JP2012079232A - Ic module substrate and ic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC module substrate and an IC module such that even when the IC module is intentionally peeled off from a card core of an IC card for the purpose of illegal use, a broken part is hardly repaired and reproduced.SOLUTION: One of insulation parts in gaps of external contact terminals arranged on a top surface of a printed board is provided linearly to penetrate from one side to the other opposite side of the printed board, and a connection part 13 for an IC chip 4 is provided on the reverse surface of the printed board which corresponds to the position of the linear insulation part across the printed board.

Description

  The present invention relates to a printed circuit board for an electronic circuit having a plurality of contact terminals, an IC module substrate in which an electronic circuit such as an IC chip is mounted on the printed circuit board, and an IC module using the same.

  An IC module in which an IC chip is mounted on a printed circuit board for electronic circuits is used for various applications as an IC card such as a credit card or an ID card.

  FIG. 6 is a plan view showing a conventional IC module. In the IC module 1, a plurality of external contact terminals 3 made of a plating pattern for connecting to an external reading / writing device are disposed on the surface of the double-sided printed circuit board 21, and the IC chip 4 is illustrated on the back surface of the double-sided printed circuit board 21. The IC chip wiring pattern is not arranged. The bonding pad of the IC chip 4 and the bonding pad of the wiring pattern are connected by a thin metal wire by a wire bonding method to form a circuit (not shown), and this circuit is an epoxy resin, and is a protective body molded by a transfer molding method. 5 is sealed. The wiring pattern is covered with an insulating film for interlayer insulation, and only the bonding pad portion is removed to enable wire bonding connection.

  FIG. 7 is a cross-sectional view showing a conventional IC card. The IC module 1 is mounted on a card core 7 formed with two steps of recesses 6. The card core 7 on which the IC module is mounted is formed with a two-step recess 6 having a different depth so that the mounting portion of the IC module 1 is fitted, and the IC module 1 is bonded and fixed thereto. An adhesive is used for adhesion and fixing, and the IC module 1 is prevented from falling off the card core 7. Such an IC module substrate and the configuration of the IC module are disclosed in Patent Document 1.

JP-A-8-39977

  As described above, the IC module is bonded and fixed to the card core. In normal use, the IC module is rarely peeled off and dropped off, but the card core is in a specific direction, for example, the arrow shown in FIG. If it is intentionally bent in the direction C, slight peeling may occur at the end of the IC module. By repeating the above action, there is a problem that the IC module is peeled off from the card core without being damaged and re-mounted on another card core for illegal use.

  8 and 9 are plan views showing a conventional IC module, which is provided with a structure for preventing unauthorized use. The base material of the printed circuit board is exposed in the gap between the external contact terminals 3 formed independently and in the periphery thereof, and the insulating portion 8 is formed. When an attempt is made to peel the IC module 1 from a card core (not shown) by forming a hole 91 (see FIG. 8) and a slit 92 (see FIG. 9) from the end face of the printed circuit board along the insulating portion 8 by punching, Before the peeling force balances the adhesive force between the printed circuit board and the card core, the printed circuit board is destroyed along the holes 91 and the slits 92, the wiring pattern (not shown) is destroyed, the IC module 1 is destroyed, and the IC module 1 Prevent unauthorized use such as reusing.

  However, even if the printed circuit board and the wiring pattern of the IC module 1 are partially broken along the easily breakable parts provided on the printed circuit board such as the holes 91 and the slits 92, the bonding pads or the parts having equivalent functions remain. If so, it can be repaired relatively easily by replenishment of fine metal wires, reconnection with solder, etc., and the structure for preventing unauthorized use has been imperfect.

  An object of the present invention is to provide an IC module for illegal use from a card core such as an IC card in an IC module in which an electronic circuit such as an IC chip is mounted on a printed circuit board for an electronic circuit having a plurality of external contact terminals. An object of the present invention is to provide an IC module substrate and an IC module that are easily damaged by peeling and are difficult to repair and regenerate when the peeling is intentionally performed, and to prevent unauthorized use of the IC module.

  In order to solve the above-described problem, at least one of the printed circuit board body exposed in the gaps of the plurality of plating patterns constituting the external contact terminals disposed on the surface of the printed circuit board or the insulating portion formed by the insulation treatment is provided on the printed circuit board. A connecting portion with an IC chip, for example, a bonding pad, is provided on the back surface of the corresponding printed circuit board with the printed circuit board sandwiched in a linear insulating section provided so as to penetrate from one side to the opposite other side. .

  That is, an IC module substrate in which bonding pads of a wiring pattern disposed on the back surface of a printed circuit board are arranged in a portion corresponding to the linear insulating portion in order to connect a thin metal wire drawn from the bonding pad of the IC chip, and This is an IC module in which an IC chip is mounted and electrically connected.

  With the above configuration, when an external stress is applied to peel off the IC module from the card core such as an IC card, the IC module bends and breaks along the linear insulating portion, and the bonding pad itself is also destroyed. Since it is cut, it is difficult to regenerate the IC module by repairing or reconnecting the wiring pattern using solder or the like.

  In order to solve the above problem, at least one of the insulating portions formed by the gaps of the plurality of plating patterns constituting the external contact terminals arranged on the surface of the printed board is placed on the other side facing the printed board. A linear insulating portion is formed by being provided in a straight line so as to penetrate, and a wiring pattern is projected or extended from at least one external contact terminal constituting the linear insulating portion to the linear insulating portion. A through-hole is provided in the printed circuit board so as to abut on the IC board, and an IC chip mounted on the back surface of the printed circuit board and an external contact terminal forming a linear insulating portion are connected through the through-hole.

  At this time, at least the IC chip and the through hole are covered with a protective body, and the through hole is filled with a thin metal wire drawn from the IC chip and a member constituting the protective body, and the IC chip is mounted on the IC module substrate. And an electrically connected IC module.

  With the above configuration, when an external stress is applied to peel the IC module from the card core such as an IC card, the IC module bends and breaks along the linear insulating portion, and the member constituting the protector Since the filled through hole is broken and cut in the form of a thin metal wire, it is difficult to regenerate the IC module by repairing or reconnecting the wiring pattern using solder or the like.

  According to the present invention, at least one of the insulating portions formed by the gaps of the plurality of plating patterns constituting the external contact terminals arranged on the surface of the printed board is penetrated from one side of the printed board to the other side facing the printed board. Provided in a straight line as a linear insulating part, and a connecting part for connecting to an IC chip mounted on the printed circuit board is arranged at a position corresponding to the linear insulating part on the back surface of the printed circuit board. An IC module substrate characterized by the above is obtained.

  According to the present invention, it is possible to obtain an IC module substrate characterized in that the external contact terminal and the connection portion are connected via a through hole.

  According to the present invention, there is obtained an IC module substrate characterized in that the connecting portion is a bonding pad.

  According to the present invention, at least one of the insulating portions formed by the gaps of the plurality of plating patterns constituting the external contact terminals arranged on the surface of the printed board is penetrated from one side of the printed board to the other side facing the printed board. Provided in a straight line as a linear insulating portion, the printed circuit board is provided with a through hole that contacts the wiring pattern extending from the external contact terminal forming the linear insulating portion to the linear insulating portion, An IC chip mounted on the back surface of the printed circuit board is connected to the external contact terminal forming the linear insulating portion through a through hole, and the IC chip and the through hole are covered with a protective body. An IC module substrate characterized by being used is obtained.

  According to the present invention, there is obtained an IC module substrate characterized in that the IC chip mounted on the back surface of the printed circuit board and the external contact terminal forming the linear insulating portion are connected using a thin metal wire. It is done.

  According to the present invention, there is obtained an IC module substrate characterized in that the protector does not cover a portion corresponding to the linear insulating portion except a portion corresponding to the through hole.

  According to the present invention, an IC module is obtained in which an IC chip is mounted on and electrically connected to any of the above IC module substrates.

  According to the present invention, when the IC module is peeled off from the printed circuit board for improper purpose, the IC module is broken and broken, and the bonding pad formed in the wiring pattern or the connection part having the same function is also broken. A printed circuit board and an IC module that are difficult to repair and regenerate can be provided.

FIG. 1A is a plan view, FIG. 1B is a BB sectional view, and FIG. 1C is an AA sectional view. FIG. 2A is a plan view, FIG. 2B is a BB sectional view, FIG. 2C is an AA sectional view, and FIG. It is the elements on larger scale of the -A cross section. FIG. 3A is a plan view, FIG. 3B is a BB sectional view, FIG. 3C is an AA sectional view, and FIG. It is the elements on larger scale of the -A cross section. It is a top view which shows the IC module of this invention. It is a top view which shows the IC module of this invention. It is a top view which shows the conventional IC module. It is sectional drawing which shows the conventional IC card. It is a top view which shows the conventional IC module. It is a top view which shows the conventional IC module.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
1A and 1B are views showing an IC module according to the present invention, in which FIG. 1A is a plan view, FIG. 1B is a cross-sectional view along BB, and FIG. 1C is a cross-sectional view along AA.

  The external contact terminal 3 made of a plating pattern formed on the front surface of the double-sided printed circuit board 21 is connected to the IC chip 4 mounted on the back surface through the through hole 10, the wiring pattern 11 formed on the back surface, and the metal thin wire 12. Then, the IC module 1 is configured. A circuit composed of a part of the wiring pattern 11 formed on the back surface, the fine metal wire 12 and the IC chip 4 is sealed with a protector 5. The external contact terminal 3 is connected to an external read / write device (not shown). The wiring pattern 11 disposed on the back surface of the double-sided printed circuit board 21 has one end connected to the through hole 10 and the other end having a bonding pad 13, and the bonding pad is formed by a general method including a wire bonding method. A thin metal wire 12 is connected to 13. Similarly, the fine metal wire 12 is connected to a bonding pad (not shown) of the IC chip 4 to constitute a circuit.

  The plurality of external contact terminals 3 are composed of a plurality of parts that are independent via an insulating part. The insulating part 8 which is one of the insulating parts is configured to penetrate from one side of the surface of the double-sided printed circuit board 21 to the other side opposite thereto, that is, in a straight line in the BB direction, and is located on the back side of the insulating part 8 The bonding pad 13 of the wiring pattern 11 is formed on the back surface of the double-sided printed board 21.

  When an attempt is made to peel the IC module 1 from an IC card obtained by fixing the exposed surface of the protector 5 of the IC module 1 manufactured in the above procedure to a concave portion of a card core (not shown) using an adhesive, Since the adhesion of the protector 5 is stronger, peeling starts from the interface between the protector 5 and the double-sided printed circuit board 21, and the double-sided printed circuit board 21 bends with the linear insulating part 8 as a base line and is on the insulating part 8 The formed bonding pad 13 and the connected fine metal wire 12 are broken or broken.

  Repair of the wiring pattern 11 by a general method including soldering due to destruction of the bonding pad 13 or reconnection of the broken fine metal wire 12 cannot be performed, making it difficult to recycle and reuse the IC module 1.

(Embodiment 2)
2A and 2B are diagrams showing an IC module according to the present invention. FIG. 2A is a plan view, FIG. 2B is a cross-sectional view along BB, FIG. 2C is a cross-sectional view along A-A, and FIG. ) Is a partially enlarged view of the AA cross section.

  The external contact terminals 3 formed on the surface of the single-sided printed circuit board 22 are mounted on the back surface of the single-sided printed circuit board 22 through the fine metal wires 12 inserted into the through holes 14 formed in the single-sided printed circuit board 22. 4 to configure the IC module 1. By forming the through hole 14 from the back surface direction of the single-sided printed circuit board 22 so that the back surface of the external contact terminal 3 is exposed in the vicinity of the linear insulating portion 8 penetrating in the BB direction of the single-sided printed circuit board 22, An exposed portion 15 that functions as a bonding pad is formed. The through hole 14 is provided so as to contact the end of the external contact terminal 3, or is provided so as to contact a part of the wiring pattern 11 extending from the external contact terminal 3 to the insulating portion 8.

  Note that the circuit composed of the fine metal wires 12 and the IC chip 4 formed on the back surface of the single-sided printed board 22 including the through hole 14 is sealed with a protective body 5, and the through hole 14 is sealed with the protective body 5. Filled with stop agent. However, the protective body 5 is not illustrated in FIG.

  The external contact terminal 3 is connected to an external read / write device (not shown). Bonding pads (not shown) of the external contact terminals 3 and the IC chip 4 disposed on the back surface of the single-sided printed circuit board 22 are connected by the fine metal wires 12 using a wire bonding method to form a circuit.

  The plurality of external contact terminals 3 are composed of a plurality of parts that are independent via an insulating part. The insulating part 8 that is one of the insulating parts is configured to penetrate from one side of the surface of the single-sided printed circuit board 22 to the other side opposite to the other side, that is, in a straight line in the BB direction, and protrudes on the insulating part 8. A through hole 14 is formed on the external contact terminal 3.

  When an attempt is made to peel the IC module 1 from an IC card obtained by fixing the exposed surface of the protector 5 of the IC module 1 manufactured in the above procedure to a concave portion of a card core (not shown) using an adhesive, Since the adhesion of the protector 5 is stronger, peeling starts from the interface between the protector 5 and the single-sided printed board 22, and the single-sided printed board 22 bends with the linear insulating portion 8 as a base line and protrudes to the insulating portion 8. The through-hole 14 formed in this way is broken or broken so as to entrain the fine metal wire 12.

  Due to the breakage in the above state, the thin metal wires 12 cannot be reconnected, and it becomes difficult to recycle and reuse the IC module 1.

(Embodiment 3)
3A and 3B are views showing an IC module according to the present invention. FIG. 3A is a plan view, FIG. 3B is a BB cross-sectional view, FIG. 3C is an AA cross-sectional view, and FIG. ) Is a partially enlarged view of the AA cross section.

  Although the configuration is almost the same as that of the second embodiment, the protector 5 is configured not to cover the back surface of the insulating portion 8 except in the vicinity of the through hole 14. However, the protector 5 is not shown in FIG.

  By configuring in this way, when the peeling of the IC module 1 is attempted from an IC card obtained by fixing the exposed surface of the protector 5 of the IC module 1 to the concave portion of the card core (not shown) using an adhesive, Since the adhesion between the card core and the protector 5 is stronger, peeling starts from the interface between the protector 5 and the single-sided printed circuit board 22, and the single-sided printed circuit board 22 includes the linear insulating portion 8 in which the protector 5 does not exist. As a base line, it bends more easily than other embodiments, and the through hole 14 formed on the insulating portion 8 is broken or broken so that the fine metal wire 12 is wound.

  Due to the destruction in the above state, the thin metal wires 12 cannot be reconnected, and it becomes difficult to recycle and reuse the IC module 1.

(Embodiment 4)
4 and 5 are plan views showing the IC module of the present invention. The IC module 1 has substantially the same configuration as the IC module described in the first embodiment, but has two linear insulating portions each. The linear first insulating portion 81 and the second insulating portion 82 are arranged in parallel with the IC chip 4 interposed therebetween, and the bonding pad 13 is a position corresponding to the first insulating portion 81 and the second insulating portion 82. (See FIG. 4). Further, the linear third insulating portion 83 and the fourth insulating portion 84 are arranged so as to be orthogonal to each other, and the bonding pad 13 is located at a position corresponding to the third insulating portion 83 and the fourth insulating portion 84. (See FIG. 5).

  With this configuration, when the IC module is deliberately peeled from the card core, it is bent from one of the two linear insulating portions, and the operations and effects described in the first embodiment are more reliably achieved. Play. Further, not only in the first embodiment but also in the configuration of the second and third embodiments, even if two or more linear insulating portions are formed, the same operation and effect are obtained.

  In the first to fourth embodiments, the case where one bonding pad or through-hole is provided at a position corresponding to the linear insulating portion has been described. However, even if a plurality of bonding pads or through-holes are provided, the same or more functions and effects can be achieved. Needless to say.

  In Embodiments 1 to 4, an IC module in which an IC chip is mounted and electrically connected has been described. However, an IC module substrate used for these is also included in the present invention.

  The protector used in the present invention may be any one that uses a molding method and materials generally used for a protector, and may be formed by a molding or potting method using a transfer molding method using an epoxy resin. Preferably formed.

  It is preferable to select and use a double-sided printed board or a single-sided printed board as needed, and the double-sided printed board or the single-sided printed board has a thickness of 0.07 to 0.25 mm and is an epoxy resin or a polyester resin. Those made of polyimide resin or the like are preferable.

  The thin metal wire may be any material as long as it is generally used, and preferably has a wire diameter of 9 to 50 μm and is made of gold, copper, aluminum, or the like. Play.

  The insulating part between the external contact terminals preferably exposes the surface of the double-sided printed board or single-sided printed board over a width of 0.1 to 0.5 mm.

  Any adhesive may be used as long as it is generally used, and it is preferable to use an epoxy liquid adhesive or a heat-sensitive adhesive sheet using an acrylic or polyester resin.

DESCRIPTION OF SYMBOLS 1 IC module 21 Double-sided printed circuit board 22 Single-sided printed circuit board 3 External contact terminal 4 IC chip 5 Protector 6 Recessed part 7 Card core 8 Insulating part 81 1st insulating part 82 2nd insulating part 83 3rd insulating part 84 4th Insulating portion 91 Hole 92 Slit 10 Through hole 11 Wiring pattern 12 Metal wire 13 Bonding pad 14 Through hole 15 Exposed portion C Arrow

Claims (7)

  A straight line is provided by linearly penetrating at least one of insulating portions formed of gaps of a plurality of plating patterns constituting external contact terminals arranged on the surface of the printed circuit board from one side of the printed circuit board to the other opposite side. An IC module comprising a connecting portion for connecting to an IC chip mounted on the printed circuit board at a position corresponding to the linear insulating portion on the back surface of the printed circuit board. substrate.   The IC module substrate according to claim 1, wherein the external contact terminal and the connection portion are connected through a through hole.   The IC module substrate according to claim 1, wherein the connection portion is a bonding pad.   A straight line is provided by linearly penetrating at least one of insulating portions formed of gaps of a plurality of plating patterns constituting external contact terminals arranged on the surface of the printed circuit board from one side of the printed circuit board to the other opposite side. A through hole that contacts the wiring pattern extended from the external contact terminal that forms the linear insulating portion to the linear insulating portion, and is formed in the printed circuit board via the through hole; An IC chip mounted on the back surface of the printed board is connected to the external contact terminal forming the linear insulating portion, and the IC chip and the through hole are used by being covered with a protective body. IC module substrate.   5. The IC module substrate according to claim 4, wherein the IC chip mounted on the back surface of the printed circuit board is connected to the external contact terminal forming the linear insulating portion using a thin metal wire.   6. The IC module substrate according to claim 4, wherein the protector does not cover a portion corresponding to the linear insulating portion except a portion corresponding to the through hole.   7. An IC module comprising an IC chip mounted on the IC module substrate according to claim 1 and electrically connected thereto.

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