JP2012038975A5 - - Google Patents
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- JP2012038975A5 JP2012038975A5 JP2010178935A JP2010178935A JP2012038975A5 JP 2012038975 A5 JP2012038975 A5 JP 2012038975A5 JP 2010178935 A JP2010178935 A JP 2010178935A JP 2010178935 A JP2010178935 A JP 2010178935A JP 2012038975 A5 JP2012038975 A5 JP 2012038975A5
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- circuit member
- heating
- adhesive
- circuit
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Description
また、本発明は、複数のバンプが形成された第一の回路部材と、該第一の回路部材と相対向し、バンプとはんだ接合する回路電極が形成された第二の回路部材との間に介在させ、第一の回路部材と第二の回路部材とを加熱加圧により接着するための回路部材接続用接着剤であって、潜在性硬化剤と、熱硬化性樹脂と、無機フィラーとを含有し、無機フィラー及び溶媒を除く回路部材接続用接着剤の全量を１００質量部としたとき、潜在性硬化剤の含有量が０．５〜６．７質量部である、回路部材接続用接着剤を提供する。このような回路部材接続用接着剤は、バックグラインド時に半導体ウエハを保持する機能とアンダーフィル機能とを兼ね備えるとともに、はんだ接続性に優れ、保存安定性も良好である。 Further, the present invention provides a circuit between a first circuit member formed with a plurality of bumps and a second circuit member formed with circuit electrodes facing the first circuit member and soldered to the bumps. is interposed, a circuit member connecting adhesive for bonding the first circuit member and second circuit member by heat and pressure, the latent superficial hardening agent, and a thermosetting resin, an inorganic filler containing the door, when the total amount of the circuit member connecting adhesive excluding inorganic filler and a solvent is 100 parts by mass, the content of the latent resident curing agent is from 0.5 to 6.7 parts by weight, the circuit member A connecting adhesive is provided. Such an adhesive for connecting a circuit member has a function of holding a semiconductor wafer during back grinding and an underfill function, is excellent in solder connectivity, and has good storage stability.
Claims (9)
前記回路部材接続用接着剤をガラス板とシリコンチップとの間に挟んで加熱加圧した際の、加熱加圧前の面積に対する加熱加圧後の面積の倍率を計測する方法で求められる流動性が、前記第一の回路部材と前記第二の回路部材とをはんだが溶融しない温度で熱圧着する第一の加熱加圧条件では１．８〜３．０倍であり、前記第一の加熱加圧条件における加熱条件で加熱処理した後、前記第一の加熱加圧条件における加熱条件よりも高温でかつはんだが溶融する温度で加熱加圧する第二の加熱加圧条件では１．１〜３．０倍かつ前記第一の加熱加圧条件での流動性以下である、回路部材接続用接着剤。 Interposed between a first circuit member formed with a plurality of bumps, and a second circuit member formed with a circuit electrode facing the first circuit member and soldered to the bumps, A circuit member connecting adhesive for bonding a first circuit member and the second circuit member by heating and pressing,
Fluidity required by a method of measuring the ratio of the area after heating and pressing to the area before heating and pressing when the circuit member connecting adhesive is sandwiched between a glass plate and a silicon chip and heated and pressed. However, it is 1.8 to 3.0 times in the first heating and pressing condition in which the first circuit member and the second circuit member are thermocompression bonded at a temperature at which the solder does not melt, and the first heating After the heat treatment under the heating condition under the pressurizing condition, 1.1-3 under the second heating and pressurizing condition in which the heating and pressurization is performed at a temperature higher than the heating condition in the first heating and pressurizing condition and the temperature at which the solder melts. An adhesive for connecting circuit members, which is 0 times and below the fluidity under the first heating and pressing condition.
潜在性硬化剤と、熱硬化性樹脂と、無機フィラーとを含有し、
前記無機フィラー及び溶媒を除く回路部材接続用接着剤の全量を１００質量部としたとき、前記潜在性硬化剤の含有量が０．５〜６．７質量部である、回路部材接続用接着剤。 Interposed between a first circuit member formed with a plurality of bumps, and a second circuit member formed with a circuit electrode facing the first circuit member and soldered to the bumps, A circuit member connecting adhesive for bonding a first circuit member and the second circuit member by heating and pressing,
Contains a latent resident curing agent, and a thermosetting resin, an inorganic filler,
When said inorganic filler and 100 parts by mass of the total amount of the circuit member connecting adhesive except solvent, the content of pre-hexene resident curing agent is from 0.5 to 6.7 parts by weight, circuit member connection adhesive.
前記第一の加熱加圧条件の加熱温度が前記（Ｅ）成分の融点以上の温度である、請求項１に記載の回路部材接続用接着剤。 (A) a thermoplastic resin, (B) a thermosetting resin, (C) a latent curing agent, (D) an inorganic filler, and (E) a solid at a temperature of 100 ° C. or lower and the melting point of the solder A carboxyl group-containing compound having a melting point at a lower temperature,
The adhesive for circuit member connection according to claim 1, wherein the heating temperature of the first heating and pressing condition is a temperature equal to or higher than a melting point of the component (E).
前記半導体ウエハの前記バンプが設けられている側とは反対側を研削して前記半導体ウエハを薄化する工程と、
薄化した前記半導体ウエハ及び前記回路部材接続用接着剤をダイシングして回路部材接続用接着剤付半導体チップに個片化する工程と、
前記回路部材接続用接着剤付半導体チップの前記バンプを半導体素子搭載用支持部材の回路電極にはんだ接合する工程と、
を備え、
前記はんだ接合を行う工程は、前記回路部材接続用接着剤付半導体チップと前記半導体素子搭載用支持部材とをはんだが溶融しない温度で熱圧着する第一の加熱加圧工程と、該第一の加熱加圧工程における加熱条件よりも高温でかつはんだが溶融する温度で加熱加圧する第二の加熱加圧工程と、を含む、半導体装置の製造方法。 A semiconductor wafer having a plurality of bumps on one of its main surfaces is prepared, and the circuit wafer connecting adhesive according to any one of claims 1 to 5 is formed on the side of the semiconductor wafer on which the bumps are provided. Providing an adhesive layer;
Grinding the opposite side of the semiconductor wafer from the side on which the bumps are provided to thin the semiconductor wafer;
Dicing the thinned semiconductor wafer and the adhesive for connecting a circuit member into a semiconductor chip with an adhesive for connecting a circuit member; and
Solder bonding the bumps of the semiconductor chip with adhesive for circuit member connection to the circuit electrodes of the support member for mounting a semiconductor element;
With
The solder bonding step includes a first heating and pressing step of thermocompression bonding the semiconductor member with adhesive for circuit member connection and the semiconductor element mounting support member at a temperature at which solder does not melt, A second heating and pressing step of heating and pressing at a temperature higher than the heating conditions in the heating and pressing step and at a temperature at which the solder melts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010178935A JP5703621B2 (en) | 2010-08-09 | 2010-08-09 | Circuit member connecting adhesive, circuit member connecting adhesive sheet, semiconductor device, and manufacturing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010178935A JP5703621B2 (en) | 2010-08-09 | 2010-08-09 | Circuit member connecting adhesive, circuit member connecting adhesive sheet, semiconductor device, and manufacturing method of semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012038975A JP2012038975A (en) | 2012-02-23 |
| JP2012038975A5 true JP2012038975A5 (en) | 2013-08-29 |
| JP5703621B2 JP5703621B2 (en) | 2015-04-22 |
Family
ID=45850623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010178935A Active JP5703621B2 (en) | 2010-08-09 | 2010-08-09 | Circuit member connecting adhesive, circuit member connecting adhesive sheet, semiconductor device, and manufacturing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5703621B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5838903B2 (en) * | 2012-04-17 | 2016-01-06 | 住友ベークライト株式会社 | Manufacturing method of laminate |
| WO2014010258A1 (en) * | 2012-07-13 | 2014-01-16 | パナソニック株式会社 | Acrylic resin composition for semiconductor sealing, semiconductor device using same, and manufacturing method thereof |
| JP6094884B2 (en) * | 2013-06-13 | 2017-03-15 | パナソニックＩｐマネジメント株式会社 | Manufacturing method of semiconductor device and acrylic resin composition for semiconductor sealing used therefor |
| JP6094886B2 (en) * | 2013-07-12 | 2017-03-15 | パナソニックＩｐマネジメント株式会社 | Manufacturing method of semiconductor device and acrylic resin composition for semiconductor sealing used therefor |
| WO2024053232A1 (en) * | 2022-09-05 | 2024-03-14 | 株式会社レゾナック | Laminated film and method for manufacturing semiconductor device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4815648B2 (en) * | 1999-09-01 | 2011-11-16 | 日立化成工業株式会社 | Film adhesive for circuit connection |
| CN101437914B (en) * | 2006-05-09 | 2012-12-12 | 日立化成工业株式会社 | Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet |
| JP2009188063A (en) * | 2008-02-04 | 2009-08-20 | Fujikura Kasei Co Ltd | Method for connection between terminals and method for mounting semiconductor element |
| JP5417729B2 (en) * | 2008-03-28 | 2014-02-19 | 住友ベークライト株式会社 | Film for semiconductor, method for manufacturing semiconductor device, and semiconductor device |
| JP5837272B2 (en) * | 2008-05-21 | 2015-12-24 | 日立化成株式会社 | Manufacturing method of semiconductor manufacturing equipment |
-
2010
- 2010-08-09 JP JP2010178935A patent/JP5703621B2/en active Active
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