JP2012072304A - Phosphorus-containing epoxy resin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flame retardant phosphorus-containing epoxy resin having a low viscosity and markedly improved physical properties without requiring heating-cooling.SOLUTION: The phosphorus-containing epoxy resin is obtained by reacting 1 mol of a phosphorus compound (a) having active hydrogen directly linked to a phosphorus atom and represented by formula: R1-PH-(O)-R2 or R1-PH(=O)-(O)-R2 (where n is 0 or 1, and R1 and R2 are a 1-12C hydrocarbon group and may form a ring structure with P) with 0.96-0.98 mol of naphthoquinone, and reacting the resulting phosphorus compounds (A) having active hydrogen with a bifunctional epoxy resin in the range of 0.45-0.94 mol of active hydrogen groups of the phosphorus compounds (A) to 1 mol of epoxy groups.

Description

  The present invention comprises a phosphorus-containing epoxy resin obtained by synthesis under specific conditions, a phosphorus-containing epoxy resin composition containing the phosphorus-containing epoxy resin as an essential component, and further curing the phosphorus-containing epoxy resin composition. The present invention relates to a phosphorus-containing epoxy resin cured product.

  Conventionally, flame retarding of epoxy resins has been performed by halogenation, as represented by brominated epoxy resins using tetrabromobisphenol A as a raw material. However, when a halogenated epoxy resin is used, a highly toxic halide is generated due to a thermal decomposition reaction when the cured product is burned, and there is a concern that a toxic gas may be generated in the event of a fire. In contrast, in recent years, halogen-free flame retardant technology using phosphorus compounds has been studied, and proposals have been made to apply the phosphorus compounds disclosed in Patent Documents 1 to 4. However, since these phosphorus compounds have low solvent solubility and are difficult to use after being dissolved in a solvent, phosphorus compounds react with epoxy resins in advance as disclosed in Patent Documents 5 to 11. It is used as solvent-containing epoxy resins and phosphorus-containing phenol resins with solvent solubility.

JP 47-016436 A JP 60-126293 A JP-A-61-2236787 JP 05-331179 A Japanese Patent Laid-Open No. 04-11626 JP 2000-309623 A JP-A-11-166035 JP-A-11-279258 JP 2001-123049 A Japanese Patent Laid-Open No. 2003-040969 JP 2006-342217 A

  By using a phosphorus compound disclosed in Patent Documents 1 to 4 as a phosphorus compound, in particular, a phosphorus-containing bifunctional phenol compound disclosed in Patent Documents 2 to 4, physical properties such as heat resistance and adhesive strength have been improved. It is disclosed in Patent Literature 5, Patent Literature 6, and Patent Literature 9 to Patent Literature 11 that an epoxy resin or a phenol resin can be obtained.

  However, in order to obtain a high-purity phosphorus-containing bifunctional phenol compound, steps such as filtration, recrystallization, refiltration, and drying are required, which is disadvantageous in industrial production. Patent Document 11 discloses that the impurity content can be suppressed by removing water in the phosphorus compound in advance, and the reaction of the phosphorus-containing bifunctional phenol compound can be sufficiently advanced. In order to perform azeotropic dehydration, it was necessary to take a method of raising the temperature, lowering the temperature before the reaction with quinones, and further raising the temperature by the reaction, which was disadvantageous in industrial production. In Comparative Example 3, in the example using parabenzoquinone, the measured epoxy equivalent is lower than the theoretical epoxy equivalent, so that the impurity content is high, but it has not been confirmed.

  On the other hand, a method using a monofunctional phosphorus compound shown in Patent Document 1 without using a high-purity phosphorus-containing compound as shown in Patent Document 8 has also been proposed, but a polyfunctional novolak is used as an epoxy resin. Since epoxy resin is an essential component, there was a limit to the adhesive strength.

In order to solve the above problems, the present inventor has intensively studied the reaction method of a quinone compound and a phosphorus-containing compound. As a result, only when a specific quinone compound is used, a specific molar ratio range, a specific system The phosphorus-containing epoxy resin obtained by reacting in the moisture range has a much lower viscosity than using high-purity phosphorus-containing bifunctional phenolic compounds, and there is no need for heating and cooling in the reaction process. The present invention has been completed.
That is, the present invention
(1) 0.96-0.98 mol of naphthoquinone with respect to 1 mol of phosphorus compound (a) having active hydrogen directly bonded to the phosphorus atom represented by the following general formula (1) and / or general formula (2) The active hydrogen group of the phosphorus compound (A) is 0.45 with respect to 1 mol of the epoxy group of the phosphorus compound (A) having active hydrogen obtained by carrying out the reaction in the range of 2 and the bifunctional epoxy resin. A phosphorus-containing epoxy resin obtained by reacting in the range of mol to 0.94 mol.

In the formula, n is 0 or 1, and R1 and R2 are C1 to C12 hydrocarbon groups. R1 and R2 may be the same or different, and R1 and R2 together with the phosphorus atom may form a cyclic structure.

(2) When reacting a phosphorus compound (a) having active hydrogen directly bonded to a phosphorus atom with naphthoquinone, the phosphorus compound (a) is dissolved in an inert solvent and then reacted with naphthoquinone, and the water content in the system during the reaction The phosphorus-containing epoxy resin according to the above (1), wherein is 0.5 to 3.5% by weight with respect to the phosphorus compound (a).
(3) Phosphorus content as described in (1), obtained by reacting the phosphorus compound (A) with bifunctional epoxy resin after the water content in the system is 0.1% by weight or less based on the solid content Epoxy resin.
(4) 0.4 to 2.0 equivalents of the functional group of the curing agent is blended with 1 equivalent of the epoxy group of the phosphorus-containing epoxy resin according to any one of (1) to (3) above. A phosphorus-containing epoxy resin composition.
(5) A cured phosphorus-containing epoxy resin obtained by curing the phosphorus-containing epoxy resin composition described in (4) above.
It is.

  In the present invention, a specific quinone compound, that is, naphthoquinone and a phosphorus-containing compound are reacted within a range of specific reaction conditions, and then reacted with a bifunctional epoxy resin within a range of specific reaction conditions to obtain a phosphorus-containing epoxy resin. Because of its much lower viscosity than phosphorus-containing epoxy resins using high-purity phosphorus-containing bifunctional phenolic compounds, it has excellent workability and surprisingly excellent physical properties such as flame retardancy and adhesive strength. Play.

  Hereinafter, embodiments of the present invention will be described in detail. The phosphorus compound (a) having active hydrogen directly bonded to the phosphorus atom of the present invention is represented by the general formula (1) and / or the general formula (2), specifically, dimethylphosphine, diethylphosphine, diphenylphosphine. 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (manufactured by HCA Sanko), dimethylphosphine oxide, diethylphosphine oxide, dibutylphosphine oxide, diphenylphosphine oxide, 1,4-cyclooctyl Examples include lenhine phosphine oxide and 1,5-cyclooctylene phosphine oxide (CPHO manufactured by Nippon Chemical Industry Co., Ltd.). These phosphorus compounds may be used alone or in combination of two or more, and are not limited thereto.

  In the present invention, naphthoquinone is not particularly limited to isomers and substituents, and 1,4-naphthoquinone, 1,2-naphthoquinone, 1,5-naphthoquinone, 1,7-naphthoquinone, 2,3-naphthoquinone, 2, 6-naphthoquinone, 3-methyl-1,4-naphthoquinone, 5-methyl-1,4-naphthoquinone, 6-methyl-1,4-naphthoquinone, 7-methyl-1,2-naphthoquinone, 2,7-dimethyl- Examples include 1,4-naphthoquinone and 2-phenyl-1,4-naphthoquinone. These quinone compounds may be used alone or in combination of two or more, and are not limited thereto.

  In the present invention, the phosphorus compound (a) having active hydrogen directly bonded to the phosphorus atom represented by the general formula (1) and / or the general formula (2), and naphthoquinone is converted to naphthoquinone with respect to 1 mol of the phosphorus compound (a). Since the epoxy resin viscosity of the phosphorus-containing epoxy resin finally obtained by performing the reaction in the range of 96 to 0.98 mol is low, and an epoxy resin excellent in flame retardancy and adhesive strength is obtained in the cured product properties. is there.

  When the phosphorus compound (a) and naphthoquinone are reacted in the range of 0.96 to 0.98 mol of naphthoquinone with respect to 1 mol of the phosphorus compound (a), the phosphorus compound (a) is previously dissolved in an inert solvent. The reaction is carried out by adding naphthoquinone, but the water content in the system may be in the range of 0.5 wt% to 3.5 wt% with respect to the phosphorus compound (a).

    When quinone compounds adhere to the skin or mucous membranes, they cause chemical injury, so the commercial product is given some moisture to prevent the fine powder from scattering. Although some phosphorus compounds (a) react with moisture, there is no need to remove at this stage in the reaction, and there is no need to take an industrially disadvantageous process. Rather, the presence of moisture in the system also has the effect of suppressing reaction exotherm. If the water content in the system is more than 3.5% by weight, it is not preferable because it takes a long time to raise the temperature to the reaction temperature.

  The inert solvent used in the reaction is not particularly limited as long as it does not react with the phosphorus compound (a) or the quinone compound. Specifically, hexane, heptane, octane, decane, dimethylbutane, pentene, cyclohexane, methylcyclohexane, Various hydrocarbons such as benzene, toluene, xylene, ethylbenzene, ethers such as ethyl ether, isopropyl ether, butyl ether, diisoamyl ether, methyl phenyl ether, ethyl phenyl ether, amyl phenyl ether, ethyl benzyl ether, dioxane, methyl furan, tetrahydrofuran , Methyl cellosolve, methyl cellosolve acetate, ethyl cellosolve, cellosolve acetate, ethylene glycol isopropyl ether, diethylene glycol dimethyl ether, methyl Ethyl carbitol, propylene glycol monomethyl ether, dimethylformamide, dimethylsulfoxide or the like can be used, is not limited thereto, it may be used by mixing 2 or more kinds.

  In order to dissolve the phosphorus compound (a) in an inert solvent, the phosphorus compound (a) and the inert solvent are blended and then dissolved by stirring while heating. Although the dissolution temperature varies depending on the type of solvent used and the non-volatile content, it is 100 ° C. or lower, preferably 90 ° C. or lower, more preferably 80 ° C. or lower.

  After the phosphorus compound (a) is dissolved in an inert solvent, naphthoquinone is added while paying attention to the reaction exotherm. The reaction temperature at this time is 100 ° C. or lower, preferably 90 ° C. or lower, more preferably 80 ° C. or lower.

The reaction between the phosphorus compound (a) and naphthoquinone may be free of moisture in the system, but may preferably be carried out in the range of 0.5 wt% to 3.5 wt%. Also, naphthoquinone can be preliminarily mixed with water so that the fine powder of naphthoquinone is not scattered, and the water content in the system may be adjusted beforehand by adding water into the system.
In addition, the reaction between the phosphorus compound (a) and naphthoquinone proceeds with intense heat generation in the initial stage, but by containing moisture in the system, the reaction heat generation can be suppressed and the reaction can proceed slowly. Naphthoquinone is preferably added in portions, and the reaction with the phosphorus compound (a) can be completed at 100 ° C. or lower for 30 minutes to 3 hours.

  After completion of the reaction between the phosphorus compound (a) and naphthoquinone, the system temperature is raised, and the system moisture is removed by reflux dehydration. When a large amount of water remains in the system, the reaction between the phosphorus compounds (A) and the bifunctional epoxy resin is affected, and therefore dehydration is performed at this stage. When the water content in the system is high, the activity may be lost depending on the reaction catalyst species used in the reaction with the bifunctional epoxy resin, and the reaction may not reach the theoretical epoxy equivalent. The dehydration temperature at this time is 160 to 100 ° C, preferably 130 to 110 ° C.

  The bifunctional epoxy resin of the present invention is not particularly limited as long as it has two epoxy groups in one molecule, and is an epoxidized product of bisphenol compounds and diol compounds, specifically, Epototo ZX- 1027 (hydroquinone type epoxy resin, manufactured by Nippon Steel Chemical Co., Ltd.), Epototo ZX-1355, ZX-1711 (dihydroxynaphthalene type epoxy resin, manufactured by Nippon Steel Chemical Co., Ltd.) Epototo YDF-170, YDF-8170 (bisphenol F type epoxy) Resin Nippon Steel Chemical Co., Ltd.), Epototo YD-128, YD-8125 (Bisphenol A type epoxy resin, Nippon Steel Chemical Co., Ltd.), Epototo ZX-1059 (Bisphenol A type epoxy resin, Bisphenol F type epoxy resin) Mixture manufactured by Nippon Steel Chemical Co., Ltd.), Epotot ZX-1251 (biphenyl epoxy resin manufactured by Nippon Steel Chemical Co., Ltd.), Epototo ZX-1201 (bisphenolfluorene type epoxy resin manufactured by Nippon Steel Chemical Co., Ltd.), ESLV-80DE (diphenyl ether type epoxy resin manufactured by Nippon Steel Chemical Co., Ltd.) ), ESLV-50TE (diphenyl sulfide type epoxy resin manufactured by Nippon Steel Chemical Co., Ltd.), but is not limited to these, and two or more types may be used in combination.

  The reaction between the phosphorus compound (a), the phosphorus compound (A) having active hydrogen obtained by reacting naphthoquinone, and the bifunctional epoxy resin has an active hydrogen group content of 0.45 per mol of epoxy group. It is carried out in the range of mol to 0.94 mol. Preferably it is 0.50 mol-0.75 mol. When the molar ratio is less than 0.45 mol, the phosphorus content is low and flame retardancy is not obtained. When the molar ratio is greater than 0.94 mol, the resulting epoxy resin has few epoxy groups and is characteristic as a thermosetting resin. Cannot be obtained. It is necessary that the water content in the system in this reaction be 0.1% by weight or less based on the total solid content of the phosphorus compounds (A) and the bifunctional epoxy resin.

  The reaction between the phosphorus compound having active hydrogen (A) and the bifunctional epoxy resin is carried out by raising the reaction temperature while recovering the solvent in which the phosphorus compound (a) is dissolved. The reaction temperature is 130 ° C to 200 ° C, more preferably 150 ° C to 180 ° C. In addition, a catalyst may be used for the reaction in order to shorten the time or reduce the reaction temperature. The catalyst that can be used is not particularly limited, and those usually used for the synthesis of epoxy resins can be used. For example, tertiary amines such as benzyldimethylamine, quaternary ammonium salts such as tetramethylammonium chloride, phosphines such as triphenylphosphine and tris (2,6-dimethoxyphenyl) phosphine, ethyltriphenylphosphonium bromide, etc. Various catalysts such as phosphonium salts, imidazoles such as 2 methyl imidazole, 2 ethyl 4-methyl imidazole and the like can be used, and these may be used alone or in combination of two or more, but are not limited thereto. Further, it may be divided and used in several times.

  The phosphorus-containing epoxy resin of the present invention can be made into a curable phosphorus-containing epoxy resin composition by blending a curing agent. As the curing agent, various curing resins for epoxy resins such as various phenol resins, acid anhydrides, amines, hydrazides, and acidic polyesters can be used, and only one of these curing agents is used. Or you may use two or more types. Of these, dicyandiamide is preferable as the curing agent contained in the curable epoxy resin composition of the present invention. In the curable epoxy resin composition of the present invention, the amount of the curing agent used is preferably 0.4 to 2.0 equivalents of the functional group of the curing agent with respect to 1 equivalent of the epoxy group that is the functional group of the epoxy resin. -1.5 equivalent is more preferable, Especially preferably, it is 0.5-0.8 equivalent. When the curing agent is less than 0.4 equivalent with respect to 1 equivalent of epoxy group, or when it exceeds 2.0 equivalent, curing may be incomplete and good cured properties may not be obtained.

  In the flame-retardant epoxy resin composition comprising the phosphorus-containing epoxy resin of the present invention, an organic solvent can also be used for viscosity adjustment. Examples of organic solvents that can be used include amides such as N, N-dimethylformamide, ethers such as ethylene glycol monomethyl ether, ketones such as acetone and methyl ethyl ketone, alcohols such as methanol and ethanol, benzene and toluene. Aromatic hydrocarbons etc. are mentioned, What mixed one or more types of these solvents can be mix | blended in 30-80 weight% as an epoxy resin density | concentration.

  A hardening accelerator can be used for this invention composition as needed. Examples of curing accelerators that can be used include imidazoles such as 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2- (dimethylaminomethyl) phenol, 1,8-diaza-bicyclo (5 , 4, 0) tertiary amines such as undecene-7, phosphines such as triphenylphosphine, tricyclohexylphosphine, triphenylphosphine triphenylborane, and metal compounds such as tin octylate. 0.02-5.0 weight part of a hardening accelerator is used as needed with respect to 100 weight part of epoxy resin components in the epoxy resin composition of the present invention. By using a curing accelerator, the curing temperature can be lowered or the curing time can be shortened.

  A filler can be used for this invention composition as needed. Specific examples include inorganic fillers such as aluminum hydroxide, magnesium hydroxide, talc, calcined talc, clay, kaolin, titanium oxide, glass powder, and silica balloon, but pigments may be blended. The reason for using a general inorganic filler is an improvement in impact resistance. Moreover, when metal hydroxides, such as aluminum hydroxide and magnesium hydroxide, are used, it acts as a flame retardant aid and can ensure flame retardancy even if the phosphorus content is small. In particular, if the blending amount is not 10% or more, the effect of impact resistance is small. However, if the blending amount exceeds 150%, the adhesiveness, which is a necessary item for use in a laminated board, is lowered. In addition, the resin composition contains fiber fillers such as glass fiber, pulp fiber, synthetic fiber, ceramic fiber, etc., organic fillers such as fine particle rubber, thermoplastic elastomer, etc., and epoxy resins other than bifunctional epoxy resins. You can also.

  A cured phosphorus-containing epoxy resin can be obtained by curing the phosphorus-containing epoxy resin composition of the present invention. At the time of curing, for example, a resin sheet, a copper foil with a resin, a prepreg, and the like are formed and laminated and cured by heating and pressing to obtain a cured phosphorus-containing epoxy resin as a laminated board.

  As a result of making a phosphorus-containing epoxy resin composition using the phosphorus-containing epoxy resin of the present invention and evaluating the phosphorus-containing epoxy resin cured product of the laminate by heat curing, the phosphorus compound (a) and naphthoquinone are in a specific range. The phosphorus-containing epoxy resin reacted with the bifunctional epoxy resin using the phosphorus-containing compounds (A) reacted under the reaction conditions is an epoxy obtained by reacting a conventionally known high-purity bifunctional phosphorus compound with a bifunctional epoxy resin. It was found that a cured product having a significantly lower viscosity than the resin and surprisingly improved physical properties such as flame retardancy and adhesive strength can be obtained.

  EXAMPLES The present invention will be specifically described with reference to examples and comparative examples, but the present invention is not limited to these.

The epoxy equivalent of the epoxy resin synthesized in the examples and comparative examples was measured according to JIS K 7236.
The phosphorus content of the epoxy resins synthesized in the examples and comparative examples was measured by the following method. That is, 3 ml of sulfuric acid is added to 150 mg of sample and heated for 30 minutes. Return to room temperature, add 3.5 ml of nitric acid and 0.5 ml of perchloric acid and heat decompose until the contents are clear or yellow. This solution is diluted with water in a 100 ml volumetric flask. 10 ml of this sample solution is placed in a 50 ml volumetric flask, 1 drop of phenolphthalein indicator is added, and 2 mol / l ammonia water is added until the color turns red. Add 2 ml of 50% sulfuric acid solution and add water. After adding 5 ml of 2.5 g / l aqueous ammonium metavanadate and 5 ml of 50 g / l aqueous ammonium molybdate, the volume is made constant with water. After standing at room temperature for 40 minutes, water is measured as a control using a spectrophotometer at a wavelength of 440 nm. A calibration curve is prepared with an aqueous potassium dihydrogen phosphate solution, and the phosphorus content is determined from the absorbance.

The moisture content in the system of Examples and Comparative Examples was measured by the Karl Fischer method, and expressed in weight% when the phosphorus compound (a) used was 100.
The ICI viscosity of the obtained epoxy resin was measured at 100 ° C.
The solubility of the epoxy resin was visually observed when the nonvolatile content was 35% with methyl ethyl ketone. ○ dissolved and was a transparent solution. X indicates cloudiness or separation.

Flame retardancy was measured according to UL (Underwriter Laboratories) standards. The copper foil peel strength was measured in accordance with JIS C 6481 5.7, and the interlayer adhesion was measured by peeling between one prepreg and the remaining three sheets in accordance with JIS C 6481 5.7.
The glass transition temperature of the cured product was measured by TMA and DSC using an Exster 6000 manufactured by Seiko Instruments Inc.

  The nitrogen content in the epoxy resin composition was expressed as weight% when the entire solid content was taken as 100% from the nitrogen content in the curing agent.

[Example 1]
A four-necked glass separable flask equipped with a stirrer, thermometer, condenser, and nitrogen gas introduction device was charged with 216.0 parts by weight of HCA and 459.2 parts by weight of toluene as a reaction solvent, and nitrogen gas was introduced. While stirring, the mixture was heated to 75 ° C. and dissolved. Thereafter, 155.7 parts by weight of 1,4-naphthoquinone (including 2.5% by weight of water) was added in portions while paying attention to the reaction exotherm. At this time, naphthoquinone was 0.96 mol relative to HCA. The reaction was carried out for 60 minutes while controlling the system temperature at 90 ° C. The moisture in the system at this time was 2.14% by weight with respect to HCA. The temperature was further raised, reflux dehydration was performed at around 100 ° C., the temperature was raised to 130 ° C., and 300 parts by weight of the solvent was recovered. The mixture was charged and stirred under heating to further recover the solvent. At this time, the active hydrogen group relative to the epoxy group was 0.510 mol, and the water content in the system was 0.03% by weight. As a catalyst, 0.37 part by weight of triphenylphosphine was added and reacted at 165 ° C. for 4 hours. The epoxy equivalent of the obtained epoxy resin was 548.3 g / eq, the ICI viscosity was 2460 mPa · s, and the phosphorus content was 3.0% by weight. The obtained epoxy resin was dissolved in methyl ethyl ketone, and the state when the nonvolatile content was 35% was transparent and dissolved. The results are summarized in Table 1.

[Example 2]
The same operation as in Example 1 was carried out except that 157.9 parts by weight of 1,4-naphthoquinone (including 3.0% by weight of water) and 650.6 parts by weight of Epototo YDF-170 were used. At this time, naphthoquinone was 0.97 mol relative to HCA. The water content in the system in the reaction of HCA and naphthoquinone was 2.54% by weight. At this time, the active hydrogen group relative to the epoxy group was 0.514 mol, and the water content in the system was 0.05% by weight. The epoxy equivalent of the obtained epoxy resin was 550.3 g / eq, the ICI viscosity was 2590 mPa · s, and the phosphorus content was 3.0% by weight. The obtained epoxy resin was dissolved in methyl ethyl ketone, and the state when the nonvolatile content was 35% was transparent and dissolved. The results are summarized in Table 1.

Example 3
The same operation as in Example 1 was carried out except that 160.5 parts by weight of 1,4-naphthoquinone (including water content of 3.5% by weight) and Epototo YDF-170 649.2 parts by weight were used. At this time, naphthoquinone was 0.98 mol relative to HCA. The water content in the system in the reaction of HCA and naphthoquinone was 2.94% by weight. At this time, the active hydrogen group relative to the epoxy group was 0.518 mol, and the water content in the system was 0.05% by weight. The epoxy equivalent of the obtained epoxy resin was 552.6 g / eq, the ICI viscosity was 2720 mPa · s, and the phosphorus content was 3.0% by weight. The obtained epoxy resin was dissolved in methyl ethyl ketone, and the state when the nonvolatile content was 35% was transparent and dissolved. The results are summarized in Table 1.

[Comparative Example 1]
The same operation as in Example 1 was performed, except that 1,4-naphthoquinone was changed to 154.9 parts by weight (including water content of 3.0% by weight) and Epototo YDF-170 653.4 parts by weight. At this time, naphthoquinone was 0.95 mol relative to HCA. The water content in the system in the reaction of HCA and naphthoquinone was 2.49% by weight. At this time, the active hydrogen group relative to the epoxy group was 0.507 mol, and the water content in the system was 0.04% by weight. The epoxy equivalent of the obtained epoxy resin was 545.7 g / eq, the ICI viscosity was 1940 mPa · s, and the phosphorus content was 3.0% by weight. The obtained epoxy resin was dissolved in methyl ethyl ketone, and the state when the nonvolatile content was 35% was transparent and dissolved. The results are summarized in Table 1.

[Comparative Example 2]
The same operation as in Example 1 was carried out except that 162.9 parts by weight of 1,4-naphthoquinone (including 4.0% by weight of water) and 647.8 parts by weight of Epototo YDF-170 were used. At this time, naphthoquinone was 0.99 mol with respect to HCA. The water content in the system in the reaction of HCA and naphthoquinone was 3.36% by weight. At this time, the active hydrogen group with respect to the epoxy group was 0.521 mol, and the water content in the system was 0.08% by weight. The epoxy equivalent of the obtained epoxy resin was 567.6 g / eq, the ICI viscosity was 2980 mPa · s, and the phosphorus content was 3.0% by weight. The obtained epoxy resin was dissolved in methyl ethyl ketone, and the state when the nonvolatile content was 35% was transparent and dissolved. The results are summarized in Table 1.

[Comparative Example 3]
In the same apparatus as in Example 1, HCA-NQ (10- (2,7-dihydroxynaphthyl) -10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, HPLC (high performance liquid chromatography) purity 98 187.17 parts by weight (water 0% by weight) and Epototo YDF-170 327.4 parts by weight were charged, heated and held at 150 ° C. for 30 minutes. At this time, the water content in the system was 0.05% by weight. As a catalyst, 0.19 part by weight of triphenylphosphine was added and reacted at 170 ° C. for 4 hours. The active hydrogen group with respect to the epoxy group at this time was 0.519 mol. The epoxy equivalent of the obtained epoxy resin was 569.0 g / eq, the ICI viscosity was 4600 mPa · s, and the phosphorus content was 3.0% by weight. When the obtained epoxy resin was dissolved in methyl ethyl ketone to give a nonvolatile content of 35%, the state was cloudy and separated into two layers upon standing. The results are summarized in Table 1.

[Comparative Example 4]
The same operation as in Example 1 was performed except that 159.8 parts by weight of 1,4-naphthoquinone (including 4.0% by weight of water) and Epototo YDF-170 899.7 parts by weight were used. At this time, naphthoquinone was 0.97 mol relative to HCA. The water content in the system in the reaction of HCA and naphthoquinone was 3.30% by weight. At this time, the active hydrogen group with respect to the epoxy group was 0.372 mol, and the water content in the system was 0.08% by weight. The epoxy equivalent of the obtained epoxy resin was 372.2 g / eq, the ICI viscosity was 380 mPa · s, and the phosphorus content was 2.4% by weight. The obtained epoxy resin was dissolved in methyl ethyl ketone, and the state when the nonvolatile content was 35% was transparent and dissolved. The results are summarized in Table 1.

[Comparative Example 5]
The same operation as in Example 1 was carried out except that 148.3 parts by weight of 1,4-naphthoquinone (including water content of 4.0% by weight) and 76 to 484.8 parts by weight of Epototo YDF-170 were used. At this time, naphthoquinone was 0.90 mol relative to HCA. The water content in the system in the reaction of HCA and naphthoquinone was 3.09% by weight. At this time, the active hydrogen group relative to the epoxy group was 0.422 mol, and the water content in the system was 0.08% by weight. The epoxy equivalent of the obtained epoxy resin was 411.1 g / eq, the ICI viscosity was 685 mPa · s, and the phosphorus content was 2.7% by weight. The obtained epoxy resin was dissolved in methyl ethyl ketone, and the state when the nonvolatile content was 35% was transparent and dissolved. The results are summarized in Table 1.

[Comparative Example 6]
HCA-HQ (10- (2,5-dihydroxyphenyl) -10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide instead of HCA-NQ, HPLC (high performance liquid chromatography) purity 98 area% ) Was 162.14 parts by weight (water 0% by weight) and Epotot YDF-170 352.8 parts by weight. At this time, the water content in the system was 0.07% by weight. The active hydrogen group with respect to the epoxy group at this time was 0.481 mol. The epoxy equivalent of the obtained epoxy resin was 492.8 g / eq, the ICI viscosity was 1780 mPa · s, and the phosphorus content was 3.0% by weight. When the obtained epoxy resin was dissolved in methyl ethyl ketone to give a nonvolatile content of 35%, the state was cloudy and separated into two layers upon standing. The results are summarized in Table 1.

[Comparative Example 7]
The same operation as in Example 1 was carried out except that 104.8 parts by weight of parabenzoquinone (0% by weight of water) and 694.9 parts by weight of Epototo YDF-170 were used. At this time, parabenzoquinone was 0.97 mol with respect to HCA. The water content in the system in the reaction of HCA and parabenzoquinone was 0.07% by weight. At this time, the active hydrogen group with respect to the epoxy group was 0.481 mol, and the water content in the system was 0.04% by weight. The epoxy equivalent of the obtained epoxy resin was 456.8 g / eq, the ICI viscosity was 1680 mPa · s, and the phosphorus content was 3.0% by weight. The obtained epoxy resin was dissolved in methyl ethyl ketone, and the state when the nonvolatile content was 35% was transparent and dissolved. The results are summarized in Table 1.

[Examples 4 to 6 and Comparative Examples 8 to 14]
Example 1 to Example 3 and Comparative Example 1 to Comparative Example 7 epoxy resins were mixed with dicyandiamide as a curing agent together with a solvent such that 0.5 mol of active hydrogen groups per 1 mol of epoxy groups, and a curing catalyst. 2E4MZ was adjusted and blended so that the varnish gel time was 350 to 450 seconds. A glass cloth was impregnated and dried at 150 ° C. to prepare a prepreg. A copper foil was laminated on the obtained prepreg 4ply and heat-cured at 170 ° C. and 20 MPa for 2 hours to obtain a laminate. Table 2 shows the epoxy resin used in each example, the amount of the curing agent, and the amount of the curing accelerator.
Table 2 summarizes the results of glass transition temperature, copper foil peel strength, interlayer adhesion, and flame retardancy test by TMA and DSC of the laminate.

  As shown in Tables 1 and 2, the epoxy resin of Examples 1 to 3 using naphthoquinone and having a molar ratio to HCA of 0.96 to 0.98 is Comparative Example 3 using high-purity HCA-NQ. Although the ICI viscosity is remarkably lower than that of the epoxy resin of Comparative Example 7, the epoxy resin of Comparative Example 7 using benzoquinone and the molar ratio to HCA of 0.97 is a comparative example using high-purity HCA-HQ. Even when compared with 6, there is no significant difference in ICI viscosity. Further, as shown in Comparative Example 1, the molar ratio with respect to HCA is 0.95, and as shown in Comparative Examples 4 and 5, the active hydrogen group of the phosphorus compound (A) with respect to the epoxy group is more than 0.45 mol. When it is low, the ICI viscosity can be lowered, but the phosphorus content is lowered and flame retardancy cannot be obtained. Furthermore, although the flame retardance was not obtained in the laminated plate evaluation results of Comparative Example 10 using high-purity HCA-NQ, flame retardancy was obtained in all the examples, and in a system using naphthoquinone. Only low viscosity can improve workability, flame retardancy, heat resistance, adhesive properties and other physical properties.

  The present invention is superior in impregnation property because it has a lower viscosity than a phosphorus-containing epoxy resin synthesized with a conventionally used high-purity phosphorus-containing bifunctional phenol, and has excellent flame retardancy, heat resistance, and adhesiveness. It can be used for electronic circuit boards.

Claims (5)

In the range of 0.96-0.98 mol of naphthoquinone with respect to 1 mol of phosphorus compound (a) having active hydrogen directly bonded to the phosphorus atom represented by the following general formula (1) and / or general formula (2) The phosphorus compound (A) having active hydrogen obtained by carrying out the reaction and the bifunctional epoxy resin have an active hydrogen group of 0.45 mol to 0 mol per mol of the epoxy group. Phosphorus-containing epoxy resin obtained by reacting in the range of 94 mol.

In the formula, n is 0 or 1, and R1 and R2 are C1 to C12 hydrocarbon groups. R1 and R2 may be the same or different, and R1 and R2 together with the phosphorus atom may form a cyclic structure. When reacting a phosphorus compound (a) having active hydrogen directly bonded to a phosphorus atom with naphthoquinone, the phosphorus compound (a) is dissolved in an inert solvent and then reacted with naphthoquinone, and the water content in the system during the reaction is reduced by the phosphorus compound. The phosphorus-containing epoxy resin according to claim 1, wherein the content is 0.5 wt% to 3.5 wt% with respect to (a). The phosphorus-containing epoxy resin according to claim 1, which is obtained by reacting the phosphorus compound (A) with a bifunctional epoxy resin after the water content in the system is 0.1% by weight or less based on the solid content. The phosphorus containing epoxy formed by mix | blending the functional group of a hardening | curing agent with 0.4 equivalent-2.0 equivalent with respect to 1 equivalent of epoxy groups of the phosphorus containing epoxy resin of any one of Claims 1-3. Resin composition. A cured phosphorus-containing epoxy resin obtained by curing the phosphorus-containing epoxy resin composition according to claim 4.