JP2012057991A - 感圧センサー - Google Patents
感圧センサー Download PDFInfo
- Publication number
- JP2012057991A JP2012057991A JP2010199423A JP2010199423A JP2012057991A JP 2012057991 A JP2012057991 A JP 2012057991A JP 2010199423 A JP2010199423 A JP 2010199423A JP 2010199423 A JP2010199423 A JP 2010199423A JP 2012057991 A JP2012057991 A JP 2012057991A
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- sheet
- electrode
- pressure
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 claims abstract description 44
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052709 silver Inorganic materials 0.000 claims abstract description 34
- 239000004332 silver Substances 0.000 claims abstract description 34
- 230000003746 surface roughness Effects 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 33
- 238000005259 measurement Methods 0.000 abstract description 23
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract 2
- 239000002923 metal particle Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000009499 grossing Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000010946 fine silver Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Force Measurement Appropriate To Specific Purposes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010199423A JP2012057991A (ja) | 2010-09-06 | 2010-09-06 | 感圧センサー |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010199423A JP2012057991A (ja) | 2010-09-06 | 2010-09-06 | 感圧センサー |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012057991A true JP2012057991A (ja) | 2012-03-22 |
| JP2012057991A5 JP2012057991A5 (enrdf_load_stackoverflow) | 2013-10-17 |
Family
ID=46055285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010199423A Pending JP2012057991A (ja) | 2010-09-06 | 2010-09-06 | 感圧センサー |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012057991A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016114272A1 (ja) * | 2015-01-13 | 2016-07-21 | ニッタ株式会社 | 感圧センサの製造方法 |
| JP2016130736A (ja) * | 2015-01-13 | 2016-07-21 | ニッタ株式会社 | 感圧センサの製造方法 |
| JP2017072472A (ja) * | 2015-10-07 | 2017-04-13 | ニッタ株式会社 | 感圧センサ |
| JP2019052935A (ja) * | 2017-09-14 | 2019-04-04 | ユニバーサル製缶株式会社 | 圧力測定センサ、圧力測定方法 |
| CN116222837A (zh) * | 2023-03-09 | 2023-06-06 | 张家港江苏科技大学产业技术研究院 | 一种用于指状夹持器的触觉传感模块及指状夹持器 |
| JP7532828B2 (ja) | 2020-03-19 | 2024-08-14 | Ｔｏｐｐａｎホールディングス株式会社 | 触覚センサ及びその製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07198513A (ja) * | 1993-12-28 | 1995-08-01 | Honda Motor Co Ltd | 分布型力覚検出センサ |
| JP2002131155A (ja) * | 2000-10-30 | 2002-05-09 | Denso Corp | 感圧抵抗センサ |
| JP2003344185A (ja) * | 2002-05-30 | 2003-12-03 | Fujikura Ltd | 感圧センサ |
| JP2005274549A (ja) * | 2003-05-21 | 2005-10-06 | Nitta Ind Corp | 感圧センサー |
| JP2006111903A (ja) * | 2004-10-13 | 2006-04-27 | Shoei Chem Ind Co | 高結晶性フレーク状銀粉末とその製造方法 |
-
2010
- 2010-09-06 JP JP2010199423A patent/JP2012057991A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07198513A (ja) * | 1993-12-28 | 1995-08-01 | Honda Motor Co Ltd | 分布型力覚検出センサ |
| JP2002131155A (ja) * | 2000-10-30 | 2002-05-09 | Denso Corp | 感圧抵抗センサ |
| JP2003344185A (ja) * | 2002-05-30 | 2003-12-03 | Fujikura Ltd | 感圧センサ |
| JP2005274549A (ja) * | 2003-05-21 | 2005-10-06 | Nitta Ind Corp | 感圧センサー |
| JP2006111903A (ja) * | 2004-10-13 | 2006-04-27 | Shoei Chem Ind Co | 高結晶性フレーク状銀粉末とその製造方法 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016114272A1 (ja) * | 2015-01-13 | 2016-07-21 | ニッタ株式会社 | 感圧センサの製造方法 |
| JP2016130736A (ja) * | 2015-01-13 | 2016-07-21 | ニッタ株式会社 | 感圧センサの製造方法 |
| JP2017072472A (ja) * | 2015-10-07 | 2017-04-13 | ニッタ株式会社 | 感圧センサ |
| JP2019052935A (ja) * | 2017-09-14 | 2019-04-04 | ユニバーサル製缶株式会社 | 圧力測定センサ、圧力測定方法 |
| JP7532828B2 (ja) | 2020-03-19 | 2024-08-14 | Ｔｏｐｐａｎホールディングス株式会社 | 触覚センサ及びその製造方法 |
| CN116222837A (zh) * | 2023-03-09 | 2023-06-06 | 张家港江苏科技大学产业技术研究院 | 一种用于指状夹持器的触觉传感模块及指状夹持器 |
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