JP2012054350A - 電子部品の実装装置及び実装方法 - Google Patents

電子部品の実装装置及び実装方法 Download PDF

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Publication number
JP2012054350A
JP2012054350A JP2010194696A JP2010194696A JP2012054350A JP 2012054350 A JP2012054350 A JP 2012054350A JP 2010194696 A JP2010194696 A JP 2010194696A JP 2010194696 A JP2010194696 A JP 2010194696A JP 2012054350 A JP2012054350 A JP 2012054350A
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Prior art keywords
electronic component
tool
tcp
conductive member
anisotropic conductive
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JP2010194696A
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Japanese (ja)
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JP2012054350A5 (enrdf_load_stackoverflow
Inventor
Mitsuhiro Okazawa
光弘 岡澤
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2010194696A priority Critical patent/JP2012054350A/ja
Publication of JP2012054350A publication Critical patent/JP2012054350A/ja
Publication of JP2012054350A5 publication Critical patent/JP2012054350A5/ja
Pending legal-status Critical Current

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JP2010194696A 2010-08-31 2010-08-31 電子部品の実装装置及び実装方法 Pending JP2012054350A (ja)

Priority Applications (1)

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JP2010194696A JP2012054350A (ja) 2010-08-31 2010-08-31 電子部品の実装装置及び実装方法

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JP2010194696A JP2012054350A (ja) 2010-08-31 2010-08-31 電子部品の実装装置及び実装方法

Publications (2)

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JP2012054350A true JP2012054350A (ja) 2012-03-15
JP2012054350A5 JP2012054350A5 (enrdf_load_stackoverflow) 2013-10-10

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JP2010194696A Pending JP2012054350A (ja) 2010-08-31 2010-08-31 電子部品の実装装置及び実装方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014003192A (ja) * 2012-06-20 2014-01-09 Fujikura Ltd 半導体チップボンダの冷却装置
CN112351671A (zh) * 2019-08-08 2021-02-09 松下知识产权经营株式会社 部件安装装置以及部件安装方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004096046A (ja) * 2002-09-04 2004-03-25 Seiko Epson Corp Ｉｃチップの実装方法、ｉｃチップの実装構造、熱圧着装置、電気光学装置の製造方法、電気光学装置、および電子機器
JP2008091804A (ja) * 2006-10-05 2008-04-17 Matsushita Electric Ind Co Ltd 電子部品圧着方法及び装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004096046A (ja) * 2002-09-04 2004-03-25 Seiko Epson Corp Ｉｃチップの実装方法、ｉｃチップの実装構造、熱圧着装置、電気光学装置の製造方法、電気光学装置、および電子機器
JP2008091804A (ja) * 2006-10-05 2008-04-17 Matsushita Electric Ind Co Ltd 電子部品圧着方法及び装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014003192A (ja) * 2012-06-20 2014-01-09 Fujikura Ltd 半導体チップボンダの冷却装置
CN112351671A (zh) * 2019-08-08 2021-02-09 松下知识产权经营株式会社 部件安装装置以及部件安装方法

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