JP2012014756A5 - - Google Patents

Download PDF

Info

Publication number
JP2012014756A5
JP2012014756A5 JP2010147528A JP2010147528A JP2012014756A5 JP 2012014756 A5 JP2012014756 A5 JP 2012014756A5 JP 2010147528 A JP2010147528 A JP 2010147528A JP 2010147528 A JP2010147528 A JP 2010147528A JP 2012014756 A5 JP2012014756 A5 JP 2012014756A5
Authority
JP
Japan
Prior art keywords
metal support
wiring layer
layer
support substrate
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010147528A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012014756A (ja
JP5201174B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010147528A priority Critical patent/JP5201174B2/ja
Priority claimed from JP2010147528A external-priority patent/JP5201174B2/ja
Priority to US13/171,662 priority patent/US8758910B2/en
Publication of JP2012014756A publication Critical patent/JP2012014756A/ja
Publication of JP2012014756A5 publication Critical patent/JP2012014756A5/ja
Application granted granted Critical
Publication of JP5201174B2 publication Critical patent/JP5201174B2/ja
Priority to US14/278,490 priority patent/US9516747B2/en
Priority to US15/338,860 priority patent/US20170048987A1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010147528A 2010-06-29 2010-06-29 サスペンション用基板およびその製造方法 Expired - Fee Related JP5201174B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010147528A JP5201174B2 (ja) 2010-06-29 2010-06-29 サスペンション用基板およびその製造方法
US13/171,662 US8758910B2 (en) 2010-06-29 2011-06-29 Substrate for suspension, and production process thereof
US14/278,490 US9516747B2 (en) 2010-06-29 2014-05-15 Substrate for suspension, and production process thereof
US15/338,860 US20170048987A1 (en) 2010-06-29 2016-10-31 Substrate for suspension, and production process thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010147528A JP5201174B2 (ja) 2010-06-29 2010-06-29 サスペンション用基板およびその製造方法

Publications (3)

Publication Number Publication Date
JP2012014756A JP2012014756A (ja) 2012-01-19
JP2012014756A5 true JP2012014756A5 (enrdf_load_stackoverflow) 2012-08-30
JP5201174B2 JP5201174B2 (ja) 2013-06-05

Family

ID=45601010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010147528A Expired - Fee Related JP5201174B2 (ja) 2010-06-29 2010-06-29 サスペンション用基板およびその製造方法

Country Status (1)

Country Link
JP (1) JP5201174B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6166511B2 (ja) * 2012-03-30 2017-07-19 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンションおよびハードディスクドライブ
JP6027819B2 (ja) * 2012-08-20 2016-11-16 日東電工株式会社 配線回路基板
JP6128439B2 (ja) * 2013-10-04 2017-05-17 大日本印刷株式会社 多面付サスペンション用基板、サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスクドライブ
JP2015156246A (ja) * 2014-02-21 2015-08-27 株式会社東芝 ヘッドジンバルアッセンブリおよびこれを備えたディスク装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3605497B2 (ja) * 1997-07-11 2004-12-22 日本発条株式会社 ディスク装置用サスペンション
JP3988420B2 (ja) * 2001-09-19 2007-10-10 Ｔｄｋ株式会社 薄膜磁気ヘッド用配線部材、ヘッドジンバルアセンブリ、ヘッドジンバルアセンブリの検査方法及びヘッドジンバルアセンブリの製造方法
JP3877631B2 (ja) * 2002-04-10 2007-02-07 日本発条株式会社 ディスクドライブ用サスペンションの配線部材
JP2007012111A (ja) * 2005-06-28 2007-01-18 Shinka Jitsugyo Kk 磁気ヘッドスライダを搭載するサスペンション及びヘッドジンバルアッセンブリ並びにハードディスクドライブ
US7433156B2 (en) * 2006-02-10 2008-10-07 Sae Magnetics (Hk) Ltd. Flexure for minimizing fly height modulation of near-contact recording sliders in a disk drive
US7813082B2 (en) * 2007-01-26 2010-10-12 Hutchinson Technology Incorporated Head suspension flexure with inline lead portions positioned at a level between levels of first and second surfaces of the spring metal layer

Similar Documents

Publication Publication Date Title
JP2013525918A5 (enrdf_load_stackoverflow)
JP2009194322A5 (enrdf_load_stackoverflow)
JP2008277742A5 (enrdf_load_stackoverflow)
JP2012235013A5 (enrdf_load_stackoverflow)
JP2009141121A5 (enrdf_load_stackoverflow)
JP2017516308A5 (enrdf_load_stackoverflow)
JP2011060925A5 (enrdf_load_stackoverflow)
JP2007208200A5 (enrdf_load_stackoverflow)
JP2010129899A5 (enrdf_load_stackoverflow)
JP2012014756A5 (enrdf_load_stackoverflow)
JP2018066819A5 (enrdf_load_stackoverflow)
JP2011134957A5 (enrdf_load_stackoverflow)
SG170744A1 (en) Circuit board and connection substrate
WO2008087851A1 (ja) フレキシブル基板及び半導体装置
JP2009081357A5 (enrdf_load_stackoverflow)
JP2012212712A5 (enrdf_load_stackoverflow)
JP2009004648A5 (enrdf_load_stackoverflow)
JP2019211676A5 (enrdf_load_stackoverflow)
JP2013128081A5 (enrdf_load_stackoverflow)
JP2006237581A5 (enrdf_load_stackoverflow)
JP2015106663A5 (enrdf_load_stackoverflow)
JP2015052628A5 (enrdf_load_stackoverflow)
JP2008010615A5 (enrdf_load_stackoverflow)
JP2012142434A5 (enrdf_load_stackoverflow)
JP2005317912A5 (enrdf_load_stackoverflow)