JP2012038894A - 発熱源実装用基板モジュール、照明装置 - Google Patents

発熱源実装用基板モジュール、照明装置 Download PDF

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Publication number
JP2012038894A
JP2012038894A JP2010177192A JP2010177192A JP2012038894A JP 2012038894 A JP2012038894 A JP 2012038894A JP 2010177192 A JP2010177192 A JP 2010177192A JP 2010177192 A JP2010177192 A JP 2010177192A JP 2012038894 A JP2012038894 A JP 2012038894A
Authority
JP
Japan
Prior art keywords
heat
heat source
metal plate
mounting
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010177192A
Other languages
English (en)
Japanese (ja)
Inventor
Yoshihiro Akaha
良啓 赤羽
Hirohisa Saito
裕久 齊藤
Hideki Matsubara
秀樹 松原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2010177192A priority Critical patent/JP2012038894A/ja
Priority to PCT/JP2011/061870 priority patent/WO2012017725A1/ja
Priority to TW100124169A priority patent/TW201210460A/zh
Publication of JP2012038894A publication Critical patent/JP2012038894A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2010177192A 2010-08-06 2010-08-06 発熱源実装用基板モジュール、照明装置 Pending JP2012038894A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010177192A JP2012038894A (ja) 2010-08-06 2010-08-06 発熱源実装用基板モジュール、照明装置
PCT/JP2011/061870 WO2012017725A1 (ja) 2010-08-06 2011-05-24 発熱源実装用基板モジュール、照明装置
TW100124169A TW201210460A (en) 2010-08-06 2011-07-08 Substrate module for mounting heat source and illuminating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010177192A JP2012038894A (ja) 2010-08-06 2010-08-06 発熱源実装用基板モジュール、照明装置

Publications (1)

Publication Number Publication Date
JP2012038894A true JP2012038894A (ja) 2012-02-23

Family

ID=45559238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010177192A Pending JP2012038894A (ja) 2010-08-06 2010-08-06 発熱源実装用基板モジュール、照明装置

Country Status (3)

Country Link
JP (1) JP2012038894A (zh)
TW (1) TW201210460A (zh)
WO (1) WO2012017725A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016170983A (ja) * 2015-03-12 2016-09-23 パナソニックＩｐマネジメント株式会社 照明装置及び照明器具
EP3209098A1 (fr) * 2016-02-22 2017-08-23 Valeo Vision Module lumineux pour un véhicule automobile avec reprise de masse

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10537024B2 (en) * 2018-01-30 2020-01-14 General Electric Company Process for fabricating printed circuit assembly and printed circuit assembly thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004279262A (ja) * 2003-03-17 2004-10-07 Denso Corp 車両用表示器の照明装置
JP2005129838A (ja) * 2003-10-27 2005-05-19 Seiko Epson Corp 回路基板、電子モジュール、回路基板の製造方法および電子モジュールの製造方法
JP2006114096A (ja) * 2004-10-13 2006-04-27 Matsushita Electric Ind Co Ltd 半導体レーザユニットおよびそれを備えた光ピックアップ装置
JP2007294619A (ja) * 2006-04-24 2007-11-08 Nec Saitama Ltd 放熱構造
JP2008151993A (ja) * 2006-12-18 2008-07-03 Hitachi Cable Ltd 光電気配線部材
JP2009111040A (ja) * 2007-10-29 2009-05-21 Fujitsu Ltd 半導体装置
JP2009252419A (ja) * 2008-04-03 2009-10-29 Minebea Co Ltd 線状光源装置、および面状照明装置
JP2010153472A (ja) * 2008-12-24 2010-07-08 Toyoda Gosei Co Ltd 発光装置、発光装置の製造方法及び光源装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4847005B2 (ja) * 2004-11-30 2011-12-28 株式会社日立メディアエレクトロニクス 光ピックアップ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004279262A (ja) * 2003-03-17 2004-10-07 Denso Corp 車両用表示器の照明装置
JP2005129838A (ja) * 2003-10-27 2005-05-19 Seiko Epson Corp 回路基板、電子モジュール、回路基板の製造方法および電子モジュールの製造方法
JP2006114096A (ja) * 2004-10-13 2006-04-27 Matsushita Electric Ind Co Ltd 半導体レーザユニットおよびそれを備えた光ピックアップ装置
JP2007294619A (ja) * 2006-04-24 2007-11-08 Nec Saitama Ltd 放熱構造
JP2008151993A (ja) * 2006-12-18 2008-07-03 Hitachi Cable Ltd 光電気配線部材
JP2009111040A (ja) * 2007-10-29 2009-05-21 Fujitsu Ltd 半導体装置
JP2009252419A (ja) * 2008-04-03 2009-10-29 Minebea Co Ltd 線状光源装置、および面状照明装置
JP2010153472A (ja) * 2008-12-24 2010-07-08 Toyoda Gosei Co Ltd 発光装置、発光装置の製造方法及び光源装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016170983A (ja) * 2015-03-12 2016-09-23 パナソニックＩｐマネジメント株式会社 照明装置及び照明器具
EP3209098A1 (fr) * 2016-02-22 2017-08-23 Valeo Vision Module lumineux pour un véhicule automobile avec reprise de masse
FR3048153A1 (fr) * 2016-02-22 2017-08-25 Valeo Vision Module lumineux pour un vehicule automobile avec reprise de masse

Also Published As

Publication number Publication date
TW201210460A (en) 2012-03-01
WO2012017725A1 (ja) 2012-02-09

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