JP2012038859A - Led device and light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED device which enables reduction of a man hour compared to a conventional LED device and obtains a large amount of luminous energy at low cost.SOLUTION: An LED device 27 has a pair of metal contacts 28a and 28b, and front surfaces of the metal contacts 28a and 28b are covered with a material having a reflection rate higher than that on the back surfaces. The back surfaces are composed of a second material used in a connector.

Description

  The present invention relates to a device using a bare chip of a light emitting diode (hereinafter referred to as “LED”) (hereinafter referred to as “LED device”) and a light emitting device using the LED device.

  In recent years, higher output of LEDs has been realized. Accordingly, LED devices in which LED bare chips, which are semiconductor components, are directly mounted on contacts are also used in general lighting and vehicle headlamps that require a large amount of light.

  Conventionally, such LED devices generally connect contacts to a substrate or the like using solder.

  On the other hand, as in the semiconductor light emitting device 10 shown in FIG. 14, only the periphery of the LED bare chip (semiconductor light emitting element 12) is partially covered with a material having a high blue light reflectance, such as Ag, and the other parts are Au. A structure coated with is known (Patent Document 1).

JP 2007-149823 A

  However, in order to obtain the structure as disclosed in Patent Document 1, partial plating for partially covering each surface with Ag or Au is required, which increases the number of manufacturing steps and costs.

  This invention is made | formed in view of the said problem, The subject is providing the LED device which can reduce a manufacturing man-hour conventionally and can obtain a big light quantity at low cost.

  In order to solve the above-mentioned problem, according to one aspect of the present invention, it has a metal contact having both front and back surfaces that engage with a socket terminal, and an LED bare chip mounted on the surface of the metal contact, The metal contact has an LED device characterized in that the front surface is made of a first material having higher reflectance than the back surface, and the back surface is made of a second material used for a connector. It is done.

  According to another aspect of the present invention, there is provided a socket having a socket terminal, a metal contact having front and back surfaces engaged with the socket terminal, and a bare chip of an LED mounted on the surface of the metal contact. An LED device, and the metal contact is made of a first material having a higher reflectance than the back surface, and the back surface is made of a second material used for a connector. Is obtained.

  According to the present invention, it is possible to provide an LED device that can reduce the number of manufacturing steps as compared with the prior art and can obtain a large amount of light at low cost.

1 is a perspective view showing a light emitting device 100. FIG. It is AA sectional drawing of FIG. It is a B direction arrow line view of FIG. FIG. 3 is a view taken in the direction of the arrow C in FIG. 1, and is a diagram in which the description of the insulator 32 is omitted. FIG. 6 is a perspective view showing an LED device 27. It is the figure (figure before being filled with the transparent resin 26) which abbreviate | omitted description of the transparent resin 26 from FIG. It is a reverse view of FIG. 3 is a perspective view showing a socket 31. FIG. It is a perspective view which shows the contacts 33a and 33b. It is the figure which abbreviate | omitted description of the insulator 32 from FIG. FIG. 10 is a process explanatory diagram for explaining the manufacturing method of the LED device 27. FIG. 10 is a process explanatory diagram for explaining the manufacturing method of the LED device 27. FIG. 10 is a process explanatory diagram for explaining the manufacturing method of the LED device 27. 1 is a schematic cross-sectional view showing a configuration of a conventional semiconductor light emitting device 10.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments suitable for the invention will be described in detail with reference to the drawings.

  First, with reference to FIGS. 1-4, the light-emitting device 100 using the LED device 27 which concerns on this invention is demonstrated.

  As shown in FIGS. 1 to 4, the light emitting device 100 includes an LED device 27 having conductive terminal portions 29 a and 29 b and a socket 31 into which the LED device 27 can be fitted and detached.

  The socket 31 includes an insulator 32 made of an insulating resin and the like, and conductive contacts 33a and 33b that are assembled to the insulator 32 and connected to the terminal portions 29a and 29b.

  Next, each member constituting the light emitting device 100 will be described more specifically with reference to FIGS.

  First, the structure of the LED device 27 will be described with reference to FIGS.

  As shown in FIGS. 2 and 3, the LED device 27 includes a pair of metal contacts 28 a, 28 b that engage the socket 31. Each of the pair of metal contacts 28a, 28b has an L-shaped cross section, and has a U-shaped appearance when combined.

  The metal contacts 28a, 28b are insert-molded in the device body 23 such as an insulating resin, and one end of the metal contact 28a, 28b is exposed at the opening 24 (see FIG. 6) of the device body 23. The other end protrudes downward from the lower surface of the device body 23 to form plate-like terminal portions 29a and 29b.

  As shown in FIGS. 5-7, the terminal parts 29a and 29b have the recessed parts 60a and 60b by which the contacts 33a and 33b are inserted in the side surface (front and back both surfaces), respectively. Specifically, the recess 60a is provided on the front side (a surface outside the U shape), and the recess 60b is provided on the back side (a surface inside the U shape).

  As shown in FIG. 6, bare chips 25, which are LEDs, are mounted on the surfaces of the metal contacts 28 a and 28 b, that is, on the outer surface of the U shape, at positions exposed from the openings 24.

  As shown in FIGS. 1, 2, 3, and 5, the opening 24 is filled with a transparent resin 26 that is a transparent insulating resin.

  As shown in FIGS. 4 and 7, a pin 23 a for positioning when fitting with the socket 31 is formed on the lower surface of the device body 23.

  Here, the metal contacts 28a and 28b are made of materials having different front and back surfaces.

  More specifically, the front surface (the outer surface of the U shape) is made of a material (first material) having a higher blue light reflectance than the back surface (the inner surface of the U shape), and the back surface is oxidized. Resistant to deterioration / degeneration of the surface layer such as sulfidation and sulfuration, it is made of a material (second material) used for the connector.

  Here, the “material used for the connector” means a conductive material used for a conductive part such as a contact of a general connector or a conductive material coated on the conductive part. And

  That is, since the metal contacts 28a, 28b are surfaces on which the bare chip 25 is mounted, the metal contacts 28a, 28b are formed of a material having a high blue light reflectivity, and the back surfaces are formed to ensure conductivity with the contacts 33a, 33b. Consists of materials used for connectors.

  In this way, the metal contacts 28a, 28b are not contacts of the type that are connected by solder, but are contacts that are connected to a socket type connector, and the front and back are made of different materials, so that the surface of the contacts is partially plated by partial plating. Compared with the case of coating with a different material, the number of manufacturing steps can be greatly reduced, and the manufacturing cost can be reduced.

  That is, the surface of the metal contacts 28a, 28b is made of a material that emphasizes the reflectance to improve the reflectance of the LED, and the back surface is made of a material used for the connector to ensure electrical connection with the socket 31. . By having different actions on both the front and back surfaces, it is possible to easily achieve both improvement in reflectivity and securing of electrical connection without using expensive and costly means such as partial plating.

  As a combination of such front and back materials, a material is selected from Ag, Al, Pd, Ni, Cu, Au, Sn or an alloy containing them, and a material having a high reflectance is used as a surface material, and the other back surface is used. May be the material used for the connector. Of the combinations of materials described above, the most preferable combination of materials is a combination of Ag on the front surface and Au on the back surface.

  For reference, the reflectance of blue light (wavelength 400 to 500 nm) of the above-described materials is shown in Table 1.

  In addition, as a method of configuring the front surface and the back surface with different materials in this way, for example, a method of plating on both surfaces of a metal as a base is mentioned, but it is not necessarily limited to plating.

  Next, the structure of the socket 31 will be described with reference to FIGS.

  As shown in FIGS. 1-3, 8 and 9, the socket 31 has an insulator 32 and contacts 33a and 33b assembled to the insulator 32 and connected to the terminal portions 29a and 29b.

  As shown in FIG. 8, the insulator 32 has a rectangular planar shape and has two elongated holes 40 a and 40 b that receive the two terminal portions 29 a and 29 b of the LED device 27, respectively. The long holes 40a and 40b are formed to be parallel to one side of the square.

  The long holes 40 a and 40 b are provided through the upper surface of the insulator 32.

  Further, as shown in FIGS. 3 and 8, lateral holes 42a and 42b for inserting contacts 33a and 33b are provided on both side surfaces of the insulator 32 parallel to the long sides of the long holes 40a and 40b. The lateral holes 42a and 42b are connected to the long holes 40a and 40b, respectively.

  Further, grooves 44a and 44b for press-fitting the contact 33a are provided at both side ends of the horizontal hole 42a, and grooves 44c and 44d (groove 44c are not shown) for press-fitting the contact 33b at both ends of the horizontal hole 42b. ) Is provided.

  Further, an insertion port 46 into which the pin 23 a of the LED device 27 is inserted is provided between the long hole 40 a and the long hole 40 b on the upper surface of the insulator 32.

  As shown in FIG. 9, the contacts 33a and 33b have a plate-like shape with a crank side surface, and the two plate-like portions are bounded by the crank portions 90a and 90b bent in a crank shape. There are divided into board connection portions 48a and 48b and insertion portions 50a and 50b.

  The board connection parts 48a and 48b are parts connected to the board or the like by solder or screws, and have a flat plate shape in FIG.

  The insertion portions 50a and 50b are portions inserted into the insulator 32, and specifically have the following shapes.

  That is, both ends of the insertion portions 50a and 50b form plate-like press-fit portions 56a and 56b and press-fit portions 56c and 56d that are press-fitted into the grooves 44a and 44b and the grooves 44c and 44d, respectively. Are bent on the upper surface side to form comb-shaped socket terminals 36a and 36b that fit into the metal contacts 28a and 28b.

  The socket terminals 36a and 36b are provided inside the press-fit portions 56a and 56b and the press-fit portions 56c and 56d, respectively, and outer contact portions 52a and 52b (first terminals) that come into contact with the front side (outside) of the terminal portions 29a and 29b. ) And inner contact portions 54a and 54b (second terminals) provided between the outer contact portions 52a and 52b and in contact with the back sides (inner sides) of the terminal portions 29a and 29b.

  In the present embodiment, four outer contact portions 52a and 52b are provided, and two of them are in pairs. Two each of the inner contact portions 54a and 54b are provided, and are provided between the sets of the outer contact portions 52a and 52b.

  As shown in FIG. 4, the outer contact portions 52a and 52b and the inner contact portions 54a and 54b are structured to sandwich the terminal portions 29a and 29b.

  As shown in FIGS. 3 and 4, the outer contact portions 52a and 52b and a part of the inner contact portions 54a and 54b are formed so as to approach each other when viewed from the side surface (the surface shown in FIGS. 3 and 4). Projecting portions 70, 80.

  The socket terminals 36a and 36b preferably have a base material that is excellent in conductivity and heat conductivity, and a surface layer that is coated with a material used for the connector. Examples of such a material include the same material as the back surface of the metal contacts 28a and 28b.

  Here, as is clear from FIG. 9, when the outer contact portions 52a and 52b and the inner contact portions 54a and 54b are compared, the outer contact portions 52a and 52b have more terminals.

  Specifically, as described above, the inner contact portions 54a and 54b each have two terminals, but the outer contact portions 52a and 52b each have four terminals.

  That is, the number of contacts when the outer contact portions 52a and 52b are connected to the metal contacts 28a and 28b is larger than that of the inner contact portions 54a and 54b.

  This is because the outer contact portions 52a and 52b are in contact with the front side of the terminal portions 29a and 29b, but the front side is made of a material giving priority to reflectance such as Ag. That is, by increasing the number of contacts, electrical connection can be easily ensured even when contacting with a material such as Ag.

  Further, as apparent from FIGS. 3 and 8, the outer contact portions 52a and 52b are assembled to the insulator 32 in such a manner that they are exposed to the outside through the lateral holes 42a and 42b. The part is radiated from the outer contact parts 52a, 52b.

  Therefore, the heat dissipation characteristic can be improved by increasing the number of contacts.

  Next, a procedure for assembling the light emitting device 100 will be briefly described with reference to FIGS.

  First, the socket 31 as shown in FIG. 8 is assembled by combining the socket terminals 36a, 36b and the insulator 32.

  Specifically, the press-fit portions 56a and 56b and the press-fit portions 56c and 56d of the socket terminals 36a and 36b shown in FIG. 9 are press-fitted into the grooves 44a and 44b and the grooves 44c and 44d of the insulator 32, respectively. , 36b are inserted into the lateral holes 42a, 42b and disposed in the elongated holes 40a, 40b, thereby fixing the socket terminals 36a, 36b to the insulator 32.

  Next, the LED device 27 is fitted into the socket 31.

  Specifically, the metal contact terminal portions 29a and 29b (see FIGS. 2 to 7) of the LED device 27 are inserted into the elongated holes 40a and 40b of the insulator 32, and the outer contact portions 52a of the socket terminals 36a and 36b are inserted. 52b is fitted so that the surface of the metal contact terminal portions 29a and 29b and the inner contact portions 54a and 54b are in contact with the back surfaces of the metal contact terminal portions 29a and 29b, respectively. That is, the outer contact portions 52a and 52b and the inner contact portions 54a and 54b are fitted together so as to sandwich the terminal portions 29a and 29b of the metal contacts.

  When fitting, the pin 23a is inserted into the insertion port 46 for positioning, and the protrusions 70 and 80 are inserted into the recesses 60a and 60b of the terminal portions 29a and 29b of the metal contacts, respectively. (See FIG. 10).

  Thereby, the LED device 27 and the socket terminals 36a and 36b are electrically connected.

  The light emitting device 100 as shown in FIG. 1 is assembled by the above procedure.

  Next, a method for manufacturing the LED device 27 will be described with reference to FIGS. 6 and 11 to 13.

  First, a metal lead frame 21 having the shape shown in FIG. 11 is prepared. The lead frame 21 is integrally formed with a large number of metal pieces 22 having a predetermined shape to be metal contacts 28a and 28b in a later process. The metal pieces 22 are arranged in a matrix on the lead frame 21 in pairs.

  Next, a predetermined metal is coated on both the front and back surfaces of the metal piece 22 by plating or the like.

  As described above, since the metal piece 22 is a member that becomes the metal contacts 28a and 28b, the front surface and the back surface are covered with different materials. Specifically, first, the front surface is coated with a material having a higher reflectance than the back surface, the surface is masked, and then the back surface is coated with a material used for the connector.

  Next, as shown in FIG. 12, both ends of the metal piece 22 are bent by pressing or the like to form terminal portions 29a and 29b. The folding is preferably performed with the mask on the surface, and the reason will be described later.

  Next, as shown in FIG. 13, engineering plastic is molded or insert-molded for each pair of metal pieces 22 to form a device body 23 having a predetermined shape partially covering the metal pieces 22. At this time, the opening 24 is formed on the upper surface of the device body 23, and the ends of the pair of metal pieces 22 are exposed at positions adjacent to each other at the bottom of the opening 24.

  Next, after removing the mask on the surface, as shown in FIG. 6, an LED bare chip (light emitting element) 25 is fixedly mounted on the opening 24 of each device body 23 with Au—Sn eutectic solder or the like. At that time, the metal piece 22 and the bare chip 25 and the bare chip 25 and the bare chip 25 are electrically connected by conductive wires (not shown), respectively.

  Thus, since the LED device 27 of the present application has a structure in which both surfaces of the metal contacts 28a and 28b are covered with different materials, the entire bonding surface can be masked until just before bonding. It is possible to prevent dust and the like from adhering to the bonding surface (the surface of the metal piece 22) in the previous steps.

  Next, the portion of the metal piece 22 bonded to the lead frame 21 is cut, and the LED device 27 is separated from the lead frame 21.

  Finally, the transparent resin 26 (see FIG. 5) is filled in the opening 24 of the device body 23 and cured, and the LED device 27 is completed.

  Thus, according to this embodiment, the LED device 27 has a pair of metal contacts 28a, 28b, and the surfaces of the metal contacts 28a, 28b are coated with a material having a higher reflectance than the back surface, and the back surface is a connector. It is coated with the materials used in

  Therefore, the LED device 27 can reduce the number of man-hours for manufacturing than before, and can obtain a large amount of light at low cost.

  The present invention can be used for general lighting, street lamps, vehicle backlights, and the like.

DESCRIPTION OF SYMBOLS 10 Semiconductor light-emitting device 11 Chip substrate 12 Semiconductor light-emitting element 13 Frame-like member 13a Recessed part 14 Transparent resin part 15, 16 Conductive part 15a Element mounting part 15b, 16b Terminal part 16a Bonding part 21 Lead frame 22 Metal piece 23 Device main body 23a Pin 24 Opening 25 Bare chip 26 Transparent resin 27 LED device 28a, 28b Metal contact 29a, 29b Terminal part 31 Socket 32 Insulator 33a, 33b Contact 36a, 36b Socket terminal 40a, 40b Long hole 42a, 42b Side hole 44a, 44b, 44d Groove 46 Insertion port 48a, 48b Substrate connection part 50a, 50b Insertion part 52a, 52b Outer contact part (first terminal)
54a, 54b Inner contact portion (second terminal)
56a, 56b, 56c, 56d Press-fit portion 60a, 60b Recess 70, 80 Protruding portion 90a, 90b Crank portion 100 Light emitting device

Claims (12)

Metal contacts with front and back sides that engage socket terminals;
Having a bare LED chip mounted on the surface of the metal contact;
The LED device, wherein the metal contact is made of a first material having a higher reflectance than the back surface, and the back surface is made of a second material used for a connector.   2. The LED device according to claim 1, wherein the metal contact is formed by applying a surface layer material to each surface of the base metal by plating. The metal contact is a plate-like member having an L-shaped cross section,
3. The LED device according to claim 1, wherein an outer side of the L shape constitutes the front surface and an inner side constitutes the back surface. 4.   The first material and the second material are used for a highly reflective material and a connector, respectively, among materials selected from Ag, Al, Pd, Ni, Cu, Au, Sn, or alloys containing them. The LED device according to claim 1, wherein the LED device is a material. The first material is Ag;
The LED device according to claim 4, wherein the second material is Au. A socket having a socket terminal; a metal contact having front and back surfaces that engage with the socket terminal; an LED device having an LED bare chip mounted on the surface of the metal contact; and the metal contact,
The light emitting device, wherein the front surface is made of a first material having a higher reflectance than the back surface, and the back surface is made of a second material used for a connector.   The light emitting device according to claim 6, wherein the metal contact is formed by applying a surface layer material to each surface of the base metal by plating. The metal contact is a plate-like member having an L-shaped cross section,
8. The light emitting device according to claim 6, wherein an outer side of the L shape constitutes the front surface and an inner side constitutes the back surface.   The first material and the second material are used for a highly reflective material and a connector, respectively, among materials selected from Ag, Al, Pd, Ni, Cu, Au, Sn, or alloys containing them. The light emitting device according to claim 6, wherein the light emitting device is a material. The first material is Ag;
The light emitting device according to claim 9, wherein the second material is Au.   The light emitting device according to any one of claims 6 to 10, wherein the socket terminal is made of the second material.   The socket terminal has a first terminal that contacts the front surface and a second terminal that contacts the back surface, and the first terminal is in contact with the metal contact rather than the second terminal. The light emitting device according to claim 6, wherein the light emitting device has a large number of points.

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