CN104754081B - Phone housing and preparation method thereof - Google Patents
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- CN104754081B CN104754081B CN201310746028.5A CN201310746028A CN104754081B CN 104754081 B CN104754081 B CN 104754081B CN 201310746028 A CN201310746028 A CN 201310746028A CN 104754081 B CN104754081 B CN 104754081B
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Abstract
The invention discloses a kind of phone housings and preparation method thereof.Phone housing includes: that plate, film plating layer, protection ink layer, pattern layer and background layer, film plating layer are located on a part of lower surface of plate, and another part lower surface of plate is exposed to form blank parts.Protection ink layer is located on the lower surface of film plating layer.Pattern layer is located at blank parts.Background layer is located on the lower surface of pattern layer and protection ink layer.Phone housing according to an embodiment of the present invention has different appearances, guarantees that pattern layer will not be scratched or wear in use, durable.
Description
Technical field
The present invention relates to field of mobile phones, more particularly, to a kind of phone housing and preparation method thereof.
Background technique
The existing shell with metal-like generally uses metal forging then to polish and is made, and manufacture craft is multiple
It is miscellaneous, it is at high cost, feel is heavy, and the shell of metal structure has certain shielding action to electromagnetic signal, limits antenna etc.
The design of electronic structure.
Another shell with metal-like, which uses, sprays one layer of priming paint on plasthetics surface, then carries out vacuum
Plated film, then paint, finishing coat are protected in spraying, and color is single, generally only silver color, and spraying process processing procedure is longer, right
The pollution of environment is larger.
Summary of the invention
The present invention is directed to solve one of above-mentioned technical problem in the prior art at least to a certain extent.
For this purpose, there are different appearances an object of the present invention is to provide a kind of phone housing.
A kind of production method it is another object of the present invention to propose phone housing.
Phone housing according to an embodiment of the present invention, comprising: plate;Film plating layer, the film plating layer are located at the plate
On a part of lower surface, another part lower surface of the plate is exposed to form blank parts;Protect ink layer, the protection
Ink layer is located on the lower surface of the film plating layer;Pattern layer, the pattern layer are located at the blank parts;Background layer, institute
Background layer is stated to be located on the lower surface of the pattern layer and the protection ink layer.
Phone housing according to an embodiment of the present invention can be set as needed the film plating layer without color, and can pass through
The protection ink layer and background layer of different colours are selected, the product with different appearances is obtained.Again due to film plating layer and figure
Pattern layer is located between plate and background layer, and plate has fabulous physical and chemical performance, guarantees that pattern layer will not be drawn in use
Wound or abrasion, it is durable.
The production method of phone housing according to an embodiment of the present invention, includes the following steps: S1: prebake conditions plate;S2: it adopts
Plated film is carried out on the lower surface of the plate with coating process to form one layer of film plating layer;S3: using printing technology in part
One layer of protection ink layer is printed on the lower surface of film plating layer;S4: the film plating layer for not being printed with the protection ink layer is gone
Except so that part plate exposes to form blank parts;S5: printing technology printing pattern layer in the blank parts is used;
S6: background layer is set in the pattern layer and the protection ink layer, the background layer is dried to form semi-finished product;
S7: cutting technique is used to cut the semi-finished product to obtain the phone housing of predetermined shape.
The production method of phone housing according to an embodiment of the present invention can be produced outside the mobile phone with metal-like
Shell, and the production method makes the thinner thickness of phone housing.Simultaneously can by select different colours protection ink layer and
Background layer obtains the handset shell with different appearances.And due to film plating layer and pattern layer be located at plate and background layer it
Between, plate has preferable physical and chemical performance, guarantees that pattern layer will not be scratched or wear in use, durable.
Detailed description of the invention
Fig. 1 is the flow chart according to the production method of the phone housing of the embodiment of the present invention;
Fig. 2 is the schematic diagram according to the phone housing of the embodiment of the present invention.
Appended drawing reference:
Phone housing 100, plate 1, Polycarbonate Layer 10, transition resin layer 11, stiffening layer 12, film plating layer 2, protection ink
Layer 3, pattern layer 4, background layer 5
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", length ", " width ", " thickness ", "upper",
"lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", etc. instructions orientation or position
Relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, without referring to
Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot manage
Solution is limitation of the present invention.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral;It can be mechanical connect
It connects;It can be directly connected, the connection or two members inside two elements can also be can be indirectly connected through an intermediary
The interaction relationship of part.For the ordinary skill in the art, it can understand that above-mentioned term exists as the case may be
Concrete meaning in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
The production method for describing phone housing according to an embodiment of the present invention with reference to Fig. 1 first below, using the production side
Method can produce the phone housing with metal-like.
As shown in Figure 1, the production method of phone housing according to an embodiment of the present invention, includes the following steps:
S1: prebake conditions plate, wherein being to eliminate plate internal residual in the production process to plate progress prebake conditions
Stress, guarantee to crack or deform because of stress release in manufacturing process in subsequent printing etc..Specifically, by plate
Material is placed in oven, setting at a temperature of toast the regular hour, in example of the invention, plate is dried at 80 DEG C
It is 2 hours roasting.In specific example of the invention, the integral thickness of plate is 0.3-1.0mm.
S2: coating process is used to carry out plated film on the lower surface of plate to form one layer of film plating layer.Wherein it is possible to according to
Different film plating layers is arranged in different demands, such as the film plating layer with metal-like can be set.It should be noted that can adopt
With any plated film mode to form one layer of film plating layer on the lower surface of plate.
S3: one layer of protection ink layer is printed on the lower surface of Partial coatings layer using printing technology, that is, a part
It is printed with protection ink layer on the lower surface of film plating layer, is not printed with protection ink layer on the lower surface of another part film plating layer,
Preferably, one layer of protection ink layer is printed on the lower surface of Partial coatings layer using silk-screen printing technology, guarantees that film plating layer exists
It will not be damaged in subsequent operation, wherein the requirement to protection ink layer is as follows: film plating layer will not be corroded, in plated film layer surface
There is stronger adhesive force, bath corrosion will not be taken off, while having preferable adhesive force with pattern layer and background layer.Of the invention
In specific example, protect ink layer with a thickness of 10-30 microns.
S4: it will not be printed with the film plating layer removal of protection ink layer so that part plate exposes to form blank parts.
In specific example of the invention, take off plating to the film plating layer for not being printed with protection ink layer using taking off plating solution so that
Part plate exposes to form blank parts, it should be noted that after forming out blank parts, needs to the plate taken off after plating
It is dried.More specifically, the plate that can will be printed with protection ink layer be placed on when taking off in plating solution such as hydrochloric acid solution one section
Between, after the film plating layer for not being printed with protection ink layer is completely dissolved, plate is taken out, is dried, is placed on grill with dry cloth, one
Determine to toast certain time at temperature so that taking off the plate drying after plating.
S5: using printing technology printing pattern layer in blank parts, and pattern layer passes through the plate after taking off plating and presents at this time
Out.Specifically, pattern layer provides logo or other pattern effects for whole mobile phone shell, wherein requiring pattern layer in plate
And there is stronger adhesive force on protection ink layer.Preferably, using screen printing technique in blank parts printing ink layer.
In example of the invention, pattern layer with a thickness of 10-30 microns.
S6: background layer is set in pattern layer and protection ink layer, background layer is dried to form semi-finished product, also
It is to say, the entire protection ink layer of background layer covering and pattern layer, background layer provides background color for whole mobile phone shell at this time, and
Protect pattern layer injury-free.Specifically, using background layer is printed in pattern layer and protection ink layer in printing technology, at this time
Background layer is ink layer.It is required that background layer shows in printing process with stable color, and will not etch figures pattern layer.?
In specific example of the invention, background layer with a thickness of 15-60 microns.
S7: cutting technique is used to cut semi-finished product to obtain the phone housing of predetermined shape.Specifically, milling can be used
Knife cuts semi-finished product according to preset Program path, to obtain phone housing.
The production method of phone housing according to an embodiment of the present invention can be produced outside the mobile phone with metal-like
Shell, and the production method makes the thinner thickness of phone housing.Simultaneously can by select different colours protection ink layer and
Background layer obtains the handset shell with different appearances.And due to film plating layer and pattern layer be located at plate and background layer it
Between, plate has preferable physical and chemical performance, guarantees that pattern layer will not be scratched or wear in use, durable.
In a specific embodiment of the present invention, plate includes: polycarbonate (PC) layer, transition resin layer and stiffening layer, mistake
Resin layer is crossed between Polycarbonate Layer and stiffening layer, film plating layer is located on the lower surface of Polycarbonate Layer in step s 2.
Specifically, be compounded with one layer of transition resin layer on the surface of Polycarbonate Layer, then transition resin layer surface stiffened with
Stiffening layer is obtained, stiffening layer is sprayed on transition resin layer surface for example, by using spraying technology, so that the overall flexibility of plate
Preferably, the operation such as bending of big radian can be carried out.
Preferably, transition resin layer is acrylic (PMMA) layer.Since the crystallinity of acrylic layer is higher, in acrylic layer
The stiffening layer of the available relatively high rigidity of surface stiffened, can achieve 5H or more.
Specifically, stiffening layer requires have good planarization and light transmittance, and light transmittance is greater than 90%, guarantees sufficiently solidification, with
Obtain high hardness;In addition, stiffening layer needs certain ductility, guarantee when forming stretching not by drawing crack.More specifically,
Stiffening layer is polyorganosiloxane resin layer.
Acrylic layer is the resin layer being compounded on Polycarbonate Layer, it is desirable that light transmittance is higher than 92%, good forming ability, with
Polycarbonate has good adhesive force, and the thermal contraction deflection of the two is close.Polycarbonate Layer is the matrix resin of plate,
Light transmittance is asked to be higher than 90%, and good forming ability.
In some embodiments of the invention, the coating process used in step S2 is vacuum sputtering coating.Wherein vacuum
The working principle of sputtering plating is under vacuum conditions, to bombard target using high energy ion beam, generate the metallic of state of atom
After deposit to hold plating object on, due to bombardment generate metallic have higher energy, with hold plating object have stronger binding force,
Plated layer compact, adhesive force is high, is not easy to be scratched.When using vacuum sputtering coating, according to the needs of color, can choose copper, aluminium,
Stainless steel, silver, gold or indium tin are as target, and light transmittance requirement is in 10-30%, and even film layer, vacuum sputtering coating layer is fine and close,
It is not easy to be scraped off in operation and be corroded by the background layer of subsequent printing.
Further, when using vacuum sputtering coating in step S2, in step S7, before being cut can half-and-half at
Product carry out high-pressure molding, so as to arrive the phone housing with stereoscopic effect.Specifically, semi-finished product can be placed on high-pressure molding
In mold, by the pressure of high pressure gas, by the plate forming of softening to required shape.
In other embodiments of the invention, the coating process used in step S2 is beam bombardment plated film
(EBVM).Wherein, the working principle of beam bombardment plated film refers under vacuum conditions, and high-power electron beam is in preset journey
Under sequence, point different time sections bombard silica and titanium dioxide target respectively, bombard the silica and titanium dioxide of generation
Molecule deposition forms the silica and titanium oxide film layer of alternately superposition, due to silica and titanium dioxide to holding on plating object
Titanium film layer has different refraction and reflection angle to the light of chromatographies different in light, and incidence visible light is in multi-lamellar silica
It reflects and reflects with being generated in titanium dioxide membrane system, the light of certain spectrum can form total reflection inside film layer and can not reflect
The light at interface out, certain spectrum finally can reflect interface by repeatedly refraction and reflection inside film layer, not according to membrane system
Together, the light of certain particular color is finally reflected.That is, beam bombardment plated film is using silica and dioxy
Change titanium, by the superposition of the silica and titanium dioxide film of different-thickness, the absorption of the property of can choose and reflection incident light
Chromatography, different superposition membrane systems can show different colors, and the product of same membrane system observes the production after plated film from different perspectives
Different colors can be also presented in product.
It is carried out below by production method of two specific embodiments to phone housing according to an embodiment of the present invention detailed
Description, in embodiment 1 use vacuum sputtering coating, while also to semi-finished product carry out high-pressure molding.It uses in example 2
Beam bombardment plated film, target design different silica and two according to the demand of color for silica and titanium dioxide
The thicknesses of layers and lamination of titanium oxide need each thickness degree of strict control, guarantee that product colour is consistent.
Embodiment 1:
(1) prebake conditions tear the protective film on its surface off, are laid on grill by plate cutting at required size, then will
Grill is placed in oven, is toasted 2 hours at 80 DEG C, is then taken out cooling.
(2) one side that plate is torn across film upward, is laid in sputter coating Dropbox, and setting RF cleans 600 watts of power, plating
The film time 1.0 seconds, delay time 1.0 seconds, 1.5 kilowatts of plated film power, to be formed with film plating layer on plate.
(3) printing protection ink layer, ink types IPX-971, color is black, at 15 ± 2 μm of film thickness, 80 DEG C of printing
Toast drying in 1 hour.
(4) plating is taken off, the plated film plate for printing protection ink layer is placed in 2% hydrochloric acid solution, is impregnated 5-10 seconds, to not
After the film plating layer of printing protection ink layer is completely dissolved, plate is taken out, is dried, is placed on grill with dry cloth, it is small that 1 is toasted at 80 DEG C
When it is dry.
(5) after the plate that moisture is completely dried is cooling, plating region i.e. blank parts printed patterns, the face of pattern layer are being taken off
The plate that color passes through after taking off plating shows.Drying in 1 hour is toasted at 15 ± 2 μm of film thickness, 80 DEG C of printing.
(6) background layer is printed, ink paint model beauty China QIPL-534856, ink is grey, wherein joined 0.5%
Levelling agent XC3-210, print 15 ± 2 μm of film thickness, background layer need to be completely covered pattern layer and protection ink layer, to background layer
Republish one layer after dry tack free in the same manner again;It is complete that drying in 4 hours is toasted at 80 DEG C.
(7) it sets 350 DEG C of high pressure gas molding equipment baking temperature to toast 30 seconds, high-pressure 50KG, the dwell time 30
Second, venting duration 5 seconds.Plate of the printing after dry is placed in high pressure gas molding die, toasts 30 seconds and softens at 350 DEG C
Afterwards, pressure-air is poured after molding, is covered in it on bed die face, obtain preset shape, be opened and take out after pressure release, it is cold
But.
(8) plate after cooling will be formed and be fixed on the processing of CNC(computer-aided) it cuts on jig, according to final products
2D/3D figure sets CNC cutter cutting path, and the speed of mainshaft is arranged: 5000r/min, feed speed: 1000mm/min is cut
It cuts, obtains product.
Embodiment 2:
(1) prebake conditions tear the protective film on its surface off, are laid on grill by plate cutting at required size, then will
Grill is placed in oven, is toasted 2 hours at 80 DEG C, is then taken out cooling.
(2) beam bombardment plated film is carried out to plate, film layer is four layers, and first layer is silica, with a thickness of 294.28
Nanometer, the second layer is titanium dioxide, and with a thickness of 82.09 nanometers, third layer is silica, with a thickness of 108.48 nanometers, the 4th
Layer is titanium dioxide, with a thickness of 93.05 nanometers, to be formed with film plating layer on plate.
(3) printing protection ink layer, ink types IPX-971, color is black, at 15 ± 2 μm of film thickness, 80 DEG C of printing
Toast drying in 1 hour.
(4) plating is taken off, the plated film plate for printing protection ink layer is placed in 2% hydrochloric acid solution, is impregnated 20-40 seconds, to not
After the film plating layer of printing protection ink layer is completely dissolved, plate is taken out, is dried, is placed on grill with dry cloth, it is small that 1 is toasted at 80 DEG C
When it is dry.
(5) after the plate that moisture is completely dried is cooling, plating region printed patterns are being taken off, the color of pattern layer is by taking off plating
Plate afterwards shows.Drying in 1 hour is toasted at 15 ± 2 μm of film thickness, 80 DEG C of printing.
(6) background layer, ink paint model beauty China IPL-1021C are printed, ink is white, 15 ± 2 μm of film thickness are printed,
Pattern layer and protection ink layer need to be completely covered in background layer, republish one in the same manner again after the dry tack free of background layer
Layer;It is complete that drying in 4 hours is toasted at 80 DEG C.The appearance of whole mobile phone shell is rendered as white at this time, and whole mobile phone shell is from outer
It inwardly sees and is followed successively by plate, pattern layer and background layer.
(7) drying plate after cooling is fixed on CNC cutting jig, is set according to the 2D/3D figure of final products
CNC cutter cutting path, the speed of mainshaft is arranged: 5000r/min, feed speed: 1000mm/min is cut, and obtains product.
The thickness of the production method of phone housing according to an embodiment of the present invention, phone housing can be complied with down to 0.3mm
The lightening trend of electronic products such as present mobile phone, and its surface hardness is high, reaches 5H or more.It simultaneously can be according to need
It wants, sets different vacuum sputtering coating film thickness, metal-like can change according to thicknesses of layers, or different by selection
Beam bombardment plate membrane system, the product of different colours can be obtained.And the protection ink layer of selection different colours can be passed through
And background layer, obtain the product with different appearances.Again since film plating layer and pattern layer are located between plate and background layer,
Plate has fabulous physical and chemical performance, guarantees that pattern layer will not be scratched or wear in use, durable.And the mobile phone
Shell can be assembled on the other component of electronic product by marine glue, play the role of complete machine waterproof.
Phone housing 100 according to an embodiment of the present invention is described below with reference to Fig. 1 and Fig. 2.
As shown in Fig. 2, phone housing 100 according to an embodiment of the present invention, comprising: plate 1, film plating layer 2, protection ink layer
3, pattern layer 4 and background layer 5.Wherein, film plating layer 2 is located on a part of lower surface of plate 1, another part following table of plate 1
It shows out to form blank parts, that is to say, that a part of lower surface of plate 1 is equipped with film plating layer 2, another portion of plate 1
Film plating layer 2 is not provided on point lower surface.Protection ink layer 3 is located on the lower surface of film plating layer 2.Specifically, ink layer 3 is protected
With a thickness of 10-30 microns.
Pattern layer 4 is located at blank parts.Background layer 5 is located on the lower surface of pattern layer 4 and protection ink layer 3.Specifically
Ground, pattern layer 4 with a thickness of 10-30 microns, background layer 5 with a thickness of 15-60 microns, background layer 5 is ink layer.Wherein, root
Production method machine-shaping according to the above embodiment of the present invention can be used according to the phone housing 100 of the embodiment of the present invention, it should
Production method had described in detail above, and just no longer applies state here.
Phone housing 100 according to an embodiment of the present invention can be set as needed the film plating layer 2 without color, and can
By selecting the protection ink layer 3 and background layer 5 of different colours, the product with different appearances is obtained.Again due to plated film
Layer 2 and pattern layer 4 are located between plate 1 and background layer 5, and plate 1 has fabulous physical and chemical performance, guarantee that pattern layer 4 was using
It will not be scratched or wear in journey, it is durable.
In a specific embodiment of the present invention, plate 1 includes: polycarbonate (PC) layer 10, transition resin layer 11 and stiffened
Layer 12, transition resin layer 11 is between Polycarbonate Layer 10 and stiffening layer 12, and film plating layer 2 is located at polycarbonate in step s 2
On the lower surface of layer 10.Specifically, one layer of transition resin layer 11 is compounded on the surface of Polycarbonate Layer 10, then in mistake
11 surface stiffened of resin layer is crossed to obtain stiffening layer 12, so that the overall flexibility of plate 1 is preferable, the curved of big radian can be carried out
The operation such as song.
Preferably, transition resin layer 11 is acrylic (PMMA) layer.Since the crystallinity of acrylic layer is higher, in acrylic
The stiffening layer 12 of the available relatively high rigidity of layer surface stiffened, can achieve 5H or more.
Specifically, stiffening layer 12 requires have good planarization and light transmittance, and light transmittance is greater than 90%, guarantees sufficiently solidification,
To obtain high hardness;In addition, stiffening layer 12 needs certain ductility, guarantee when forming stretching not by drawing crack.More
Body, stiffening layer 12 is polyorganosiloxane resin layer.
Acrylic layer 11 is the resin layer being compounded on Polycarbonate Layer 10, it is desirable that light transmittance is higher than 92%, and mouldability is good
It is good, there is good adhesive force with polycarbonate, and the thermal contraction deflection of the two is close.Polycarbonate Layer 10 is the base of plate 1
Body resin, it is desirable that light transmittance is higher than 90%, and good forming ability.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
What can be combined in any suitable manner in one or more embodiment or examples.In addition, those skilled in the art can say this
Different embodiments or examples described in bright book are engaged and are combined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (19)
1. a kind of phone housing characterized by comprising
Plate;
Film plating layer, the film plating layer are located on a part of lower surface of the plate, and another part following table of the plate is showed
Out to form blank parts;
Ink layer is protected, the protection ink layer is located on the lower surface of the film plating layer;
Pattern layer, the pattern layer are located at the blank parts, and the pattern layer is printing layer;
Background layer, the background layer are located on the lower surface of the pattern layer and the protection ink layer;
The plate includes: Polycarbonate Layer, transition resin layer and stiffening layer, and the transition resin layer is located at the polycarbonate
Between layer and the stiffening layer, the film plating layer is located on the lower surface of the Polycarbonate Layer.
2. phone housing according to claim 1, which is characterized in that the transition resin layer is acrylic layer.
3. phone housing according to claim 1, which is characterized in that the stiffening layer is polyorganosiloxane resin layer.
4. phone housing according to claim 1, which is characterized in that it is described protection ink layer with a thickness of 10-30 microns.
5. phone housing according to claim 1, which is characterized in that the pattern layer with a thickness of 10-30 microns.
6. phone housing according to claim 1, which is characterized in that the background layer is ink layer.
7. phone housing according to claim 1, which is characterized in that the background layer with a thickness of 15-60 microns.
8. a kind of production method of phone housing, which comprises the steps of:
S1: prebake conditions plate;
S2: coating process is used to carry out plated film on the lower surface of the plate to form one layer of film plating layer;
S3: one layer of protection ink layer is printed on the lower surface of Partial coatings layer using printing technology;
S4: it will not be printed with the film plating layer removal of the protection ink layer so that part plate exposes to form gutter
Point;
S5: printing technology printing pattern layer in the blank parts is used;
S6: being arranged background layer in the pattern layer and the protection ink layer, is dried the background layer to form half
Finished product;
S7: cutting technique is used to cut the semi-finished product to obtain the phone housing of predetermined shape.
9. the production method of phone housing according to claim 8, which is characterized in that in step s 4, using taking off plating solution
The film plating layer for not being printed with the protection ink layer is carried out taking off to be plated with to form blank parts.
10. the production method of phone housing according to claim 8, which is characterized in that in step s 6, using printing skill
Art prints the background layer in the pattern layer and the protection ink layer.
11. the production method of phone housing according to claim 8, which is characterized in that the plate includes: polycarbonate
Layer, transition resin layer and stiffening layer, the transition resin layer is between the Polycarbonate Layer and the stiffening layer, described
Film plating layer described in step S2 is located on the lower surface of the Polycarbonate Layer.
12. the production method of phone housing according to claim 11, which is characterized in that the transition resin layer is sub- gram
Power layer.
13. the production method of phone housing according to claim 11, which is characterized in that the stiffening layer is polysiloxanes
Resin layer.
14. the production method of phone housing according to claim 11, which is characterized in that the light transmittance of the stiffening layer is big
In 90%.
15. the production method of phone housing according to claim 11, which is characterized in that the light transmission of the Polycarbonate Layer
Rate is greater than 90%.
16. the production method of phone housing according to claim 8, which is characterized in that the plating used in the step S2
Membrane process is vacuum sputtering coating.
17. the production method of phone housing according to claim 16, which is characterized in that in the step S7, carrying out
Before cutting high-pressure molding can be carried out to the semi-finished product.
18. the production method of phone housing according to claim 8, which is characterized in that the plating used in the step S2
Membrane process is beam bombardment plated film.
19. the production method of phone housing according to claim 8, which is characterized in that the step S3 and the step
Screen printing technique is respectively adopted in S5 and prints the protection ink layer and the pattern layer.
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CN105072228A (en) * | 2015-09-06 | 2015-11-18 | 深圳市中联讯科技有限公司 | Mobile phone surface shell and processing method thereof |
CN110324995B (en) * | 2018-03-29 | 2021-04-20 | 比亚迪股份有限公司 | Electronic equipment shell and electronic equipment |
CN108638729B (en) * | 2018-04-13 | 2022-10-18 | Oppo广东移动通信有限公司 | Shell, preparation method thereof and mobile terminal |
CN108686911B (en) * | 2018-04-16 | 2021-06-15 | 维沃移动通信有限公司 | Surface treatment method of shell and shell |
CN109774212A (en) * | 2019-03-28 | 2019-05-21 | 广东阿特斯科技有限公司 | A kind of production technology of 3D cell phone rear cover |
CN110475440B (en) * | 2019-08-12 | 2022-02-18 | Oppo广东移动通信有限公司 | Shell, preparation method thereof and electronic equipment |
CN111427167B (en) * | 2020-04-29 | 2022-04-22 | 维沃移动通信(重庆)有限公司 | 3D optical structure, preparation method thereof and electronic equipment |
CN111601469B (en) * | 2020-05-25 | 2021-06-11 | Oppo广东移动通信有限公司 | Shell assembly, manufacturing method thereof and electronic equipment |
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