JP2012069365A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device whose contact resistance is constant and whose plating of electrical connections is restrained from peeling off.SOLUTION: The electronic device comprises a housing having an electronic substrate insertion groove formed therein for an end part of an electronic substrate to be inserted, a card edge connector having relay terminals which abut on contact electrodes formed on the surface and reverse side respectively at an end part of the electronic substrate, and a case formed in a box like shape with an opening, in which the electronic substrate is accommodated. In the electronic device, the contact electrodes at the end part of the electronic substrate inserted into the electronic substrate insertion groove and the relay terminals are brought into contact, and a part of the housing including the electronic substrate insertion groove is accommodated within the case. As the electronic substrate is brought into contact with the case when it is inserted into the electronic substrate insertion groove, a slide section sliding toward the electronic substrate is provided in the housing, so that the electronic substrate is held between plural relay terminals and plural slide sections.

Description

  The present invention relates to an electronic apparatus in which a contact electrode of an electronic board and a relay terminal of the card edge connector are electrically connected by combining a case in which the electronic board is inserted and a card edge connector.

  Conventionally, as shown in Patent Document 1, for example, a card edge connector that holds a plurality of conductive terminals and abuts the contact portions of the conductive terminals with terminals formed on the surface of the plate edge has been proposed.

Japanese Patent Laid-Open No. 7-22126

  By the way, the card edge connector disclosed in Patent Document 1 has a configuration in which a plate material edge is sandwiched between conductive terminals. For this reason, if warpage occurs in the plate material edge, the distance between the terminal of the plate material edge and the contact portion varies, and the contact pressure between the terminal and the contact portion becomes unstable. As a result, the contact resistance between the terminal and the contact portion may become unstable. Moreover, as a result of the relative distance between the plate material edge and the conductive terminal being fluctuated by external stress, the spring property of the conductive terminal may be reduced. Also by this, the contact pressure between the terminal and the contact portion becomes unstable, and the contact resistance between the terminal and the contact portion may become unstable. Furthermore, as a result of rubbing between the terminal and the contact portion, there is a possibility that the plating of the terminal and the contact portion may be peeled off.

  In view of the above problems, an object of the present invention is to provide an electronic device in which contact resistance is constant and plating of an electrical connection portion is prevented from peeling off.

  In order to achieve the above object, the invention according to claim 1 is a housing in which an electronic substrate insertion groove for inserting an end portion of the electronic substrate is formed, and a contact formed at the end portion of the electronic substrate. A card edge connector having a relay terminal in contact with the electrode, and a box-shaped case having an opening and housing the electronic substrate, and a contact electrode at an end of the electronic substrate inserted into the electronic substrate insertion groove And the relay terminal are in contact with each other, and a part of the housing including the electronic substrate insertion groove is housed in the case, the contact electrode is a surface contact electrode formed on the surface of the electronic substrate, A back contact electrode formed on the back surface of the electronic substrate, and the relay terminal has a first relay terminal that contacts the front contact electrode and a second relay terminal that contacts the back contact electrode, End of electronic board to board insertion groove When inserting, the housing is provided with a slide portion that slides toward the electronic substrate by contacting the case, and the slide portion slides toward the surface of the electronic substrate by contacting the case. And a second slide part that slides toward the back surface of the electronic board by contacting the case, and the electronic board includes a first relay terminal, a second relay terminal, and a first slide. It is characterized by being clamped by the part and the second slide part.

  As described above, in the electronic device according to the present invention, the electronic substrate is sandwiched not only by the relay terminal but also by the slide portion. According to this, even if the electronic substrate is warped, the warp is corrected by the slide portion, so that fluctuation in the distance between the contact electrode of the electronic substrate and the relay terminal is suppressed. Thereby, the contact pressure between the contact electrode and the relay terminal is stabilized, and the contact resistance between the contact electrode and the relay terminal is stabilized. Further, even when an external stress is applied to the electronic device, the electronic substrate is held by the slide portion, so that the relative distance between the electronic substrate and the relay terminal is suppressed from fluctuating. Thereby, it is suppressed that the spring property of a relay terminal falls. As a result, the contact pressure between the contact electrode and the relay terminal is suppressed from becoming unstable, and the contact resistance between the contact electrode and the relay terminal is suppressed from becoming unstable. Furthermore, the contact electrode and the relay terminal are prevented from rubbing, and the plating of the contact electrode and the relay terminal is prevented from peeling off.

  According to a second aspect of the present invention, the first relay terminal is fixed to a portion of the housing in the upward direction from the back surface to the front surface of the electronic board, away from the formation position of the electronic board insertion groove, and a part of the first relay terminal The second relay terminal, which is provided in the insertion groove, is fixed to a portion of the housing in a downward direction from the front surface to the back surface of the electronic substrate, away from the formation position of the electronic substrate insertion groove, and a part thereof is the electronic substrate. A first slit for passing a portion provided in the electronic board insertion groove in the first relay terminal is formed in the end part on the electronic board side in the first slide part provided in the insertion groove, A second slit for passing a portion provided in the electronic board insertion groove in the second relay terminal is formed at an end of the second slide part on the electronic board side, and an electron in the first relay terminal is formed. In the board insertion groove A configuration in which the cut portion is in contact with the wall surface constituting the first slit and the portion provided in the electronic substrate insertion groove in the second relay terminal is in contact with the wall surface constituting the second slit is preferable. .

  According to this, the part inserted into the electronic board insertion groove in the relay terminal is elastically deformed with the contact part with the slide portion as a fulcrum when the electronic board is inserted into the electronic board insertion groove. Therefore, when the electronic board is inserted into the electronic board insertion groove, the length of the relay terminal from the fulcrum of the relay terminal to the contact part with the contact electrode as compared with the configuration in which the relay terminal is elastically deformed with the fixed part of the housing as the fulcrum. Becomes shorter. Thereby, the dispersion | variation in the contact pressure with a contact electrode by the manufacturing intersection of a relay terminal can be suppressed.

  According to a third aspect of the present invention, the portion provided in the electronic board insertion groove in the first relay terminal is in an upward direction before the end of the electronic board is inserted into the electronic board insertion groove. The portion provided in the electronic board insertion groove in the second relay terminal is away from the back surface of the electronic board in a state before the end of the electronic board is inserted into the electronic board insertion groove. When the end of the electronic board is inserted into the electronic board insertion groove, the first relay terminal that contacts the first slide part is brought into contact with the surface of the electronic board by the sliding of the first slide part and the second slide part. A configuration is preferred in which the second relay terminal approaching the surface contact electrode and contacting the second slide portion approaches the back surface of the electronic substrate and contacts the back surface contact electrode.

  According to this, since the electronic substrate and the relay terminal do not contact at the beginning of the insertion of the end portion of the electronic substrate into the electronic substrate insertion groove, the contact electrode and the relay terminal may be rubbed by the insertion pressure of the electronic substrate. It is suppressed. Thereby, it is suppressed that plating of a contact electrode and each relay terminal peels off.

  According to a third aspect of the present invention, as described in the fourth aspect, the electronic board insertion groove is opened on a surface of the housing facing the bottom surface of the case, and the first relay terminal and Each of the second relay terminals is embedded in the housing, and the end portion is connected to the embedded portion exposed from the opposing surface of the housing, and the end portion exposed from the opposing surface of the housing in the embedded portion, and from the connecting portion with the embedded portion A connecting portion that extends to the opening corner of the electronic substrate insertion groove along the opposing surface, and a fulcrum forming portion that is connected to the opening corner end of the connecting portion and extends in the electronic substrate insertion direction in the electronic substrate insertion groove And an end portion of the electronic substrate inserted into the electronic substrate insertion groove. The contact portion is connected to the end portion on the back side of the electronic substrate insertion groove in the fulcrum forming portion and protruded into the electronic substrate insertion groove. The first sly The contact portion of the first relay terminal approaches the surface of the electronic substrate as the fulcrum forming portion of the first relay terminal that contacts the first slide portion approaches the surface of the electronic substrate due to the slide of the first and second slide portions. The fulcrum forming part of the second relay terminal that is in contact with the surface contact electrode and in contact with the second slide part approaches the back surface of the electronic substrate, so that the contact portion of the second relay terminal approaches the back surface of the electronic substrate, A configuration in contact with the contact electrode can be employed.

  According to a fifth aspect of the present invention, the housing has a first inner wall surface that constitutes the electronic board insertion groove along the upward direction so as to straddle a part of the portion of the first relay terminal fixed to the housing. The first through hole penetrating from the upper inner wall surface on the relay terminal side to the upper outer wall surface on the first relay terminal side on the outer wall surface of the housing, and a part of the portion fixed to the housing on the second relay terminal are straddled. A second through hole penetrating from the lower inner wall surface on the second relay terminal side on the inner wall surface constituting the electronic substrate insertion groove to the lower outer wall surface on the second relay terminal side in the outer wall surface of the housing along the lower direction; The first through hole is provided with a first slide portion, the second through hole is provided with a second slide portion, and the first slide portion is fixed to the housing of the first relay terminal. While passing through A first through hole is formed to prevent the first slide portion from contacting the portion of the first relay terminal fixed to the housing by the slide of the first slide portion. The second slide portion includes a second through hole. A second through hole that prevents the second slide portion and the portion fixed to the housing in the second relay terminal from contacting each other by sliding the second slide portion while passing the portion fixed to the housing in the relay terminal. The structure in which is formed is good.

  According to this, it is suppressed that the site | part fixed to the housing in a slide part and the relay terminal contacts by the slide of a slide part. Thereby, it is suppressed that the bending of the relay terminal unexpectedly occurs and the resistance of the relay terminal increases.

  According to a sixth aspect of the present invention, when the end portion of the electronic substrate is inserted into the electronic substrate insertion groove, the end portion on the upper outer wall surface side of the first slide portion is exposed from the first through hole. The end portion on the lower outer wall surface side of the slide portion is exposed from the second through hole, the end portion on the upper outer wall surface side of the first slide portion, and the end portion on the lower outer wall surface side of the second slide portion, respectively. A configuration in which a taper is formed in which the length in the upward direction gradually becomes longer in the insertion direction of the electronic substrate. According to this, compared with the structure in which the taper is not formed, sliding of a slide part becomes easy.

  Since the operational effect of the invention described in claim 7 is the same as that of the invention described in claim 1, the description thereof is omitted. Moreover, since the effect of the invention of Claim 8 is the same as that of the invention of Claim 2, the description is omitted.

  As a specific configuration of the displacement portion described in claims 7 and 8, as described in claim 9, the first displacement portion is formed from an upper wall located above the surface of the electronic substrate in the case, from the electronic substrate. A first extending portion extending toward the surface of the electronic substrate, and an end portion on the surface side of the electronic substrate in the first extending portion, extending in the insertion direction of the electronic substrate, and inserted into the electronic substrate insertion groove. A second insertion portion extending from the lower side wall located below the back surface of the electronic substrate in the case toward the back surface of the electronic substrate, and the second extension portion. A first insertion portion and a second insertion portion, the second insertion portion extending from an end portion of the rear surface side of the electronic substrate in the installation portion toward the insertion direction of the electronic substrate and inserted into the electronic substrate insertion groove. In each case, the thickness gradually decreases along the upward direction in the insertion direction of the electronic substrate. There can be employed formed configuration.

  As a specific configuration of the relay terminal and a specific configuration of the holding of the relay terminal, as described in claim 10, the electronic board insertion groove is opened to a surface of the housing facing the bottom surface of the case. Each of the first relay terminal and the second relay terminal is embedded in the housing, and the end portion is connected to the embedded portion exposed from the opposing surface of the housing, and the end portion exposed from the opposing surface of the housing in the embedded portion, A connecting portion that extends from the connecting portion to the embedded portion to the opening corner of the electronic substrate insertion groove along the opposing surface, and is connected to an end of the connecting portion on the opening corner portion side. A fulcrum forming portion extending in the insertion direction, and a contact portion connected to the back end of the electronic substrate insertion groove in the fulcrum formation portion and projecting into the electronic substrate insertion groove, to the electronic substrate insertion groove Inserting the end of the electronic board Therefore, the fulcrum formation part of the first relay terminal is sandwiched between the first insertion part and the inner wall surface of the electronic board insertion groove, and the fulcrum formation part of the second relay terminal is sandwiched between the second insertion part and the electronic board insertion groove. A configuration sandwiched between the inner wall surface and the inner wall surface can be employed.

  According to the eleventh aspect, the end of the upper side wall located above the surface of the electronic substrate in the case and the end of the lower side wall located below the back surface of the electronic substrate in the case are inserted into the housing. Thus, a configuration in which a fixing portion for fixing the housing and the case is formed is preferable. According to this, the housing (card edge connector) and the case are firmly fixed.

It is an exploded sectional view showing a schematic structure of an electronic device concerning a 1st embodiment. It is sectional drawing which shows the electronic device which concerns on 1st Embodiment. It is a front view which shows schematic structure of a slide part. It is sectional drawing for demonstrating the slide of a slide part, (a) shows before a slide, (b) has shown after the slide. It is an exploded sectional view showing a schematic structure of an electronic device concerning a 2nd embodiment. It is sectional drawing which shows the electronic device which concerns on 2nd Embodiment. It is a front view which shows schematic structure of a displacement part.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is an exploded cross-sectional view illustrating a schematic configuration of the electronic device according to the first embodiment. FIG. 2 is a cross-sectional view showing the electronic device according to the first embodiment. FIG. 3 is a front view showing a schematic configuration of the slide portion. 4A and 4B are cross-sectional views for explaining the sliding of the sliding portion, in which FIG. 4A shows a state before sliding, and FIG. 4B shows a state after sliding. In FIG. 3, the second slide part 70b is omitted, and only the first slide part 70a is shown. Further, in FIG. 4, the slide part 70 provided in the housing 20 is indicated by a broken line in order to clarify the positional relationship between the slit 73 and the through hole 74 and the relay terminals 30 a and 30 b.

  In the following, the direction in which the electronic substrate 10 is inserted into the electronic substrate insertion groove 21 along the front surface 10a and the back surface 10b of the electronic substrate 10 is referred to as the insertion direction, and the reverse direction of the insertion direction is referred to as the removal direction. In addition, the direction orthogonal to the front surface 10a and the back surface 10b of the electronic substrate 10, the direction from the back surface 10b to the front surface 10a is indicated as the upward direction, and the direction from the front surface 10a to the back surface 10b is indicated as the downward direction. Further, a direction orthogonal to the insertion direction and the upward direction (extraction direction and downward direction) is indicated as a lateral direction.

  As shown in FIG. 1, the electronic device 100 is in contact with a housing 20 in which an electronic substrate insertion groove 21 for inserting an end portion 11 of the electronic substrate 10 is formed, and a contact electrode 12 formed in the end portion 11. A card edge connector 40 having a relay terminal 30 and a box 50 having an opening and accommodating the electronic substrate 10.

  In this embodiment, the terminal insertion hole 22 for inserting the terminal 63 of the harness 60 is formed in the housing 20, and the end portion 11 of the electronic board 10 is inserted into the electronic board insertion groove 21 as shown in FIG. 2. Then, the contact electrode 12 and the terminal 63 are electrically connected via the relay terminal 30 by inserting the terminal 63 of the harness 60 into the terminal insertion hole 22. A part of the housing 20 including the electronic board insertion groove 21 is accommodated in the case 50.

  The electronic substrate 10 includes an electronic element (not shown) and a wiring pattern (not shown) electrically connected to the electronic element. As shown in FIGS. 1 and 2, contact electrodes 12 corresponding to the terminal terminals of the wiring pattern described above are formed on the front surface 10 a of the end portion 11 inserted into the housing 20 and the back surface 10 b of the electronic substrate 10. Yes.

  The contact electrode 12 has a front contact electrode 12a formed on the front surface 10a and a back contact electrode 12b formed on the back surface 10b. The contact electrodes 12a and 12b each have a rectangular shape whose longitudinal direction is along the insertion direction (extraction direction), and the contact electrodes 12 and relay along the insertion direction are relayed compared to the case where each of the contact electrodes 12a and 12b is square. The connection area with the terminal 30 is increased.

  As shown in FIG. 4B, each of the plurality of contact electrodes 12a and 12b is arranged along the lateral direction at a predetermined interval, and the front contact electrode 12a and the back contact electrode 12b are arranged via the electronic substrate 10. Are arranged at opposite positions. That is, the projection position of the front contact electrode 12a onto the back surface 10b matches the formation position of the back contact electrode 12b, and the projection position of the back contact electrode 12b onto the front surface 10a matches the formation position of the front contact electrode 12a. In addition, contact electrodes 12a and 12b are arranged.

  The housing 20 is configured to electrically connect the terminal 63 and the contact electrode 12 via the relay terminal 30 while holding the harness 60 and the electronic substrate 10. The housing 20 is formed by injection molding of resin, and is formed with an electronic board insertion groove 21 for inserting the electronic board 10 and a terminal insertion hole 22 for inserting the terminal 63 of the harness 60. An annular seal member 23 is provided on the outer wall of the housing 20.

  As shown in FIGS. 1 and 2, the electronic substrate insertion groove 21 is a region sandwiched between an upper inner wall surface 24 a positioned above the electronic substrate 10 and a lower inner wall surface 24 b positioned downward. The housing 20 has an opening in a surface 20a facing the bottom (not shown) of the case 50. The inner wall surfaces 24 a and 24 b and the facing surface 20 a form an opening corner 25 of the electronic board insertion groove 21, and this opening corner 25 is formed between the connecting portion 32 and the fulcrum forming portion 33 constituting the relay terminal 30. It is in contact with the connection site. Note that the facing distance between the front surface 10a and the upper inner wall surface 24a is equal to the facing distance between the back surface 10b and the lower inner wall surface 24b.

  As shown in FIGS. 1 and 2, the terminal insertion hole 22 is opened on the back surface 20b of the facing surface 20a, and the first terminal insertion hole 22a spaced upward from the formation position of the electronic substrate insertion groove 21; And a second terminal insertion hole 22b spaced downward from the formation position of the electronic substrate insertion groove 21. Each of the plurality of terminal insertion holes 22a and 22b is arranged along the lateral direction at a predetermined interval, and a first terminal 63a described later is inserted into the first terminal insertion hole 22a, and the second terminal insertion hole 22b. The second terminal 63b, which will be described later, is inserted into the second. In addition, the inner wall surface which comprises the terminal insertion hole 22 is formed with a projection (not shown) which is fitted into a hole (not shown) formed in a main body 65 of the terminal 63 which will be described later. Although not shown, a sealing material for closing the terminal insertion hole 22 is provided on the back surface 20b.

  The housing 20 according to the present embodiment is formed with through holes 26a and 26b for providing a slide portion 70 described later. As shown in FIGS. 1 and 2, the first through hole 26 a extends from the upper inner wall surface 24 a to the upper outer wall surface 27 a on the first terminal insertion hole 22 a side on the outer wall surface of the housing 20 along the upward direction. The second through hole 26b penetrates from the lower inner wall surface 24b to the lower outer wall surface 27b on the second terminal insertion hole 22b side on the outer wall surface of the housing 20 along the downward direction.

  The relay terminal 30 is formed by punching a single metal plate, and is provided in the housing 20 so that one end protrudes into the electronic board insertion groove 21 and the other end protrudes into the terminal insertion hole 22. It has been. The relay terminal 30 is a first relay terminal 30a that electrically connects the surface contact electrode 12a and a first terminal 63a described later, and a second terminal that electrically connects the back contact electrode 12b and a second terminal 63b described later. Relay terminal 30b. As shown in FIG. 4, each of the plurality of relay terminals 30a and 30b is arranged along the horizontal direction at a predetermined interval, and the first relay terminal 30a and the second relay terminal 30b face each other. The electronic substrate 10 is sandwiched between the first relay terminal 30a and the second relay terminal 30b.

  Each of the first relay terminal 30a and the second relay terminal 30b is partially embedded in the housing 20, and an end portion exposed from the facing surface 20a in the embedded portion 31 is embedded in the embedded portion 31 exposed from the facing surface 20a. Are connected to the connecting portion 32 extending from the connecting portion with the embedded portion 31 to the opening corner portion 25 along the facing surface 20a, and to the end portion on the opening corner portion 25 side of the connecting portion 32, and the electronic substrate insertion groove 21 A fulcrum forming portion 33 extending in the insertion direction, and a contact portion 34 connected to an end portion on the back side of the electronic substrate insertion groove 21 in the fulcrum formation portion 33 and protruding into the electronic substrate insertion groove 21. The

  As shown in FIGS. 1 and 2, the embedded portion 31 of the first relay terminal 30a extends from the facing surface 20a to the first terminal insertion hole 22a, and the embedded portion 31 of the second relay terminal 30b is connected to the facing surface 20a. To the second terminal insertion hole 22b. An end portion of the embedded portion 31 on the terminal insertion hole 22 side is inserted into a body portion 65 of a terminal 63 described later, and is in contact with and electrically connected to the contact portion 66. The connection angle between the embedded portion 31 and the connecting portion 32 is substantially a right angle, and the embedded portion 31 and the connecting portion 32 are connected in an L shape.

  As shown in FIG. 1, in a state before the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the fulcrum forming portion 33 of the first relay terminal 30a extends along the upper inner wall surface 24a in the electronic substrate insertion groove 21. The fulcrum forming portion 33 of the second relay terminal 30b extends in the insertion direction along the lower inner wall surface 24b in the electronic substrate insertion groove 21. Thus, in a state before the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the connection angle between the connecting portion 32 and the fulcrum forming portion 33 is almost a right angle, and the connecting portion 32 and the fulcrum forming portion 33. Are connected in an L shape.

  As shown in FIG.1 and FIG.2, the connection angle of the fulcrum formation part 33 and the contact part 34 is an obtuse angle, and the fulcrum formation part 33 and the contact part 34 are connected in the shape of a dogleg. The contact portion 34 is curved so as to be convex with respect to the electronic substrate 10, and the apex of the curved portion is in contact with the contact electrode 12 of the electronic substrate 10. As shown in FIG. 1, in the state before the end portion 11 of the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the apex of the contact portion 34 of the first relay terminal 30a is above the surface 10a of the electronic substrate 10. The apex of the contact portion 34 of the second relay terminal 30b is separated downward from the back surface 10b of the electronic substrate 10.

  As shown in FIG. 2, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, a slide portion 70 described later slides so as to approach the electronic substrate 10, and the slide portion 70 and the fulcrum forming portion 33 come into contact with each other. To do. As a result, the fulcrum forming part 33 is elastically deformed toward the electronic substrate 10, the connection angle between the fulcrum formation part 33 and the connection part 32 is changed from a right angle to an obtuse angle, and the connection shape between the fulcrum formation part 33 and the connection part 32. However, it becomes a K shape. Along with this change, the contact portion 34 connected to the end on the back side of the electronic substrate insertion groove 21 in the fulcrum forming portion 33 approaches the electronic substrate 10 and contacts the contact electrode 12. The contact portion 34 in contact with the contact electrode 12 is elastically deformed with the contact portion between the fulcrum forming portion 33 and the slide portion 70 as a fulcrum. With the above change, the distance between the apex of the contact portion 34 and the contact portion of the fulcrum forming portion 33 with the slide portion 70 in all the relay terminals 30 is constant.

  The case 50 is fitted with the housing 20 to close the storage space for the electronic substrate 10 and stores the electronic substrate 10 in an internal space formed by the case 50 and the housing 20. The case 50 has a box shape having an opening, and a groove (not shown) for guiding the insertion of the electronic substrate 10 into the case 50 is formed on the inner surface of the side portion of the case 50. A support portion (not shown) for supporting the electronic substrate 10 is formed along with the groove portion. The case 50 and the housing 20 are coupled by fitting, and the housing 50 is inserted into the case 50, whereby the case 50 and the housing 20 (card edge connector 40) are assembled.

  The harness 60 includes a metal wire 61 and a covering portion 62 that covers the metal wire 61. As shown in FIG. 1, a terminal 63 is electrically and mechanically connected to the end of the harness 60.

  The terminal 63 has a first terminal 63a inserted into the first terminal insertion hole 22a and a second terminal 63b inserted into the second terminal insertion hole 22b. Each of the terminals 63a and 63b includes a coupling portion 64 coupled to the covering portion 62 of the harness 60 by caulking, a cylindrical main body portion 65 extending from the coupling portion 64, and a contact portion provided inside the main body portion 65. 66, a female terminal. The contact portion 66 can be elastically deformed, and when the relay terminal 30 is inserted into the main body portion 65, the contact portion 66 is brought into contact with a predetermined contact pressure by elastic deformation and functions to ensure electrical connection. In the main body 65, the metal wire 61 of the harness 60 is electrically and mechanically connected by caulking or the like.

  Next, the slide part 70 which is a feature point of the electronic device 100 according to the present embodiment will be described. The slide portion 70 slides toward the electronic substrate 10 by contacting the case 50 when the end portion 11 of the electronic substrate 10 is inserted into the electronic substrate insertion groove 21. The slide portion 70 includes a first slide portion 70a that slides downward toward the front surface 10a of the electronic substrate 10, and a second slide portion 70b that slides upward toward the back surface 10b of the electronic substrate 10. Have. As shown in FIG. 4, the first slide part 70a and the second slide part 70b are opposed to each other, and the electronic substrate 10 is sandwiched between the first slide part 70a and the second slide part 70b.

  The first slide part 70a is provided in the first through hole 26a, and the second slide part 70b is provided in the second through hole 26b. As shown in FIG. 1, each of the slide portions 70a and 70b is provided with a projection 71, and each of the through holes 26a and 26b is formed with a recess 28 into which the projection 71 is inserted. In a state before the end portion 11 of the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the slide portions 70 a and 70 b are suppressed from sliding into the electronic substrate insertion groove 21 by the protrusions 71. . In this state, the end portion on the upper outer wall surface 27a side in the first slide portion 70a is exposed to the outside, and the end portion on the lower outer wall surface 27b side in the second slide portion 70b is exposed to the outside. Further, the end of the first slide portion 70a on the electronic substrate insertion groove 21 side is provided in the first through hole 26a, and the end of the second slide portion 70b on the electronic substrate insertion groove 21 side is in the second through hole 26b. Is provided. In a state after the end portion 11 of the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the protrusion 71 is inserted into the recess 28, and the protrusions 71 and the recess 28 allow the slide portions 70 a and 70 b to pass through the through hole 26 a. , 26b.

  As shown in FIGS. 1 to 4, the taper 72 whose length in the upward direction (downward direction) gradually increases toward the insertion direction at the end on the outer wall surface side of the housing 20 in the slide portions 70 a and 70 b. Is formed. When the end portion 11 of the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the slope forming the taper 72 comes into contact with the side wall of the case 50, so that a part of the insertion pressure of the electronic substrate 10 in the insertion direction. Is converted into a force that slides the first slide part 70a downward and slides the second slide part 70b upward.

  A slit 73 with a part cut away is formed along the upper direction (downward direction) at the end of the slide portions 70a and 70b on the electronic substrate 10 side. As shown in FIGS. 3 and 4, a plurality of slits 73 are arranged at predetermined intervals in the lateral direction, and the fulcrum forming portion 33 of one relay terminal 30 is passed through each slit 73. Yes. The length of the slit 73 in the upward direction (downward direction) is shorter than the distance that the slide unit 70 slides (hereinafter referred to as the slide distance), and as shown in FIGS. 2 and 4B, the slide When the portion 70 slides, the bottom wall surface forming the slit 73 and the fulcrum forming portion 33 come into contact with each other, and the fulcrum forming portion 33 is displaced so as to approach the electronic substrate 10.

  A rectangular through hole 74 is formed between the portion where the taper 72 is formed and the portion where the slit 73 is formed in the slide portions 70a and 70b. As shown in FIGS. 1, 2, and 4, the embedded portion 31 is passed through the through hole 74 of the slide portion 70. The length in the upward direction (downward direction) of the through hole 74 is longer than the slide distance. As shown in FIGS. 2 and 4B, even if the slide part 70 slides, the through hole 74 is slid. The four sides that form the shape and the embedded portion 31 do not come into contact with each other. Speaking structurally, before the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, among the four sides constituting the through-hole 74, between the side on the electronic substrate insertion groove 21 side and the embedded portion 31. The distance between the side away from the electronic substrate insertion groove 21 and the embedded portion 31 is longer than the slide distance.

  Next, a method for manufacturing the electronic device 100 according to the present embodiment will be described. First, the harness 60, the housing 20, the relay terminal 30, the case 50 in which the electronic substrate 10 is inserted, and the slide part 70 are prepared. The above is the preparation process.

  After the preparation step, the slide portion 70 is moved through the through holes 26a, 26b so that the taper 72 is exposed from the opening on the outer wall side of the housing 20 in the through holes 26a, 26b, and the inclined surface forming the taper 72 faces toward the facing surface 20a. 26b is inserted into each. In this state, the projecting portion 71 of the slide portion 70 and the outer wall of the housing 20 are in contact with each other. The above is the first insertion step.

  After the first insertion step, the through holes 26a and 26b and the through holes 74 of the slide part 70 are passed through the through holes 26a and 26b and through the through holes 26a and 26b and the through holes 74 of the slide portion 70, respectively. The embedded portion 31 is press-fitted. As a result, the relay terminal 30 is attached to the housing 20. The above is the press-fitting process.

  After the press-fitting process, the terminal 63 to which the harness 60 is connected is inserted into the terminal insertion hole 22. Since the front end surface of the main body portion 65 of the terminal 63 is open, the front end portion of the embedded portion 31 of the relay terminal 30 previously attached to the housing 20 is introduced into the main body portion 65 and comes into contact with the contact portion 66. To do. The above is the second insertion step.

  After the second insertion step, the electronic substrate 10 is inserted into the electronic substrate insertion groove 21. At this time, the side wall of the case 50 comes into contact with the taper 72 of the slide part 70, the slide part 70 slides toward the electronic substrate 10, and the protrusion 71 of the slide part 70 is inserted into the recess 28. Is fixed to the housing 20. Thus, the electronic substrate 10 is held between the first relay terminal 30a and the second relay terminal 30b, and the first slide portion 70a and the second slide portion 70b, and is held in the electronic substrate insertion groove 21. Further, as the electronic board 10 is inserted into the electronic board insertion groove 21, the housing 20 is inserted into the case 50, and the case 50 and the housing 20 are assembled. Thereby, the annular seal member 23 is disposed between the housing 20 and the case 50, and the storage space of the electronic substrate 10 constituted by the housing 20 and the case 50 is closed. The above is the third insertion step.

  Through the above steps, the electronic device 100 according to this embodiment is assembled. In the above assembling method, the third insertion process is performed after the second insertion process is completed. However, the second insertion process may be performed after the third insertion process is completed.

  Next, functions and effects of the electronic device 100 according to the present embodiment will be described. As described above, the electronic substrate 10 is sandwiched not only by the relay terminal 30 but also by the slide part 70. According to this, even if the electronic substrate 10 is warped, the warp is corrected by the slide portion 70, and the fluctuation of the distance between the contact electrode 12 of the electronic substrate 10 and the relay terminal 30 is suppressed. Thereby, the contact pressure between the contact electrode 12 and the relay terminal 30 is stabilized, and the contact resistance between the contact electrode 12 and the relay terminal 30 is stabilized. Even if an external stress is applied to the electronic device 100, the electronic substrate 10 is held by the slide portion 70, so that the relative distance between the electronic substrate 10 and the relay terminal 30 and between the electronic substrate 10 and the housing 20 is as follows. Fluctuation is suppressed. Thereby, it is suppressed that the spring property of the relay terminal 30 falls. As a result, the contact pressure between the contact electrode 12 and the relay terminal 30 is suppressed from becoming unstable, and the contact resistance between the contact electrode 12 and the relay terminal 30 is suppressed from becoming unstable. Furthermore, the contact electrode 12 and the relay terminal 30 are prevented from rubbing, and the plating of the contact electrode 12 and the relay terminal 30 is suppressed from peeling off.

  The contact portion 34 is elastically deformed with the contact portion between the slide portion 70 and the fulcrum forming portion 33 as a fulcrum when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21. According to this, when the electronic board 10 is inserted into the electronic board insertion groove 21, the contact part 34 is compared with a configuration in which the contact part 34 is elastically deformed with the embedded part 31 that is a fixed part to the housing 20 as a fulcrum. The length from the fulcrum to the contact area with the contact electrode 12 is shortened. Thereby, the variation in the contact pressure with the contact electrode 12 by the manufacturing intersection of the relay terminal 30 can be suppressed.

  In all the relay terminals 30, the distance between the apex of the contact portion 34 and the contact portion of the fulcrum forming portion 33 with the slide portion 70 is constant. As a result, the contact pressure between all the relay terminals 30 and the contact electrodes 12 becomes constant, and the contact resistance between the relay terminals 30 and the contact electrodes 12 becomes constant.

  At the beginning of insertion of the end portion 11 of the electronic substrate 10 into the electronic substrate insertion groove 21, the contact portion (vertex) of the contact portion 34 of the first relay terminal 30 a with the surface contact electrode 12 a is from the surface 10 a of the electronic substrate 10. The contact portion (vertex) of the contact portion 34 of the second relay terminal 30b with the back contact electrode 12b is separated from the back surface 10b of the electronic substrate 10 downward. The contact portion 34 approaches the electronic substrate 10 and comes into contact with the contact electrode 12 by sliding of the slide portion 70 when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21. According to this, at the beginning of the insertion of the end portion 11 of the electronic substrate 10 into the electronic substrate insertion groove 21, the electronic substrate 10 and the relay terminal 30 do not contact each other. Therefore, the contact electrode 12 and the relay terminal 30 are prevented from rubbing due to the insertion pressure of the electronic substrate 10, and the plating of the contact electrode 12 and the relay terminal 30 is suppressed from peeling off.

  A through hole 74 through which the embedded portion 31 is passed is formed in the slide portion 70. Then, in a state before the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, among the four sides constituting the through hole 74, a predetermined distance is provided between the side on the electronic substrate insertion groove 21 side and the embedded portion 31. The distance between the side away from the electronic substrate insertion groove 21 and the embedded portion 31 is longer than the slide distance. According to this, since the slide part 70 and the embedded part 31 are not in contact with each other, as a result of the slide part 70 and the embedded part 31 being in contact, unexpected bending occurs in the relay terminal 30 and the resistance of the relay terminal 30 is increased. Is suppressed.

  Before the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, a taper 72 is formed at the end exposed to the outside from the through holes 26 a and 26 b in the slide portions 70 a and 70 b. According to this, compared with the structure in which the taper 72 is not formed, the slide of the slide part 70 becomes easy.

  The contact electrode 12 has a rectangular shape whose longitudinal direction is along the insertion direction. According to this, since the connection region between the contact electrode 12 and the relay terminal 30 along the insertion direction is increased as compared with the case where the contact electrode 12 is square, the displacement of the electronic substrate 10 in the insertion direction is caused. In addition, it is possible to suppress poor electrical connection between the contact electrode 12 and the relay terminal 30.

  In the present embodiment, the apex of the contact portion 34 of the first relay terminal 30a is above the surface 10a of the electronic substrate 10 before the end portion 11 of the electronic substrate 10 is inserted into the electronic substrate insertion groove 21. An example is shown in which the apex of the contact portion 34 of the second relay terminal 30 b is separated downward from the back surface 10 b of the electronic substrate 10. However, before the end portion 11 of the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the apex of the contact portion 34 of the first relay terminal 30a is positioned at the height of the surface 10a, and the second relay terminal 30b. The apex of the contact portion 34 may be located at the height of the back surface 10b.

  In this embodiment, when the slide part 70 slides, the example which the bottom part wall surface which forms the slit 73, and the fulcrum formation part 33 contacted was shown. However, when the slide part 70 slides, the bottom wall surface forming the slit 73 and the fulcrum forming part 33 do not need to contact each other.

  In the present embodiment, an example in which the fulcrum forming portion 33 of one relay terminal 30 is passed through each slit 73 is shown. However, the present invention is not limited to the above configuration example, and for example, a configuration in which two fulcrum forming portions 33 are passed through one slit 73 may be employed.

  In the present embodiment, an example in which the slit 73 is rectangular as shown in FIG. 3 is shown. However, the shape of the slit 73 is not limited to the above example.

  In the present embodiment, an example in which one through hole 74 is formed in each of the slide portions 70a and 70b is shown. However, the number of through holes 74 is not limited to the above example, and may be plural.

  In the present embodiment, an example in which the through hole 74 is rectangular is shown. However, the shape of the through hole 74 is not limited to the above example, and may be circular, for example.

  In the present embodiment, an example in which each of the slide portions 70 a and 70 b is provided in the housing 20 is shown. However, a configuration in which a plurality of slide portions 70 a and 70 b are provided in the housing 20 may be employed.

(Second Embodiment)
Next, 2nd Embodiment of this invention is described based on FIGS. FIG. 5 is an exploded cross-sectional view showing a schematic configuration of the electronic device according to the second embodiment, and corresponds to FIG. 1 shown in the first embodiment. FIG. 6 is a cross-sectional view showing the electronic device according to the second embodiment, and corresponds to FIG. 2 shown in the first embodiment. FIG. 7 is a front view showing a schematic configuration of the displacement portion. In FIG. 7, the second displacement portion 80b is omitted and only the first displacement portion 80a is shown.

  Since the electronic device 100 according to the second embodiment is often in common with that according to the first embodiment, a detailed description of the common parts will be omitted below, and different parts will be mainly described. In addition, the same code | symbol shall be provided to the element same as the element shown in 1st Embodiment.

  In the first embodiment, an example in which the slide part 70 is provided in the housing 20 has been described. In contrast, the present embodiment is characterized in that the displacement portion 80 is provided in the case 50.

  The displacement portion 80 is displaced toward the electronic substrate 10 when the end portion 11 of the electronic substrate 10 is inserted into the electronic substrate insertion groove 21. The displacement portion 80 comes into contact with the upper inner wall surface 24a (opening corner portion 25), whereby a first displacement portion 80a that is displaced toward the surface 10a of the electronic substrate 10 and a lower inner wall surface 24b (opening corner portion 25). It has the 2nd displacement part 80b displaced toward the back surface 10b of the electronic substrate 10 by contacting. As shown in FIGS. 5 and 6, the first displacement portion 80 a and the second displacement portion 80 b are opposed to each other with the electronic substrate 10 interposed therebetween.

  Each of the first displacement portion 80a and the second displacement portion 80b extends in the insertion direction from the extending portion 81 extending from the side wall of the case 50 toward the electronic substrate 10 and the end portion of the extending portion 81 on the electronic substrate 10 side. And an insertion portion 82 that extends in the direction and is inserted into the electronic substrate insertion groove 21. The extending portion 81 of the first displacement portion 80 a extends from the upper side wall 51 located above the surface 10 a of the electronic substrate 10 in the case 50 toward the surface 10 a of the electronic substrate 10, and the insertion portion 82 is extended to the extending portion 81. From the end on the surface 10a side in the direction of insertion. The extending portion 81 of the second displacement portion 80b extends from the lower side wall 52 located below the back surface 10b of the electronic substrate 10 in the case 50 toward the back surface 10b of the electronic substrate 10, and the insertion portion 82 is extended to the extending portion 81. From the end on the back surface 10b side in the direction of insertion.

  As shown in FIGS. 5 to 7, the insertion portion 82 is formed with a taper 83 whose thickness gradually decreases in the upward direction (downward direction) in the insertion direction. The thickness of the tip of the insertion portion 82 of the first displacement portion 80a is shorter than the length between the surface 10a of the electronic substrate 10 and the upper inner wall surface 24a, and the thickness of the connection end with the extending portion 81 is the surface. It is longer than the length between 10a and the upper inner wall surface 24a. Further, the thickness of the tip of the insertion portion 82 of the second displacement portion 80b is shorter than the length between the back surface 10b of the electronic substrate 10 and the lower inner wall surface 24b, and the thickness of the connection end with the extending portion 81 is The length between the back surface 10b and the lower inner wall surface 24b is longer.

  As shown in FIG. 6, in a state before the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the insertion portion 82 of the first displacement portion 80a is away from the surface 10a in the upward direction, and the second displacement portion. The insertion portion 82 of 80b is away from the back surface 10b in the downward direction.

  As shown in FIG. 7, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21 and the insertion portion 82 is inserted into the electronic substrate insertion groove 21, the taper 83 of the insertion portion 82 is connected to the connecting portion 32 and the fulcrum. The connecting portion with the forming portion 33 and the opening corner portion 25 are contacted. Thereby, part of the insertion pressure of the electronic substrate 10 in the insertion direction is converted into a force that displaces the first displacement portion 80a downward and displaces the second displacement portion 80b upward. By this force, the upper side wall 51 to which the first displacement portion 80a is connected is deformed so as to be convex toward the surface 10a, the first displacement portion 80a approaches the surface 10a, and the second displacement portion 80b is connected. The lower wall 52 is deformed so as to be convex toward the back surface 10b, and the second displacement portion 80b approaches the back surface 10b. As a result, the electronic substrate 10 is sandwiched between the first displacement portion 80a and the second displacement portion 80b. At the same time, the fulcrum forming portion 33 of the first relay terminal 30a is sandwiched between the first displacement portion 80a and the upper inner wall surface 24a, and the fulcrum formation portion 33 of the second relay terminal 30b is connected to the second displacement portion 80b. It is clamped by the lower inner wall surface 24b.

  As described above, in the present embodiment, the electronic substrate 10 is sandwiched not only by the relay terminal 30 but also by the displacement portion 80. According to this, even if the electronic substrate 10 is warped, the warp is corrected by the displacement portion 80, and fluctuations in the distance between the contact electrode 12 of the electronic substrate 10 and the relay terminal 30 are suppressed. Even if an external stress is applied to the electronic device 100, the electronic substrate 10 is sandwiched by the displacement portion 80, so that the relative distance between the electronic substrate 10 and the relay terminal 30 due to the external stress is suppressed. It is suppressed that the spring property of the relay terminal 30 is lowered. Thereby, the contact pressure between the contact electrode 12 and the relay terminal 30 is suppressed from becoming unstable, and the contact resistance between the contact electrode 12 and the relay terminal 30 is suppressed from becoming unstable. Furthermore, since the relative distance between the electronic substrate 10 and the relay terminal 30 due to external stress is suppressed, friction between the contact electrode 12 and the relay terminal 30 is suppressed, and the contact electrode 12 and the relay terminal 30 are suppressed. It is suppressed that each plating peels off.

  Further, the fulcrum forming portion 33 is sandwiched between the displacement portion 80 and the inner wall surface of the electronic substrate insertion groove 21. According to this, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the contact portion 34 is elastically deformed with the fulcrum forming portion 33 as a fulcrum. Therefore, the length from the fulcrum in the relay terminal 30 to the contact portion with the contact electrode 12 is shorter than the configuration in which the contact part 34 is elastically deformed with the embedded part 31 as a fulcrum. Thereby, the variation in the contact pressure with the contact electrode 12 by the manufacturing intersection of the relay terminal 30 can be suppressed.

  As shown in FIGS. 5 and 6, in the present embodiment, the housing 20 and the case 50 are inserted into the outer wall of the housing 20 by inserting the end of the upper side wall 51 and the end of the lower side wall 52, respectively. A fixing portion 90 is provided for fixing. The fixing portion 90 and the housing 20 are formed separately, and the constituent materials thereof may be the same or different. As described above, as the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the side walls 51 and 52 are deformed so as to be convex toward the electronic substrate 10. However, as shown in FIGS. 5 and 6, by inserting the end portions of the side walls 51 and 52 into the recesses formed between the fixed portion 90 and the outer wall of the housing 20, the end portions of the side walls 51 and 52 are inserted. The generated deformation is corrected, and a decrease in adhesion between the side walls 51 and 52 and the annular seal member 23 is suppressed. Thereby, it is suppressed that the airtightness of the storage space of the electronic substrate 10 comprised by the housing 20 and the case 50 falls. Further, the housing 20 and the case 50 are firmly fixed. Needless to say, the electronic device 100 shown in the first embodiment may include the fixing unit 90 described above.

  In the present embodiment, an example in which each of the displacement portions 80a and 80b is provided in the case 50 is shown. However, a configuration in which a plurality of the displacement portions 80a and 80b are provided in the case 50 may be employed.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Electronic board 12 ... Contact electrode 20 ... Housing 30 ... Relay terminal 40 ... Card edge connector 50 ... Case 60 ... Harness 63 ... Terminal 70 ... Slide Part 80 ... Displacement part 100 ... Electronic device

Claims (11)

A housing in which an electronic substrate insertion groove for inserting an end portion of the electronic substrate is formed, and a card edge connector having a relay terminal in contact with a contact electrode formed on the end portion of the electronic substrate;
A box shape having an opening, and a case for storing the electronic substrate,
The contact electrode at the end of the electronic board inserted in the electronic board insertion groove and the relay terminal are in contact with each other, and the part of the housing including the electronic board insertion groove is accommodated in the case. A device,
The contact electrode has a surface contact electrode formed on the surface of the electronic substrate, and a back contact electrode formed on the back surface of the electronic substrate,
The relay terminal has a first relay terminal that contacts the front surface contact electrode, and a second relay terminal that contacts the back surface contact electrode,
When the end of the electronic substrate is inserted into the electronic substrate insertion groove, a sliding portion that slides toward the electronic substrate by contacting the case is provided in the housing.
The slide part comes into contact with the case to slide toward the surface of the electronic board, and the second slide comes into contact with the case to slide toward the back surface of the electronic board. And
The electronic device is characterized in that the electronic substrate is sandwiched between the first relay terminal and the second relay terminal, and the first slide part and the second slide part. The first relay terminal is fixed to a portion of the housing in an upward direction from the back surface to the front surface of the electronic substrate, away from the formation position of the electronic substrate insertion groove, and a part thereof is in the electronic substrate insertion groove. Provided,
The second relay terminal is fixed to a portion of the housing in a downward direction from the front surface to the back surface of the electronic substrate, away from the formation position of the electronic substrate insertion groove, and a part thereof is in the electronic substrate insertion groove. Provided,
A first slit for passing a portion provided in the electronic board insertion groove in the first relay terminal is formed at an end of the first slide part on the electronic board side,
A second slit for passing a portion provided in the electronic substrate insertion groove in the second relay terminal is formed at an end of the second slide portion on the electronic substrate side,
The part provided in the electronic board insertion groove in the first relay terminal is in contact with the wall surface constituting the first slit, and the part provided in the electronic board insertion groove in the second relay terminal. The electronic device according to claim 1, wherein the electronic device is in contact with a wall surface forming the second slit. The portion provided in the electronic substrate insertion groove in the first relay terminal is in a state before the end of the electronic substrate is inserted into the electronic substrate insertion groove, from the surface of the electronic substrate in the upward direction. Away,
The portion provided in the electronic substrate insertion groove in the second relay terminal is in a state before the end portion of the electronic substrate is inserted into the electronic substrate insertion groove from the back surface of the electronic substrate. Away
When the end of the electronic substrate is inserted into the electronic substrate insertion groove, the first relay terminal that is in contact with the first slide portion by the slide of the first slide portion and the second slide portion is the electron The second relay terminal approaching the surface of the substrate and contacting the surface contact electrode and contacting the second slide portion approaches the back surface of the electronic substrate and contacts the back surface contact electrode. The electronic device according to claim 2. The electronic board insertion groove is opened on a surface of the housing facing the bottom surface of the case,
Each of the first relay terminal and the second relay terminal is embedded in the housing, and the end portion is connected to the embedded portion exposed from the opposing surface of the housing, and the end portion exposed from the opposing surface of the housing in the embedded portion A connecting portion extending from a connecting portion with the embedded portion to the opening corner of the electronic substrate insertion groove along the facing surface, and an end of the connecting portion on the opening corner portion side, and the electronic substrate A fulcrum forming portion extending in the insertion direction of the electronic substrate in the insertion groove, and a contact portion connected to an end portion on the back side of the electronic substrate insertion groove in the fulcrum formation portion, and protruding into the electronic substrate insertion groove; Consists of
Formation of a fulcrum of the first relay terminal in contact with the first slide portion by sliding of the first slide portion and the second slide portion when the end portion of the electronic substrate is inserted into the electronic substrate insertion groove As the portion approaches the surface of the electronic substrate, the contact portion of the first relay terminal approaches the surface of the electronic substrate, contacts the surface contact electrode, and contacts the second slide portion. 4. The contact portion of the second relay terminal approaches the back surface of the electronic substrate and comes into contact with the back contact electrode when the fulcrum forming portion of the terminal approaches the back surface of the electronic substrate. The electronic device described. The first relay terminal side of the inner wall surface constituting the electronic board insertion groove along the upper direction so as to straddle a part of the portion fixed to the housing in the first relay terminal. A first through hole penetrating from an upper inner wall surface to an upper outer wall surface on the first relay terminal side of the outer wall surface of the housing, and a part of a portion fixed to the housing in the second relay terminal. Further, along the downward direction, the inner wall surface constituting the electronic substrate insertion groove penetrates from the lower inner wall surface on the second relay terminal side to the lower outer wall surface on the second relay terminal side on the outer wall surface of the housing. A second through hole is formed,
The first slide part is provided in the first through hole, the second slide part is provided in the second through hole,
The first slide portion is fixed to the housing at the first slide portion and the first relay terminal by sliding the first slide portion while passing the portion fixed to the housing at the first relay terminal. A first through hole is formed to prevent contact with the formed part;
The second slide portion is fixed to the housing at the second slide portion and the second relay terminal by sliding the second slide portion while passing the portion fixed to the housing at the second relay terminal. 5. The electronic device according to claim 2, wherein a second through hole is formed to prevent contact with the formed portion. When the end portion of the electronic substrate is inserted into the electronic substrate insertion groove, the end portion on the upper outer wall surface side of the first slide portion is exposed from the first through hole, and the second slide portion An end on the lower outer wall surface side is exposed from the second through hole,
The upper lengths of the end portion on the upper outer wall surface side of the first slide portion and the end portion on the lower outer wall surface side of the second slide portion are directed toward the insertion direction of the electronic substrate. 6. The electronic device according to claim 5, wherein a taper that gradually increases is formed. A housing in which an electronic substrate insertion groove for inserting an end portion of the electronic substrate is formed, and a card edge connector having a relay terminal in contact with a contact electrode formed on the end portion of the electronic substrate;
A box shape having an opening, and a case for storing the electronic substrate,
The contact electrode at the end of the electronic board inserted in the electronic board insertion groove and the relay terminal are in contact with each other, and the part of the housing including the electronic board insertion groove is accommodated in the case. A device,
The contact electrode has a surface contact electrode formed on the surface of the electronic substrate, and a back contact electrode formed on the back surface of the electronic substrate,
The relay terminal has a first relay terminal that contacts the front surface contact electrode, and a second relay terminal that contacts the back surface contact electrode,
When the end of the electronic substrate is inserted into the electronic substrate insertion groove, a displacement portion that is displaced toward the electronic substrate is provided in the case,
The displacement portion is in contact with the inner wall surface constituting the electronic substrate insertion groove, thereby being displaced toward the surface of the electronic substrate, and in contact with the inner wall surface, A second displacement portion that is displaced toward the back surface,
The electronic device is characterized in that the electronic board is sandwiched between the first relay terminal and the second relay terminal, and the first displacement part and the second displacement part. The first relay terminal is fixed to a portion of the housing in an upward direction from the back surface to the front surface of the electronic substrate, away from the formation position of the electronic substrate insertion groove, and a part thereof is in the electronic substrate insertion groove. Provided,
The second relay terminal is fixed to a portion of the housing in a downward direction from the front surface to the back surface of the electronic substrate, away from the formation position of the electronic substrate insertion groove, and a part thereof is in the electronic substrate insertion groove. Provided,
A portion of the first relay terminal provided in the electronic board insertion groove is sandwiched between the first displacement portion and an inner wall surface of the electronic board insertion groove, and the electronic board insertion in the second relay terminal. The electronic device according to claim 7, wherein a portion provided in the groove is sandwiched between the second displacement portion and an inner wall surface of the electronic substrate insertion groove. The first displacement portion includes a first extending portion extending from an upper side wall located above the surface of the electronic substrate in the case toward the surface of the electronic substrate, and the electrons in the first extending portion. A first insertion portion that extends from an end portion on the surface side of the substrate toward the insertion direction of the electronic substrate and is inserted into the electronic substrate insertion groove;
The second displacement portion includes a second extending portion extending from a lower side wall located below the back surface of the electronic substrate in the case toward the back surface of the electronic substrate, and the electrons in the second extending portion. A second insertion portion extending from an end portion on the back side of the substrate toward the insertion direction of the electronic substrate and inserted into the electronic substrate insertion groove;
2. The taper according to claim 1, wherein each of the first insertion portion and the second insertion portion is formed with a taper that gradually decreases in thickness along the upward direction in the insertion direction of the electronic substrate. 9. The electronic device according to 8. The electronic board insertion groove is opened on a surface of the housing facing the bottom surface of the case,
Each of the first relay terminal and the second relay terminal is embedded in the housing, and the end portion is connected to the embedded portion exposed from the opposing surface of the housing, and the end portion exposed from the opposing surface of the housing in the embedded portion A connecting portion extending from a connecting portion with the embedded portion to the opening corner of the electronic substrate insertion groove along the facing surface, and an end of the connecting portion on the opening corner portion side, and the electronic substrate A fulcrum forming portion extending in the insertion direction of the electronic substrate in the insertion groove, and a contact portion connected to an end portion on the back side of the electronic substrate insertion groove in the fulcrum formation portion, and protruding into the electronic substrate insertion groove; Consists of
By inserting the end portion of the electronic substrate into the electronic substrate insertion groove, the fulcrum forming portion of the first relay terminal is sandwiched between the first insertion portion and the inner wall surface of the electronic substrate insertion groove, and the second The electronic device according to claim 9, wherein a fulcrum forming portion of the relay terminal is sandwiched between the second insertion portion and an inner wall surface of the electronic substrate insertion groove.   The housing is inserted with an end portion of the upper side wall located above the surface of the electronic substrate in the case and an end portion of the lower side wall located below the back surface of the electronic substrate in the case. The electronic device according to claim 1, wherein a fixing portion that fixes the housing and the case is formed.

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