CN109572131A - The manufacturing method of the shell of electronic device, electronic device and shell - Google Patents
The manufacturing method of the shell of electronic device, electronic device and shell Download PDFInfo
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- CN109572131A CN109572131A CN201811392110.1A CN201811392110A CN109572131A CN 109572131 A CN109572131 A CN 109572131A CN 201811392110 A CN201811392110 A CN 201811392110A CN 109572131 A CN109572131 A CN 109572131A
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- layer
- shell
- electronic device
- resin layer
- pet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
- B29K2067/003—PET, i.e. poylethylene terephthalate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2069/00—Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
- B32B2250/244—All polymers belonging to those covered by group B32B27/36
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/28—Multiple coating on one surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/402—Coloured
- B32B2307/4023—Coloured on the layer surface, e.g. ink
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/536—Hardness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
This application discloses the manufacturing method of a kind of shell of electronic device, electronic device and shell, shell includes: matrix and functional layer.Matrix includes the appearance being oppositely arranged and medial surface, matrix includes being stacked compound PET resin layer and PC resin layer, the surface of the separate PC resin layer of PET resin layer constitutes appearance, the surface of the separate PET resin layer of PC resin layer constitutes medial surface, PET resin layer with a thickness of 30-150um, functional layer is located at the medial surface of matrix.According to the shell of the electronic device of the embodiment of the present application, shell can be reduced and generate underbead crack under external impact force action and even crack and collapse angle, the thickness of PET resin layer is arranged within the scope of 30-150um, both it can guarantee the structural strength of matrix, while can be further reduced shell and generating underbead crack under external impact force action and even crack and collapsing angle.Furthermore it is possible to improve the safety in utilization of electronic device.
Description
Technical field
This application involves technical field of electronic device, more particularly, to the shell, electronic device and shell of a kind of electronic device
The manufacturing method of body.
Background technique
Currently, the electronic devices such as more and more mobile phones use PC (Polycarbonate, polycarbonate)+PMMA
(polymethyl methacrylate, polymethyl methacrylate) composite board does the shell of the electronic devices such as mobile phone, although
It is cheap with respect to glass to can achieve exquisite appearance, fine and smooth texture, the colour match of bloom gradual change and price, but also has very
Obvious disadvantage.
Firstly, being usually to be used as appearance for PMMA layers, but PMMA material toughness is excessively poor, in higher hard force condition
Or be very easy to generate underbead crack and even crack under foreign impacts to collapse angle, influence the use of user.This just promotes shell
The hardness of the hardened layer on surface cannot be too high, and the high stress that otherwise solidification process generates, which is easy to cause inside PMMA layers of appearance, to be split
Line, or easily cracking collapses angle under by external impacts.And the hardness of hardened layer is compromised, and the surface of shell can be brought easily to go out
Scratch scratch is now scraped, bad impression is brought to appearance.And after long-term use, hardened layer gradually wears out bottom PMMA layers of exposing
Afterwards, the great friction coefficient of PMMA and opposite high rigidity are more easier to scrape scratch what unrepairable occurred in routine use process.
Secondly, the fire resistance of PMMA plate is excessively poor, fire-protection rating is only UL94-HB.Just in case occur battery overheat or
It is easy burning when accidentally touching open fire, safety is lower.
Summary of the invention
Present applicant proposes a kind of shell of electronic device, shell toughness with higher, fire resistance be good and shell
Appearance hardness with higher.
The application has also been proposed a kind of electronic device with above-mentioned shell.
The application also proposed a kind of manufacturing method of the shell of electronic device.
According to the shell of the electronic device of the application first aspect embodiment, comprising: matrix, described matrix include opposite set
The appearance and medial surface set, described matrix include being stacked compound PET resin layer and PC resin layer, the PET resin layer
Surface far from the PC resin layer constitutes the appearance, the surface structure far from the PET resin layer of the PC resin layer
At the medial surface, the PET resin layer with a thickness of 30-150um；Functional layer, the functional layer are located at the interior of described matrix
Side.
According to the shell of the electronic device of the embodiment of the present application, matrix is fabricated using PC+PET composite board, and
PET resin layer is located at the outside of PC resin layer, using the high transparency of PET material and PC material, passes through the medial surface in matrix
Upper formation functional layer, may be implemented color, texture of shell and other effects, and due to the hardness of PET material be greater than PC material and
Toughness with higher, it is possible to reduce shell, which generates underbead crack under external impact force action and even cracks, collapses angle.Meanwhile it will
The thickness of PET resin layer is arranged within the scope of 30-150um, can both guarantee the structural strength of matrix, while can be further
It reduces shell and generates underbead crack under external impact force action and even crack and collapse angle.In addition, PET material has preferable fire resisting
Property, the safety in utilization of electronic device can be improved.
According to the electronic device of the application second aspect embodiment, comprising: shell, the shell are above-mentioned according to the application
The shell of the electronic device of first aspect embodiment；Display screen component, the display screen component are connected with the shell, described aobvious
Installation space is limited between display screen component and the shell；Mainboard, the mainboard be located in the installation space and with it is described
Display screen component electrical connection.
The overall flexibility of shell can be improved by the above-mentioned shell of setting according to the electronic device of the embodiment of the present application,
Shell can be reduced and generate underbead crack under external impact force action and even crack and collapse angle, and electronic device can be improved
Safety in utilization.
According to the manufacturing method of the shell of the electronic device of the application third aspect embodiment, include the following steps: to provide
Plate, the plate are PC+PET composite board, and PET sheet and PC sheet material are answered by bonding or multi-layer co-extruded compound mode
It closes to form PC+PET composite board；It is sticked protective film in the two sides of the PC+PET composite board；Tear the plate off
The protective film of PC sheet material side forms functional layer in the PC sheet material side of the plate.
According to the manufacturing method of the shell of the electronic device of the embodiment of the present application, by the way that PET sheet and PC sheet material are passed through
Bonding or multi-layer co-extruded compound mode are compound to form PC+PET composite board, facilitate being processed into for PC+PET composite board
Type, but also shell toughness with higher, it is possible to reduce shell generates underbead crack even under external impact force action
Cracking collapses angle, and the safety in utilization of electronic device can be improved.In addition, passing through PC+PET composite board after formation
Two sides be sticked protective film, can play a protective role to PC+PET composite board, form function on the medial surface to plate
When layer, protective film can be torn off, thereby may be ensured that the Forming Quality of shell.
The additional aspect and advantage of the application will be set forth in part in the description, and will partially become from the following description
It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the schematic cross-section according to the shell of the electronic device of the application one embodiment；
Fig. 2 is the flow diagram one according to the manufacturing method of the shell of the electronic device of the embodiment of the present application；
Fig. 3 is the flow diagram two according to the manufacturing method of the shell of the electronic device of the embodiment of the present application；
Fig. 4 is the flow diagram three according to the manufacturing method of the shell of the electronic device of the embodiment of the present application；
Fig. 5 is the schematic diagram according to the electronic device of the application one embodiment.
Appended drawing reference:
Electronic device 100；
Shell 1；Matrix 11；PET resin layer 111；PC resin layer 112；Hardened layer 12；Functional layer 13；Texture layer 131；Face
Color functional layer 132；Reflecting layer 133；Substrate layer 14；
Display screen component 2.
Specific embodiment
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
Below with reference to Fig. 1-Fig. 5 description according to the shell 1 of the electronic device of the embodiment of the present application.
As shown in Figure 1, according to the shell 1 of the electronic device of the application first aspect embodiment, comprising: matrix 11 and function
Layer 13.Matrix 11 includes that the appearance being oppositely arranged and medial surface, functional layer 13 are located at the medial surface of matrix 11.Pass through setting
The texture of shell 1, color and other effects may be implemented in functional layer 13, enriches the appearance of shell 1.
Wherein, matrix 11 includes being stacked compound PET (polyethylene terephthalate, poly terephthalic acid
Glycol ester) resin layer and PC (Polycarbonate, polycarbonate) resin layer, the separate PC resin layer of PET resin layer 111
112 surface constitutes appearance, and the surface of the separate PET resin layer 111 of PC resin layer 112 constitutes medial surface.Utilize PET material
Color, the line of shell 1 may be implemented by forming functional layer 13 on the medial surface of matrix 11 with the high transparency of PC material
Reason and other effects.
By the way that the matrix 11 of shell 1 to be fabricated using PC+PET composite board, and PET resin layer 111 is located at PC tree
(" outside of PC resin layer 112 " refers to the center of the separate electronic device 100 of PC resin layer 112 in the outside of rouge layer 112
Side), higher material layers of hardness in matrix 11 can be made to be located at the outside of the lower material layers of hardness, can both guarantee base
(PET resin layer 111 is that the PC resin layer 112 on the inside of being located relatively at is with higher to the appearance of body 11 hardness with higher
Hardness, compared with traditional PMMA resin layer, the hardness of PET resin layer 111 is relatively low), and matrix 11 can be made whole
Toughness with higher.
Also, since PET resin layer 111 is relative to the hardness with higher of PC resin layer 112 and 111 phase of PET resin layer
Toughness with higher for PMMA resin layer, it is possible to reduce shell 1 generates underbead crack even under external impact force action
Cracking collapses angle.Moreover, compared with traditional PMMA resin layer, PET resin layer 111 has lower coefficient of friction and lower hard
Degree can make shell 1 have better scraping and wiping resistance performance.
Further, the thickness d 1 of PET resin layer 111 is 30-150um.The thickness of PET resin layer 111 is arranged as a result,
It within the scope of 30-150um, can both guarantee the overall structural strength of matrix 11, while can be further reduced shell 1 outside
Underbead crack is generated under portion's impact force action and is even cracked collapses angle.In addition, PET material has preferable fire resistance, can be improved
The safety in utilization of electronic device 100.
In addition, hardened layer 12 is formed in PET resin layer when being further formed hardened layer 12 in the appearance of matrix 11
On 111.Due to be located at outside PET resin layer 111 have higher toughness, hardening bath be coated in matrix 11 appearance on it
After carry out it is cured during, it is possible to reduce or avoid hardening bath solidification process generate high pressure cause in PET resin layer 111
Portion is cracked.Moreover, the hardness of hardened layer 12 can do more, so as to further improve the appearance of shell 1
Wearability.
Optionally, when shell 1 includes above-mentioned hardened layer 12, hardened layer 12 is formed in the appearance of matrix 11, hardening
The thickness d 6 of layer 12 can be 5-20um.Thus, it is possible to guarantee the thickness of the hardened layer 12 of the appearance of shell 1, so that electric
During long-time service, above-mentioned hardened layer 12 can not be worn through sub-device 100；And it is possible to make the entirety of shell 1
Thickness is smaller, to be conducive to the lightening of complete machine.
Optionally, the hardness of above-mentioned hardened layer 12 can be 2H-7H.The hardness of hardened layer 12 can according to need setting,
Certainly the hardness of hardened layer 12 can be set higher, such as the thickness of hardened layer 12 can achieve 6H, even 7H, and traditional
The hardness maximum of the hardened layer 12 of the shell 1 of electronic device is no more than 5H.
According to the shell 1 of the electronic device of the embodiment of the present application, matrix 11 is fabricated using PC+PET composite board,
And PET resin layer 111 is located at the outside of PC resin layer 112, using the high transparency of PET material and PC material, by matrix
Functional layer 13 is formed on 11 medial surface, color, texture of shell 1 and other effects may be implemented, and due to the hardness of PET material
Greater than PC material and toughness with higher, it is possible to reduce shell 1 generates underbead crack or even opened under external impact force action
It splits and collapses angle.Meanwhile the thickness of PET resin layer 111 being arranged within the scope of 30-150um, it can both guarantee that the structure of matrix 11 was strong
Degree, while can be further reduced shell 1 and generating underbead crack under external impact force action and even crack and collapsing angle.In addition,
PET material has preferable fire resistance, and the safety in utilization of electronic device 100 can be improved.
According to some embodiments of the present application, referring to Fig.1, the thickness d 2 of PC resin layer 112 is 300-700um.As a result, may be used
To guarantee the overall structural strength and toughness of matrix 11, and the integral thickness of shell 1 can be made smaller.
According to some embodiments of the present application, PET resin layer 111 and PC resin layer 112 are compound by way of bonding.By
This, facilitates and PET resin layer 111 and PC resin layer 112 is combined with each other to form PC+PET composite board.
According to some embodiments of the present application, PET resin layer 111 and PC resin layer 112 pass through multi-layer co-extruded compound side
Formula is compound.Thus, it is possible to which PET resin layer 111 and PC resin layer 112 is made to be not necessarily to be combined with each other to form PC by glue
+ PET composite board.
According to some embodiments of the present application, referring to Fig.1, functional layer 13 includes texture layer 131, the thickness of texture layer 131
D3 is 5-20um.Thus, it is possible to make shell 1 have preferable grain effect, and can make the integral thickness of shell 1 compared with
It is small.Optionally, texture layer 131 can be formed on the medial surface of matrix 11 using UV transfer printing process, texture layer 131 can be by
Colourless UV ink is formed, and texture layer 131 is also possible to by being formed with coloured UV ink.It is by having in texture layer 131
When the UV ink formation of color, texture layer 131, which has, can make shell 1 with grain effect, while it is also possible that shell 1
With color effects.Texture layer 131 can be single layer, or multilayer.
According to some embodiments of the present application, referring to Fig.1, functional layer 13 includes color functional layer 132, color functional layer
132 thickness d 4 is 10-300um.Thus, it is possible to make shell 1 that there are preferable color effects, and shell 1 can be made
Integral thickness is smaller.Single color may be implemented in color functional layer 132, and gradient color effect also may be implemented.
Optionally, color functional layer 132 can be colored ink layer.
Optionally, color functional layer 132 or film plating layer, such as film plating layer may include TiO2Layer, NbO2Layer,
Nb2O3Layer, Nb2O2Layer, Nb2O5Layer, SiO2Layer and ZrO2At least one of layer.Film plating layer can be single layer structure, or
Multilayered structure.When film plating layer is single layer structure, film plating layer can be TiO2Layer, NbO2Layer, Nb2O3Layer, Nb2O2Layer, Nb2O5Layer,
SiO2Layer and ZrO2One of layer.When film plating layer is multilayered structure, film plating layer may include TiO2Layer, NbO2Layer, Nb2O3Layer,
Nb2O2Layer, Nb2O5Layer, SiO2Layer and ZrO2At least two in layer.
When functional layer 13 only includes color functional layer 132, color functional layer 132 can be formed directly into the interior of matrix 11
On side.For example, can spray or be printed on matrix for colored ink when color functional layer 132 is colored ink layer
On 11 medial surface；When color functional layer 132 is film plating layer, film plating layer can be formed in matrix by way of vacuum plating
On 11 medial surface.
When functional layer 13 includes above-mentioned texture layer 131 and color functional layer 132, texture layer 131 can be formed directly
On the medial surface of matrix 11, color functional layer 132 is formed in the side of the separate matrix 11 of texture layer 131.For example, in color
When functional layer 132 is colored ink layer, colored ink can be sprayed or is printed on the separate matrix 11 of texture layer 131
Side；When color functional layer 132 is film plating layer, film plating layer can be formed in texture layer 131 by way of vacuum plating
Side far from matrix 11.
Functional layer 13 include above-mentioned texture layer 131 and color functional layer 132 when, if color functional layer 132 have compared with
Color functional layer 132, can also directly be formed on the medial surface of matrix 11, texture layer 131 is formed in face by good light transmittance
The side of the separate matrix 11 of color functional layer 132.
In his embodiment, referring to Fig. 3, functional layer 13 can also be formed in carrier film on piece, then by carrier film
Piece is sticked on the medial surface of matrix 11.Optionally, carrier diaphragm can be PET film or PET+TPU composite membrane, carrier diaphragm
Thickness can be 15-25um.
In the further embodiment of the application, referring to Fig.1, functional layer 13 is including the coloured texture layer of above-mentioned tool
131 or when color functional layer 132, functional layer 13 can also include reflecting layer 133, and reflecting layer 133 is arranged in texture layer 131 or face
The side of the separate matrix 11 of color functional layer 132, reflecting layer 133 can increase the coloured texture layer 131 of tool or color function
The light volume reflection of layer 132 increases the bright and beautiful degree of color of shell 1.Optionally, reflecting layer 133 can be In/Sn layers.
According to some embodiments of the present application, referring to Fig.1, shell 1 includes: substrate layer 14, and substrate layer 14 is formed in function
The side of the separate described matrix 11 of layer 13, the thickness d 5 of substrate layer 14 are 10-20um.Pass through the substrate layer 14 of setting as a result,
It can guarantee that base is opaque, substrate layer 14 can be black or white ink, and by the way that the thickness of substrate layer 14 to be arranged
In above range, light leakage can be better protected from.For example, can be by the dry method of reciprocal coated with multiple layer in functional layer 13
Side far from matrix 11 forms above-mentioned substrate layer 14.
Referring to Fig.1 and Fig. 5, according to the electronic device 100 of the application third aspect embodiment, comprising: shell 1, display screen
Component 2 and mainboard.Shell 1 is according to the shell 1 of the electronic device of the above-mentioned second aspect embodiment of the application, display screen component 2
It is connected with shell 1, installation space is limited between display screen component 2 and shell 1, mainboard is located in installation space and and display screen
Component 2 is electrically connected.
The entirety of shell 1 can be improved by the way that above-mentioned shell 1 is arranged according to the electronic device 100 of the embodiment of the present application
Toughness, it is possible to reduce shell 1, which generates underbead crack under external impact force action and even cracks, collapses angle, and electronics can be improved
The safety in utilization of device 100.
Illustratively, the electronic device 100 of the application can be mobile or portable and execute the various types of of wireless communication
Any one of computer system device of type (only illustratively shows a kind of form) in Fig. 5.Specifically, electronic device
100 can be mobile phone or smart phone (for example, being based on iPhone TM, the phone based on Android TM), portable game
Play equipment (such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone
TM), laptop computer, PDA, portable Internet appliance, music player and data storage device, other handheld devices with
And wrist-watch, In-Ear Headphones, pendant, headphone etc., electronic device 100100 can also set for others are wearable
It is standby (for example, such as electronic glasses, electronics clothes, electronics bracelet, electronics necklace, electronics are tatooed, electronic equipment or smartwatch
Headset equipment (HMD)).
- Fig. 4 referring to Fig.1, according to the manufacturing method of the shell 1 of the electronic device of the application third aspect embodiment, including
Following steps:
Plate is provided, plate is PC+PET composite board, and PET sheet and PC sheet material are passed through bonding or multi-layer co-extruded compound
Mode it is compound facilitate the machine-shaping of PC+PET composite board to form PC+PET composite board, but also the shell 1 has
Higher toughness, it is possible to reduce shell 1, which generates underbead crack under external impact force action and even cracks, collapses angle, and can mention
The safety in utilization of high electronic device 100；
It is sticked protective film, can be played a protective role to PC+PET composite board in the two sides of PC+PET composite board；
The protective film for tearing the PC sheet material side of plate off forms functional layer 13 in the PC sheet material side of plate, so as to realize
The texture of shell 1, color and other effects.
According to the manufacturing method of the shell 1 of the electronic device of the embodiment of the present application, by the way that PET sheet and PC sheet material are passed through
Bonding or multi-layer co-extruded compound mode are compound to form PC+PET composite board, facilitate being processed into for PC+PET composite board
Type, but also the toughness with higher of shell 1, it is possible to reduce shell 1 generates underbead crack very under external impact force action
Angle is collapsed to cracking, and the safety in utilization of electronic device 100 can be improved.In addition, multiple by PC+PET after formation
The two sides of plywood material are sticked protective film, can play a protective role to PC+PET composite board, the shape on the medial surface to plate
When at functional layer 13, protective film can be torn off, thereby may be ensured that the Forming Quality of shell 1.
According to some embodiments of the present application, the manufacturing method of shell 1 further includes following steps: to plate carry out hot bending at
Type, so that plate hot bending forms required moulding.For example, 3D high pressure hot bending shape can be carried out to plate, so that shell 1 has
There is 3D moulding.
Optionally, the hot pressing temperature of above-mentioned hot bending shape is 130-240 DEG C.Thus, it is possible to avoid due to hot bending temperature mistake
It is low and cause molding size (such as the molding size of 3D) not in place, can not obtain it is final needed for finished size；Meanwhile it can be with
It avoids causing Material shrinkage deformation warpage serious since hot bending temperature is excessively high, guarantees the Forming Quality and yield of shell 1.
Optionally, the briquetting pressure of above-mentioned hot bending shape is 30-150bar.Thus, it is possible to avoid briquetting pressure too small and
Cause molding size (such as the molding size of 3D) is not in place, workpiece size shrink it is big；It simultaneously can be to avoid briquetting pressure mistake
It is big and composite board is easily pressed quick-fried gas leakage.
Optionally, the hot pressing time of above-mentioned hot bending shape is 0.3-2min.Thus, it is possible to avoid the hot bending time short and cause
Size molding is not in place；Meanwhile the hot bending time can be made shorter, guarantee production efficiency.
For example, carrying out 3D high pressure hot bending shape, the heat of hot bending shape to plate in the specific embodiment of the application
Pressing temperature is 130-240 DEG C, and the briquetting pressure of hot bending shape is 30-150bar, and is applied using compressed gas to plate
Briquetting pressure, briquetting pressure at this time are molding the blowing pressure, and the hot pressing time of hot bending shape is 0.3-2min.Thus, it is possible to
So that molding shell 1 quality with higher, and the yield of finished product can be improved simultaneously, guarantee production efficiency.
According to some embodiments of the present application ,-Fig. 4, tears the protective film of the PET sheet side of plate off, in plate referring to Fig.1
PET sheet side formed hardened layer 12.Thus, it is possible to which making the appearance of shell 1 has preferable wearability.
Referring to Fig. 1-Fig. 4 description according to the manufacturing method of the shell 1 of the electronic device of the multiple embodiments of the application.
In following multiple embodiments, referring to Fig.1, shell 1 includes above-mentioned matrix 11, hardened layer 12, functional layer
13 and substrate layer 14, wherein functional layer 13 includes above-mentioned texture layer 131, color functional layer 132 and reflecting layer 133, texture layer
131 are formed in the side of the separate matrix 11 of matrix 11, and color functional layer 132 is formed in the separate matrix 11 of texture layer 131
Side, reflecting layer 133 are formed in the side of the separate matrix 11 of color functional layer 132, and substrate layer 14 is formed in reflecting layer 133
Side far from matrix 11.
Embodiment one,
Referring to Fig. 2 and Fig. 1 is combined, in the present embodiment, shell 1 is 3D moulding, and the manufacturing method of the shell 1 includes as follows
Step:
A1: providing plate, and PET sheet and PC sheet material is compound to form PC by bonding or multi-layer co-extruded compound mode
+ PET composite board；
A2: it is sticked protective film in the two sides of PC+PET composite board, plays the protective effect to matrix 11；
A3: tearing the protective film of the PC sheet material side of plate off, forms functional layer 13, the functional layer 13 in the PC sheet material side of plate
Including above-mentioned texture layer 131, color functional layer 132 and reflecting layer 133, to realize texture and color effects；
A4: substrate layer 14 is formed in the side of the separate plate of functional layer 13；
A5: 3D high pressure hot bending shape is carried out to obtain 3D moulding to plate；
A6: carrying out numerical control processing to the plate after high pressure hot bending shape, to remove extra leftover pieces, obtains final required
Assemble the shell 1 of fit dimension；
A7: tearing the protective film of the PET sheet side of plate off, forms hardened layer 12 in the PET sheet side of plate, improves shell
The wearability of 1 appearance.
Embodiment two,
Referring to Fig. 3 and Fig. 1 is combined, in the present embodiment, shell 1 is 3D moulding, and the manufacturing method of the shell 1 includes as follows
Step:
B1: providing plate, and PET sheet and PC sheet material is compound to form PC by bonding or multi-layer co-extruded compound mode
+ PET composite board；
B2: it is sticked protective film in the two sides of PC+PET composite board, plays the protective effect to matrix 11；
B31: 3D high pressure hot bending shape is carried out to obtain 3D moulding to plate；
B32: functional layer 13 is formed in carrier film on piece；
B33: substrate layer 14 is formed in the side of the separate carrier diaphragm of functional layer 13；
B4: after plate hot bending shape, the protective film of the PC sheet material side of plate is torn off, by the load in above-mentioned steps B33
Body diaphragm is sticked the PC sheet material side of the plate after hot bending shape, so as to be arranged functional layer 13 on matrix 11, with reality
Existing texture and color effects；
B5: carrying out numerical control processing to the plate in above-mentioned steps B4, to remove extra leftover pieces, obtains final required group
Fill the shell 1 of fit dimension；
B6: tearing the protective film of the PET sheet side of plate off, forms hardened layer 12 in the PET sheet side of plate, improves shell
The wearability of 1 appearance.
Wherein, above-mentioned steps B31 and step B32, step B33 can be carried out simultaneously.
Embodiment three,
Referring to Fig. 4 and Fig. 1 is combined, in the present embodiment, shell 1 is 2D or 2.5D moulding, the manufacturing method packet of the shell 1
Include following steps:
C1: providing plate, and PET sheet and PC sheet material is compound to form PC by bonding or multi-layer co-extruded compound mode
+ PET composite board；
C2: it is sticked protective film in the two sides of PC+PET composite board, plays the protective effect to matrix 11；
C3: tearing the protective film of the PET sheet side of plate off, forms hardened layer 12 in the PET sheet side of plate, improves shell
The wearability of 1 appearance；
C4: tearing the protective film of the PC sheet material side of plate off, forms functional layer 13, the functional layer 13 in the PC sheet material side of plate
Including above-mentioned texture layer 131, color functional layer 132 and reflecting layer 133, to realize texture and color effects；
C5: substrate layer 14 is formed in the side of the separate plate of functional layer 13.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are contained at least one embodiment or example of the application.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that embodiments herein, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle and objective of the application, this
The range of application is defined by the claims and their equivalents.
Claims (17)
1. a kind of shell of electronic device characterized by comprising
Matrix, described matrix include the appearance being oppositely arranged and medial surface, and described matrix includes being stacked compound PET resin layer
The appearance is constituted with the surface far from the PC resin layer of PC resin layer, the PET resin layer, the PC resin layer
Surface far from the PET resin layer constitutes the medial surface, the PET resin layer with a thickness of 30-150um；
Functional layer, the functional layer are located at the medial surface of described matrix.
2. the shell of electronic device according to claim 1, which is characterized in that the PC resin layer with a thickness of 300-
700um。
3. the shell of electronic device according to claim 1, which is characterized in that the PET resin layer and the PC resin
Layer is compound by way of bonding.
4. the shell of electronic device according to claim 1, which is characterized in that the PET resin layer and the PC resin
Layer is compound by multi-layer co-extruded compound mode.
5. the shell of electronic device according to claim 1, which is characterized in that the functional layer includes texture layer, described
Texture layer with a thickness of 5-20um.
6. the shell of electronic device according to claim 1, which is characterized in that the functional layer includes color functional layer,
The color functional layer with a thickness of 10-300um.
7. the shell of electronic device according to claim 6, which is characterized in that the color functional layer is film plating layer, institute
Stating film plating layer includes TiO2Layer, NbO2Layer, Nb2O3Layer, Nb2O2Layer, Nb2O5Layer, SiO2Layer and ZrO2At least one of layer.
8. the shell of electronic device according to claim 1 characterized by comprising substrate layer, the substrate layer are formed
In the side of the separate described matrix of the functional layer, the substrate layer with a thickness of 10-20um.
9. the shell of electronic device according to claim 1 characterized by comprising hardened layer, the hardened layer are formed
In the appearance of described matrix, the hardened layer with a thickness of 5-20um.
10. the shell of electronic device according to claim 1 characterized by comprising hardened layer, the hardened layer shape
At in the appearance of described matrix, the hardness of the hardened layer is 2H-7H.
11. a kind of electronic device characterized by comprising
Shell, the shell are the shell according to electronic device of any of claims 1-10；
Display screen component, the display screen component are connected with the shell, limit between the display screen component and the shell
Installation space out；
Mainboard, the mainboard are located in the installation space and are electrically connected with the display screen component.
12. a kind of manufacturing method of the shell of electronic device, which comprises the steps of:
Plate is provided, the plate is PC+PET composite board, and PET sheet and PC sheet material are passed through bonding or multi-layer co-extruded compound
Mode it is compound to form PC+PET composite board；
It is sticked protective film in the two sides of the PC+PET composite board；
The protective film for tearing the PC sheet material side of the plate off forms function in the PC sheet material side of the plate
Layer.
13. the manufacturing method of the shell of electronic device according to claim 12, which is characterized in that further include walking as follows
It is rapid: hot bending shape is carried out to the plate.
14. the manufacturing method of the shell of electronic device according to claim 13, which is characterized in that the hot bending shape
Hot pressing temperature is 130-240 DEG C.
15. the manufacturing method of the shell of electronic device according to claim 13, which is characterized in that the hot bending shape
Briquetting pressure is 30-150bar.
16. the manufacturing method of the shell of electronic device according to claim 13, which is characterized in that the hot bending shape
Hot pressing time is 0.3-2min.
17. the manufacturing method of the shell of electronic device according to claim 12, which is characterized in that tear the plate off
The protective film of the PET sheet side forms hardened layer in the PET sheet side of the plate.
Priority Applications (1)
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|---|---|---|---|
| CN201811392110.1A CN109572131A (en) | 2018-11-21 | 2018-11-21 | The manufacturing method of the shell of electronic device, electronic device and shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811392110.1A CN109572131A (en) | 2018-11-21 | 2018-11-21 | The manufacturing method of the shell of electronic device, electronic device and shell |
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| CN109572131A true CN109572131A (en) | 2019-04-05 |
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|---|---|---|---|
| CN201811392110.1A Pending CN109572131A (en) | 2018-11-21 | 2018-11-21 | The manufacturing method of the shell of electronic device, electronic device and shell |
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