JP2012025081A - Resin molding - Google Patents

Resin molding Download PDF

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JP2012025081A
JP2012025081A JP2010167409A JP2010167409A JP2012025081A JP 2012025081 A JP2012025081 A JP 2012025081A JP 2010167409 A JP2010167409 A JP 2010167409A JP 2010167409 A JP2010167409 A JP 2010167409A JP 2012025081 A JP2012025081 A JP 2012025081A
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hole
end portion
lead
covering
molded product
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JP5464089B2 (en
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Mutsuto Ogino
睦人 荻野
Nobuyoshi Wakasugi
信嘉 若杉
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Denso Corp
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Denso Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a resin molding, wherein displacement of an end of a lead is prevented.SOLUTION: The resin molding includes: the lead consisting of a conductive material; and a cover that is made of a resin material and partially covers the lead. In the lead, the one end and the other end are connected through a connecting section; a side surface and lower surface of the one end, and a whole surface of the connecting section are covered with the cover; an upper surface of the one end and a whole surface of the other end are exposed from the cover. The connecting section is formed in a shape where a lateral direction of the connecting section is longer than the one end thereof, wherein the connecting section intersects with the lead in a longitudinal direction and thickness direction. A first hole is formed in the connecting section, wherein the length along the lateral direction of the hole is longer than one end thereof, and the hole penetrates the connecting section in a thickness direction. The first hole is filled with the cover.

Description

本発明は、導電材料から成るリードの一部が、樹脂材料から成る被覆部によって被覆された樹脂成形品に関するものである。   The present invention relates to a resin molded product in which a part of a lead made of a conductive material is covered with a covering portion made of a resin material.

従来、例えば特許文献1に示されるように、端子の少なくとも一部が埋設された樹脂射出成形品が提案されている。この端子における、樹脂射出成形品によって埋設される部位には、射出成形時の樹脂を入り込ませるための固定部が形成されており、この固定部によって、端子と樹脂射出成形品との接合強度が向上されている。これにより、温度の変動によって、端子が熱膨張や熱収縮した際に、端子の端部が変位し難くなっている。   Conventionally, as shown in Patent Document 1, for example, a resin injection molded product in which at least a part of a terminal is embedded has been proposed. In this terminal, a portion embedded in the resin injection molded product is formed with a fixing portion for allowing the resin at the time of injection molding to enter, and this fixing portion provides a bonding strength between the terminal and the resin injection molding product. Has been improved. Thereby, when the terminal is thermally expanded or contracted due to a change in temperature, the end of the terminal is hardly displaced.

特開2005−205720号公報JP 2005-205720 A

特許文献1では、上記した固定部の具体的な構成として、円形の孔を採用している(特許文献1の図9参照)。この円形の孔に射出成形時の樹脂が入り込むようになっており、孔に入り込んだ樹脂のアンカー効果によって、端子の端部が変位し難くなっている。   In patent document 1, the circular hole is employ | adopted as a specific structure of an above-described fixing | fixed part (refer FIG. 9 of patent document 1). The resin at the time of injection molding enters the circular hole, and the end of the terminal is difficult to displace due to the anchor effect of the resin that has entered the hole.

ところで、円形の孔に入り込んだ樹脂の体積や剛性は、その孔の形状に依存する。特許文献1の図11に示されるように、端子は直状であって、端子の長手方向と厚さ方向とに交差する横方向の長さが一定となっている。これにより、孔の径が、端子の横方向の長さよりも短くなり、孔に入り込む樹脂の量が制限されていた。この結果、端子の熱膨張や熱収縮によって、円形の孔に入り込んだ樹脂が湾曲し、端子の端部の変位が抑制され難くなる虞があった。   By the way, the volume and rigidity of the resin that has entered the circular hole depend on the shape of the hole. As shown in FIG. 11 of Patent Document 1, the terminal is straight, and the length in the lateral direction intersecting the longitudinal direction and the thickness direction of the terminal is constant. As a result, the diameter of the hole is shorter than the length in the lateral direction of the terminal, and the amount of resin entering the hole is limited. As a result, the resin that has entered the circular hole is bent due to thermal expansion or contraction of the terminal, and it is difficult to suppress the displacement of the end of the terminal.

そこで、本発明は上記問題点に鑑み、端子(リード)の端部の変位が抑制された樹脂成形品を提供することを目的とする。   In view of the above problems, an object of the present invention is to provide a resin molded product in which the displacement of the end portion of the terminal (lead) is suppressed.

上記した目的を達成するために、請求項1に記載の発明は、導電材料から成るリードと、樹脂材料から成り、リードの一部を被覆する被覆部と、を備える樹脂成形品であって、リードは、一方の端部と他方の端部とが連結部によって連結されて成り、一方の端部の側面と下面、及び、連結部の全面が被覆部によって被覆され、一方の端部の上面、及び、他方の端部の全面が被覆部から露出されており、連結部は、一方の端部よりも、リードの長手方向と厚さ方向とに交差する横方向に長い形状を成し、連結部に、一方の端部よりも、横方向に沿う長さが長い、厚さ方向に貫通する第1の孔が形成され、この第1の孔が被覆部によって充填されていることを特徴とする。   In order to achieve the above-mentioned object, the invention according to claim 1 is a resin molded product comprising a lead made of a conductive material and a covering portion made of a resin material and covering a part of the lead, The lead is formed by connecting one end portion and the other end portion by a connecting portion, the side surface and the lower surface of one end portion, and the entire surface of the connecting portion are covered with a covering portion, and the upper surface of one end portion. And the entire surface of the other end is exposed from the covering portion, and the connecting portion has a shape that is longer than the one end in the lateral direction intersecting the longitudinal direction and the thickness direction of the lead, The connecting portion is formed with a first hole penetrating in the thickness direction having a longer length along the lateral direction than one end portion, and the first hole is filled with the covering portion. And

このように本発明によれば、連結部が、一方の端部よりも、横方向に長い形状を成している。そして、この連結部に、一方の端部よりも、横方向に沿う長さが長い第1の孔が形成されている。これによれば、第1の孔に充填される樹脂材料(被覆部の形成材料)の量が、一方の端部よりも横方向に沿う長さが短い孔に充填される樹脂材料の量よりも多くなる。これにより、第1の孔に充填される樹脂材料(被覆部)の量が確保され、その剛性が確保される。この結果、リードの熱膨張や熱収縮によって、第1の孔に入り込んだ樹脂が湾曲することが抑制され、一方の端部の変位が抑制される。   Thus, according to the present invention, the connecting portion has a shape that is longer in the lateral direction than one end portion. And the 1st hole whose length along a horizontal direction is longer than this one edge part in this connection part. According to this, the amount of the resin material (formation material of the covering portion) filled in the first hole is larger than the amount of the resin material filled in the hole having a shorter length in the lateral direction than the one end portion. Will also increase. Thereby, the quantity of the resin material (coating part) with which a 1st hole is filled is ensured, and the rigidity is ensured. As a result, the resin that has entered the first hole is prevented from being bent by the thermal expansion and contraction of the lead, and the displacement of one end is suppressed.

また、本発明では、一方の端部の側面と下面が被覆部によって被覆されているが、上記したように、一方の端部の変位が抑制されているので、一方の端部の変位によって、被覆部における一方の端部の端面を被覆している部位に亀裂が生じることが抑制される。   Further, in the present invention, the side surface and the lower surface of one end portion are covered with the covering portion, but as described above, since the displacement of one end portion is suppressed, the displacement of one end portion, It is suppressed that a crack is generated in a portion covering the end face of one end portion of the covering portion.

請求項2に記載のように、一方の端部と連結部の境界と、連結部と他方の端部の境界との対向領域が、第1の孔によって横断された構成が好適である。   According to a second aspect of the present invention, it is preferable that the boundary between the one end and the connecting portion and the opposing region between the connecting portion and the other end be crossed by the first hole.

これによれば、一方の端部への、熱膨張による他方の端部の伸張の伝達が、第1の孔によって遮られる。これにより、他方の端部の伸張によって、一方の端部が変位することが抑制され、被覆部における一方の端部の端面を被覆している部位に亀裂が生じることが抑制される。   According to this, the transmission of the extension of the other end due to thermal expansion to one end is blocked by the first hole. Thereby, it is suppressed that one edge part is displaced by expansion | extension of the other edge part, and it is suppressed that the site | part which coat | covers the end surface of one edge part in a coating | coated part produces a crack.

請求項3に記載のように、一方の端部の側面における、長手方向に交差する端面の形状が、曲状である構成が好ましい。これによれば、一方の端部の端面が直状(角張った形状)である構成とは異なり、被覆部における一方の端部の端面を被覆している部位に応力が集中され難くなる。この結果、被覆部における一方の端部の端面を被覆している部位に亀裂が生じることが抑制される。   According to a third aspect of the present invention, it is preferable that the shape of the end surface intersecting the longitudinal direction on the side surface of one end portion is a curved shape. According to this, unlike the configuration in which the end surface of one end portion is straight (angular shape), the stress is less likely to be concentrated on the portion of the covering portion that covers the end surface of the one end portion. As a result, the occurrence of cracks in the portion covering the end face of one end of the covering portion is suppressed.

請求項4に記載のように、第1の孔における、長手方向に沿う長さが、横方向に沿う長さよりも短い構成が好ましい。これによれば、第1の孔が円形の構成と比べて、連結部における長手方向の長さを短くすることができる。更に言えば、被覆部における連結部を被覆する部位の長手方向の長さを短くすることができる。これらにより、樹脂成形品の体格の増大が抑制される。   According to a fourth aspect of the present invention, a configuration in which the length along the longitudinal direction in the first hole is shorter than the length along the lateral direction is preferable. According to this, the length of the longitudinal direction in a connection part can be shortened compared with the structure where the 1st hole is circular. Furthermore, the length in the longitudinal direction of the portion covering the connecting portion in the covering portion can be shortened. By these, the increase in the physique of a resin molded product is suppressed.

なお、第1の孔は、単数に限らず、請求項5に記載のように、複数でも良い。   Note that the number of the first holes is not limited to one, and a plurality of the first holes may be provided as described in claim 5.

請求項6に記載のように、一方の端部に、厚さ方向に貫通する第2の孔が形成され、この第2の孔が被覆部によって充填された構成が良い。これによれば、熱膨張による連結部の伸張が、一方の端部の端面に伝達されることが抑制されるので、一方の端部の端面が変位することがより効果的に抑制される。これにより、被覆部における一方の端部の端面を被覆している部位に亀裂が生じることがより効果的に抑制される。   According to a sixth aspect of the present invention, it is preferable that a second hole penetrating in the thickness direction is formed in one end portion, and the second hole is filled with a covering portion. According to this, since extension of the connecting portion due to thermal expansion is suppressed from being transmitted to the end surface of one end portion, displacement of the end surface of one end portion is more effectively suppressed. Thereby, it is suppressed more effectively that a crack arises in the part which coat | covers the end surface of one edge part in a coating | coated part.

請求項7に記載のように、第2の孔における、長手方向に沿う長さが、横方向に沿う長さよりも短い構成が好ましい。これによれば、第2の孔が円形の構成と比べて、一方の端部における長手方向の長さを短くすることができる。更に言えば、被覆部における一方の端部を被覆する部位の長手方向の長さを短くすることができる。これらにより、樹脂成形品の体格の増大が抑制される。   As described in claim 7, a configuration in which the length along the longitudinal direction of the second hole is shorter than the length along the lateral direction is preferable. According to this, the length of the longitudinal direction in one edge part can be shortened compared with the structure where the 2nd hole is circular. Furthermore, the length in the longitudinal direction of the portion covering one end portion of the covering portion can be shortened. By these, the increase in the physique of a resin molded product is suppressed.

なお、第2の孔は、単数に限らず、請求項8に記載のように、複数でも良い。   The second hole is not limited to a single hole, and may be a plurality of holes as described in claim 8.

被覆部の具体的な構成としては、請求項9に記載のように、被覆部は、底部と、該底部の縁に沿って形成された、底部の内面を囲む側壁部と、から成る有底筒状を成し、一方の端部の側面と下面は、底部によって被覆され、連結部の全面は、側壁部によって被覆された構成を採用することができる。   As a specific configuration of the covering portion, as described in claim 9, the covering portion includes a bottom portion and a bottomed portion formed along the edge of the bottom portion and including a side wall portion surrounding the inner surface of the bottom portion. It is possible to adopt a configuration in which a cylindrical shape is formed, and a side surface and a lower surface of one end portion are covered with a bottom portion, and an entire surface of a connecting portion is covered with a side wall portion.

請求項10に記載のように、一方の端部の上面と、底部の内面とが面一になっている構成が良い。これによれば、一方の端部の上面と底部の内面とが面一ではない構成と比べて、一方の端部の上面に電気的な接続部材であるワイヤなどを接続し易くなる。   As described in claim 10, it is preferable that the upper surface of one end portion and the inner surface of the bottom portion are flush with each other. According to this, compared to a configuration in which the upper surface of one end and the inner surface of the bottom are not flush with each other, it becomes easier to connect a wire or the like as an electrical connection member to the upper surface of one end.

第1実施形態に係る樹脂成形品の概略構成を示す斜視図である。It is a perspective view which shows schematic structure of the resin molded product which concerns on 1st Embodiment. 図1のリードを示す平面図である。It is a top view which shows the lead | read | reed of FIG. リードの変形例を示す平面図である。It is a top view which shows the modification of a lead | read | reed. リードの変形例を示す平面図である。It is a top view which shows the modification of a lead | read | reed. リードの変形例を示す平面図である。It is a top view which shows the modification of a lead | read | reed. リードの変形例を示す平面図である。It is a top view which shows the modification of a lead | read | reed.

以下、本発明の実施の形態を図に基づいて説明する。
(第1実施形態)
図1は、第1実施形態に係る樹脂成形品の概略構成を示す斜視図である。図2は、図1のリードを示す平面図である。以下においては、リード10の延びた方向を長手方向、長手方向に交差し、リード10の厚さに沿う方向を厚さ方向、長手方向と厚さ方向とに交差し、リード10の横幅に沿う方向を横方向と示す。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a perspective view showing a schematic configuration of a resin molded product according to the first embodiment. FIG. 2 is a plan view showing the lead of FIG. In the following, the extending direction of the lead 10 intersects the longitudinal direction and the longitudinal direction, the direction along the thickness of the lead 10 intersects the thickness direction, the longitudinal direction and the thickness direction, and conforms to the lateral width of the lead 10. The direction is indicated as the horizontal direction.

図1に示すように、樹脂成形品100は、要部として、導電材料から成るリード10と、樹脂材料から成る被覆部30と、を有する。リード10は、長手方向に伸びた形状を成し、被覆部30は、厚さ方向に面する一面が開口した有底筒状を成す。リード10の一方の端部11が、被覆部30の内部に位置し、リード10の他方の端部12が、被覆部30の外部に位置しており、リード10の連結部13が、被覆部30に埋設されている。これにより、被覆部30にリード10が固定され、被覆部30の内部と外部とが、リード10を介して電気的に接続可能と成っている。   As shown in FIG. 1, the resin molded product 100 includes a lead 10 made of a conductive material and a covering portion 30 made of a resin material as main parts. The lead 10 has a shape extending in the longitudinal direction, and the covering portion 30 has a bottomed cylindrical shape in which one surface facing the thickness direction is opened. One end portion 11 of the lead 10 is located inside the covering portion 30, the other end portion 12 of the lead 10 is located outside the covering portion 30, and the connecting portion 13 of the lead 10 is connected to the covering portion. 30. Thereby, the lead 10 is fixed to the covering part 30, and the inside and the outside of the covering part 30 can be electrically connected via the lead 10.

図2に示すように、リード10は、端部11と端部12とが連結部13によって連結されて成る。本実施形態では、3本のリード10が被覆部30に固定されており、3本のリード10それぞれの端部11の側面と下面、及び、連結部13の全面が被覆部30によって被覆され、端部11の上面11a、及び、端部12の全面が被覆部30から露出されている。これにより、端部11の上面11aと端部12の全面とが、電気的な接続に供せられるようになっている。リード10は、本実施形態に係る樹脂成形品100の特徴点なので、後で詳説する。なお、端部11は、リード10における被覆部30の内部に位置する部位であり、端部12は、リード10における被覆部30の外部に位置する部位である。   As shown in FIG. 2, the lead 10 is formed by connecting an end portion 11 and an end portion 12 by a connecting portion 13. In the present embodiment, the three leads 10 are fixed to the covering portion 30, and the side and bottom surfaces of the end portions 11 of each of the three leads 10 and the entire surface of the connecting portion 13 are covered with the covering portion 30. The upper surface 11 a of the end portion 11 and the entire surface of the end portion 12 are exposed from the covering portion 30. Thereby, the upper surface 11a of the end portion 11 and the entire surface of the end portion 12 are provided for electrical connection. Since the lead 10 is a characteristic point of the resin molded product 100 according to the present embodiment, it will be described in detail later. The end portion 11 is a portion located inside the covering portion 30 in the lead 10, and the end portion 12 is a portion located outside the covering portion 30 in the lead 10.

被覆部30は、底部31と、該底部31の縁に沿って形成された、底部31の内面31aを囲む側壁部32と、から成る。底部31によって、端部11の側面と下面が被覆され、側壁部32によって、連結部13の全面が被覆されている。これにより、リード10と被覆部30とが一体化され、被覆部30にリード10が固定されている。なお、図1に示すように、端部11の上面11aが、底部31の内面31aと面一となっており、連結部13は、側壁部32における横方向に沿う部位によって被覆されている。   The covering portion 30 includes a bottom portion 31 and a side wall portion 32 that is formed along the edge of the bottom portion 31 and surrounds the inner surface 31 a of the bottom portion 31. The bottom portion 31 covers the side surface and the lower surface of the end portion 11, and the side wall portion 32 covers the entire surface of the connecting portion 13. Thereby, the lead 10 and the covering portion 30 are integrated, and the lead 10 is fixed to the covering portion 30. As shown in FIG. 1, the upper surface 11 a of the end portion 11 is flush with the inner surface 31 a of the bottom portion 31, and the connecting portion 13 is covered with a portion along the lateral direction in the side wall portion 32.

底部31には、センサチップを搭載するための第1凹部33と、センサチップの出力信号を処理する処理回路を搭載するための第2凹部34と、が形成されている。そして、凹部33,34それぞれの深さが、センサチップ及び処理回路それぞれの厚さ程度となっており、第1凹部33にセンサチップが搭載され、第2凹部34に処理回路が搭載された状態で、センサチップ及び処理回路それぞれにおける電極パッドが形成された上面と底部31の内面とが近くなるようになっている。   The bottom 31 is formed with a first recess 33 for mounting the sensor chip and a second recess 34 for mounting a processing circuit for processing the output signal of the sensor chip. The depth of each of the recesses 33 and 34 is about the thickness of each of the sensor chip and the processing circuit, and the sensor chip is mounted on the first recess 33 and the processing circuit is mounted on the second recess 34. Thus, the upper surface on which the electrode pads in each of the sensor chip and the processing circuit are formed and the inner surface of the bottom portion 31 are close to each other.

なお、凹部33,34にセンサチップと処理回路とが搭載された後は、センサチップと処理回路とがワイヤを介して電気的に接続され、処理回路とリード10とがワイヤを介して電気的に接続される。この電気的な接続の後、側壁部32によって囲まれた領域に、センサチップや処理回路の電気的な接続部位を保護するための保護樹脂が塗布される。   Note that after the sensor chip and the processing circuit are mounted in the recesses 33 and 34, the sensor chip and the processing circuit are electrically connected via a wire, and the processing circuit and the lead 10 are electrically connected via a wire. Connected to. After this electrical connection, a protective resin for protecting the electrical connection portions of the sensor chip and the processing circuit is applied to the region surrounded by the side wall portion 32.

次に、本実施形態に係る樹脂成形品100の特徴点であるリード10の形状を詳説する。図2に示すように、連結部13は、横方向に沿う長さが、長手方向に沿う長さと比べて長い形状を成し、端部11と比べて横方向に長くなっている。本実施形態では、連結部13及び端部11それぞれが矩形状を成し、端部11の側面における長手方向に交差する端面の形状が、曲状と成っている。   Next, the shape of the lead 10 that is a characteristic point of the resin molded product 100 according to the present embodiment will be described in detail. As shown in FIG. 2, the connecting portion 13 has a shape in which the length along the lateral direction is longer than the length along the longitudinal direction, and is longer in the lateral direction than the end portion 11. In the present embodiment, each of the connecting portion 13 and the end portion 11 has a rectangular shape, and the shape of the end surface that intersects the longitudinal direction on the side surface of the end portion 11 has a curved shape.

連結部13には、厚さ方向に貫通する第1の孔14が形成され、端部11には、厚さ方向に貫通する第2の孔15が形成されている。孔14,15それぞれは、横方向に沿う長さが、長手方向に沿う長さと比べて長い形状を成しており、第1の孔14は、端部11よりも、横方向に沿う長さが長くなっている。本実施形態では、孔14,15それぞれは矩形状を成している。   A first hole 14 penetrating in the thickness direction is formed in the connecting portion 13, and a second hole 15 penetrating in the thickness direction is formed in the end portion 11. Each of the holes 14 and 15 has a shape in which the length along the lateral direction is longer than the length along the longitudinal direction, and the first hole 14 has a length along the lateral direction rather than the end portion 11. Is getting longer. In the present embodiment, each of the holes 14 and 15 has a rectangular shape.

孔14,15それぞれは、被覆部30を構成する樹脂材料によって充填されており、被覆部30(側壁部32)における第1の孔14に充填された部位が、側壁部32における連結部13の下面に位置する部位、及び、上面に位置する部位それぞれと連結され、被覆部30(底部31)における第2の孔15に充填された部位が、底部31における端部11の下面に位置する部位と連結されている。   Each of the holes 14 and 15 is filled with a resin material constituting the covering portion 30, and a portion filled in the first hole 14 in the covering portion 30 (side wall portion 32) is connected to the connecting portion 13 in the side wall portion 32. The part located on the lower surface of the end part 11 in the bottom part 31 is connected to the part located on the lower surface and the part located on the upper surface and filled with the second hole 15 in the covering part 30 (bottom part 31). It is connected with.

また、図2に示すように、第1の孔14を含む連結部13の全体形状が、2つの長手方向に沿う部位と、2つの横方向に沿う部位と、によって構成された環状を成しており、これら2つの横方向に沿う部位の一方に端部11が連結され、他方に端部12が連結されている。そして、連結部13における、端部11と連結部13の境界と、連結部13と端部12の境界との対向領域FA(破線で囲まれた領域)が、第1の孔14によって横断され、対向領域FAが、上記した2つの横方向に沿う部位のみによって構成されている。なお、端部11と連結部13の境界は、対向領域FAを構成する4つの破線における、横方向に沿う、端部11側の破線であり、連結部13と端部12の境界は、対向領域FAを構成する4つの破線における、横方向に沿う、端部12側の破線である。   In addition, as shown in FIG. 2, the overall shape of the connecting portion 13 including the first hole 14 forms an annular shape constituted by two portions along the longitudinal direction and two portions along the lateral direction. The end 11 is connected to one of the two portions along the horizontal direction, and the end 12 is connected to the other. In addition, the first hole 14 crosses the boundary region FA (region surrounded by the broken line) between the boundary between the end portion 11 and the coupling portion 13 and the boundary between the coupling portion 13 and the end portion 12 in the coupling portion 13. The opposing area FA is constituted only by the portions along the two lateral directions described above. The boundary between the end portion 11 and the connecting portion 13 is a broken line on the end portion 11 side along the horizontal direction in the four broken lines constituting the facing area FA, and the boundary between the connecting portion 13 and the end portion 12 is facing. It is the broken line by the side of the edge part 12 along the horizontal direction in the four broken lines which comprise area | region FA.

次に、本実施形態に係る樹脂成形品100の作用効果を説明する。上記したように、連結部13は、端部11と比べて横方向に長い形状を成し、この連結部13に、端部11よりも、横方向に沿う長さが長い第1の孔14が形成されている。これによれば、第1の孔14に充填される樹脂材料(被覆部30の形成材料)の量が、端部11よりも横方向に沿う長さが短い孔に充填される樹脂材料の量よりも多くなる。これにより、第1の孔14に充填される樹脂材料(被覆部30)の量が確保され、その剛性が確保される。この結果、リード10の熱膨張や熱収縮によって、第1の孔14に入り込んだ樹脂が湾曲することが抑制され、端部11の変位が抑制される。   Next, the effect of the resin molded product 100 according to this embodiment will be described. As described above, the connecting portion 13 has a shape that is longer in the lateral direction than the end portion 11, and the first hole 14 having a longer length in the lateral direction than the end portion 11 in the connecting portion 13. Is formed. According to this, the amount of the resin material filled in the first hole 14 (the forming material of the covering portion 30) is the amount of the resin material filled in the hole having a shorter length along the lateral direction than the end portion 11. More than. Thereby, the quantity of the resin material (coating part 30) with which the 1st hole 14 is filled is ensured, and the rigidity is ensured. As a result, the resin that has entered the first hole 14 is prevented from being bent by the thermal expansion and contraction of the lead 10, and the displacement of the end portion 11 is suppressed.

また、本実施形態で、端部11の側面と下面が被覆部30によって被覆されているが、上記したように、端部11の変位が抑制されるので、端部11の変位によって、被覆部30における端部11の端面を被覆している部位(底部31)に亀裂が生じることが抑制される。   Further, in the present embodiment, the side surface and the lower surface of the end portion 11 are covered with the covering portion 30, but as described above, the displacement of the end portion 11 is suppressed. 30 is prevented from cracking at the portion covering the end face of the end portion 11 (bottom portion 31).

対向領域FAが、第1の孔14によって横断されている。これによれば、端部11への、熱膨張による端部12の伸張(図2に示す白抜き矢印で示された伸び)の伝達が、第1の孔14によって遮られる。これにより、端部12の伸張による、端部11の変位が抑制され、底部31に亀裂が生じることが抑制される。   The facing area FA is traversed by the first hole 14. According to this, the transmission of the extension of the end portion 12 due to thermal expansion (elongation indicated by the white arrow shown in FIG. 2) to the end portion 11 is blocked by the first hole 14. Thereby, the displacement of the end portion 11 due to the extension of the end portion 12 is suppressed, and a crack in the bottom portion 31 is suppressed.

第1の孔14を含む連結部13の全体形状が環状を成している。これによれば、長手方向に沿う応力が端部12に印加したとしても、連結部13が撓むので、その応力が端部11に印加されることが抑制される。これにより、応力による端部11の変位が抑制され、底部31に亀裂が生じることが抑制される。   The entire shape of the connecting portion 13 including the first hole 14 is annular. According to this, even if the stress along the longitudinal direction is applied to the end portion 12, the connecting portion 13 bends, so that the stress is suppressed from being applied to the end portion 11. Thereby, the displacement of the end portion 11 due to the stress is suppressed, and the occurrence of a crack in the bottom portion 31 is suppressed.

端部11の端面が曲状を成している。これによれば、端部11の端面が直状(角張った形状)である構成とは異なり、底部31に応力が集中され難くなり、底部31に亀裂が生じることが抑制される。   The end surface of the end portion 11 is curved. According to this, unlike the configuration in which the end surface of the end portion 11 is straight (angular shape), it is difficult for stress to be concentrated on the bottom portion 31, and the occurrence of cracks in the bottom portion 31 is suppressed.

第1の孔14は、横方向に沿う長さが、長手方向に沿う長さと比べて長い形状を成している。これによれば、第1の孔14が円形の構成と比べて、連結部13における長手方向の長さを短くすることができる。更に言えば、連結部13を被覆する側壁部32の長手方向の長さを短くすることができる。これらにより、樹脂成形品100の体格の増大が抑制される。   The first hole 14 has a shape in which the length along the lateral direction is longer than the length along the longitudinal direction. According to this, the length of the longitudinal direction in the connection part 13 can be shortened compared with the structure where the 1st hole 14 is circular. Furthermore, the length in the longitudinal direction of the side wall portion 32 covering the connecting portion 13 can be shortened. By these, the increase in the physique of the resin molded product 100 is suppressed.

端部11には、厚さ方向に貫通する第2の孔15が形成され、第2の孔15は、被覆部30を構成する樹脂材料によって充填されている。これによれば、熱膨張による連結部13の伸張が、端部11の端面に伝達されることが抑制されるので、端部11の端面が変位することがより効果的に抑制される。これにより、底面31に亀裂が生じることがより効果的に抑制される。   A second hole 15 penetrating in the thickness direction is formed in the end portion 11, and the second hole 15 is filled with a resin material constituting the covering portion 30. According to this, since the expansion of the connecting portion 13 due to thermal expansion is suppressed from being transmitted to the end surface of the end portion 11, the end surface of the end portion 11 is more effectively suppressed from being displaced. Thereby, it is suppressed more effectively that a crack occurs in the bottom surface 31.

第2の孔15は、横方向に沿う長さが、長手方向に沿う長さと比べて長い形状を成している。これによれば、第2の孔15が円形の構成と比べて、端部11における長手方向の長さを短くすることができる。更に言えば、端部11の一部を被覆する底部31の長手方向の長さを短くすることができる。これらにより、樹脂成形品100の体格の増大が抑制される。   The second hole 15 has a shape in which the length along the lateral direction is longer than the length along the longitudinal direction. According to this, the length of the longitudinal direction in the edge part 11 can be shortened compared with the structure where the 2nd hole 15 is circular. Furthermore, the length in the longitudinal direction of the bottom 31 covering a part of the end 11 can be shortened. By these, the increase in the physique of the resin molded product 100 is suppressed.

端部11の上面11aが、底部31の内面31aと面一となっている。これによれば、上面11aと内面31aとが面一ではない構成と比べて、上面11aにワイヤを接続し易くなる。更に、本実施形態では、底部31に、凹部33,34が形成され、第1凹部33にセンサチップが搭載され、第2凹部34に処理回路が搭載された状態で、センサチップ及び処理回路の上面に形成された電気パッドと底部31の内面とが近くなっている。これによれば、底部31に、凹部33,34が形成されていない構成と比べて、センサチップと処理回路とのワイヤ接続、及び、処理回路と端部11とのワイヤ接続が容易となる。   The upper surface 11 a of the end portion 11 is flush with the inner surface 31 a of the bottom portion 31. According to this, it becomes easy to connect a wire to the upper surface 11a as compared with the configuration in which the upper surface 11a and the inner surface 31a are not flush with each other. Furthermore, in the present embodiment, the recesses 33 and 34 are formed in the bottom 31, the sensor chip is mounted on the first recess 33, and the processing circuit is mounted on the second recess 34, and the sensor chip and the processing circuit are mounted. The electric pad formed on the upper surface and the inner surface of the bottom 31 are close to each other. This facilitates wire connection between the sensor chip and the processing circuit and wire connection between the processing circuit and the end portion 11 as compared with a configuration in which the recesses 33 and 34 are not formed in the bottom 31.

連結部13は、横方向に沿う長さが、長手方向に沿う長さと比べて長い形状を成し、側壁部32における横方向に沿う部位によって被覆されている。これによれば、連結部13が横方向に長くなったとしても、その長くなる方向に、連結部13を被覆する側壁部32の形状が沿っているので、側壁部32の体格が増大することが抑制される。これにより、樹脂成形品100の体格の増大が抑制される。   The connecting portion 13 has a shape in which the length along the horizontal direction is longer than the length along the longitudinal direction, and is covered by a portion along the horizontal direction in the side wall portion 32. According to this, even if the connecting part 13 becomes longer in the lateral direction, the shape of the side wall part 32 covering the connecting part 13 is along the longer direction, so that the size of the side wall part 32 increases. Is suppressed. Thereby, the increase in the physique of the resin molded product 100 is suppressed.

以上、本発明の好ましい実施形態について説明したが、本発明は上記した実施形態になんら制限されることなく、本発明の主旨を逸脱しない範囲において、種々変形して実施することが可能である。   The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

本実施形態では、第1の孔14が矩形状である例を示した。しかしながら、第1の孔14の形状としては上記例に限定されず、例えば、図3に示すように、楕円を採用することもできる。   In the present embodiment, an example in which the first hole 14 is rectangular has been described. However, the shape of the first hole 14 is not limited to the above example, and for example, an ellipse can be adopted as shown in FIG.

本実施形態では、図2に示すように、1つの連結部13に1つの第1の孔14が形成された例を示した。しかしながら、第1の孔14の数としては上記例に限定されず、例えば、図4に示すように、1つの連結部13に2つの第1の孔14が形成された構成を採用することもできる。図4では、第1の孔14が、長手方向に並んで形成されている。   In the present embodiment, as shown in FIG. 2, an example in which one first hole 14 is formed in one connecting portion 13 is shown. However, the number of the first holes 14 is not limited to the above example. For example, as shown in FIG. 4, a configuration in which two first holes 14 are formed in one connecting portion 13 may be adopted. it can. In FIG. 4, the 1st hole 14 is formed along with the longitudinal direction.

本実施形態では、第2の孔15が矩形状である例を示した。しかしながら、第2の孔15の形状としては上記例に限定されず、例えば、図4に示すように、円形を採用することもできる。また、図5に示すように、第2の孔15の形状として、長手方向に沿う長さが長い矩形状を採用することもできる。しかしながら、上記したいずれの構成も、本実施形態で示した構成と比べて、端部11における長手方向の長さが長く成り、樹脂成形品100の体格が増大される。したがって、第2の孔15の形状としては、本実施形態で示した構成が好ましい。   In the present embodiment, an example in which the second hole 15 is rectangular has been described. However, the shape of the second hole 15 is not limited to the above example, and for example, as shown in FIG. Further, as shown in FIG. 5, a rectangular shape having a long length along the longitudinal direction can be adopted as the shape of the second hole 15. However, in any of the above-described configurations, the length in the longitudinal direction at the end portion 11 is longer than the configuration shown in the present embodiment, and the physique of the resin molded product 100 is increased. Therefore, the configuration shown in this embodiment is preferable as the shape of the second hole 15.

本実施形態では、図2に示すように、1つの連結部13に1つの第2の孔15が形成された例を示した。しかしながら、第2の孔15の数としては上記例に限定されず、例えば、図6に示すように、1つの連結部13に2つの第2の孔15が形成された構成を採用することもできる。図6では、第2の孔15が、長手方向に並んで形成されている。なお、上記した図3〜図6は、リードの変形例を示す平面図である。   In the present embodiment, as shown in FIG. 2, an example in which one second hole 15 is formed in one connecting portion 13 is shown. However, the number of the second holes 15 is not limited to the above example. For example, as illustrated in FIG. 6, a configuration in which two second holes 15 are formed in one connecting portion 13 may be adopted. it can. In FIG. 6, the 2nd hole 15 is formed along with the longitudinal direction. 3 to 6 described above are plan views showing modifications of the leads.

本実施形態では、被覆部30が、センサチップ、処理回路を搭載する構成例を示した。しかしながら、被覆部30は、上記したセンサチップや処理回路を搭載する機能を果たさない構成を採用することもできる。この場合、樹脂成形品100は、コネクタとしての機能のみを果たす。   In the present embodiment, a configuration example in which the covering unit 30 is mounted with a sensor chip and a processing circuit is shown. However, the covering portion 30 can also employ a configuration that does not perform the function of mounting the above-described sensor chip or processing circuit. In this case, the resin molded product 100 functions only as a connector.

10・・・リード
11,12・・・端部
13・・・連結部
14・・・第1の孔
15・・・第2の孔
30・・・被覆部
31・・・底部
32・・・側壁部
100・・・樹脂成形品
DESCRIPTION OF SYMBOLS 10 ... Lead 11, 12 ... End part 13 ... Connection part 14 ... 1st hole 15 ... 2nd hole 30 ... Covering part 31 ... Bottom part 32 ... Side wall part 100 ... resin molded product

Claims (10)

導電材料から成るリードと、
樹脂材料から成り、前記リードの一部を被覆する被覆部と、を備える樹脂成形品であって、
前記リードは、一方の端部と他方の端部とが連結部によって連結されて成り、
前記一方の端部の側面と下面、及び、前記連結部の全面が前記被覆部によって被覆され、前記一方の端部の上面、及び、前記他方の端部の全面が前記被覆部から露出されており、
前記連結部は、前記一方の端部よりも、前記リードの長手方向と厚さ方向とに交差する横方向に長い形状を成し、
前記連結部に、前記一方の端部よりも、前記横方向に沿う長さが長い、前記厚さ方向に貫通する第1の孔が形成され、この第1の孔が前記被覆部によって充填されていることを特徴とする樹脂成形品。
A lead made of a conductive material;
A resin molded product comprising a resin material, and a covering portion covering a part of the lead,
The lead consists of one end and the other end connected by a connecting portion,
The side surface and the lower surface of the one end portion and the entire surface of the connecting portion are covered with the covering portion, and the upper surface of the one end portion and the entire surface of the other end portion are exposed from the covering portion. And
The connecting portion has a shape that is longer in the lateral direction intersecting the longitudinal direction and the thickness direction of the lead than the one end portion,
A first hole penetrating in the thickness direction and having a longer length along the lateral direction than the one end portion is formed in the connecting portion, and the first hole is filled with the covering portion. A resin molded product characterized by
前記一方の端部と前記連結部の境界と、前記連結部と前記他方の端部の境界との対向領域が、前記第1の孔によって横断されていることを特徴とする請求項1に記載の樹脂成形品。   The boundary region between the one end portion and the connecting portion and the opposing region between the boundary portion between the connecting portion and the other end portion are crossed by the first hole. Resin molded products. 前記一方の端部の側面における、前記長手方向に交差する端面の形状が、曲状であることを特徴とする請求項1又は請求項2に記載の樹脂成形品。   The resin molded product according to claim 1 or 2, wherein a shape of an end surface intersecting the longitudinal direction on a side surface of the one end portion is a curved shape. 前記第1の孔における、前記長手方向に沿う長さが、前記横方向に沿う長さよりも短いことを特徴とする請求項1〜3いずれか1項に記載の樹脂成形品。   The resin molded product according to any one of claims 1 to 3, wherein a length along the longitudinal direction in the first hole is shorter than a length along the lateral direction. 前記第1の孔は、前記連結部に複数形成されていることを特徴とする請求項1〜4いずれか1項に記載の樹脂成形品。   The resin molded product according to any one of claims 1 to 4, wherein a plurality of the first holes are formed in the connecting portion. 前記一方の端部に、前記厚さ方向に貫通する第2の孔が形成され、この第2の孔が前記被覆部によって充填されていることを特徴とする請求項1〜5いずれか1項に記載の樹脂成形品。   6. The second hole penetrating in the thickness direction is formed in the one end portion, and the second hole is filled with the covering portion. The resin molded product described in 1. 前記第2の孔における、前記長手方向に沿う長さが、前記横方向に沿う長さよりも短いことを特徴とする請求項6に記載の樹脂成形品。   The resin molded product according to claim 6, wherein a length along the longitudinal direction in the second hole is shorter than a length along the lateral direction. 前記第2の孔は、前記一方の端部に複数形成されていることを特徴とする請求項6又は請求項7に記載の樹脂成形品。   The resin molded product according to claim 6 or 7, wherein a plurality of the second holes are formed at the one end portion. 前記被覆部は、底部と、該底部の縁に沿って形成された、前記底部の内面を囲む側壁部と、から成る有底筒状を成し、
前記一方の端部の側面と下面は、前記底部によって被覆され、前記連結部の全面は、前記側壁部によって被覆されていることを特徴とする請求項1〜8いずれか1項に記載の樹脂成形品。
The covering portion has a bottomed cylindrical shape including a bottom portion and a side wall portion that is formed along an edge of the bottom portion and surrounds the inner surface of the bottom portion,
9. The resin according to claim 1, wherein a side surface and a lower surface of the one end portion are covered with the bottom portion, and an entire surface of the connecting portion is covered with the side wall portion. Molding.
前記一方の端部の上面と、前記底部の内面とが面一になっていることを特徴とする請求項9に記載の樹脂成形品。   The resin molded product according to claim 9, wherein an upper surface of the one end portion and an inner surface of the bottom portion are flush with each other.
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS633916A (en) * 1986-06-24 1988-01-08 Omron Tateisi Electronics Co Manufacture of terminal base

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS633916A (en) * 1986-06-24 1988-01-08 Omron Tateisi Electronics Co Manufacture of terminal base

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