JP2012054337A - Method of manufacturing electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device that can easily arrange a lid member at a predetermined position of an element-mounted member and has high productivity.SOLUTION: An electronic device manufacturing method comprises: a plating metal layer forming step of forming an annular plating metal layer along an edge portion of a portion serving as an element-mounted member 110 of an element-mounted member wafer WT1; a sealing frame portion forming step of providing the plating metal layer with a plating layer; an element mounting step of mounting electronic component elements on the portion serving as the element-mounted member 110; a lid member arranging step of arranging a lid member 130 at the position where the inner-edge side surface of the sealing frame portion 111 and the outer-edge side surface of the lid member 130 face each other while mounting the electronic component elements in a recess space 131 of the lid member 130; a joint step of irradiating the sealing frame portion 111 with a laser beam to join one principal surface of the element-mounted member 110 to the outer-edge side surface of the lid member 130; and a singulating step of cutting and singulating the element-mount member wafer WT1 every portion serving as the element-mounted member 110.

Description

  The present invention relates to a method for manufacturing an electronic device in which an element mounting member on which an electronic component element is mounted and a lid member are joined and the element mounting member is hermetically sealed.

Electronic devices are generally used in electronic equipment. In particular, piezoelectric devices, which are examples of electronic devices, are often used in electronic devices such as mobile communication devices.
The electronic device includes at least an electronic component element, an element mounting member on which the electronic component element is mounted, a lid member, and a sealing material that joins the element mounting member and the lid member. At this time, the electronic component element mounted on the element mounting member is hermetically sealed by joining the element mounting member and the lid member with the sealing material.

Here, the element mounting member has a recessed space formed on one main surface, for example.
The element mounting member is provided with a mounting pad for mounting the electronic component element on the bottom surface of the concave portion, and the electronic component element is accommodated in the concave space of the electronic component element.
Further, the element mounting member is provided with an external connection terminal on the other main surface, and is electrically connected to the mounting pad.
The element mounting member is provided with an annular sealing frame portion along the edge portion of one main surface.

The sealing material is formed, for example, by providing a plating layer on a plating metal layer.
Further, the sealing material is formed between one main surface of the element mounting member and one main surface of the lid member described later, and along the edge of the one main surface of the element mounting member. .
Further, the sealing material is formed by melting and hardening a sealing frame portion provided on the element mounting member.

The lid member is made of, for example, metal and is provided in a rectangular flat plate shape.
The lid member is irradiated with laser light on the other principal surface of the lid member, for example, with the sealing frame portion sandwiched between one principal surface of the element mounting member and one principal surface of the lid member, The lid member is heated to melt the sealing frame portion, and the melted sealing frame portion is cured to form a sealing material. One main surface of the lid member is one main surface of the element mounting member. It is joined to the surface by a sealing material.

Therefore, in the conventional electronic device, the component element is mounted on the element mounting member, and the mounted component element is accommodated in a space formed by the element mounting member and the lid member. As a result, the component elements are hermetically sealed.
Further, in the conventional electronic device, the sealing frame formed on one main surface of the element mounting member is sandwiched between one main surface of the element mounting member and one main surface of the lid member. The sealing member is melted by irradiating the other main surface of the lid member with laser light and heating the lid member, and the melted sealing frame is cured to form a sealing material. Thus, one main surface of the element mounting member and one main surface of the lid member are joined (for example, see Patent Document 1).

An example of such an electronic device is a piezoelectric device.
A piezoelectric vibrator, which is an example of a piezoelectric device, includes, for example, a piezoelectric vibration element that is an electronic component element, an element mounting member on which the piezoelectric vibration element that is an electronic component element is mounted, a lid member, an element mounting member, and a lid member And a sealing material for joining the two. At this time, the piezoelectric vibration element is in an airtight sealed state in which the element mounting member and the lid member are joined by the sealing material.

The electronic device manufacturing method as described above includes, for example, an element mounting process, a lid member arranging process, a temporary bonding process, and a bonding process.
Here, for example, when the electronic device is a piezoelectric vibrator, a method for manufacturing the electronic device will be described.

(Element mounting process)
The element mounting step is a step of mounting a piezoelectric vibration element, which is an electronic component element, on the element mounting member.

  A piezoelectric vibration element, which is an electronic component element, includes a piezoelectric piece, an excitation electrode, and a routing pattern.

  The piezoelectric piece is made of a piezoelectric material, and is formed in, for example, a rectangular flat plate shape.

  For example, two excitation electrodes are paired. One excitation electrode is provided on one main surface of the piezoelectric piece. The other excitation electrode is provided on the other main surface of the piezoelectric piece and at a position facing one excitation electrode.

  In the routing pattern, one end is connected to the excitation electrode, and the other end is located at an edge of a predetermined side of the main surface of the piezoelectric piece. Further, for example, two routing patterns are provided as a pair. One routing pattern has one end connected to one excitation electrode and the other end positioned at an edge of a predetermined side of the other main surface of the piezoelectric piece. In the other routing pattern, one end is connected to the other excitation electrode, and the other end is located at an edge of a predetermined side of one main surface of the piezoelectric piece.

For example, the element mounting member has a concave space formed on one main surface, and a mounting pad is provided on the bottom surface of the concave space. The element mounting member has an external connection terminal on the other main surface.
The element mounting member has an annular sealing frame portion formed along an edge portion of one main surface.

For example, two mounting pads are provided in pairs, and two mounting pads are provided side by side along a predetermined side of one main surface of the element mounting member.
The mounting pad is provided at a position facing the above-described lead pattern of the piezoelectric vibration element, and is electrically connected to the lead pattern by, for example, a conductive adhesive.

For example, four external connection terminals are provided, one at each of the four corners of the other main surface of the element mounting member.
Further, the two predetermined external connection terminals are electrically connected via the mounting pads described above and the internal wiring of the element mounting member. Therefore, the external connection terminal is electrically connected to the excitation electrode via the internal wiring of the element mounting member, the mounting pad, the conductive adhesive, and the routing pattern.

The sealing frame portion is formed, for example, by providing a plating metal layer on one main surface of the element mounting member, and providing a plating layer on the plating metal layer by plating.
Further, the sealing frame portion is provided in one facing the one main surface of the lid member in the lid member arranging step described later.

In the element mounting process, for example, the lead pattern of the piezoelectric vibration element and the mounting pad of the element mounting member are electrically connected by a conductive adhesive, and the piezoelectric vibration element that is an electronic component element is mounted on the element mounting member.
Therefore, in the element mounting step, the piezoelectric vibration element that is an electronic component element is mounted on the bottom surface of the recessed space of the element mounting member, and the piezoelectric vibrating element is accommodated in the recessed space of the element mounting member.

(Cover member placement process)
The lid member arranging step is a step of arranging the lid member at a predetermined position of the element mounting member so as to cover the piezoelectric vibration element mounted on the element mounting member with the element mounting member and the lid member.

  The lid member is made of, for example, metal and is formed in a rectangular flat plate shape.

  In the lid member arranging step, while providing a sealing frame portion between the main surface of the lid member and one main surface of the element mounting member, one main surface of the lid member and one main surface of the element mounting member The lid member is disposed at a position where the sealing frame portion is sandwiched. At this time, the piezoelectric vibration element mounted on the element mounting member is stored in a space covered with the element mounting member and the lid member.

(Temporary joining process)
A temporary joining process is a process of carrying out spot welding by partially spot-welding a lid member and an element mounting member using electric welding.

(Joining process)
In the bonding process, the other main surface of the lid member is irradiated with laser light, the lid member is heated, and the sealing frame is melted and cured by the heat, whereby the one main surface of the element mounting member and the lid This is a step of joining one main surface of the member.

Here, the melted and cured sealing frame portion is used as a sealing material.
Therefore, in the joining step, the sealing frame portion is melted, and one main surface of the element mounting member and one main surface of the lid member are joined by the sealing material.

  Therefore, in the electronic device manufacturing method, the electronic component element is formed by the element mounting member and the lid member while sandwiching the sealing frame portion between the one main surface of the element mounting member and the one main surface of the lid member. In the state accommodated in the space, the sealing frame is melted by a laser, and the sealing frame is melted to form a sealing material, and one main surface of the element mounting member and the lid member One main surface is joined and the electronic component element is hermetically sealed (see, for example, Patent Document 2).

JP-A-8-46075 JP-A-6-152296

However, according to the conventional method for manufacturing an electronic device, the electronic component element is housed in the space formed by the element mounting member and the lid member, and one main surface of the element mounting member and one main surface of the lid member are accommodated. With the sealing frame portion sandwiched between the surfaces, the laser frame is irradiated to melt the sealing frame portion, and one main surface of the element mounting member and one main surface of the lid member are joined, In a state before the sealing frame portion is melted, the space in which the electronic component is stored and the sealing frame portion are in contact with each other.
For this reason, according to the conventional method for manufacturing an electronic device, when the sealing frame is melted as if it is bumped by laser light, the sealing frame is melted into the space in which the electronic component element is accommodated. A part of the part may scatter and adhere to the electronic component element, which may deteriorate the electrical characteristics of the conventional electronic device. In particular, when the conventional electronic device is a piezoelectric device, the melted sealing frame portion adheres to the piezoelectric vibration element, so that the piezoelectric vibration element is less likely to vibrate, and the frequency of the piezoelectric device may become unstable. .
Therefore, according to the conventional method for manufacturing an electronic device, the melted sealing frame portion adheres to the electronic component element and the electrical characteristics are deteriorated, so that the productivity may be deteriorated.

Further, according to the conventional method for manufacturing an electronic device, the electronic component element is housed in the space formed by the element mounting member and the lid member, and one main surface of the element mounting member and one main surface of the lid member are accommodated. The sealing frame portion is formed by irradiating the main surface of the lid member opposite to the main surface of the lid member facing the electronic component element with the surface sandwiched between the sealing frame portion and heating the lid member. Is melted, the melted sealing frame portion is cured, and one main surface of the element mounting member and one main surface of the lid member are joined together, so that the sealing frame portion is melted. At this time, the lid member is heated by the laser beam, and the element mounting member is heated by the sealing frame portion melted.
For this reason, according to the conventional method of manufacturing an electronic device, since the lid member is directly heated by the laser beam, due to the difference in expansion amount between the lid member and the element mounting member when the laser beam is irradiated, When the melted sealing frame portion is cured, distortion is generated inside the element mounting member and the lid member.
Therefore, according to the conventional method for manufacturing an electronic device, a crack is generated in the element mounting member or the lid member due to the strain generated in the element mounting member and the lid member in the joining process, and the electronic component element is hermetically sealed. This can prevent productivity from deteriorating.

  In addition, according to the conventional method for manufacturing an electronic device, the sealing frame is sandwiched between one main surface of the element mounting member and one main surface of the lid member, and the device mounting member is placed at a predetermined position. After the lid member is arranged and temporarily attached, the sealing frame is melted and one main surface of the element mounting member and one main surface of the lid member are joined, so that the predetermined element mounting member It is necessary to place a lid member at the position and perform temporary attachment, and it takes time and labor to perform temporary attachment, which may deteriorate productivity.

Further, according to the conventional method of manufacturing an electronic device, the lid member is arranged so that the sealing frame portion is sandwiched between one main surface of the element mounting member and one main surface of the lid member, Since the sealing frame is melted and one main surface of the element mounting member and one main surface of the lid member are joined, when the electronic device is downsized, the sealing frame is interposed between There is a possibility that the lid member cannot be arranged on the element mounting member so as to be sandwiched while being provided.
For this reason, according to the conventional manufacturing method of an electronic device, when an electronic device is reduced in size, an electronic component element cannot be airtightly sealed, and productivity may be deteriorated.

  Therefore, in the present invention, the melted sealing frame portion does not adhere to the electronic component element, and the distortion generated at the time of bonding can be alleviated, and the lid member is easily disposed at a predetermined position of the element mounting member. An object of the present invention is to provide a method for manufacturing an electronic device with good productivity.

In order to solve the above-described problem, the element mounting member wafer is provided with a portion serving as an element mounting member in which a mounting pad is provided on one main surface and an external connection terminal is provided on the other main surface. A plating metal layer forming step in which an annular plating metal layer is formed along an edge of one main surface of a portion to be an element mounting member, and the plating of the portion to be the element mounting member by a plating method A sealing frame portion forming step in which a plating layer is provided on the metal layer and a sealing frame portion is formed; and an element mounting step in which an electronic component element is mounted on the mounting pad of the portion serving as the element mounting member; A position where the electronic component element is accommodated in the recessed space of the lid member having a recessed space on the main surface thereof, and a side surface on the inner edge side of the sealing frame portion and a side surface on the outer edge side of the lid member And the lid member at a position where A lid member arranging step to be placed, and a sealing frame portion of a portion to be the element mounting member is irradiated with laser light to melt the sealing frame portion, and one main surface of the element mounting member and the lid A joining step in which the side surface on the outer edge side of the member is joined, and an individualization step in which the element mounting member wafer to which the lid member is joined is cut into individual pieces to be cut into pieces.
It is characterized by having.

According to such an electronic device manufacturing method, the sealing frame portion is provided in an annular shape along the edge portion of one main surface of the element mounting member, and a lid is provided on the inner edge side of the sealing frame portion. With the member disposed, the sealing frame is irradiated with laser light to melt the sealing frame, and the one main surface of the element mounting member and the side surface on the outer edge side of the lid member are joined. Therefore, before the sealing frame portion is melted, the space in which the electronic component elements are stored and the sealing frame portion are not in contact with each other.
For this reason, according to such a method for manufacturing an electronic device, when the sealing frame is melted as if it was bumped by laser light, the sealing for melting into the space in which the electronic component element is accommodated Part of the frame portion can be prevented from scattering.
Therefore, according to such an electronic device manufacturing method, the molten sealing frame portion can be prevented from adhering to the electronic component element, and the molten sealing frame portion adheres to the electronic component element. It is possible to prevent the electrical characteristics of the electronic device from deteriorating. In particular, when the electronic device is a piezoelectric device, a part of the melted sealing frame portion does not adhere to the piezoelectric vibration element, and the frequency of the piezoelectric device can be prevented from becoming unstable.

Further, according to such a method for manufacturing an electronic device, the sealing frame portion is provided in an annular shape along the edge portion of one main surface of the element mounting member, and the inner edge side of the sealing frame portion In the state where the lid member is disposed, the sealing frame portion is irradiated with the laser beam to melt the sealing frame portion, and the one main surface of the element mounting member and the side surface on the outer edge side of the lid member are joined. Therefore, when the sealing frame is melted, the lid member and the element mounting member are not directly irradiated with laser light, and the lid member and the element mounting member are heated by the melted sealing frame. It becomes a state.
For this reason, according to the manufacturing method of such an electronic device, since the sealing frame portion is melted without directly irradiating the lid member or the element mounting member with the laser beam, the sealing frame portion is melted. When the difference in expansion between the lid member and the element mounting member is smaller than that of the conventional electronic device manufacturing method, as a result, the lid member and the element mounting when the molten sealing frame is cured The distortion generated inside the member can be reduced as compared with the conventional method for manufacturing an electronic device.
Therefore, according to such an electronic device manufacturing method, cracks due to distortion generated inside the element mounting member and the lid member can be reduced as compared with the conventional electronic device manufacturing method. Can be hermetically sealed and productivity can be improved.

  In addition, according to such an electronic device manufacturing method, the sealing frame portion is melted in a state where the lid member is disposed on the inner edge side of the sealing frame portion formed on the element mounting member, and the element mounting is performed. Since one main surface of the member and the side surface on the outer edge side of the lid member are joined, the lid member can be fixed by the sealing frame portion, so there is no need to perform temporary attachment, and the time required for temporary attachment Productivity can be improved without much time and effort.

In addition, according to such an electronic device manufacturing method, the electronic component element is housed in the recessed space of the element mounting member, and the side surface on the inner edge side of the sealing frame portion and the side surface on the outer edge side of the lid member are The lid member is disposed at the facing position, the sealing frame is melted, and one main surface of the element mounting member and the side surface on the outer edge side of the lid member are joined, so that the recessed space is placed on the element mounting member side. When the lid member is disposed on the inner edge side of the sealing frame portion in the oriented state, the lid member can be easily disposed at a predetermined position of the element mounting member.
Therefore, according to such a method for manufacturing an electronic device, when the electronic device is downsized, the lid member can be disposed at a predetermined position of the element mounting member, and the electronic device mounted on the element mounting member The component elements can be hermetically sealed, and productivity can be improved.

It is sectional drawing which shows an example of the electronic device manufactured using the manufacturing method of the electronic device which concerns on 1st embodiment of this invention. It is a perspective view which shows an example of the state of the element mounting member wafer of the metal formation process for plating of the manufacturing method of the electronic device which concerns on 1st embodiment of this invention. It is a perspective view which shows an example of the state of the element mounting member wafer after the sealing frame part formation process of the manufacturing method of the electronic device which concerns on 1st embodiment of this invention. It is sectional drawing which shows an example of the state of the element mounting process of the manufacturing method of the electronic device which concerns on 1st embodiment of this invention. It is sectional drawing which shows an example of the state of the cover member arrangement | positioning process of the manufacturing method of the electronic device which concerns on 1st embodiment of this invention. It is sectional drawing which shows an example of the state of the joining process of the manufacturing method of the electronic device which concerns on 1st embodiment of this invention. It is a perspective view which shows an example of the state of the individualization process of the manufacturing method of the electronic device which concerns on 1st embodiment of this invention. It is sectional drawing which shows an example of the electronic device manufactured using the manufacturing method of the electronic device which concerns on 2nd embodiment of this invention. It is a perspective view which shows an example of the state of the 2nd metal layer formation process for plating of the manufacturing method of the electronic device which concerns on 2nd embodiment of this invention. It is a perspective view which shows an example of the state of the positioning frame part formation process of the manufacturing method of the electronic device which concerns on 2nd embodiment of this invention. It is sectional drawing which shows an example of the state of the element mounting process of the manufacturing method of the electronic device which concerns on 2nd embodiment of this invention. It is sectional drawing which shows an example of the state of the cover member arrangement | positioning process of the manufacturing method of the electronic device which concerns on 2nd embodiment of this invention. It is sectional drawing which shows an example of the state of the joining process of the manufacturing method of the electronic device which concerns on 2nd embodiment of this invention.

Next, the best mode for carrying out the present invention will be described. In each drawing, the state of each component is exaggerated for easy understanding.
Here, the electronic device is described as a piezoelectric vibrator, for example. At this time, the electronic component element is a piezoelectric vibration element.

(First embodiment)
As shown in FIG. 1, the electronic device manufactured by the method for manufacturing an electronic device according to the first embodiment of the present invention includes an electronic component element 120, an element mounting member 110, and a lid member 130 that are melted and cured. It is mainly composed of the frame portion 111.

  The electronic component element is, for example, the piezoelectric vibration element 120.

  As shown in FIG. 1, the piezoelectric vibration element 120 includes a piezoelectric piece 121, an excitation electrode 122, and a routing pattern 123.

  For example, a piezoelectric material is used for the piezoelectric piece 121 and is formed in a rectangular flat plate shape.

  For example, as shown in FIG. 1, the excitation electrodes 122 form a pair. One excitation electrode 122 is provided on one main surface of the piezoelectric piece 121. The other excitation electrode 122 is provided on the other main surface of the piezoelectric piece 121 at a position facing the one excitation electrode 122.

  For example, the routing pattern 123 is a pair of two. One routing pattern 123 has one end connected to one excitation electrode 122 and the other end positioned at an edge of a predetermined side of the other main surface of the piezoelectric piece 121. The other routing pattern 123 has one end connected to the other excitation electrode 122, and the other end located at an edge of a predetermined side of one main surface of the piezoelectric piece 121.

The element mounting member 110 is made of, for example, alumina ceramics and is provided in a rectangular flat plate shape. Further, as shown in FIG. 1, the element mounting member 110 is provided with a mounting pad P on one main surface and an external connection terminal G on the other main surface.
Further, as shown in FIG. 1, the element mounting member 110 is provided with a sealing frame portion 111 that is melted and hardened in an annular shape along an edge portion of one main surface.

For example, two mounting pads P are provided in pairs, and two mounting pads P are provided along a predetermined side of one main surface of the element mounting member 110.
The mounting pad P is provided at a position facing the routing pattern 123 of the piezoelectric vibration element 120 that is an electronic component element, and is electrically connected to the routing pattern 123 of the piezoelectric vibration element 120 by the conductive adhesive D. ing.

  For example, four external connection terminals G are provided, one at each of the four corners of the other main surface of the element mounting member 110. The two predetermined external connection terminals G are electrically connected to the mounting pad P via the internal wiring (not shown) of the element mounting member 110.

Here, the melted and hardened sealing frame portion 111 means that the sealing frame portion 111 provided in an annular shape along the edge portion of one main surface of the element mounting member 110 is irradiated with laser light. It is melted and cured again.
The melted and hardened sealing frame portion 111 is provided in an annular shape along the edge portion of one main surface of the element mounting member 110.

The lid member 130 is made of, for example, metal and is formed in a rectangular flat plate shape.
Further, as shown in FIG. 1, the lid member 130 includes a concave space 131 on one main surface, and the size of the bottom surface of the concave space 131 is formed larger than the size of the main surface of the piezoelectric vibration element 120. ing.
Further, as shown in FIG. 1, the lid member 130 is formed so that the size of the main surface thereof is smaller than the main surface of the element mounting member 110 inside the sealing frame portion 111 described above.
Further, as shown in FIG. 1, the lid member 130 is provided in the element mounting member 110 with the opening of the recessed space 131 facing the one main surface side of the element mounting member 110 on which the piezoelectric vibration element 120 is mounted. It has been. Accordingly, the piezoelectric vibration element 120 that is an electronic component element is housed in the recessed space 131 of the lid member 130.
The lid member 130 has a sealing frame portion 111 that is melted and hardened on the side surface on the outer edge side. Therefore, the edge portion of one main surface of the element mounting member 110 and the side surface on the outer edge side of the lid member 130 are joined by the sealing frame portion 111 which is melted and hardened. At this time, the piezoelectric vibration element 120 housed in the recessed space 131 is in an airtightly sealed state.

  Therefore, in the piezoelectric vibrator which is an example of the electronic device manufactured by the electronic device manufacturing method according to the first embodiment of the present invention, the piezoelectric vibration element 120 is mounted on the element mounting member 110 as shown in FIG. The piezoelectric vibration element mounted on the element mounting member 110 is formed by joining one main surface of the element mounting member 110 and the side surface on the outer edge side of the lid member by the molten and cured sealing frame portion 111. 120 has a hermetically sealed structure.

Next, an electronic device manufacturing method according to the first embodiment of the present invention will be described.
The electronic device manufacturing method according to the first embodiment of the present invention includes a plating metal layer forming step, a sealing frame forming step, an element mounting step, a lid member arranging step, a joining step, and an individualizing step. ing.

(Metal layer forming process for plating)
As shown in FIG. 2, the plating metal layer forming step includes an element mounting member 110 provided with a mounting pad P on one main surface and an external connection terminal G (see FIG. 4) on the other main surface. This is a step in which the annular plating metal layer 111a is formed along the edge of one main surface of the portion to be the element mounting member 110 of the element mounting member wafer WT1 in which the portion to be provided is in a matrix.

Here, as shown in FIG. 1, the element mounting member wafer WT <b> 1 is provided with a portion serving as an element mounting member in a matrix.
A portion to be the element mounting member 110 has a rectangular flat plate shape, and includes at least a mounting pad P and an external connection terminal G.

The mounting pad P plays a role of mounting the electronic component element 120 (see FIG. 4).
When the electronic component element 120 is the piezoelectric vibration element 120 as described above, the mounting pads P are, for example, a pair of two as shown in FIG. Are provided side by side along one predetermined side.

  For example, four external connection terminals G are provided, and one external connection terminal G is provided at each of the four corners of the other main surface of the portion to be the element mounting member 110. In addition, the two predetermined external connection terminals G are electrically connected to the mounting pad P via an internal wiring (not shown) of a portion that becomes the element mounting member 110.

For the plating metal layer 111a, for example, copper is used.
Here, although the case where copper is used for the metal layer 111a for plating has been described, for example, molybdenum or tungsten may be used.

The plating metal layer 111a is provided with a film made of copper on the entire surface of the element mounting member wafer WT1, for example, and a photolithography technique and an etching technique are used.
Here, a case has been described in which a film made of copper is provided on the entire surface of the element mounting member wafer WT1 and formed using photolithography technology and etching technology. However, for example, it may be formed using screen printing. Good. At this time, molybdenum or tungsten is used for the metal layer 111a for plating.

  Therefore, in the plating metal layer forming step, for example, the plating metal layer 111 a made of copper is formed in an annular shape along the edge of one main surface of the element mounting member 110. At this time, each metal layer for plating 111a is provided at a position where it is not connected to the mounting pad P.

(Sealing frame forming step)
In the sealing frame portion forming step, as shown in FIG. 2, the plating layer 111b is formed on the plating metal layer 111a in the portion to be the element mounting member 110 by plating, thereby forming the sealing frame portion 111. Process.

  In the sealing frame portion forming step, for example, electroplating is used.

Here, the plating layer 111b includes, for example, a copper plating layer (not shown), a nickel plating layer (not shown), and a gold plating layer (not shown).
The copper plating layer is provided on the surface of the plating metal layer 111a facing one main surface of the portion to be the element mounting member 110.
The nickel plating layer is provided on the surface of the copper plating layer facing one main surface of the portion to be the element mounting member 110.
The gold plating layer is provided on the exposed surface of the plating metal layer 111a, the copper plating layer, and the nickel plating layer. The gold plating layer plays a role in preventing the exposed surface from being oxidized.

Therefore, as shown in FIG. 3, the sealing frame portion 111 is formed by providing a plating layer 111b on a plating metal layer 111a, and is composed of the plating metal layer 111a and the plating layer 111b.
Further, as shown in FIG. 3, the sealing frame portion 111 is provided in an annular shape along the edge portion of the portion to be the element mounting member 110 and is formed in a frame shape.
Further, as shown in FIG. 3, the sealing frame portion 111 is formed at a position where it does not contact the mounting pad P.
Further, the sealing frame portion 111 has a thickness of 15 μm or more.

  Here, the thickness of the sealing frame portion 111 refers to one main surface of the portion to be the element mounting member 110 and one main surface of the portion to be the element mounting member 110. The length with the surface.

When the thickness of the sealing frame portion 111 is smaller than 15 μm, when the sealing frame portion 111 is melted by irradiating the sealing frame portion 111 with a laser beam in the joining step described later, There is a possibility that the element mounting member and the lid member cannot be joined by the stop frame portion 111. For this reason, there is a possibility that the piezoelectric vibration element which is an electronic component element cannot be hermetically sealed.
In addition, when the thickness of the sealing frame portion 111 is smaller than 15 μm, it may be difficult to position the lid member in the lid member arranging step described later, and it takes time and effort to position the lid member. There is a risk that productivity will deteriorate.
Therefore, the sealing frame portion 111 has a thickness of 15 μm or more.

(Element mounting process)
As shown in FIG. 4, the element mounting step is a step of mounting the electronic component element 120 on the mounting pad P in a portion that becomes the element mounting member 110.
In the element mounting step, for example, the routing pattern 123 of the piezoelectric vibration element 120 that is an electronic component element is provided at a position where the mounting pad P of the element mounting member 110 is opposed to the wiring pattern 123 by the conductive adhesive D. The mounting pad P is electrically connected.

(Cover member placement process)
As shown in FIG. 5, the lid member arranging step is a position where the electronic component element 120 is accommodated in the concave space 131 of the lid member 130 having the concave space 131 on one main surface, and the sealing member This is a step of arranging the lid member 130 at a position where the side surface on the inner edge side of the frame portion 111 faces the side surface on the outer edge side of the lid member 130.

The lid member 130 is made of metal, for example.
As shown in FIG. 5, the lid member 130 includes a concave space 131 on one main surface, and the size of the bottom surface of the concave space 131 is larger than that of the piezoelectric vibration element 120 that is an electronic component element. Largely formed.
Further, as shown in FIG. 5, the lid member 130 is formed so that its main surface is smaller than one main surface of the portion to be the element mounting member 110 on the inner edge side of the sealing frame portion 111 described above.

In the lid member arranging step, as shown in FIG. 5, the concave space 131 of the lid member 130 is directed to one main surface side of the element mounting member 110 on which the piezoelectric vibration element 120 that is an electronic component element is mounted. Provided.
Further, in the lid member arranging step, as shown in FIG. 5, the side surface on the inner edge side of the sealing frame portion 111 and the side surface on the outer edge side of the lid member 130 face each other.
Therefore, in the lid member arranging step, the lid member 130 can be easily provided at a predetermined position of the portion to be the element mounting member 110 by providing the lid member 130 on the inner edge side of the sealing frame portion 111.

(Joining process)
As shown in FIG. 6, the bonding process is performed by irradiating the sealing frame portion 111 of the portion that becomes the element mounting member 110 with laser light to melt the sealing frame portion 111. This is a step of joining one main surface and the side surface on the outer edge side of the lid member 130.

In the joining process, for example, a laser irradiation apparatus is used.
In this joining step, the laser beam is applied to the sealing frame portion 111 of the element mounting member 110. At this time, the laser beam is inclined at an angle of 90 ° or less with respect to the main surface of the portion to be the element mounting member 110. In addition, the laser beam is sealed to face the closest edge of the other main surface of the lid member 130 disposed in the portion that becomes the adjacent element mounting member 110 and one main surface of the portion that becomes the element mounting member 110. It is inclined at an angle larger than an angle formed by a surface passing through the inner edge side of the surface of the stopping frame portion 111 and one main surface of a portion to be the element mounting member 110.

When the laser beam is inclined at an angle larger than 90 ° with respect to the main surface of the portion to be the element mounting member 110, the laser beam is applied to the portion to be the lid member 130, and the laser beam is applied to the sealing frame portion 111. There is a risk that it will be impossible to irradiate.
Therefore, the laser beam is inclined at an angle of 90 ° or less with respect to the main surface of the portion to be the element mounting member 110.

The laser beam is used for sealing so as to oppose the closest edge of the other main surface of the lid member 130 disposed in the portion to be the adjacent element mounting member 110 and one main surface of the portion to be the element mounting member 110. When the surface of the frame 111 is inclined at an angle smaller than the angle formed between the surface passing through the inner edge side edge and one main surface of the portion serving as the element mounting member 110, the laser beam is adjacent to the element. There is a possibility that the lid member 130 disposed in the portion to be the mounting member 110 is irradiated and the sealing frame portion 111 cannot be irradiated with laser light.
Therefore, the laser beam is sealed to face the edge closest to the other main surface of the lid member 130 arranged in the portion that becomes the adjacent element mounting member 110 and one main surface of the portion that becomes the element mounting member 110. The surface of the stop frame 111 is inclined at an angle larger than the angle formed between the surface passing through the inner edge side edge and one main surface of the portion to be the element mounting member 110.

  That is, the laser beam is inclined at an angle at which the sealing frame portion 111 can be irradiated, and at an angle that does not contact the lid member 130 disposed in a portion that becomes the adjacent element mounting member 110. .

Further, in the bonding step, the sealing frame 111 is melted by irradiating the sealing frame 111 formed on the element mounting member 110 with a laser beam, and one main surface of the element mounting member 110 is melted. And the side surface on the outer edge side of the lid member 130 are joined.
In addition, when performing a joining process, you may carry out in a vacuum atmosphere.

(Individualization process)
As shown in FIG. 7, the singulation process is a process of cutting and dividing each part of the element mounting member wafer to which the lid member is bonded into the element mounting member.
In the singulation process, for example, a dicing saw is used.

The element mounting member 110 that has been separated into pieces for each part that becomes the element mounting member 110 in the singulation process is joined to the lid member 130, and in the space 131 formed by the element mounting member 110 and the lid member 130. In addition, the piezoelectric vibration element 120 which is an electronic component element is hermetically sealed.
Therefore, the piezoelectric vibrator which is an example of an electronic device is formed by dividing into parts for each element to be the element mounting member 110 in the separation process.

According to the method of manufacturing an electronic device according to the first embodiment of the present invention, the sealing frame portion 111 is provided in an annular shape along the edge portion of one main surface of the element mounting member 110. In a state where the lid member 130 is disposed on the inner edge side of the sealing frame portion 111, the sealing frame portion 111 is melted by irradiating the sealing frame portion 111 with laser light, and the element mounting member 110. Since one main surface and the side surface on the outer edge side of the lid member 130 are joined, in a state before the sealing frame portion 111 is melted, the space in which the electronic component element 120 is stored and the sealing frame The part 111 is not in contact.
For this reason, according to the method for manufacturing an electronic device according to the first embodiment of the present invention, when the sealing frame portion 111 is melted as if bumped by the laser beam, the electronic component element 120 is stored. It is possible to prevent a part of the sealing frame portion 111 melted into the space being scattered from scattering.
Therefore, according to the method for manufacturing an electronic device according to the first embodiment of the present invention, the molten sealing frame portion 111 can be prevented from adhering to the electronic component element 120, and the molten It is possible to prevent the electrical characteristics of the electronic device from deteriorating due to the sealing frame portion 111 adhering to the electronic component element 120. In particular, when the electronic device is a piezoelectric device, a part of the melted sealing frame portion does not adhere to the piezoelectric vibration element, and the frequency of the piezoelectric device can be prevented from becoming unstable.

Further, according to the electronic device manufacturing method according to the first embodiment of the present invention, the sealing frame portion 111 is provided in an annular shape along the edge portion of one main surface of the element mounting member 110. In the state where the lid member 130 is arranged on the inner edge side of the sealing frame portion 111, the sealing frame portion 111 is melted by irradiating the sealing frame portion 111 with the laser beam, and the element mounting member Since one main surface of 110 and the side surface on the outer edge side of the lid member 130 are joined, when the sealing frame portion 111 is melted, the lid member 130 and the element mounting member 110 are directly irradiated with laser light. Instead, the lid member 130 and the element mounting member 110 are heated by the melted sealing frame portion 111.
For this reason, according to the method for manufacturing an electronic device according to the first embodiment of the present invention, the sealing frame portion 111 is melted without directly irradiating the lid member 130 or the element mounting member 110 with laser light. Therefore, when the sealing frame portion 111 is melted, the difference in expansion amount between the lid member 130 and the element mounting member 110 becomes smaller than that in the conventional method for manufacturing an electronic device, and as a result, the sealing frame portion 111 is melted. The distortion generated inside the lid member 130 and the element mounting member 110 when the sealing frame portion 111 is cured can be reduced as compared with the conventional method for manufacturing an electronic device.
Therefore, according to the electronic device manufacturing method of the first embodiment of the present invention, compared to the conventional electronic device manufacturing method, the distortion caused in the element mounting member 110 and the lid member 130 is caused. Since cracks can be reduced, the electronic component element 120 can be hermetically sealed and productivity can be improved.

  Further, according to the method for manufacturing an electronic device according to the first embodiment of the present invention, the lid member 130 is disposed on the inner edge side of the sealing frame portion 111 formed on the element mounting member 110. Since the sealing frame portion 111 is melted in this state and one main surface of the element mounting member 110 and the side surface on the outer edge side of the lid member 130 are joined, the lid member 130 is fixed by the sealing frame portion 111. Therefore, it is not necessary to perform tacking, and it is possible to improve productivity without taking time and labor for tacking.

Further, according to the method for manufacturing an electronic device according to the first embodiment of the present invention, the electronic component element 120 is housed in the recessed space 131 of the element mounting member 110 and the sealing frame portion 111 is The lid member 130 is disposed at a position where the side surface on the inner edge side faces the side surface on the outer edge side of the lid member 130, the sealing frame portion 111 is melted, and one main surface of the element mounting member 110 and the lid member 130 Since the side surface on the outer edge side is joined, when the lid member 130 is disposed on the inner edge side of the sealing frame portion 111 with the recessed space 131 facing the element mounting member 110 side, a predetermined position of the element mounting member 110 is obtained. The lid member 130 can be easily disposed on the surface.
Therefore, according to the electronic device manufacturing method according to the first embodiment of the present invention, when the electronic device is downsized, the lid member 130 is disposed at a predetermined position of the element mounting member 110. Thus, the electronic component element 120 mounted on the element mounting member 110 can be hermetically sealed, and productivity can be improved.

(Second embodiment)
An electronic device manufacturing method according to the second embodiment of the present invention will be described.

First, an electronic device manufactured using the electronic device manufacturing method according to the second embodiment of the present invention will be described.
As shown in FIG. 8, the electronic device is different from the first embodiment in that a positioning frame portion 212 is provided on the inner edge side of the melted and cured sealing frame portion 211.

The positioning frame portion 212 includes a second plating metal layer 212a and a second plating layer 212b.
Further, the positioning frame portion 212 is annularly provided on one main surface of the element mounting member 210.
The positioning frame portion 212 is provided on the inner edge side of the sealing frame portion 211 and is provided in a state where it is not in contact with the sealing frame portion 211.
Further, the positioning frame portion 212 is provided at a position that does not contact the mounting pad P, and the mounting pad P is provided on the inner edge side of the positioning frame portion 211.
Further, the positioning frame portion 212 is provided at a position facing the side surface of the lid member 230 facing the recessed space 231 of the lid member 230.

  Accordingly, in the electronic device manufactured by the electronic device manufacturing method according to the second embodiment of the present invention, the electronic component element 220 is mounted on the mounting pad P provided on one main surface of the element mounting member 210. The electronic component element 220 is accommodated in the recessed space 231 of the lid member 230, and the element mounting member 210 and the lid member 230 are joined by the melted sealing frame portion 211, so that the electronic component element 220 is It is hermetically sealed.

Next, an electronic device manufacturing method according to the second embodiment of the present invention will be described.
As shown in FIG. 7, in the method for manufacturing an electronic device according to the second embodiment of the present invention, the second plating metal film 212a is formed on the inner edge side of the plating metal layer 211a. As shown in FIG. 8, the metal film forming step includes a positioning frame portion forming step in which a second plating layer 212b is provided on the second plating metal film 212a to form a positioning frame portion 212. This is different from the first embodiment.

(Second metal layer forming step for plating)
In the second plating metal layer forming step, as shown in FIG. 9, the second plating metal layer 212 a is formed on the inner edge side of the plating metal layer 211 a formed along the edge of the element mounting member 210. It is a process of forming.

The second metal layer for plating 211a is formed in an annular shape on one main surface of a portion to be the element mounting member 210.
Further, the second plating metal layer 211a is formed on the inner edge side of the plating metal layer 211a formed along the edge of one main surface of the portion to be the element mounting member 210, and It is formed at a position not in contact with the plating metal layer 211a.
The second plating metal layer 211a is formed at a position that does not come into contact with the mounting pad P provided on one main surface of the element mounting member 210, and the mounting pad P is the second plating metal layer. It is formed so as to be located on the inner edge side of 211a.

Here, copper is used for the metal layer 212a for 2nd plating, for example.
In addition, although the case where copper is used for the second plating metal layer 212a has been described here, for example, molybdenum or tungsten may be used.

For example, the second plating metal layer 212a is provided with a film made of copper on the entire surface of the element mounting member wafer WT2, and photolithography technique and etching technique are used.
Here, a case has been described in which a film made of copper is provided on the entire surface of the element mounting member wafer WT2 and is formed using a photolithography technique and an etching technique. Good. At this time, molybdenum or tungsten is used for the second plating metal layer 212a.

  Therefore, in the second plating metal layer forming step, for example, the second plating metal layer 212 a made of copper is formed in an annular shape along the edge of one main surface of the element mounting member 210. At this time, each of the second plating metal layers 212a is provided at a position not connected to the mounting pad P and not in contact with the plating metal layer 211a.

  The second plating metal layer forming step may be performed in the same manner as the plating metal layer forming step of forming the plating metal layer 211a.

(Positioning frame forming process)
The positioning frame portion forming step is a step of forming the positioning frame portion 212 by providing the second plating layer 212b on the second plating metal film 212a as shown in FIG.

  In the positioning frame portion forming step, for example, electroplating is used.

Here, the second plating layer 212b includes, for example, a copper plating layer (not shown), a nickel plating layer (not shown), and a gold plating layer (not shown).
The copper plating layer is provided on the surface of the second metal layer for plating 212 a facing the one main surface of the portion to be the element mounting member 210.
The nickel plating layer is provided on the surface of the copper plating layer facing one main surface of the portion to be the element mounting member 210.
The gold plating layer is provided on the exposed surface of the second plating metal layer 212a, the copper plating layer, and the nickel plating layer. The gold plating layer plays a role in preventing the exposed surface from being oxidized.

Therefore, as shown in FIG. 10, the positioning frame portion 212 is formed by providing the second plating layer 212b on the second plating metal layer 212a, and the second plating metal layer 212a and the second plating layer 212a. And a second plating layer 212b.
Further, as shown in FIG. 10, the positioning frame portion 212 is provided in an annular shape along the edge of the portion that becomes the element mounting member 210, and is formed in a frame shape.
Further, as shown in FIG. 10, the positioning frame portion 212 is formed at a position that does not contact the mounting pad P and the sealing frame portion 211.
The positioning frame 212 has a thickness of 15 μm or more.

  Here, the thickness of the positioning frame portion 212 is defined as that of the positioning frame portion 212 facing one main surface of the portion to be the element mounting member 210 and one main surface of the portion to be the element mounting member 210. The length with the surface.

If the thickness of the positioning frame portion 212 is smaller than 15 μm, it may be difficult to position the lid member 230 in the lid member arranging step, and it takes time and labor to position the lid member 230. There is a risk of gender deterioration.
Therefore, the positioning frame 212 has a thickness of 15 μm or more.

  The positioning frame portion forming step may be performed in the same manner as the sealing frame portion forming step in which the plating layer 211b is provided and the sealing frame portion 211 is formed.

(Cover member placement process)
As shown in FIG. 12, the lid member arranging step is a position for housing the electronic component element 220 in the recessed space 231 of the lid member 230 having a recessed space 231 on one main surface, A position where the inner edge side surface of the frame portion 211 and the outer edge side surface of the lid member 230 face each other, and the outer edge side surface of the positioning frame portion 212 and the side surface of the lid member 230 facing the recess space 231; Is a step of disposing the lid member 230 at a position facing each other.

In the lid member arranging step, as shown in FIG. 12, the recessed space 231 of the lid member 230 is directed toward one main surface of the element mounting member 210 on which the piezoelectric vibration element 220 that is an electronic component element is mounted. Provided.
In the lid member arranging step, as shown in FIG. 12, the side surface on the inner edge side of the sealing frame portion 211 and the side surface on the outer edge side of the lid member 230 face each other.
In the lid member arranging step, as shown in FIG. 12, the side surface on the outer edge side of the positioning frame portion 212 and the side surface facing the recessed space 231 of the lid member 230 face each other.
Therefore, in the lid member arranging step, the lid member 230 is easily provided at a predetermined position of the element mounting member 210 by fitting the lid member between the positioning frame portion 212 and the sealing frame portion 211. Can do.

  Such a method of manufacturing an electronic device according to the second embodiment of the present invention uses a laser to seal the sealing frame portion 211 provided in an annular shape along the edge portion of one main surface of the element mounting member 210. Since the one main surface of the element mounting member 210 and the side surface on the outer edge side of the lid member 230 are joined by melting, the same effects as those of the first embodiment are obtained.

  Further, according to the method for manufacturing an electronic device according to the second embodiment of the present invention, the lid member 230 is fitted between the sealing frame portion 211 and the positioning frame portion 212 in the lid member arranging step. Therefore, the lid member 230 can be easily provided at a predetermined position of the element mounting member 210, so that labor and time can be reduced and productivity can be improved.

  Although the case where the electronic device is a piezoelectric vibrator has been described, the sealing frame portion is irradiated with laser light, the sealing frame portion is melted, and the element mounting member and the lid member are joined to each other to form a piezoelectric element that is an electronic component element. If the vibration element is hermetically sealed, for example, a piezoelectric device such as a piezoelectric oscillator may be used.

  Although the case where the electronic component element is a piezoelectric vibration element has been described, the sealing frame portion is irradiated with laser light, the sealing frame portion is melted, the element mounting member and the lid member are joined, and the electronic component element is vented. If the sealing is performed, for example, the electronic component element may be a chip capacitor or a chip resistor.

110, 120 Element mounting members 111, 211 Sealing frame portion 212 Positioning frame portion P Mounting pad G External connection terminals 120, 220 Piezoelectric vibration elements 121, 221 Piezoelectric pieces 122, 222 Excitation electrodes 123, 223 Lead pattern 130, 230 Lid members 131 and 231 Recessed spaces WT1 and WT2 Element mounting member wafer D Conductive adhesive

Claims (1)

A portion to be an element mounting member provided with a mounting pad on one main surface and an external connection terminal on the other main surface is provided in a matrix. A plating metal layer forming step in which an annular plating metal layer is formed along the edge of one main surface;
A sealing frame portion forming step in which a plating layer is provided on the metal layer for plating in the portion to be the element mounting member by plating, and a sealing frame portion is formed;
An element mounting step of mounting an electronic component element on the mounting pad of the portion to be the element mounting member;
A position where the electronic component element is accommodated in the recessed space of the lid member having a recessed space on one main surface, the side surface on the inner edge side of the sealing frame portion and the side surface on the outer edge side of the lid member A lid member arranging step of arranging the lid member at a position facing each other;
The sealing frame portion of the portion to be the element mounting member is irradiated with laser light to melt the sealing frame portion, and one main surface of the element mounting member and the side surface on the outer edge side of the lid member are A joining process to be joined;
An individualization step of cutting and dividing each part to be the element mounting member of the element mounting member wafer to which the lid member is bonded,
An electronic device manufacturing method comprising:

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