JP2012011534A - Ultrasonic vibration cutting tool and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fix an annular diamond blade to a resonator with solder without causing deformation.SOLUTION: The resonator 2 made from iron having Rockwell hardness HRC 45-60 includes a vibration body part 3, a vibration transformation part 4 which protrudes outward in radial direction from the outer peripheral surface of the vibration body part 3, and a blade fixing part 5 which protrudes outward in radial direction from the outer peripheral surface of the vibration transformation 4. An annular diamond blade 11 having thickness t of 40-500 μm is inserted into the resonator 2 in such manner as to surround the vibration transformation part 4. Since the diamond blade 11 is fixed to a blade fixing part 5 of the resonator 2 using a low melting-point solder 15, no difference in contraction/expansion occurs between the blade fixing part 5 of iron and the annular diamond blade 11, even affected thermally from soldering. Even after completion of soldering, the annular diamond blade 11 does not deform and is fixed to the resonator 2 by the low melting-point solder 15.

Description

  The present invention relates to an ultrasonic vibration cutting tool in which an annular diamond blade is appropriately fixed to a vibration conversion portion of a resonator with solder, and a method for manufacturing the same.

  As disclosed in Patent Document 1, the applicant has proposed an ultrasonic vibration cutting tool in which a diamond blade is fixed to a resonator made of aluminum with solder. This proposed ultrasonic vibration cutting tool has a structure in which an annular diamond blade is fixed to a blade fixing portion of a resonator made of aluminum with aluminum solder. When this ultrasonic vibration cutting tool is used for cutting a chip from a semiconductor wafer, it is required to form a diamond blade with a thickness of 40 to 500 μm. The thin annular diamond blade having a thickness of 40 to 500 μm is fitted to the vibration converting portion of the resonator made of aluminum so that the clearance of the fitting is reduced to be concentric, and the blade fixing portion is used for various types of aluminum. Tried to fix with solder. However, the melting point of the solder for aluminum is in the range of 270 to 400 ° C., and due to the thermal effect of soldering, the resonator made of aluminum expands and contracts more than the annular diamond blade. There was a drawback that the diamond blade would be deformed.

JP 2008-040443 A

  An object of the invention is to provide an ultrasonic vibration cutting tool that can be fixed to a resonator with solder so that an annular diamond blade is not deformed, and a method for manufacturing the same.

  In the ultrasonic vibration cutting tool according to the present invention, the resonator including the vibration main body and the vibration conversion portion protruding outward in the diameter direction from the outer peripheral surface of the vibration main body portion and the blade fixing portion of the vibration conversion portion is made of iron, An annular diamond blade is fitted into the resonator so as to surround the vibration converting portion, and is fixed to the blade fixing portion with low melting point solder. The method of manufacturing an ultrasonic vibration cutting tool according to the present invention includes a vibration main body, a vibration converting portion protruding outward in the diameter direction from the outer peripheral surface of the vibration main body portion, and protruding outward in the diameter direction from the outer peripheral surface of the vibration converting portion. A laminated body in which an annular diamond blade and a low melting point solder are interposed in a blade fixing portion of a resonator made of iron having a fixed blade fixing portion is mounted on a hot plate, and the hot plate depends on the melting temperature of the low melting point solder. The low-melting-point solder is melted by the heat applied from the hot plate and then cooled and solidified to fix the annular diamond blade to the blade fixing part by being electrically controlled to be in a heated state. It is characterized by.

  The ultrasonic vibration cutting tool and the manufacturing method thereof according to the present invention can be soldered without causing a difference in expansion and contraction between the blade fixing portion made of iron and the annular diamond blade even when thermally affected by soldering. After completion, there is an effect that the annular diamond blade can be fixed to the resonator by soldering so as not to be deformed.

The front view which shows the ultrasonic vibration cutting tool which concerns on embodiment. The disassembled perspective view which shows the resonator and tiremond blade which concern on embodiment. The longitudinal cross-sectional view cut | disconnected along the centerline which shows the resonator and tiremond blade which concern on embodiment. The schematic diagram which shows the method of fixing the tiremond blade which concerns on embodiment to a resonator with a low melting-point solder. The schematic diagram which shows the method different from FIG. 4 which fixes the tiremond blade which concerns on embodiment to a resonator with a low melting-point solder. The longitudinal cross-sectional view cut | disconnected along the centerline which shows the resonator and tire-mondo blade by the aspect of the pre-processing performed before fixing the tire-mond blade which concerns on embodiment to a resonator with a low melting-point solder. The front view which combined the booster and the vibrator | oscillator with the ultrasonic vibration cutting tool which concerns on embodiment. The side view of the rotary ultrasonic vibration cutting device which concerns on embodiment.

  Referring to FIG. 1, an ultrasonic vibration cutting tool 1 includes a vibration body 4 and a vibration converter 4 and a vibration converter 4 in which a resonator 2 made of iron protrudes outward from the outer peripheral surface of the vibration body 3 and the vibration body 3 in the diameter direction. And an annular diamond blade 11 is fitted into the resonator 2 so as to surround the vibration converting portion 4, and the diamond blade 11 is a blade of the resonator 2. The fixing part 5 is fixed with a low melting point solder 15.

  In the ultrasonic vibration cutting tool 1 shown in FIG. 1, the resonator 2 is made of iron and has a hardness of HRC45 to 60 in order to reduce the coefficient of thermal expansion. HRC is an abbreviation for Rockwell hardness. As the diamond blade 11, a diamond blade having a thickness t of 40 to 500 μm was used. The thickness t of the diamond blade 11 is a dimension in a direction parallel to the center line L of the resonator 2. As the low melting point solder 15, the low melting point solder 15 having a melting temperature of 70 to 175 ° C. was used. A blade fitting portion 6 is provided on the outer peripheral surface of the vibration converting portion 4 of the resonator 2 so as to protrude outward in the diameter direction, and an annular diamond blade 11 is externally fitted to the blade fitting portion 6. It has become. Thus, a structure in which a thin annular diamond blade 11 having a thickness of 40 to 500 μm is fitted to the blade fitting portion 6 of the resonator 2 made of iron so as to be concentric with a reduced clearance. In the case of adoption, there is no difference in expansion and contraction between the resonator 2 made of iron and the annular diamond blade 11 even if it is thermally affected by soldering. Did not deform.

  In addition, a structure in which a thin annular diamond blade 11 having a thickness of 40 to 500 μm is fitted to the blade fitting portion 6 of the resonator 2 made of iron so as to be concentric with a reduced clearance is adopted. Even when the annular diamond blade 11 is fitted from one end of the resonator 2 so as to surround the vibration converting portion 4, the annular diamond blade 11 is easily fitted so as not to contact the vibration converting portion 4, and the annular diamond blade 11 is damaged. There is an advantage of not receiving. That is, a structure in which the blade fitting portion 6 is not provided may be used, but in that case, when the annular diamond blade 11 is fitted from one end of the resonator 2 so as to surround the vibration converting portion 4, the vibration converting portion. It is necessary to insert it with care so as not to be damaged even if it contacts 4.

  A rough structure of the resonator 2 and the annular diamond blade 11 will be described with reference to FIG. The resonator 2 will be described. The resonator 2 includes a vibration main body portion 3, a vibration conversion portion 4, a blade fixing portion 5, a blade fitting portion 6, a component connecting portion 7, and a tool fitting portion 8. The component connecting portion 7 is for coupling a booster or a vibrator to the resonator 2 and is a screw hole recessed inward from the end face of the vibration converting portion 4 so as to attach a connecting tool such as a stud bolt. As provided on both left and right end faces of the vibration main body 3. In FIG. 2, only the component connection part 7 provided in the right end surface of the vibration conversion part 4 is shown in figure. The annular diamond blade 11 will be described. The annular diamond blade 11 has an annular plate shape that is externally fitted to the blade fitting portion 6.

  When the booster or the vibrator is coupled to the resonator 2, the tool fitting unit 8 fits the resonator 2 and the booster (see FIG. 7) or the vibrator (see FIG. 7) by fitting a tool (not shown). As shown in FIG. 2, it is provided on both left and right end surfaces of the vibration converting unit 4 as concave portions recessed inward from the end surface of the vibration converting unit 4. In FIG. 2, only the tool fitting part 8 provided in the right end surface of the vibration conversion part 4 is shown in figure. The tool fitting portion 8 may be provided on the outer peripheral surface of the vibration main body portion 3.

  A detailed structure of the resonator 2 and the annular diamond blade 11 will be described with reference to FIG. The vibration main body 3 has a rod shape that resonates with ultrasonic vibration input from one of the left and right ends, and may have a length that is an integral multiple of ½ wavelength of the resonance frequency. An example of a half wavelength is shown. At both left and right ends of the vibration main body 3, there are maximum vibration amplitude points f1; f3 of the vibration waveform W1 indicating an instantaneous displacement (vibration amplitude) that vibrates in the transmission direction X of the ultrasonic vibration. There is a minimum vibration amplitude point f2 of the vibration waveform W1 in the center.

  The vibration conversion unit 4 protrudes concentrically with the vibration main body 3 in the diameter direction Y orthogonal to the transmission direction X of ultrasonic vibration from the outer peripheral surface of the vibration main body 3 at the position of the minimum vibration amplitude point f2 of the vibration waveform W1. It has a larger diameter than the vibration main body 3 and a width equally distributed on both sides of the ultrasonic vibration transmission direction X around the minimum vibration amplitude point f2, and the ultrasonic vibration transmission direction X is the diameter from the axial direction. Transform into the diametric direction which is the direction Y. The transmission direction X is the same as the direction in which the center line L of the resonator 2 extends. The instantaneous displacement (vibration amplitude) of the ultrasonic vibration converted in the diameter direction Y is a vibration waveform W2. The maximum vibration amplitude point f4; f5 in the vibration waveform W2 exists on the outer peripheral surface of the vibration converting unit 4.

  The thickness of the vibration converting portion 4 is smaller than the thickness from one end to the other end of the vibration main body portion 3. The blade fixing portion 5 protrudes concentrically with the vibration main body portion 3 on the outer side in the diameter direction Y from the outer peripheral surface of the vibration converting portion 4. The thickness of the blade fixing portion 5 is smaller than the thickness of each of the vibration converting portions 4 on both sides of the blade fixing portion 5. The blade fitting portion 6 protrudes outward in the diameter direction Y from the outer peripheral surface of the vibration converting portion 4 and is connected to one of the left and right end surfaces of the blade fixing portion 5. The thickness of the blade fitting portion 6 is smaller than the thickness of the vibration converting portion 4 on the protruding side of the blade fitting portion 6. The thickness of the vibration main body portion 3, the thickness of the vibration conversion portion 4, the thickness of the blade fixing portion 5, and the thickness of the blade fitting portion 6 are dimensions in a direction parallel to the center line L of the resonator 2.

  The annular diamond blade 11 has a structure in which a large number of diamond particles are bonded with a metal layer made of nickel by a diamond electrolytic plating method.

  In FIG. 3, when the outer diameter of the blade fitting portion 6 is L1, the outer diameter of the blade fixing portion 5 is L2, the inner diameter of the annular diamond blade 11 is L3, and the outer diameter of the annular diamond blade 11 is L4. , L1 <L2, L1 ≦ L3 <L2, and L2 <L4. If the center hole 12 constituting the inner diameter L3 of the diamond blade 11 is fitted so as to be in close contact with the outer peripheral surface constituting the outer diameter L1 of the blade fitting portion 6 in L1 ≦ L3, the annular diamond blade 11 Is fitted into the blade fitting portion 6 so that the center of the annular diamond blade 11 coincides with the center of the resonator 2.

  With reference to FIG. 4, the manufacturing method of the ultrasonic vibration cutting tool 1 is demonstrated. When the ultrasonic vibration cutting tool 1 is manufactured, the resonator 2 made of iron, the annular diamond blade 11, the low melting point solder 15, and the hot plate 17 are prepared. The resonator 2 and the annular diamond blade 11 are in the form shown in FIGS. The low melting point solder 15 is a hard solid or a soft paste. When the low melting point solder 15 is solid, it has an inner diameter that is the same as the inner diameter L3 (see FIG. 3) of the annular diamond blade 11, and an outer diameter that is the same as the blade fixing portion 5 and the outer diameter L2 (see FIG. 3). When the low melting point solder 15 is paste-like, it is applied to the surface of the blade fixing portion 5 on the side of the annular diamond blade 11 or the surface of the annular diamond blade 11 on the side of the blade fixing portion 5. In FIG. 4, the hot plate 17 is provided with a conversion portion accommodating portion 18 and an electric heater (not shown). The hot plate 17 is horizontally installed on an installation floor 19 such as a work table with a support 20 for heat insulation interposed therebetween.

  In order to manufacture the ultrasonic vibration cutting tool 1, first, as shown in FIG. 4, a laminated body including the resonator 2, the annular diamond blade 11, and the low melting point solder 15 is placed on the hot plate 17. In that case, the vibration main body 3 is arranged such that the end face of the blade fixing part 5 on the side where the blade fitting part 6 is not provided is in contact with and supported by the upper surface of the hot plate 17 around the conversion part accommodating part 18. After one end portion is inserted into the conversion portion accommodating portion 18 from above the hot plate 17, one end portion of the vibration converting portion 4 is accommodated in the conversion portion accommodating portion 18. As a result, the annular diamond blade 11 has the low-melting-point solder 15 interposed therebetween so that the end face in the thickness t direction of the annular diamond blade 11 is parallel to the diameter direction Y in the resonator 2. Mounted on top.

  Next, as shown in FIG. 4, after the laminated body composed of the resonator 2, the annular diamond blade 11, and the low melting point solder 15 is mounted on the hot plate 17, the electric heater (not shown) on the hot plate 17 is powered. Heated by supply. In that case, the power supply to the electric heater (not shown) in the hot plate 17 is controlled so that the hot plate 17 is in a heating state according to the melting temperature of the low melting point solder 15. Thereby, the low melting point solder 15 is melted by the heat applied from the hot plate 17 and then cooled and solidified to fix the annular diamond blade 11 to the blade fixing portion 5. That is, the ultrasonic vibration cutting tool 1 having the structure shown in FIG. 1 in which the annular diamond blade 11 is fixed to the blade fixing portion 5 of the resonator 2 made of iron with the low melting point solder 15 is manufactured.

  Although not shown in FIG. 4, the laminate composed of the resonator 2, the annular diamond blade 11, and the low melting point solder 15 is mounted on the hot plate 17, and the low melting point solder 15 is heated by the heat of the hot plate 17. In the period until it starts to melt, the annular weight stone is externally fitted to the blade fitting portion 6 from above the resonator 2 via the upper vibration main body portion 3 and the upper vibration converting portion 4 to form an annular diamond blade. When placed on 11, the annular diamond blade 11 is fixed by the low melting point solder 15 in the vicinity of the blade fixing portion 5.

  With reference to FIG. 5, the manufacturing method of the ultrasonic vibration cutting tool 1 different from FIG. 4 is demonstrated. When the ultrasonic vibration cutting tool 1 is manufactured, the resonator 2 made of iron, the annular diamond blade 11, the low melting point solder 15, and the hot plate 17 are prepared. The resonator 2 and the annular diamond blade 11 are in the form shown in FIGS. The low melting point solder 15 is a hard solid or a soft paste. When the low melting point solder 15 is solid, it has the same inner diameter as the inner diameter L3 (see FIG. 3) of the annular diamond blade 11 and the outer diameter L2 (see FIG. 3) of the blade fixing portion 5. When the low melting point solder 15 is paste-like, it is applied to the surface of the blade fixing portion 5 on the side of the annular diamond blade 11 or the surface of the annular diamond blade 11 on the side of the blade fixing portion 5. In FIG. 5, the hot plate 17 is provided with a fitting portion accommodating portion 21 and an electric heater (not shown). The hot plate 17 is horizontally installed on an installation floor 19 such as a work table with a support 20 for heat insulation interposed therebetween.

  In order to manufacture the ultrasonic vibration cutting tool 1, first, as shown in FIG. 5, a laminated body including the resonator 2, the annular diamond blade 11, and the low melting point solder 15 is placed on the hot plate 17. In that case, the other end portion of the vibration main body portion 3 is fitted from above the hot plate 17 so that the annular diamond blade 11 is supported in contact with the upper surface of the hot plate 17 around the fitting portion accommodating portion 21. After being inserted into the part accommodating part 21, the blade fitting part 6 is accommodated in the fitting part accommodating part 21. As a result, the blade fixing portion 5 has the low melting point solder 15 interposed therebetween so that the end face in the thickness t direction of the annular diamond blade 11 is parallel to the diameter direction Y in the resonator 2. Mounted on top.

  Next, as shown in FIG. 5, after the laminated body composed of the resonator 2, the annular diamond blade 11, and the low melting point solder 15 is mounted on the hot plate 17, the electric heater (not shown) on the hot plate 17 is powered. Heated by supply. In that case, the power supply to the electric heater (not shown) in the hot plate 17 is controlled so that the hot plate 17 is in a heating state according to the melting temperature of the low melting point solder 15. Accordingly, the resonator 2 functions as a weight, and the low melting point solder 15 is melted by the heat applied from the hot plate 17 and then cooled and solidified to fix the annular diamond blade 11 to the blade fixing portion 5. That is, the ultrasonic vibration cutting tool 1 having the structure shown in FIG. 1 in which the annular diamond blade 11 is fixed to the blade fixing portion 5 of the resonator 2 made of iron with the low melting point solder 15 is manufactured.

  In FIG. 5, it is also possible to provide a conversion portion accommodating portion 18 shown in FIG. 4 instead of the fitting portion accommodating portion 21. In that case, by setting the thickness of the blade fitting portion 6 in the direction parallel to the center line L to be smaller than the thickness t of the annular diamond blade 11 (see FIG. 1), the annular diamond blade 11 is It comes into contact with and is supported by the upper surface of the hot plate 17.

  In short, the method of manufacturing the ultrasonic vibration cutting tool 1 shown in FIGS. 4 and 5 includes the vibration main body 3 and the vibration conversion unit 4 and the vibration conversion unit that protrude outward from the outer peripheral surface of the vibration main body 3 in the diameter direction Y. A laminated body in which an annular diamond blade 11 and a low-melting-point solder 15 are interposed in a blade fixing portion 5 of an iron resonator 2 having a blade fixing portion 5 protruding outward in the diameter direction Y from the outer peripheral surface of 4. The heat applied to the hot plate 17 is electrically controlled so that the hot plate 17 is heated in accordance with the melting temperature of the low melting point solder 15, whereby the low melting point solder 15 is applied with heat applied from the hot plate 17. And then solidifying by cooling and fixing the annular diamond blade 11 to the blade fixing portion 5.

  According to the method for manufacturing the ultrasonic vibration cutting tool 1 shown in FIGS. 4 and 5, iron having a Rockwell hardness of HRC 45 to 60 is used as iron constituting the resonator 2, and 40 to 500 μm is used as the diamond blade 11. The diamond blade 11 having a thickness t is used, and the low melting point solder 15 having a melting temperature of 70 to 175 ° C. is used as the low melting point solder 15. There was no difference in expansion and contraction between the blade fixing portion 5 and the annular diamond blade 11, and the annular diamond blade 11 was not deformed after the soldering was completed.

  After the ultrasonic vibration cutting tool 1 shown in FIG. 1 is manufactured through the steps shown in FIG. 4 or FIG. 5, the ultrasonic vibration cutting tool 1 is attached to a centering device (not shown) and the core of the annular diamond blade 11 is attached. Take out. For this purpose, the ultrasonic vibration cutting tool 1 is taken out from the hot plate 17 shown in FIG. 4 or 5 and attached to the rotation mechanism of the centering device. In that case, the vibration main body portion of the resonator 2 is used so that the resonator 2 is supported from one side or both sides by the rotation mechanism of the centering device using one or both of the component connecting portions 7 in FIG. 3 is attached to the rotation mechanism of the centering device. In this state, after the rotation mechanism of the centering device is driven by the motor, the annular diamond blade 11 is rotated from the outside in the diameter direction Y of the annular diamond blade 11 driven by a polishing material such as a grindstone in the centering device. It is in contact with the outer peripheral surface. Thereby, the annular diamond blade 11 is centered so as to be circular with the center line L of the resonator 2 shown in FIG.

  Even when the fitting clearance between the diamond blade 11 and the blade fitting portion 6 is reduced, when the annular diamond blade 11 is fixed to the resonator 2 made of iron with the low melting point solder 15, the diamond blade 11 Is not distorted and is not deformed, and the centering operation time is shortened. Further, if the clearance of the engagement between the diamond blade 11 and the blade fitting portion 6 is set to a minimum so that the annular diamond blade 11 is fitted in close contact with the outer peripheral surface of the blade fitting portion 6, the annular diamond is obtained. When the blade 11 is fitted into the blade fitting portion 6, the center of the annular diamond blade 11 and the center of the resonator 2 are concentric, so that the centering operation is not necessary.

  Referring to FIG. 6, before soldering the annular diamond blade 11 to the resonator 2, a surface on which the annular diamond blade 11 is soldered and a surface on which the blade fixing portion 5 of the resonator 2 is half-attached. The pretreatment for applying the tin plating 22; The pretreatment shown in FIG. 6 may or may not be performed before the annular diamond blade 11 shown in FIG. 4 or 5 is fixed to the resonator 2 with the low melting point solder 15. Although the number of manufacturing steps is increased, if the tin plating 22; 23 is performed, the low melting point solder 15 is easily adapted to the annular diamond blade 11 and the blade fixing portion 5 of the resonator 2 in the step shown in FIG.

  With reference to FIG. 7, the form with which the ultrasonic vibration cutting tool 1 is used for an ultrasonic vibration cutting process is demonstrated. A booster 25 is coupled to one end of the resonator 2 by a coupling tool 26 such as a stud bolt, and a vibrator 27 is coupled to one end of the booster 25 by a coupling tool 28 such as a stud bolt. The booster 25 may be made of a metal having good acoustic characteristics, and may have a length that is an integral multiple of ½ wavelength that resonates with the ultrasonic vibration transmitted from the vibrator 27. FIG. Is illustrated. At both ends of the booster 25, there are maximum vibration amplitude points f11 and f15 of the vibration waveform W1. When the resonator 2 and the booster 25 are coupled by a connecting tool 26 such as a stud bolt, one resonator 2 is configured. The booster 25 includes front and rear support portions 29 and a tool fitting portion (not shown). The support portion 29 has an annular shape that protrudes outward in the diameter direction Y from the outer surface of the booster 25 at the position of the minimum vibration amplitude point f12; f14 of the booster 25.

  Then, in a state where the support portion 29 is supported by the ultrasonic vibration rotating mechanism 31 (see FIG. 8), when the vibrator 27 generates ultrasonic vibration with electric energy, the ultrasonic vibration causes the booster 25 to move from the vibrator 27. The resonator 2 resonates with the ultrasonic vibration transmitted from the vibrator 27, and the outer peripheral surface of the annular diamond blade 11 vibrates in the diameter direction indicated by the arrow Y. The fact that the outer peripheral surface of the annular diamond blade 11 vibrates in the diameter direction is determined by the amount of protrusion from the vibration converting portion 4. If the diameter of the annular diamond blade 11 is too larger than the diameter of the vibration converting portion 4, the outer peripheral surface of the annular diamond blade 11 will also vibrate in the arrow X direction. Based on the diameter of the conversion part 4, the blade edge is determined within a range in which it vibrates only in the arrow Y direction. For example, the resonance frequency is 18 to 55 kHz, the blade height protruding outward in the diameter direction Y from the blade fixing portion 5 of the annular diamond blade 11 is 0.2 to 20 mm, and the vibration amplitude of the outer peripheral surface of the annular diamond blade 11 is It was used in a range not including zero of 30 μm or less. In FIG. 7, the resonator 2 and the booster 25 may be the resonator 2 of the form comprised from the single metal material, without couple | bonding with the coupling tool 26 like a stud bolt.

  With reference to FIG. 8, the cutting process using the ultrasonic vibration cutting tool 1 is demonstrated. A description will be given of an example of a cutting process in which a semiconductor wafer 34 such as an IC as a member to be cut is cut into dice-like semiconductor chips called bare chips. The booster 25 and the vibrator 27 shown in FIG. 7 are incorporated concentrically inside the ultrasonic vibration rotating mechanism 31 of the ultrasonic vibration cutting device 30 shown in FIG. 8, and the support portions 29 shown in FIG. The annular diamond blade 11 shown in FIG. 1 of the ultrasonic vibration cutting tool 1 attached to the ultrasonic vibration rotating mechanism 31 shown in FIG. 8 is disposed outside the ultrasonic vibration rotating mechanism 31 shown in FIG. Further, the semiconductor wafer 34 is fixed to the mounting base 32 of the ultrasonic vibration cutting device 30.

  Then, the ultrasonic vibration rotating mechanism 31, the three-axis drive mechanism 33 of the ultrasonic vibration cutting device 30 and the vibrator 27 of FIG. 7 operate, and the annular diamond blade 11 rotates in one direction and resonates with ultrasonic vibration. However, by drawing a square locus by linear movement in the front / rear, left / right, up / down directions, the circular diamond blade 11 is cut once in one direction with respect to the semiconductor wafer 34 in one locus of the square. The semiconductor wafer 34 is cut into a plurality of strips by repeating the movement of drawing a square locus by the three-axis drive mechanism 33. When this strip-shaped cutting is completed, the mounting table 32 rotates 90 degrees in the horizontal direction and stops, and the orientation of the semiconductor wafer 34 with respect to the ultrasonic vibration rotating mechanism 31 is changed 90 degrees in the horizontal plane. In this state, the operations of the ultrasonic vibration rotating mechanism 31, the triaxial drive mechanism 33, and the vibrator 27 of FIG. 7 are resumed, and the annular diamond blade 11 cuts the strip-shaped semiconductor wafer 34 into a plurality of dice. Thus, the cutting operation for one semiconductor wafer 34 is completed.

DESCRIPTION OF SYMBOLS 1 is an ultrasonic vibration cutting tool, 2 is a resonator, 3 is a vibration main body part, 4 is a vibration conversion part, 5 is a blade fixing part, 6 is a blade fitting part, 7 is a component connection part, 8 is a tool fitting part , 9; 10 is a missing number, 11 is a diamond blade, 12 is a central hole, 13; 14 is a missing number, 15 is a low melting point solder, 16 is a missing number, 17 is a hot plate, 18 is a conversion portion accommodating portion, and 19 is an installation floor surface. , 20 is a support base, 21 is a fitting portion accommodating portion, 22; 23 is tin-plated, 24 is a missing number, 25 is a booster, 26 is a connection tool, 27 is a vibrator, 28 is a connection tool, 29 is a support portion, 30 Is an ultrasonic vibration cutting device, 31 is an ultrasonic vibration rotation mechanism, 32 is a mounting base, 33 is a three-axis drive mechanism, and 34 is a semiconductor wafer.

Claims (6)

  The resonator having the vibration main body, the vibration converting portion protruding outward in the diameter direction from the outer peripheral surface of the vibration main body portion, and the blade fixing portion protruding outward in the diameter direction from the outer peripheral surface of the vibration converting portion is made of iron and has an annular shape An ultrasonic vibration cutting tool characterized in that the diamond blade is fitted into a resonator so as to surround the vibration converting portion and fixed to the blade fixing portion with a low melting point solder.   On the outer peripheral surface of the vibration conversion portion of the resonator, a blade fitting portion for externally fitting an annular diamond blade protrudes outward in the diametrical direction and is connected to one of the left and right end surfaces of the blade fixing portion. The ultrasonic vibration cutting tool according to claim 1, wherein the ultrasonic vibration cutting tool is provided.   The ultrasonic vibration cutting tool according to claim 1, wherein iron having a Rockwell hardness of HRC 45 to 60 is used as iron constituting the resonator.   The ultrasonic vibration cutting tool according to claim 1, wherein an annular diamond blade having a thickness of 40 to 500 µm is used as the annular diamond blade.   The ultrasonic vibration cutting tool according to claim 1, wherein a low melting point solder having a melting temperature of 70 to 175 ° C is used as the low melting point solder.   Blade fixing of a resonator made of iron having a vibration main body, a vibration converting portion protruding outward in the diameter direction from the outer peripheral surface of the vibration main portion, and a blade fixing portion protruding outward in the diameter direction from the outer peripheral surface of the vibration converting portion A laminated body in which a low-melting point solder is interposed in a circular diamond blade is attached to a hot plate, and the heating is controlled electrically so that the hot plate is in a heating state corresponding to the melting temperature of the low-melting point solder. The ultrasonic vibration cutting tool according to claim 1, wherein the low melting point solder is melted by heat applied from a hot plate and then cooled and solidified to fix the annular diamond blade to the blade fixing portion. How to manufacture.

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