JP2012064817A - Package for mounting electronic component and module for communication - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for mounting an electronic component and a module for communication in which high frequency characteristics are improved.SOLUTION: A package 10 for mounting an electronic component comprises: a substrate 1; a dielectric 2; a signal lead 3; a mounting substrate 4; a ground lead 7; and a lid 8. The substrate 1 consists of a metal disc-like member and has a through hole 1a penetrating in the thickness direction. The substrate 1 also consists of two portions, i.e. a thin layer portion 1c and a thick layer portion 1d, having different thicknesses with reference to the mounting surface 1b which is one main surface on which an electronic component 6 is mounted.

Description

  The present invention relates to an electronic component mounting package for mounting and storing electronic components such as optical semiconductor elements used in the field of optical communication and the like, and a communication module using the same.

  The demand for high-speed communication in long-distance transmission is increasing rapidly, and research and development on high-speed and large-capacity information transmission is underway. In long-distance transmission, it is important to suppress loss due to transmission, and optical communication using optical signals has attracted attention from the viewpoint of transmission loss and transmission speed. In optical communication, an optical communication device that receives and transmits optical signals is used. The speeding up of optical communication is realized by speeding up a semiconductor device or the like used in the optical communication device. Transmission capacity can be improved by increasing the output and speed of optical signals.

  The optical output of an electronic device typified by a conventional semiconductor device is about 0.2 to 0.5 mW, and the driving power of a semiconductor element used as an electronic component is about 5 mW. However, in a higher output semiconductor device, the optical output is increased to about 1 mW, and the driving power of the semiconductor element is required to be 10 mW or more. Further, the transmission capacity of the conventional semiconductor device was about 2.5 to 10 Gbps (Giga bit per second), but in recent years, the transmission capacity has been improved to about 25 to 40 Gbps. It is necessary to make it.

LDs (Laser Diodes), PDs (PDs) used in conventional optical communication devices
For example, Patent Document 1 and Patent Document 2 describe an electronic component mounting package on which an electronic component including an optical semiconductor element such as Photo Diode is mounted and an electronic device using the same.

  In either case, an electronic component is mounted on the mounting surface of the stem, and a signal lead penetrating the stem is inserted into the substrate to connect the electronic component and the substrate wiring.

JP 2001-144366 A JP 2005-228766 A

  When using an electronic component mounting package having a stem, the portion of the signal lead that is inserted into the substrate is surrounded by a dielectric, but the signal lead is exposed from the stem to the substrate. An inductance component is generated and high frequency characteristics are deteriorated. In order to reduce an unnecessary inductance component, if the exposed portion of the signal lead is shortened, that is, if the insertion depth into the substrate is deepened, the distance between the stem and the substrate is shortened. When the ground conductor layer is provided on the surface of the substrate on the package side, the distance between the stem and the ground conductor layer is shortened, thereby causing resonance and lowering the high frequency characteristics.

  An object of the present invention is to provide an electronic component mounting package and a communication module with improved high frequency characteristics.

The electronic component mounting package of the present embodiment is a base body made of a metal plate-like member and provided with a through-hole penetrating in the thickness direction. The electronic component is mounted on one main surface, and the one main surface is used as a reference. A substrate having a thin layer part whose thickness is thinner than other parts;
A signal line conductor inserted in the center of the through hole and extending in a direction perpendicular to the main surface of the base body;
A dielectric provided between the signal line conductor and the inner peripheral surface of the through hole;
A connection conductor provided on one main surface side of the base, and connecting the electronic component and the signal line conductor;
An electronic component mounting package comprising: a ground conductor provided on the other main surface side of the base body and extending in parallel with the signal line conductor.

The communication module of the present embodiment is a communication module having the electronic component mounting package, the electronic component mounted on the electronic component mounting package, and a circuit board.
The circuit board is
A dielectric layer;
A grounding conductor layer provided on one surface of the dielectric layer;
A penetrating conductor that penetrates from one surface of the dielectric layer to the other surface and is provided with an insertion hole for inserting the signal line conductor of the electronic component mounting package;
A signal wiring layer provided on the other surface of the dielectric layer and connected to the through conductor;
In a state where the signal line conductor is inserted into the insertion hole of the through conductor and the electronic component mounting package is mounted on the circuit board, the ground conductor layer includes the thin layer portion of the base and the dielectric Provided in the region facing the body layer,
The electronic component mounting package is mounted on the circuit board so that an interval between the ground conductor layer and the thin layer portion of the base is 1/8 or more of a wavelength of a high-frequency signal transmitted through the signal line conductor. This is a communication module characterized by the above.

  Further, in the communication module according to the present embodiment, the electronic component mounting package is arranged so that the distance between the dielectric and the through conductor is 1/16 or less of the wavelength of the high-frequency signal transmitted through the signal line conductor. It is mounted on the circuit board.

Further, in the communication module of the present embodiment, the electronic component mounting package has one or more line conductors and one or more ground conductors,
The signal line conductor and the ground conductor are provided so as to be positioned in a straight line in a direction parallel to the main surface of the base body,
The circuit board is provided with the ground conductor layer extending in a direction perpendicular to the arrangement direction of the signal line conductor and the ground conductor, and a distance between a width direction end of the ground conductor layer and the center of the ground conductor. Is not more than ¼ of the wavelength of the high-frequency signal transmitted through the signal line conductor.

  According to the electronic component mounting package of the present embodiment, in the electronic component mounting package including a so-called stem, the base that is the stem has a thickness with respect to one main surface on which the electronic component is mounted as compared to other portions. It has a thin thin layer.

  Since the base has the thin layer portion, when the electronic component mounting package is mounted on the circuit board, the distance between the circuit board and the base is widened between the thin layer portion, and the ground conductor layer and the base of the circuit board are widened. The interval between and becomes wider. By widening the interval in this way, unnecessary resonance can be suppressed, and the high frequency characteristics of the electronic component mounting package are improved.

  According to the communication module of the present embodiment, an electronic component mounting package having a so-called stem has a thin layer portion, and an interval between the ground conductor layer and the thin layer portion of the base is the signal line conductor. The electronic component mounting package is mounted on the circuit board so as to be 1/8 or more of the wavelength of the high-frequency signal to be transmitted.

  By expanding this interval to 1/8 or more of the wavelength of the high frequency signal, unnecessary resonance can be suppressed, and the high frequency characteristics of the communication module are improved.

  Further, according to the communication module of the present embodiment, the electronic component mounting device is configured such that the distance between the dielectric and the through conductor is 1/16 or less of the wavelength of the high-frequency signal transmitted through the signal line conductor. A package is mounted on the circuit board.

  This interval corresponds to the length of the portion where the signal line conductor is exposed. By setting this interval to 1/16 or less of the wavelength of the high frequency signal, an unnecessary inductance component can be reduced, and the high frequency characteristics of the communication module are improved.

  Further, according to the communication module of the present embodiment, the ground conductor layer is provided so as to extend in a direction orthogonal to the arrangement direction of the signal line conductor and the ground conductor, and the width direction end of the ground conductor layer And the center of the ground conductor is ¼ or less of the wavelength of the high-frequency signal transmitted through the signal line conductor.

  By defining the dimension in the width direction of the ground conductor layer as described above, the occurrence of resonance in the width direction can be suppressed.

1 is a perspective view showing an appearance of an electronic component mounting package 10 according to an embodiment of the present invention. It is sectional drawing when cut | disconnecting by cut surface line AA of FIG. It is sectional drawing which shows the structure of the module for communication 100 which is embodiment of this invention. It is sectional drawing which shows the structure of the package 12 for electronic components which is other embodiment of this invention. FIG. 3 is a plan view of the communication module 100 as viewed from the back side of the circuit board 20. FIG. 6 is a perspective view showing another aspect of the substrate 1 in the electronic component mounting package 10. It is a figure which shows the structure of the package 30 for a box-shaped electronic component mounting which is further another embodiment of this invention. 6 is a perspective view showing another aspect of the base body 1 in the electronic component mounting package 30. FIG.

  FIG. 1 is a perspective view showing an external appearance of an electronic component mounting package 10 according to an embodiment of the present invention. 2 is a cross-sectional view taken along the cutting plane line AA of FIG.

  The electronic component mounting package 10 includes a base 1, a dielectric 2, a signal lead 3, a mounting substrate 4, a ground lead 7 and a lid 8.

  The substrate 1 is made of a metal disk-like member, and is provided with a through hole 1a penetrating in the thickness direction. The substrate 1 includes a thin layer portion 1c and a thick layer portion 1d, which are two portions having different thicknesses with respect to the mounting surface 1b that is one main surface on which the electronic component 6 is mounted.

  The substrate 1 has a function of dissipating heat generated by the mounted electronic component 6. For this reason, the base body 1 is made of a metal having good thermal conductivity, and as a material close to the thermal expansion coefficient of the electronic component 6 to be mounted or the mounting substrate 4 made of ceramic or a low-cost material, for example, Fe-Ni-Co An alloy such as an alloy or an Fe-Mn alloy or a metal such as pure iron is selected. More specifically, there is an SPC (Steel Plate Cold) material of Fe 99.6 mass% -Mn 0.4 mass%. When the substrate 1 is made of an Fe—Mn alloy, the ingot (lumps) is manufactured in a predetermined shape by applying a known metal processing method such as rolling or punching, and the through-hole 1a is formed by drilling or a die. It is formed by punching. Further, the mounting surface 1b of the base body 1 can be formed by cutting or pressing.

  The shape of the substrate 1 is a plate shape in which the thickness of the thick layer portion 1d is 0.5 to 2 mm and the thickness of the thin layer portion 1c is about 0.1 to 1 mm, and the shape is not particularly limited. Is a disc shape having a diameter of 3 to 10 mm, a semi-disc shape having a radius of 1.5 to 8 mm, and a square plate shape having a side of 3 to 15 mm. One electronic component 6 is mounted on the base body 1 having the through hole 1a. However, depending on the number of electronic components 6 or the number of electronic components 6 and the number of terminals of the electronic components 6, the signal leads Three or more through holes 1 a for fixing 3 may be formed.

  The thickness of the thick layer portion 1d of the substrate 1 is preferably 0.5 mm or more and 2 mm or less. When the thickness is less than 0.5 mm, when the metal lid 8 for protecting the electronic component 6 is bonded to the upper surface of the metal substrate 1, the substrate 1 may be bent depending on the bonding conditions such as the bonding temperature. Therefore, it becomes easy to deform | transform, and it becomes easy to reduce airtightness by deformation | transformation. On the other hand, if the thickness exceeds 2 mm, the thickness of the electronic component mounting package or the electronic device becomes unnecessarily thick, and it is difficult to reduce the size.

  An Ni layer having a thickness of 0.5 to 9 μm on the surface of the substrate 1 having excellent corrosion resistance and excellent wettability with a brazing material for joining and fixing the electronic component 6, the mounting substrate 4 or the lid 8. And an Au layer having a thickness of 0.5 to 5 μm are preferably sequentially deposited by a plating method. Thereby, it is possible to effectively prevent the base body 1 from being oxidatively corroded and to satisfactorily braze the electronic component 6, the mounting substrate 4, or the lid body 8 to the base body 1.

  The dielectric 2 is provided between the signal lead 3 and the inner peripheral surface of the through hole 1a. The signal lead 3 is inserted through the central portion of the through hole 1 a and extends in a direction orthogonal to the main surface of the base 1. The peripheral portion of the base 1 around the through hole 1a functions as an outer conductor, and the dielectric 2 and the signal lead 3 constitute a coaxial line.

  The mounting substrate 4 is provided so that its main surface is orthogonal to the mounting surface 1 b, and has a connection conductor 4 a for connecting the electronic component 6 and the signal lead 3 on one main surface. The electronic component 6 is mounted on one main surface of the mounting substrate 4 and electrically connects the signal pad of the electronic component 6 and the connection conductor 4a by a bonding wire 6a.

  The signal lead 3 protrudes about 0.5 to 3 mm toward the mounting surface 1 b of the base 1, and the protruding portion and the connection conductor 4 a are connected by a conductive material such as a brazing material 5. In the present embodiment, two signal leads 3 are provided, both of which are provided on the thick layer portion 1 d of the substrate 1. The signal lead 3 is provided so as to extend with a length of about 1 to 20 mm in a direction orthogonal to a surface (hereinafter referred to as a thick layer back surface) 1e opposite to one main surface of the thick layer portion 1d. In the present embodiment, the two signal leads 3 have the same length, and the protruding lengths protruding from the mounting surface 1b and the thick layer back surface 1e of the substrate 1 are also the same.

  The ground lead 7 is provided in the thick layer portion 1d of the base 1 like the signal lead 3. However, the ground lead 7 does not need to penetrate the base 1, and is fixed to the thick back surface 1e or about several mm from the thick back surface 1e. Inserted and fixed.

  The signal lead 3 and the ground lead 7 are arranged in a straight line in a direction parallel to the thick layer back surface 1 e, and are provided so that one ground lead 7 is located at an intermediate position between the two signal leads 3. It is done.

  The lid 8 has a housing space for housing the mounting substrate 4, the electronic component 6, and the like, and is bonded and fixed to the mounting surface 1 b. The lid 8 may be provided with a window that transmits light at a portion facing the electronic component 6, or an optical fiber and an optical isolator for preventing return light joined in place of or in addition to the window. But you can.

  The lid 8 is made of a metal such as an Fe—Ni—Co alloy, an Fe—Ni alloy, or an Fe—Mn alloy, and is produced by subjecting these plate materials to a known metal working method such as press working or punching. . The lid 8 preferably has the same thermal expansion coefficient as the material of the base 1, and more preferably the same as the material of the base 1. When the lid 8 has a window, a plate-like or lens-like glass window member is joined to a member provided with a hole in the portion facing the electronic component 6 with a low melting point glass or the like.

  The lid 8 is joined to the base body 1 by welding such as seam welding or YAG laser welding or by brazing with a brazing material such as an Au-Sn brazing material.

  The dielectric 2 is made of a dielectric inorganic material such as glass or ceramics, and has a function of securing an insulation interval between the signal lead 3 and the base 1 and fixing the signal lead 3 in the through hole 1 a of the base 1. . Examples of such dielectric 2 include glass such as borosilicate glass and soda glass and those added with a ceramic filler for adjusting the thermal expansion coefficient and relative dielectric constant of these glass dielectrics 2, The relative dielectric constant is appropriately selected for impedance matching. Examples of the filler that lowers the dielectric constant include lithium oxide.

  For example, when the relative permittivity of the dielectric 2 is 6.8 and the outer diameter of the signal lead 3 is 0.25 mm, the characteristic impedance of the signal lead 3 can be increased by setting the diameter of the through hole 1a to 0.75 mm. It can be 25Ω. Further, when the relative permittivity of the dielectric 2 is 5 and the outer diameter of the signal lead 3 is 0.25 mm, the characteristic impedance can be 25Ω by setting the diameter of the through hole 1 a to 0.64 mm. The characteristic impedance can be 50Ω by setting the diameter of the through hole 1a to 1.62 mm.

  The signal lead 3 is made of a metal such as an Fe—Ni—Co alloy or an Fe—Ni alloy. For example, when the signal lead 3 is made of an Fe—Ni—Co alloy, the ingot (lumb) is rolled or punched, By applying a known metal processing method such as cutting, a length of 1.5 to 22 mm and a diameter of 0.1 to 1 mm are produced. In order to reduce the size of the signal lead 3 while ensuring the strength of the signal lead 3 while performing matching with a higher characteristic impedance, the diameter of the signal lead 3 is preferably 0.15 to 0.3 mm. When the diameter of the signal lead 3 is smaller than 0.15 mm, the signal lead 3 is easily bent by handling when mounting the electronic component mounting package, and the workability is easily lowered. On the other hand, if the diameter is larger than 0.3 mm, the diameter of the through hole 1a when impedance matching is increased with the diameter of the signal lead 3, which is not suitable for downsizing of the product.

  In order to insert and fix the signal lead 3 through the dielectric 2 filled in the through hole 1a, for example, the following method is used. When the dielectric 2 is made of glass, first, glass powder is molded using a known powder pressing method or extrusion molding method, the inner diameter is the outer diameter of the signal lead 3, and the outer diameter is the inner diameter of the through hole 1a. A cylindrical molded body is prepared, and the signal lead 3 is inserted into the insertion hole of the molded body of the dielectric 2 to put the molded body into a mold. The glass component is melted by heating to a predetermined temperature, and then cooled and solidified to form the dielectric 2 having a predetermined shape to which the signal lead 3 is fixed. As a result, the through hole 1a is hermetically sealed by the dielectric 2, and the signal lead 3 is insulated and fixed from the base 1 by the dielectric 2 to form a coaxial line. Only the dielectric 2 matching the shape of the through hole 1a is formed in advance, and this is inserted into the through hole 1a, and the signal lead 3 is also inserted into the insertion hole of the dielectric 2, and the dielectric 2 and the through hole 1a are inserted. The inner surface and the outer surface of the signal lead 3 may be joined at the same time.

The mounting substrate 4 is obtained by forming a connection conductor 4a on an insulating substrate made of a ceramic insulating material such as an aluminum oxide (alumina: Al ₂ O ₃ ) sintered body or an aluminum nitride (AlN) sintered body. . If the insulating substrate is made of, for example, an aluminum oxide sintered body, an organic solvent suitable for the raw material powder such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. Then, a solvent is added and mixed to form a slurry, which is formed into a sheet by a known doctor blade method, calendar roll method, or the like to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). Thereafter, the green sheet is punched into a predetermined shape, and a plurality of sheets are laminated as necessary, and the green sheet is fired at a temperature of about 1600 ° C.

  As a method for forming the connection conductor 4a, there are a well-known method of forming metal metallization by simultaneous firing with the insulating substrate, or after the insulating substrate is manufactured, and a method of forming the insulating substrate by vapor deposition or photolithography after the insulating substrate is manufactured. . When the package is small, the mounting substrate 4 mounted on the package is smaller, so that the connection conductor 4a is fine. In order to increase the alignment accuracy between the connection conductor 4a and the signal lead 3, a vapor deposition method or the like is used. A method of forming the connection conductor 4a by a photolithography method is preferable. In this case, the main surface of the insulating substrate may be polished as necessary.

  Hereinafter, the case where the connection conductor 4a is formed by vapor deposition or photolithography will be described in detail. The connection conductor 4a is composed of a conductor layer having a three-layer structure in which, for example, an adhesion metal layer, a diffusion prevention layer, and a main conductor layer are sequentially laminated.

From the viewpoint of improving the adhesion with an insulating substrate made of ceramics or the like, the adhesion metal layer is made of titanium (Ti), chromium (Cr), tantalum (Ta), niobium (Nb), nickel-chromium (Ni- It is preferable to be made of at least one kind of metal having a thermal expansion coefficient close to that of ceramics, such as a Cr) alloy and tantalum nitride (Ta ₂ N), and the thickness is preferably about 0.01 to 0.2 μm. If the thickness of the adhesion metal layer is less than 0.01 μm, it tends to be difficult to firmly adhere the adhesion metal layer to the insulating substrate. If the thickness exceeds 0.2 μm, the adhesion metal layer is caused by internal stress during film formation. There is a tendency to easily peel from the insulating substrate.

  From the viewpoint of preventing mutual diffusion between the adhesion metal layer and the main conductor layer, the diffusion preventing layer is platinum (Pt), palladium (Pd), rhodium (Rh), nickel (Ni), Ni—Cr alloy, Ti— It is preferably made of at least one metal having good thermal conductivity such as W alloy, and its thickness is preferably about 0.05 to 1 μm. If the thickness of the diffusion preventive layer is less than 0.05 μm, defects such as pinholes tend to be generated, making it difficult to function as a diffusion preventive layer. If the thickness exceeds 1 μm, the diffusion preventive layer is caused by internal stress during film formation. Tends to be easily peeled off from the adhesive metal layer. When a Ni—Cr alloy is used for the diffusion preventing layer, the adhesion metal layer can be omitted because the Ni—Cr alloy has good adhesion to the insulating substrate.

  The main conductor layer is preferably made of at least one of gold (Au), Cu, Ni and silver (Ag) having a low electric resistance, and the thickness is preferably about 0.1 to 5 μm. If the thickness of the main conductor layer is less than 0.1 μm, the electric resistance becomes large, and the electric resistance required for the connection conductor 4a of the mounting substrate 4 tends to be not satisfied. Therefore, the main conductor layer tends to be easily separated from the diffusion preventing layer. Further, since Cu is easily oxidized, a protective layer made of Ni and Au may be coated thereon.

  When the connection conductor 4a has a microstrip structure, when the alumina having a relative dielectric constant of 9.5 is used as the insulating layer of the mounting substrate 4, the thickness is 0.2 mm, and the width is 0.64 mm, the characteristic impedance is 25Ω. Become.

  The mounting board 4 thus manufactured is joined to the mounting surface 1 b of the base 1, and the signal lead 3 and the connection conductor 4 a are connected by the brazing material 5.

  An electronic device 11 in which the electronic component 6 is mounted on the electronic component mounting package 10 is obtained by mounting the electronic component 6 on the mounting substrate 4 and joining the lid 8 to the base 1.

  Electronic components 6 to be mounted include optical semiconductor elements such as LD (laser diode) and PD (photodiode), semiconductor elements including semiconductor integrated circuit elements, piezoelectric elements such as crystal resonators and surface acoustic wave elements, pressure A sensor element, a capacitive element, a resistor, etc. are mentioned.

  The electronic component 6 may be mounted on the mounting substrate 4 or the mounting substrate 4 may be mounted on the electronic component mounting package 10 by being fixed with a conductive bonding material such as a brazing material or a conductive resin. For example, when the electronic component 6 is mounted on the mounting substrate 4 after mounting the mounting substrate 4 on the base body 1, a gold-tin (Au—Sn) alloy or gold-germanium (Au—) is used to fix the mounting substrate 4. A brazing material of Ge) alloy is used as a bonding material, and for fixing the electronic component 6, a tin-silver (Sn-Ag) alloy or a tin-silver-copper (Sn-Ag-Cu) alloy having a melting point lower than these is used. A brazing material or a resin adhesive such as Ag epoxy that can be cured at a temperature lower than the melting point may be used as the bonding material. Further, after mounting the electronic component 6 on the mounting substrate 4, the mounting substrate 4 may be mounted on the base 1, and in this case, contrary to the above, bonding used when mounting the mounting substrate 4 on the base 1 is performed. The melting point of the material may be lowered. In any case, a paste of a bonding material is printed on the mounting substrate 4 or the mounting surface 1b of the base body 1 using a known screen printing method, a bonding material layer is formed by a photolithography method, For example, a preform of a low melting point brazing material may be placed.

FIG. 3 is a cross-sectional view showing a configuration of the communication module 100 according to the embodiment of the present invention.
The communication module 100 is obtained by mounting the electronic device 11 on the circuit board 20. The circuit board 20 is realized by, for example, a flexible printed circuit board (FPC) and has a dielectric layer 21, a ground conductor layer 22, a through conductor 23, and a signal wiring layer 24. The dielectric layer 21 is made of a plate-like dielectric material. As the dielectric material, an organic resin material, a ceramic material, a mixed material of resin and ceramics, or the like can be used. As the organic resin material, for example, an epoxy resin and a polyimide resin can be used. As the ceramic material, a metal oxide such as alumina, a nitride such as silicon nitride, a carbide such as silicon carbide, and a glass material can be used.

  The through conductor 23 penetrates from one surface of the dielectric layer 21 to the other surface, and is provided with an insertion hole 23 a for inserting the signal lead 3 of the electronic component mounting package 10. The through conductor 23 is provided on one surface of the dielectric layer 21, an annular surface conductor 23 b, an insertion conductor 23 c inserted in the dielectric layer 21 and having an insertion hole 23 a in the center, and a dielectric It consists of an annular back conductor 23d provided on the other surface of the layer 21. The insertion hole 23a has a hole diameter substantially the same as the diameter of the signal lead 3, and the signal lead 3 is inserted from one side to the other side during mounting. The signal lead 3 is inserted through the insertion hole 23a by a predetermined length. At this time, the tip is inserted so as to protrude from the back conductor 23d, the protruding tip and the back conductor 23d are connected by a conductive connecting material such as solder, and the signal lead 3 is connected to the through conductor 23. Fixed.

  The ground conductor layer 22 is provided at least in a region where the thin layer portion 1c of the substrate 1 and the dielectric layer 21 face each other in a state where the electronic device 11 is mounted in this manner. Although not shown, the ground lead 7 of the electronic component mounting package 10 penetrates the circuit board 20 in the thickness direction and is fixed similarly to the signal lead 3. And it is electrically connected to the ground conductor layer 22 in a fixed state.

  The signal wiring layer 24 is provided on the other surface of the dielectric layer 21 and is electrically connected to the through conductor 23 by being connected to the back conductor 23d. Therefore, at the time of mounting, the signal wiring layer 24 and the signal lead 3 are electrically connected via the through conductor 23, and a high-frequency signal can be transmitted between the signal wiring layer 24 and the signal lead 3.

  As described above, with the electronic device 11 mounted on the circuit board 20, the gap G1 between the ground conductor layer 22 and the thin layer portion 1c of the base 1, specifically, the surface of the ground conductor layer 22, and the thin layer The distance from the thin layer back surface 1 f which is the surface of the portion 1 c is 1/8 or more of the wavelength of the high frequency signal transmitted through the signal lead 3.

  The distance G1 between the ground conductor layer 22 and the thin layer portion 1c of the base body 1 is less than 1/8 of the wavelength of the high-frequency signal, that is, if the ground conductor layer 22 and the thin layer portion 1c of the base body 1 are too close to each other, resonance occurs. Occurs, and the high-frequency characteristics of the transmitted high-frequency signal deteriorate. The occurrence of unnecessary resonance can be suppressed by sufficiently widening the gap G1 between the ground conductor layer 22 and the thin layer portion 1c of the base 1 as described above.

  Further, the distance G2 between the dielectric 2 and the through conductor 23, specifically, the distance between the bottom surface of the cylindrical dielectric 2 and the surface conductor 23b of the through conductor 23 is the wavelength of the high frequency signal transmitted through the signal lead 3. 1/16 or less.

  This interval G2 corresponds to the length of the portion where the signal lead 3 is exposed. The longer the exposed portion of the signal lead 3, the larger the unnecessary inductance component. Therefore, the unnecessary inductance component can be reduced by sufficiently narrowing the gap G2 as described above.

  Further, when the electronic component mounting package 10 is viewed from the lid 8 side, the thick layer portion 1d of the base 1 and the ground conductor layer 22 overlap each other, and resonance also occurs due to this overlapping portion. In order to suppress the occurrence of unnecessary resonance due to the overlapping portion, the longest length of the overlapping portion may be set to 1/8 or less of the wavelength of the high-frequency signal transmitted through the signal lead 3.

  In the present embodiment, the step between the thin layer portion 1c and the thick layer portion 1d is provided in a straight line parallel to the direction in which the signal lead 3 and the ground lead 7 are arranged. At this time, in the overlapping portion, the length G3 in the direction orthogonal to the linear step is set to 1/8 or less of the wavelength of the high-frequency signal transmitted through the signal lead 3.

  FIG. 4 is a cross-sectional view showing a configuration of an electronic component mounting package 12 according to another embodiment of the present invention. Note that this embodiment is different from the above-described embodiment only in that the gap defining portion 9 provided on the ground lead 7 is different from the above-described embodiment, and therefore the same configuration as the electronic component mounting package 10 according to the above-described embodiment. Are denoted by the same reference numerals and description thereof is omitted.

  As described above, the high frequency characteristics can be improved by setting the gap G1 and the gap G2 to desired distances. However, these gaps are determined when the signal leads 3 and the ground leads 7 are mounted on the circuit board 20 during mounting. It depends on the insertion depth. In the mounting process, each lead is inserted by manual operation using a jig or a mounting device, but the accuracy of the insertion depth cannot be obtained sufficiently by manual operation, and the mounting device detects the insertion depth of each lead. A detection mechanism is required.

  In the present embodiment, an interval defining portion 9 is provided on the ground lead 7. The space defining portion 9 is formed by a protruding portion that protrudes outward from the ground lead 7. When the space defining portion 9 is provided on the ground lead 7, when the protruding portion of the space defining portion 9 contacts the surface of the circuit board 20 when the ground lead 7 of the electronic component mounting package 12 is inserted, The electronic component mounting package 12 cannot be inserted any further. If the position of the gap defining portion 9 on the ground lead 7 is set so that the gap G1 and the gap G2 are in the appropriate ranges as described above in a state where the gap cannot be inserted, until the gap G1 and the gap G2 are not inserted. The interval G1 and the interval G2 can be achieved with high accuracy by a simple operation of insertion.

FIG. 5 is a plan view of the communication module 100 as seen from the back side of the circuit board 20.
As shown in FIG. 5, two signal leads 3 and one ground lead 7 are provided in a straight line in a direction parallel to the main surface of the substrate 1, that is, a direction parallel to the paper surface. One ground lead 7 is provided in the middle of the signal lead 3.

  Here, the ground conductor layer 22 is not widely formed on one surface of the dielectric layer 21, but at least in the vicinity of the electronic device 11 in a direction orthogonal to the arrangement direction of the signal leads 3 and the ground leads 7. It has a rectangular portion that extends. The distance D1 between the widthwise end of the rectangular portion and the center of the ground lead 7 is set to ¼ or less of the wavelength of the high-frequency signal transmitted through the signal lead 3. That is, the width dimension of the rectangular portion is set to 2 × D1.

  By setting such a width dimension in the rectangular portion of the ground conductor layer 22, the occurrence of resonance in the width direction can be suppressed.

  Further, the distance D2 between the end of the rectangular portion in the extending direction and the center of the ground lead 7 is also set to 1/4 or less of the wavelength of the high-frequency signal transmitted through the signal lead 3. The Thereby, the occurrence of resonance in the extending direction can be suppressed in the rectangular portion of the ground conductor layer 22.

  In the above embodiment, the base 1 is configured such that the step between the thin layer portion 1c and the thick layer portion 1d is provided in a straight line parallel to the direction in which the signal lead 3 and the ground lead 7 are arranged. . However, since the thin layer portion 1c is provided in order to sufficiently widen the gap G1 with the ground conductor layer 22 as already described, the thin layer portion 1c is not limited to the configuration in which the step is linear in the base body 1.

  FIG. 6 is a perspective view showing another aspect of the substrate 1 in the electronic component mounting package 10. As shown in FIG. 6A, as another aspect, the thin layer portion 1c and the thick layer portion 1d are provided in a concentric disk shape, and the thin layer portion 1c is positioned outside the thick layer portion 1d. It is configured as follows. The thick layer portion 1d is provided in a region including at least the position where the signal lead 3, the ground lead 7, and the dielectric 2 are arranged.

  As shown in FIG. 6B, as yet another aspect, the thick layer portion 1d is configured by a rectangular parallelepiped and semicircular plates connected to both ends in the longitudinal direction of the rectangular parallelepiped. The rectangular parallelepiped that forms the thick layer portion 1 d has a long side that is the same as the interval between the two signal leads 3 and a short side that is slightly longer than the diameter of the dielectric 2. The semicircular disk has the same diameter as the short side of the rectangular parallelepiped, and is provided so that the diameter and the short side coincide.

  Since unnecessary resonance occurs between the thick layer portion 1d and the ground conductor layer 22, it is preferable to configure the base 1 so that the thin layer portion 1c is as large as possible, as shown in FIG.

  Furthermore, in the above description, a so-called stem-type electronic component mounting package has been described. However, the present invention is not limited to this, and a so-called box-type electronic component mounting package may be used.

  FIG. 7 is a diagram showing a configuration of a box-type electronic component mounting package 30 according to still another embodiment of the present invention. Fig.7 (a) is a perspective view, FIG.7 (b) is sectional drawing when cut | disconnecting by the cutting surface line AA of Fig.7 (a), FIG.7 (c) is a top view.

  The difference between the stem type and the box type is that there is one signal lead 3 and two grounding leads 7 are provided in a straight line across the signal lead 3, and the shape of the substrate 1 is not a disc shape. Since it has a rectangular plate shape, the same reference numerals are assigned to the same components as those of the electronic component mounting package 10 according to the above embodiment, and the description thereof is omitted.

  In general, the stem type is advantageous for downsizing, and the box type is excellent in heat dissipation. Further, when the signal lead 3 is disposed so as to be sandwiched between the two ground leads 7 as in the electronic component mounting package 30 of the present embodiment, the ground potential with respect to the signal lead 3 is stabilized. Can transmit a signal having a higher frequency.

  The electronic component mounting package 30 of this embodiment stores the semiconductor element 6 in the internal space of a box-shaped housing 31 having one surface open. The box-shaped housing 31 includes a bottom plate 31a on the opposite side of the open surface, and a side wall 31b that stands upright from the four sides of the bottom plate 31a with respect to the bottom plate 31a. One of the side walls 31b is the base body 1. The base 1 is provided with a through hole 1a, and the signal lead 3 can be inserted into the center of the through hole 1a. The dielectric 2 is provided between the signal lead 3 and the inner peripheral surface of the through hole 1a.

  The base body 1, which is one of the side walls, has a thin layer portion 1 c and a thick layer portion 1 d, and the ground lead 7 is provided on the thick layer portion 1 d of the base body 1 like the signal lead 3. The signal lead 3 is electrically connected to the connecting conductor 4 a and the brazing material 5.

  Similar to the electronic component mounting packages 10 and 12, the thin layer portion 1 c is provided. Therefore, when the electronic component mounting package 30 is mounted on the circuit board 20, the ground conductor layer 22 provided on the surface of the dielectric layer 21. Is provided in order to sufficiently widen the interval. As a result, generation of unnecessary resonance can be suppressed as in the above embodiment.

  FIG. 8 is a perspective view showing another aspect of the base body 1 in the electronic component mounting package 30. As shown in FIG. 8 (a), as another aspect, a rectangular plate-like thin layer portion 1c is provided so as to overlap a disk-like thick layer portion 1d, and the thin layer portion 1c is a thick layer. It is comprised so that it may be located outside the part 1d. The thick layer portion 1d is provided in a region including at least the position where the signal lead 3, the ground lead 7, and the dielectric 2 are arranged. As shown in FIG. 8 (b), as yet another aspect, the thin layer portion 1c is formed in a rectangular plate shape, and the thick layer portion 1d is connected to the rectangular parallelepiped and the longitudinal ends of the rectangular parallelepiped. Consists of

  Since unnecessary resonance occurs between the thick layer portion 1d and the ground conductor layer 22, it is preferable to configure the base 1 so that the thin layer portion 1c is as large as possible, as shown in FIG.

  Similarly to the stem-type electronic component mounting package 10, the box-type electronic component mounting package 30 is mounted on the circuit board 20 as an electronic device on which the electronic component 6 is mounted, and constitutes a communication module. One signal lead 3 and two ground leads 7 are provided in a straight line, and are inserted through an insertion hole of the circuit board 20 and mounted. The ground conductor layer 22 provided on the circuit board 20 is arranged in the direction in which the signal leads 3 and the ground leads 7 are arranged in order to suppress unnecessary resonance, as in the case of mounting the stem-type electronic component mounting package 10. The distance D1 between the width direction end and the center of the ground lead 7 is set to ¼ or less of the wavelength of the high-frequency signal transmitted through the signal lead 3. Further, the distance D2 between the end of the rectangular portion in the extending direction and the center of the ground lead 7 on the side where the electronic device is mounted is also ¼ of the wavelength of the high-frequency signal transmitted through the signal lead 3. Set to:

  Alternatively, the electronic module mounting package 30 may be mounted on an FPC, and the FPC may be connected to a circuit board to constitute a communication module. In the case of the box-type electronic component mounting package 30, it is mounted on the end portion of the FPC, the FPC is bent at approximately 90 degrees, and the end portion on the side where the electronic component mounting package 30 is not mounted is connected to the circuit board. . As a result, the bottom plate 31a of the electronic component mounting package 30 is parallel to the circuit board 20, and the bottom plate 31a can be joined to a housing or the like to improve the cooling efficiency by heat transfer from the bottom plate 31a.

  In the above, regarding the signal leads 3 and the ground leads 7, the number of signal leads 3 and the number of ground leads 7 are not limited to one or two, and may be three or more. Further, it is preferable that two ground leads are provided with one signal lead 3 interposed therebetween. For example, it is necessary to provide at least two signal leads 3 in order to apply to transmission of differential signals. When the size is determined in advance, it is preferable to provide two signal leads 3 with one ground lead 7 interposed therebetween as in the electronic component mounting package 10, but more preferably, three ground leads. Two signal leads 3 are provided between the two signal leads 3, and the signal leads 3 are sandwiched between the two ground leads 7.

DESCRIPTION OF SYMBOLS 1 Base | substrate 1a Through-hole 1c Thin layer part 1d Thick layer part 2 Dielectric body 3 Signal lead 4 Mounting board 4a Connection conductor 6 Electronic component 7 Grounding lead 8 Lid 9 Spacing part 10, 12 Electronic component mounting package 11 Electronic device 12 Electronic component mounting package 20 Circuit board 21 Dielectric layer 22 Ground conductor layer 23 Through conductor 23a Insertion hole 24 Signal wiring layer 100 Communication module

Claims (4)

A substrate made of a metal plate-like member and provided with a through-hole penetrating in the thickness direction. An electronic component is mounted on one main surface, and the thickness with respect to the one main surface is thinner than other portions. A substrate having a thin layer portion;
A signal line conductor inserted in the center of the through hole and extending in a direction perpendicular to the main surface of the base body;
A dielectric provided between the signal line conductor and the inner peripheral surface of the through hole;
A connection conductor provided on one main surface side of the base, and connecting the electronic component and the signal line conductor;
An electronic component mounting package comprising: a ground conductor provided on the other main surface side of the base body and extending in parallel with the signal line conductor. A communication module comprising: the electronic component mounting package according to claim 1; an electronic component mounted on the electronic component mounting package; and a circuit board.
The circuit board is
A dielectric layer;
A grounding conductor layer provided on one surface of the dielectric layer;
A penetrating conductor that penetrates from one surface of the dielectric layer to the other surface and is provided with an insertion hole for inserting the signal line conductor of the electronic component mounting package;
A signal wiring layer provided on the other surface of the dielectric layer and connected to the through conductor;
In a state where the signal line conductor is inserted into the insertion hole of the through conductor and the electronic component mounting package is mounted on the circuit board, the ground conductor layer includes the thin layer portion of the base and the dielectric Provided in the region facing the body layer,
The electronic component mounting package is mounted on the circuit board so that an interval between the ground conductor layer and the thin layer portion of the base is 1/8 or more of a wavelength of a high-frequency signal transmitted through the signal line conductor. A communication module characterized by that.   The electronic component mounting package is mounted on the circuit board so that a distance between the dielectric and the through conductor is 1/16 or less of a wavelength of a high-frequency signal transmitted through the signal line conductor. The communication module according to claim 2. The electronic component mounting package has one or more line conductors and one or more ground conductors,
The signal line conductor and the ground conductor are provided so as to be positioned in a straight line in a direction parallel to the main surface of the base body,
The circuit board is provided with the ground conductor layer extending in a direction perpendicular to the arrangement direction of the signal line conductor and the ground conductor, and a distance between a width direction end of the ground conductor layer and the center of the ground conductor. 4. The communication module according to claim 2, wherein is not more than ¼ of a wavelength of a high-frequency signal transmitted through the signal line conductor. 5.

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