm; Therefore, these data are the Control Parameter under some concrete conditions, but in the production of reality, are not limited to these Control Parameter.Generally, sand is wanted dry sand, and these sand all can find on the market.The shape of described recess and the degree of depth can be decided by the designing requirement of pedestal or enclosing cover and the specification requirement of product.
After sandblast is accomplished, remove diaphragm again, the method for removing diaphragm can be any one of Mechanical Method, heating power method, solvent method.Further handle then, wash the remaining sand on potsherd surface, water or organic solvent clean usually, can obtain enclosing cover after washing remaining sand, and enclosing cover need not to use sputter and changes coating technology and further process.If manufacturing base of ceramic; Then after having cleaned surperficial remaining sand; Use the vacuum sputtering metal and change coating technology at the metallic circuit, metal wafer mounting disc and the metal pad that form on this general potsherd on the base of ceramic; Metallic circuit links together with vibration IC resonance piece in function aspects, metal pad links together this type resonator or oscillator with outside application circuit.These metallic circuits, metal wafer mounting disc and metal pad all are the important component parts of pedestal.Used metal can be the combination of chromium, titanium, aluminium, copper, copper alloy, nickel, nickel alloy, silver, silver alloy, gold, billon or any above metal or other metal.The size of metallic circuit and metal dish is decided by designing requirement, and metal layer thickness is also decided by designing requirement.
The overall dimension of described pedestal or enclosing cover is also decided by the specification of product.Common pedestal or enclosing cover overall dimension can be 5mm x 3.2mm, 3.2mm x 2.5mm, 2.5mm x 2.0mm, 2.0mm x 1.6mm etc.
The present invention adopts common potsherd as the base material of making base of ceramic or enclosing cover; Utilize diaphragm and sandblast technology to process; Thereby make the common potsherd also can be as the packaging body of quartz-crystal resonator and oscillator; Do not re-use the material that Japan monopolizes shortage, can produce base of ceramic and enclosing cover cheaply quickly and efficiently in enormous quantities, can reduce the production cost of base of ceramic and enclosing cover greatly.
The present invention also has the characteristics that are prone to realization; And the packaging body of manufacturing comprises that the base of ceramic and the enclosing cover of base of ceramic and enclosing cover and existing stacked structure has equivalent technology index and reliability, further; Manufacturing approach of the present invention has been avoided the structure of multilayer ceramic pedestal; Base of ceramic and being integrally formed of enclosing cover make base of ceramic can keep enough intensity, can form the more base of ceramic and the enclosing cover of small size.
Description of drawings
The control flow chart that Fig. 1 implements for the present invention.
Fig. 2 forms figure for the pedestal that the present invention implements.
Fig. 3 forms figure for the enclosing cover that the present invention implements.
Embodiment
Shown in accompanying drawing, further explanation is done in enforcement of the present invention.
Shown in Figure 1, in conjunction with Fig. 2 and Fig. 3, the main flowsheet synthesis of the manufacturing approach of base of ceramic and enclosing cover is described below.
1. choose potsherd: a potsherd is chosen in the requirement according to pedestal or enclosing cover or its matrix specification, and reserves the external dimensions (combining shown in Fig. 2 " a ", shown in Fig. 3 " a ") of potsherd.
2. pasting protective film: layer protecting film is attached to the surface (combining Fig. 2 " b " with shown in Fig. 3 " b ") of this type of potsherd tightly, and diaphragm employing plastic film gets final product, and sticks with glue in the surface of potsherd.
3. product orientation: the potsherd of coated with protective film is put into positioning tool, and cover porose frock, the size and dimension in hole is decided by the model of resonator or oscillator.
4. laser forming: in order accurately unwanted diaphragm cutting to be removed; Adopt laser that diaphragm is excised; The above-mentioned frock that potsherd and porose frock have been housed is put into the laser machine; Accurately will not need the diaphragm on the protected position to remove with laser, expose not protected ceramic position.Not protected ceramic position normally confirms that according to the recess that base of ceramic or enclosing cover form its concrete size is confirmed (shown in Fig. 2 " c " and Fig. 3 " c ") by designing requirement and product specification.
5. sandblast is shaped: in order to form the recess of base of ceramic or enclosing cover; Part is removed the potsherd of diaphragm and put into sand-blasting machine; Usually adopt high pressure sandblast (high pressure is meant that pressure is greater than 1.0pa), make not protected ceramic position be configured as recess (shown in Fig. 2 " d " and Fig. 3 " d ").Recess requires to have the certain shape and the degree of depth, and the shape of recess is to confirm that by the coverage of diaphragm the degree of depth then is to be confirmed by the speed of the pressure of sand-blasting machine sandblast and charging; Generally; Select for use sand generally to be about between the 100-1000 order, charging rate generally is about: pedestal: 20 ~ 50mm/ minute, and enclosing cover: 5 ~ 30mm/ minute; Blasting pressure generally is about: pedestal: 1.0 ~ 4.0pa, enclosing cover: 1.5 ~ 5.0pa.These are some concrete Control Parameter, but are not limited to these Control Parameter.
6. remove diaphragm: the potsherd sandblast just need all be removed the diaphragm on the potsherd after forming recess.The method of removing is decided by the characteristic of diaphragm, includes but not limited to Mechanical Method, heating power method, solvent method (shown in Fig. 2 " e " and Fig. 3 " e ").
7. clean surface: the surface clean of potsherd is clean through cleaning process.The method of cleaning includes but not limited to Mechanical Method, heating power method, solvent method, surface activity method, pickling, alkali cleaning and rinsing.The pottery enclosing cover cleans the back just can form finished product, and base of ceramic then need further be handled according to following step.
8. sputtering electrode: the clean pedestal potsherd that recess is arranged is put into the sputter frock and covered porose mask plate; The size in hole is consistent with recess; The good metal dots lacquer disk(-sc) of sputter, pad and metallic circuit on the pedestal potsherd in a vacuum; The design of its concrete metal dots lacquer disk(-sc), pad and metallic circuit is decided by porose mask plate, and porose mask plate is decided (shown in Fig. 2 " f ") by the concrete specification of pedestal.
9. change plating: with the pedestal potsherd after the sputter, through the method for electroless plating, plate nickel dam and gold layer at the good metal dots lacquer disk(-sc) of sputter, pad and metallic circuit, nickel dam is decided by foundation design with the thickness of gold layer.With change pedestal after the plating clean up, air-dry, this product is exactly new base of ceramic.The method of cleaning includes but not limited to Mechanical Method, heating power method, solvent method, surface activity method, pickling, alkali cleaning and rinsing.
By this method, can produce the pedestal and corresponding enclosing cover of surface sticked quartz crystal resonator and oscillator in enormous quantities at low cost, satisfy demand low-cost pedestal and enclosing cover.And the mentioned method of the present invention, realize simple, with low cost.Go up wafer after making the pedestal point glue of accomplishing, through putting for the second time glue, the encapsulation enclosing cover can be accomplished the manufacturing of resonator or oscillator again.
The above only is the specific descriptions that the present invention is implemented, all modes of not representing the present invention and being implemented.Equivalent variations and the modification on the basis of the object of the invention and technical scheme, done are all in the protection range of invention.
Claims (9)
1. the manufacturing approach of the packaging body of quartz-crystal resonator or oscillator is characterized in that this method mainly comprises the steps:
A, selection, the potsherd of choosing suitable shape is as packaging body; Described packaging body is any one of base of ceramic or enclosing cover;
B, overlay film are with covered with protective film on the potsherd;
C, cut film, diaphragm is excised according to processing request; Described processing request is size and the position that base of ceramic or enclosing cover need form recess;
D, sandblast, to the potsherd with diaphragm, sand impinges upon the potsherd surface that does not have diaphragm, forms recess with sand blasting sand;
E, striping are removed remaining diaphragm;
F, be for further processing.
2. the manufacturing approach of the packaging body of quartz-crystal resonator as claimed in claim 1 or oscillator it is characterized in that the described diaphragm of step B is the diaphragm that plastics or elastomeric material form, and diaphragm sticks with glue on potsherd.
3. the manufacturing approach of the packaging body of quartz-crystal resonator as claimed in claim 1 or oscillator; It is characterized in that among the step C; Remove unwanted part on the diaphragm through laser, remove on the diaphragm unwanted part corresponding to the recess of base of ceramic or enclosing cover.
4. the manufacturing approach of the packaging body of quartz-crystal resonator as claimed in claim 3 or oscillator; It is characterized in that step C adopts laser to remove that unwanted part is meant that direct employing laser excises on the diaphragm; Perhaps diaphragm loam cake a slice has the frock in hole or the parts with the protectiveness in hole; Excise with laser again; The hole has definite shape and size, and the periphery of diaphragm is lived in the parts protection of frock and protectiveness, and being exposed to outer diaphragm is exactly the part of being excised.
5. the manufacturing approach of the packaging body of quartz-crystal resonator as claimed in claim 1 or oscillator; It is characterized in that among the step D; Spray base of ceramic or enclosing cover with sandblast, make that to remove that part of potsherd shaping surface that is not protected behind the diaphragm be recess with diaphragm; Sandblast adopts sand-blasting machine to carry out sandblast, and sand adopts dry sand.
6. the manufacturing approach of the packaging body of quartz-crystal resonator as claimed in claim 5 or oscillator; It is characterized in that among the step D; Selecting sand for use is between the 100-1000 order, and the charging rate of sand-blasting machine is: pedestal: 20 ~ 50mm/ minute, and enclosing cover: 5 ~ 30mm/ minute; Blasting pressure is: pedestal: 1.0 ~ 4.0pa, enclosing cover: 1.5 ~ 5.0pa.
7. the manufacturing approach of the packaging body of quartz-crystal resonator as claimed in claim 1 or oscillator is characterized in that in the step e, and the method for striping can be any one of Mechanical Method, heating power method, solvent method.
8. the manufacturing approach of the packaging body of quartz-crystal resonator as claimed in claim 1 or oscillator; It is characterized in that in the step F; Be for further processing; Comprise the remaining sand that washes the potsherd surface, cleaning method comprises any one of Mechanical Method, heating power method, solvent method, surface activity method, pickling, alkali cleaning and rinsing.
9. the manufacturing approach of the packaging body of quartz-crystal resonator as claimed in claim 7 or oscillator is characterized in that being for further processing in the step F, further comprises the vacuum sputtering metal and changes the plating step; Base of ceramic is after having cleaned surperficial remaining sand; Again through vacuum sputtering metal and metallic circuit, metal wafer mounting disc and the metal pad of change plating step on formation base of ceramic on the potsherd; Metallic circuit links together with vibration IC resonance piece in function aspects, metal pad links together resonator or oscillator with outside application circuit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110129884A CN102324904A (en) | 2011-05-19 | 2011-05-19 | Manufacturing method of packaging body for quartz crystal resonator or oscillator |
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| CN201110129884A CN102324904A (en) | 2011-05-19 | 2011-05-19 | Manufacturing method of packaging body for quartz crystal resonator or oscillator |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103825569A (en) * | 2014-03-05 | 2014-05-28 | 安庆友仁电子有限公司 | Quartz crystal resonator manufacturing process |
| CN103897613A (en) * | 2014-04-18 | 2014-07-02 | 太仓泰邦电子科技有限公司 | Piezoelectric and conductive adhesive tape |
| CN104384708A (en) * | 2014-10-08 | 2015-03-04 | 中国电子科技集团公司第五十五研究所 | Laser processing method of chip packaging shell |
| CN104762665A (en) * | 2015-03-27 | 2015-07-08 | 上海集成电路研发中心有限公司 | Laser processing device and system as well as wafer processing system |
| CN110149101A (en) * | 2019-05-20 | 2019-08-20 | 成都泰美克晶体技术有限公司 | A method of protection quartz wafer electrode |
| CN110919203A (en) * | 2019-12-02 | 2020-03-27 | 东莞信柏结构陶瓷股份有限公司 | Ceramic surface pattern processing method, ceramic and electronic equipment shell |
| CN112054063A (en) * | 2020-09-07 | 2020-12-08 | 深圳市灵明光子科技有限公司 | Chip-scale packaging method, chip-scale packaging structure and photoelectric device |
| CN114714268A (en) * | 2020-12-22 | 2022-07-08 | 浙江蓝晶芯微电子有限公司 | Ultrahigh frequency ultrathin quartz wafer mask positioning tool and positioning method |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103825569A (en) * | 2014-03-05 | 2014-05-28 | 安庆友仁电子有限公司 | Quartz crystal resonator manufacturing process |
| CN103897613A (en) * | 2014-04-18 | 2014-07-02 | 太仓泰邦电子科技有限公司 | Piezoelectric and conductive adhesive tape |
| CN104384708A (en) * | 2014-10-08 | 2015-03-04 | 中国电子科技集团公司第五十五研究所 | Laser processing method of chip packaging shell |
| CN104762665A (en) * | 2015-03-27 | 2015-07-08 | 上海集成电路研发中心有限公司 | Laser processing device and system as well as wafer processing system |
| CN110149101A (en) * | 2019-05-20 | 2019-08-20 | 成都泰美克晶体技术有限公司 | A method of protection quartz wafer electrode |
| CN110919203A (en) * | 2019-12-02 | 2020-03-27 | 东莞信柏结构陶瓷股份有限公司 | Ceramic surface pattern processing method, ceramic and electronic equipment shell |
| CN110919203B (en) * | 2019-12-02 | 2021-09-10 | 东莞信柏结构陶瓷股份有限公司 | Ceramic surface pattern processing method, ceramic and electronic equipment shell |
| CN112054063A (en) * | 2020-09-07 | 2020-12-08 | 深圳市灵明光子科技有限公司 | Chip-scale packaging method, chip-scale packaging structure and photoelectric device |
| CN112054063B (en) * | 2020-09-07 | 2022-04-15 | 深圳市灵明光子科技有限公司 | Chip-scale packaging method, chip-scale packaging structure and photoelectric device |
| CN114714268A (en) * | 2020-12-22 | 2022-07-08 | 浙江蓝晶芯微电子有限公司 | Ultrahigh frequency ultrathin quartz wafer mask positioning tool and positioning method |
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Application publication date: 20120118 |