JPS633916A - Manufacture of terminal base - Google Patents
Manufacture of terminal baseInfo
- Publication number
- JPS633916A JPS633916A JP61147737A JP14773786A JPS633916A JP S633916 A JPS633916 A JP S633916A JP 61147737 A JP61147737 A JP 61147737A JP 14773786 A JP14773786 A JP 14773786A JP S633916 A JPS633916 A JP S633916A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- synthetic resin
- base
- metal
- insert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 9
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 9
- 239000000057 synthetic resin Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 6
- 230000004907 flux Effects 0.000 abstract description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052804 chromium Inorganic materials 0.000 abstract description 2
- 239000011651 chromium Substances 0.000 abstract description 2
- 239000007822 coupling agent Substances 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の分野］
この発明は、端子を合成樹脂製ベースにインサート成形
する端子ベースの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to a method for manufacturing a terminal base in which a terminal is insert-molded into a synthetic resin base.
［従来技術とその問題点コ
従来、金属製端子は金型のキャビティ内に固定した状態
で、溶融樹脂を射出し、端子を樹脂製ベースにインサー
ト成形していた。[Prior art and its problems] Conventionally, metal terminals were fixed in a mold cavity, then molten resin was injected and the terminals were insert-molded into a resin base.
しかし、このような従来の端子ベースの製造方法によれ
ば、成形後に金属と樹脂との熱収縮差、インサートされ
た端子の曲げ、切断加工等によって、端子とベースとの
接合面に微少な隙間が生じていた。However, according to such conventional terminal base manufacturing methods, minute gaps may be created at the bonding surface between the terminal and the base due to differences in thermal shrinkage between the metal and resin, bending of the inserted terminal, cutting process, etc. after molding. was occurring.
そのため、端子の半田付は時に発生するフラックスなど
の腐食性溶剤が上記の隙間からベースの内側に浸入して
、接点機構に付着し、接点の腐食や接触抵抗の増加など
を招く欠点があった。また、製品の洗浄時に、その洗浄
液が製品の内部に浸入するなどの欠点があった。Therefore, when soldering terminals, corrosive solvents such as flux that are sometimes generated enter the inside of the base through the above-mentioned gaps and adhere to the contact mechanism, resulting in corrosion of the contacts and an increase in contact resistance. . Further, there is a drawback that when cleaning the product, the cleaning liquid infiltrates into the interior of the product.
そこで、上記インサート成形前に、上記端子のインサー
ト部に金属と樹脂とのぬれ性を高める材料を塗布するこ
とが試みられた。（特願昭６０−１６６３７２号参照）
しかしながら、上記端子のインサート部に金属と樹脂と
のぬれ性を高める材料を塗布するのみでは、上記隙間を
確実に封止することは不十分であることが確認された。Therefore, an attempt has been made to coat the insert portion of the terminal with a material that enhances the wettability between metal and resin before the insert molding. (Refer to Japanese Patent Application No. 60-166372.) However, simply applying a material that enhances the wettability of metal and resin to the insert portion of the terminal is insufficient to reliably seal the gap. confirmed.
［発明の目的］
この発明は上記欠点を解決するためになされたもので、
端子と合成樹脂製ベースとのシール性を一層向上させる
ことができる端子ベースの製造方法を提供することを目
的する。[Object of the invention] This invention was made to solve the above-mentioned drawbacks,
It is an object of the present invention to provide a method for manufacturing a terminal base that can further improve the sealing performance between the terminal and the synthetic resin base.
［発明の構成と効果］
この発明に係る端子ベースの製造方法は、インサート成
形前に、端子のインサート部に凹凸部を形成したのち、
この凹凸部に金属と樹脂とのぬれ性を高める材料を塗布
することを特徴とする。[Configuration and Effects of the Invention] The method for manufacturing a terminal base according to the present invention includes forming an uneven portion on an insert portion of a terminal before insert molding, and then
The method is characterized in that a material that enhances the wettability between metal and resin is applied to the uneven portions.
この発明によれば、端子のインサート部に凹凸部を形成
したのち、この凹凸部に金属と樹脂とのぬれ性を高める
材料を塗布することにより、端子とベースとのシール性
を一層向上させることができ、半田フラックスなどの溶
剤や洗浄液の浸入を有効に防止することができるととも
に、接点の腐食等の不良品の発生が防止できる。According to the present invention, after forming an uneven portion on the insert portion of the terminal, a material that improves the wettability of metal and resin is applied to the uneven portion, thereby further improving the sealing performance between the terminal and the base. This makes it possible to effectively prevent the infiltration of solvents such as solder flux and cleaning fluids, as well as to prevent the occurrence of defective products such as corrosion of contacts.
［実施例の説明］ 以下、この発明の実施例を図面にしたがって説明する。[Explanation of Examples] Embodiments of the present invention will be described below with reference to the drawings.
第１図はこの発明に係る製造方法を説明するための端子
ベースの一例を示し、１はフラットな金属製端子であっ
て、そのインサート部ＩＡには、第２図で示すようなＶ
字形の溝からなる凹凸部３を形成し、この凹凸部３の外
表面にシラン系、チタン系、クロム系のカップリング剤
、つまりぬれ性を高める材料を浸漬手段等により塗布す
ることにより、上記端子ｌの表面を改質して樹脂との密
着性を向上させる。FIG. 1 shows an example of a terminal base for explaining the manufacturing method according to the present invention, in which 1 is a flat metal terminal, and its insert part IA has a V as shown in FIG.
By forming an uneven part 3 consisting of a letter-shaped groove and applying a silane-based, titanium-based, or chromium-based coupling agent, that is, a material that improves wettability, to the outer surface of the uneven part 3 by dipping means or the like, the above-mentioned The surface of the terminal l is modified to improve its adhesion to the resin.
その後、上記端子１を金型のキャビティ内の所定位置に
固定保持した状態で、合成樹脂製ベース２を成形するこ
とにより、インサート部ＩＡのシール性に優れ、半田フ
ラックスや洗浄液等の浸入を確実に防止できる端子ベー
スが得られる。After that, by molding the synthetic resin base 2 with the terminal 1 fixed and held in a predetermined position in the mold cavity, the insert part IA has excellent sealing properties and ensures that solder flux, cleaning liquid, etc. do not infiltrate. This provides a terminal base that can prevent this from occurring.
上記端子１の凹凸部３は、第３図および第４図で示すよ
うな多数の凹部もしくは凸部からなるものであってもよ
く、また、第５図で示すよに、インサート部ＩＡの両面
に形成されてもよいことはいうまでもない。The concavo-convex portion 3 of the terminal 1 may be composed of a large number of concave portions or convex portions as shown in FIGS. 3 and 4, or, as shown in FIG. Needless to say, it may be formed as follows.
このように、端子ｌのインサート部ＩＡに凹凸部３を形
成したのち、この凹凸部３に金属と樹脂とのぬれ性を高
める材料を塗布することにより、端子１とベース２との
シール性を一層向上させることができ、半田フラックス
などの溶剤や洗浄液の浸入を有効に防止することができ
るとともに、接点の腐食等の不良品の発生が防止できる
。In this way, after forming the uneven portion 3 on the insert portion IA of the terminal 1, the sealing property between the terminal 1 and the base 2 is improved by applying a material that improves the wettability of metal and resin to the uneven portion 3. Further, it is possible to effectively prevent the infiltration of solvents such as solder flux and cleaning liquids, and also to prevent the occurrence of defective products such as corrosion of contacts.
第１図はこの発明に係る製造方法を説明するための端子
ベースの一例を示す要部の斜視図、第２図ないし第４図
は端子の凹凸部の異なる例を示す斜視図、第５図はこの
発明に係る製造方法を説明するための端子ベースの他の
例を示す要部の斜視図である。
１・・・端子、ＩＡ・・・インサート部、２・・・ベー
ス、３・・・凹凸部。
第１図 第２図
第５図FIG. 1 is a perspective view of essential parts showing an example of a terminal base for explaining the manufacturing method according to the present invention, FIGS. 2 to 4 are perspective views showing different examples of uneven portions of the terminal, and FIG. FIG. 2 is a perspective view of main parts showing another example of a terminal base for explaining the manufacturing method according to the present invention. 1... Terminal, IA... insert part, 2... base, 3... uneven part. Figure 1 Figure 2 Figure 5
Claims (1)
子ベースの製造方法において、上記インサート成形前に
、上記端子のインサート部に凹凸部を形成したのち、こ
の凹凸部に金属と樹脂とのぬれ性を高める材料を塗布す
ることを特徴とする端子ベースの製造方法。(1) In a method for manufacturing a terminal base in which a terminal is insert-molded into a synthetic resin base, an uneven part is formed on the insert part of the terminal before the insert molding, and the wettability of metal and resin is improved in the uneven part. A method for manufacturing a terminal base, characterized by applying a material that increases the
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61147737A JPS633916A (en) | 1986-06-24 | 1986-06-24 | Manufacture of terminal base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61147737A JPS633916A (en) | 1986-06-24 | 1986-06-24 | Manufacture of terminal base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS633916A true JPS633916A (en) | 1988-01-08 |
Family
ID=15437001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61147737A Pending JPS633916A (en) | 1986-06-24 | 1986-06-24 | Manufacture of terminal base |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS633916A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01280517A (en) * | 1988-05-06 | 1989-11-10 | Tottori Taiho Kogyo Kk | Adhesion method for synthetic resin molded product and silicone rubber |
| JP2012025081A (en) * | 2010-07-26 | 2012-02-09 | Denso Corp | Resin molding |
| WO2014038261A1 (en) * | 2012-09-04 | 2014-03-13 | 日本航空電子工業株式会社 | Waterproof connector |
-
1986
- 1986-06-24 JP JP61147737A patent/JPS633916A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01280517A (en) * | 1988-05-06 | 1989-11-10 | Tottori Taiho Kogyo Kk | Adhesion method for synthetic resin molded product and silicone rubber |
| JP2012025081A (en) * | 2010-07-26 | 2012-02-09 | Denso Corp | Resin molding |
| WO2014038261A1 (en) * | 2012-09-04 | 2014-03-13 | 日本航空電子工業株式会社 | Waterproof connector |
| JP2014049411A (en) * | 2012-09-04 | 2014-03-17 | Japan Aviation Electronics Industry Ltd | Waterproof connector |
| US9564705B2 (en) | 2012-09-04 | 2017-02-07 | Japan Aviation Electronics Industry, Limited | Waterproof connector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20130078423A1 (en) | Composite Molded Body of Metal Member and Molded Resin Member, and Surface Processing Method of Metal Member | |
| US6465737B1 (en) | Over-molded electric cable and method for making same | |
| JPS633916A (en) | Manufacture of terminal base | |
| JPS624862B2 (en) | ||
| JP2561546B2 (en) | Method for producing box-shaped molded article composed of composite of plastic and metal foil | |
| JPH0147284B2 (en) | ||
| JPH0246134B2 (en) | ||
| JP2756615B2 (en) | Insert molded article and method of manufacturing the same | |
| US6878328B2 (en) | Methods for producing a molded part | |
| JP3695789B2 (en) | Three-dimensional substrate and manufacturing method thereof | |
| JP3552340B2 (en) | Glow plug and manufacturing method thereof | |
| JPH02107416A (en) | Molding method for composite article | |
| JP3319284B2 (en) | Method of manufacturing gasket having annular seal | |
| JP3142506B2 (en) | Resin coated pipe and method of manufacturing the same | |
| JPH0232730A (en) | Molding method | |
| JPH066310B2 (en) | Baking-molded product manufacturing method | |
| JPH07232352A (en) | Resin molding device | |
| KR830000960B1 (en) | Manufacturing Method of Semiconductor Device | |
| JPH097671A (en) | Connector and its manufacture | |
| EP0511062B1 (en) | Method for sealing a device such as an induction coil | |
| JPH0235466Y2 (en) | ||
| JPH04130792A (en) | Manufacture of circuit board | |
| JPH07183416A (en) | Box-type resin molded body for semiconductor device and manufacture thereof | |
| JPH01312863A (en) | Manufacture of resin-sealed semiconductor device | |
| JPS6265003A (en) | Sealing method for optical fiber sealing part |