JP2012009768A - Piezoelectric electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric electronic component which absorbs impact from an exterior portion with first and second cases and prevents ambient air from intruding into an interior portion.SOLUTION: A piezoelectric electronic component 1 includes a piezoelectric member 5 having a vibration region, case members 14 and 15, each of which forms a clearance with the vibration region of the piezoelectric member 5 to house the piezoelectric member 5. The case members 14 and 15 cover end surfaces of the piezoelectric member 5 and has a first case 14 and a second case 15 holding end portions of the piezoelectric member 5.

Description

  The present invention relates to a piezoelectric electronic component such as a piezoelectric oscillator, an acceleration sensor, and a piezoelectric power generation component.

  2. Description of the Related Art Conventionally, microcomputers have been used for communication devices and electronic devices, and piezoelectric oscillators incorporating piezoelectric members have been widely used as clock sources for such microcomputers.

  Conventionally, an acceleration sensor with a built-in piezoelectric member has been used for applications such as detection of external impact applied to an electronic device such as a hard disk drive.

  Further, conventionally, a piezoelectric power generation component incorporating a piezoelectric member has been used as an energy conversion component that converts energy from vibration or heat into electrical energy.

  As such a piezoelectric electronic component, for example, Patent Document 1 proposes a piezoelectric electronic component in which the piezoelectric member is sandwiched between a pair of cases with the end face of the piezoelectric member exposed.

JP 7-74578 A

  However, in the piezoelectric electronic component disclosed in Patent Document 1, since the end face of the piezoelectric member is exposed, the boundary portion between the piezoelectric member and the case is also exposed. Therefore, since this boundary portion is not covered with another member, there is a problem that the sealing performance of the space provided around the vibration portion of the piezoelectric member is deteriorated.

  The present invention has been made in view of the problems in the conventional techniques as described above, and an object thereof is to provide a piezoelectric electronic component having a high sealing performance.

  The piezoelectric electronic component of the present invention includes a piezoelectric member having a vibration region, and a case member that houses the piezoelectric member so as to provide a gap between the vibration region of the piezoelectric member. It has the 1st case and 2nd case which cover the end surface of a piezoelectric member and clamp the edge part of the said piezoelectric member, It is characterized by the above-mentioned.

  According to the piezoelectric electronic component of the present invention, a piezoelectric member having a vibration region and a case member that houses the piezoelectric member so as to provide a gap between the vibration region of the piezoelectric member are provided. Since the first case and the second case that cover the end surface of the piezoelectric member and sandwich the end portion of the piezoelectric member are included, the boundary portion between the piezoelectric member and the case member is covered with the case member. Therefore, the sealing performance of the space provided around the vibration part of the piezoelectric member can be improved.

(A) is a longitudinal cross-sectional view of the piezoelectric electronic component which shows an example of embodiment of the piezoelectric electronic component of this invention, (b) is before bonding a 1st case about the piezoelectric electronic component shown to (a). It is a top view which shows an example. It is a longitudinal cross-sectional view which shows the other example of embodiment of the piezoelectric member of the piezoelectric electronic component of this invention. (A) is a principal part enlarged view which shows one edge part of the piezoelectric electronic component shown in FIG. 1, (b)-(f) is respectively the piezoelectric electronic component of the other example of embodiment of this invention. It is a principal part enlarged view which shows one edge part. (A) is the longitudinal cross-sectional view which shows the example of the 1st case where the adhesive sheet was adhered and the upper side electrode material was arrange | positioned, (b) is the top view which looked at the 1st case shown to (a) from the downward direction It is. (A)-(e) is a longitudinal cross-sectional view for every process which shows an example of embodiment of the manufacturing method of the piezoelectric electronic component of this invention, respectively. (A) is a longitudinal cross-sectional view of the piezoelectric electronic component which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) adhere | attaches a 1st case about the piezoelectric electronic component shown to (a). It is a top view which shows an example before. It is a longitudinal cross-sectional view which shows the other example of embodiment of the piezoelectric member of the piezoelectric electronic component of this invention. It is a longitudinal cross-sectional view which shows the other example of embodiment of the piezoelectric member of the piezoelectric electronic component of this invention. (A) is a longitudinal cross-sectional view of the piezoelectric electronic component which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) adhere | attaches a 1st case about the piezoelectric electronic component shown to (a). It is a top view which shows an example before. (A) is a principal part enlarged view which shows the other edge part of the piezoelectric electronic component shown in FIG. 9, (b)-(e) is respectively the piezoelectric electronic component of the other example of embodiment of this invention. It is a principal part enlarged view which shows the other edge part. (A) is a principal part enlarged view which shows one edge part of the piezoelectric electronic component shown in FIG. 9, (b)-(e) is respectively the piezoelectric electronic component of the other example of embodiment of this invention. It is a principal part enlarged view which shows one edge part. (A) is a longitudinal cross-sectional view of the piezoelectric electronic component which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) adhere | attaches a 1st case about the piezoelectric electronic component shown to (a). It is a top view which shows an example before. (A) is a longitudinal cross-sectional view of the piezoelectric electronic component which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) adhere | attaches a 1st case about the piezoelectric electronic component shown to (a). It is a top view which shows an example before. (A) is a longitudinal cross-sectional view of the piezoelectric electronic component which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) adhere | attaches a 1st case about the piezoelectric electronic component shown to (a). It is a top view which shows an example before. (A) is a principal part enlarged view which shows the other edge part of the piezoelectric electronic component shown in FIG. 14, (b)-(e) is respectively the piezoelectric electronic component of the other example of embodiment of this invention. It is a principal part enlarged view which shows the other edge part. (A) is a principal part enlarged view which shows one edge part of the piezoelectric electronic component shown in FIG. 14, (b)-(e) is respectively the piezoelectric electronic component of the other example of embodiment of this invention. It is a principal part enlarged view which shows one edge part. (A) is a longitudinal cross-sectional view of the piezoelectric electronic component which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) adhere | attaches a 1st case about the piezoelectric electronic component shown to (a). It is a top view which shows an example before. (A) is a longitudinal cross-sectional view of the piezoelectric electronic component which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) adhere | attaches a 1st case about the piezoelectric electronic component shown to (a). It is a top view which shows an example before. (A) is a principal part enlarged view which shows one edge part of a piezoelectric electronic component. (A) is a longitudinal cross-sectional view of the piezoelectric electronic component which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) adhere | attaches a 1st case about the piezoelectric electronic component shown to (a). It is a top view which shows an example before. (A) is a longitudinal cross-sectional view of the piezoelectric electronic component which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) adhere | attaches a 1st case about the piezoelectric electronic component shown to (a). It is a top view which shows an example before. (A) is a longitudinal cross-sectional view of the piezoelectric electronic component which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) adhere | attaches a 1st case about the piezoelectric electronic component shown to (a). It is a top view which shows an example before. (A) is the longitudinal cross-sectional view in the XX line of the form shown to (b) and (c) which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) is (a). It is a top view which shows an example before adhering a 1st case about the piezoelectric electronic component shown to (c), (c) is a bottom view of the 1st case of the piezoelectric electronic component shown to (a). (A) is the longitudinal cross-sectional view in the XX line of the form shown to (b) and (c) which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) is (a). It is a top view which shows an example before adhering a 1st case about the piezoelectric electronic component shown to (c), (c) is a bottom view of the 1st case of the piezoelectric electronic component shown to (a). (A) is the longitudinal cross-sectional view in the XX line of the form shown to (b) and (c) which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) is (a). It is a top view which shows an example before adhering a 1st case about the piezoelectric electronic component shown to (c), (c) is a bottom view of the 1st case of the piezoelectric electronic component shown to (a). (A) is a longitudinal cross-sectional view of the piezoelectric electronic component which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) adhere | attaches a 1st case about the piezoelectric electronic component shown to (a). It is a top view which shows an example before. (A) is the longitudinal cross-sectional view in the XX line of the form shown to (c) which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) is the piezoelectric member shown to (a) It is a disassembled perspective view, (c) is a top view which shows an example before adhering a 1st case about the piezoelectric electronic component shown to (a). (A) is the longitudinal cross-sectional view in the XX line of the form shown to (c) which shows the other example of embodiment of the piezoelectric electronic component of this invention, (b) is the piezoelectric member shown to (a) It is a disassembled perspective view, (c) is a top view which shows an example before adhering a 1st case about the piezoelectric electronic component shown to (a).

(First embodiment)
1A includes a piezoelectric member 5, a case member (first case 14 and second case 15), an upper electrode material 16, a lower electrode material 17, and an adhesive material 18. is doing.

  The piezoelectric member 5 includes a piezoelectric substrate 2, a first electrode 3, and a second electrode 4. The piezoelectric substrate 2 has a rectangular shape. The first electrode 3 is provided from one end 6 to the center on the upper surface of the piezoelectric substrate 2. The second electrode 4 is provided on the lower surface of the piezoelectric substrate 2 from the other end 7 to the central portion so as to form a vibration region by facing each other with the first electrode 3 and the piezoelectric substrate 2 interposed therebetween. The piezoelectric member in the first to eleventh embodiments indicates a general piezoelectric element.

The case members (the first case 14 and the second case 15) have recesses 8 and 9, one indentation 10 and 11, and the other indentation 12 and 13, respectively, and accommodate the piezoelectric member 5. The recesses 8 and 9 oppose the upper surface or the lower surface of the piezoelectric member 5, and the recesses 8 and 9 provide a gap between the first and second case members 14 and 15 and the vibration region of the piezoelectric member 5. ing. The end surface of the piezoelectric member 5 is covered by the one recess 10, 11 and the other recess 12, 13, and both end portions 6, 7 of the piezoelectric member 5 are sandwiched.

  The upper electrode material 16 is provided from one recess 10 of the first case 14 to the outer surface, and is in contact with the first electrode 3 on the upper surface of the piezoelectric member 5.

  The lower electrode material 17 is provided from the other recess 13 of the second case 15 to the outer surface, and is in contact with the second electrode 4 on the lower surface of the piezoelectric member 5.

  The adhesive 18 bonds the periphery of the opening of the recess 8 of the first case 14 and the periphery of the opening of the recess 9 of the second case 15.

  With the above configuration, the boundary portion between the piezoelectric member and the case member is covered with the case member, so that the sealing performance of the space provided around the vibration portion of the piezoelectric member can be improved.

  Also, one end 6 of the piezoelectric member 5 is supported by one recess 10, 11 of each of the first and second cases 14, 15, and the other end 7 of the piezoelectric member 5 is supported by the first and second cases 14. , 15 is supported by the other recesses 12 and 13, and the periphery of the opening of the recess 8 of the first case 14 and the periphery of the opening of the recess 9 of the second case 15 are bonded by an adhesive 18, Since both end surfaces 6 and 7 of the member 5 are covered with the first case 14 and the second case 15, external shocks can be absorbed by the first and second cases 14 and 15. it can. Accordingly, it is possible to make it difficult for the impact to be transmitted to the piezoelectric member 5.

  Moreover, since it is possible to suppress the impact from being transmitted to the piezoelectric member 5, when the piezoelectric electronic component 1 is used as an acceleration sensor, it is possible to accurately detect the acceleration.

  The piezoelectric electronic component 1 is used as a piezoelectric oscillator, an acceleration sensor, or a piezoelectric power generation component. When the piezoelectric electronic component 1 is used as a piezoelectric oscillator, it is used as a clock source for a microcomputer or the like in communication equipment and electronic equipment. When the piezoelectric electronic component 1 is used as an acceleration sensor, charges generated by the distortion of the piezoelectric substrate 2 due to acceleration are detected via the first electrode 3 and the second electrode 4 on the upper and lower surfaces of the piezoelectric substrate 2. It is. When the piezoelectric electronic component 1 is used as the piezoelectric power generation component, energy from vibration or heat applied from the outside is converted into electric energy by the piezoelectric substrate 2, and the first and second electrodes on the upper and lower surfaces of the piezoelectric substrate 2 are converted. 3 and 4 are output.

The piezoelectric substrate 2 is composed of lead zirconate titanate (PbZr _1-x Ti _x O ₃ ), lead titanate (PbTiO ₃ ), sodium / potassium niobate (Na _1-x K _x NbO ₃ ), bismuth layered compound (example) : MBi ₄ Ti ₄ O ₁₅ , M: a divalent alkaline earth metal element) or the like, or a piezoelectric single crystal such as quartz or lithium tantalate (LiTaO ₃ ).

  The piezoelectric substrate 2 has, for example, a rectangular parallelepiped shape having a length of 0.5 to 15 mm, a width of 0.2 to 10 mm, and a thickness of 50 μm to 2 mm.

  Further, when the piezoelectric electronic component 1 is used as a piezoelectric oscillator, the piezoelectric substrate 2 does not need to have a uniform thickness over the entire surface. For the purpose of improving the energy confinement of thickness vibration and improving the resonance characteristics, for example, The thickness of the piezoelectric substrate 2 in the vibration region where the first electrode 3 and the second electrode 4 are opposed to each other can be formed thinner or thicker than the surrounding region.

Further, when the piezoelectric electronic component 1 is used as an acceleration sensor and a piezoelectric power generation component, for example, the thickness of the central portion of the piezoelectric substrate 2 is formed thick, so that the thickness of the piezoelectric substrate 2 is increased to increase the vibration displacement. In addition, the charge output can be increased. In particular, the piezoelectric substrate 2 is preferably a laminated body in which electrodes are provided, from the viewpoint that the output of charges can be increased.

  When the piezoelectric electronic component 1 is used as a piezoelectric oscillator, the relative dielectric constant value of the piezoelectric substrate 2 is preferably 1000 or less from the viewpoint of excellent resonance characteristics in a high frequency region. Further, when the piezoelectric electronic component 1 is used as an acceleration sensor and a piezoelectric power generation component, the relative dielectric constant of the piezoelectric substrate 2 is preferably 1000 or more from the viewpoint of increasing the output of charges.

When the piezoelectric substrate 2 is made of a ceramic material, the raw material powder is pressed by adding a binder, or the raw material powder is mixed with water and a dispersing agent using a ball mill and then dried, and a binder, a solvent, a plasticizer, etc. are added. Then, a green sheet is formed by a method such as molding by a doctor blade method, and then a substrate is formed by baking at a peak temperature of 1100 to 1400 ° C. for 0.5 to 8 hours, and at a temperature of 80 to 200 ° C., for example, A piezoelectric substrate 2 having desired piezoelectric characteristics is obtained by applying a polarization treatment by applying a voltage of 3 to 6 kV / mm in the thickness direction.

  In addition, when the piezoelectric substrate 2 is made of a piezoelectric single crystal material, the piezoelectric single crystal material ingot (base material) that becomes the piezoelectric substrate 2 is cut so as to have a predetermined crystal direction, thereby providing desired piezoelectric characteristics. Thus obtained piezoelectric substrate 2 is obtained.

The first and second electrodes 3 and 4 are preferably made of a metal film such as gold, silver, copper or aluminum from the viewpoint of conductivity. The thickness of the first and second electrodes 3 and 4 is preferably in the range of 0.1 to 5 μm. By making the metal film to be the first and second electrodes 3 and 4 thicker than 0.1 μm, for example, when exposed to a high temperature in the atmosphere, it is possible to suppress a decrease in conductivity due to oxidation. . In addition, by making the metal film thinner than 5 μm, it is possible to prevent the metal film from being peeled off by stress.

For the deposition of the metal film to be the first and second electrodes 3 and 4, a vacuum vapor deposition method, a CVD (Chemical Vapor Deposition) method, a sputtering method, or the like can be used.

  At this time, in order to improve the adhesion between the piezoelectric substrate 2 and the first and second electrodes 3 and 4, for example, a base made of a metal having high adhesion to the ceramic material constituting the piezoelectric substrate 2, such as chromium. An electrode layer may be provided in advance, and a desired metal film may be provided thereon.

  Moreover, the 1st and 2nd electrodes 3 and 4 can also be formed by baking the conductive paste which contains metal fillers, such as silver or copper, and uses low temperature glass as a binder at predetermined temperature, for example. In this case, the thickness of the first and second electrodes 3 and 4 is preferably in the range of 5 to 30 μm. By making the electrode film to be the first and second electrodes 3 and 4 thicker than 5 μm, it is possible to suppress an increase in conduction resistance due to poor contact between the metal fillers. Further, by making the thickness thinner than 30 μm, it is possible to prevent the vibration characteristics of the piezoelectric substrate 2 from deteriorating due to the mass effect of the first and second electrodes 3 and 4.

The dimensions of the first and second electrodes 3 and 4 are appropriately set according to the dimensions of the piezoelectric substrate 2. For example, when the dimensions of the piezoelectric substrate 2 are 2 mm in length, 0.5 mm in width, and 0.2 mm in thickness, the dimensions of the first and second electrodes 3 and 4 are the dimensions in the length direction of the piezoelectric substrate 2. Is 1.5 mm, the dimension in the width direction of the piezoelectric substrate 2 is 0.5 mm, and the thickness is 1 μm.

FIG. 2 shows another example of the configuration of the first and second electrodes 3 and 4. As shown in FIG. 2, the first electrode 3 is connected to the counter electrode portion 3 a and the counter electrode portion 3 a provided from one end 6 to the center on the upper surface and inside of the piezoelectric substrate 2. The second electrode 4 is formed from the other end portion 7 to the center portion on the lower surface and inside of the piezoelectric substrate 2 and is opposed to the counter electrode portion 3a, and the counter electrode portion 4a. It consists of the connection electrode part 4b which has connected mutually.

  By adopting such a configuration, for example, it is possible to increase the charge output when the piezoelectric electronic component 21 is used as an acceleration sensor or a piezoelectric power generation component.

  In the case of manufacturing a laminated piezoelectric substrate 2 having electrodes provided therein, a green body and internal electrodes are alternately laminated to form a laminated body, and after firing the laminated body, A piezoelectric substrate 2 is obtained by subjecting the piezoelectric layer to polarization treatment.

  As the material of the first case 14 and the second case 15, for example, an ultraviolet curable resin material or a thermosetting resin material such as a phenol resin, a polyimide resin, or an epoxy resin is used. A thermoplastic resin such as polyetheretherketone can also be used. When these resin materials are used, the first case 14 and the second case 15 can be thinned, and the first and second cases 14 and 15 are hardly broken, which is preferable. Further, as the material of the first and second cases 14 and 15, for example, a ceramic material such as alumina, aluminum nitride, or silicon nitride can be used. Use of these ceramic materials is preferable from the viewpoint of excellent rigidity.

The overall dimensions of the first case 14 and the second case 15 are appropriately set according to the dimensions of the piezoelectric member 5. For example, the length is 0.7 to 20 mm, the width is 0.5 to 15 mm, and the thickness is 0.1 mm to
2 mm. Further, the dimensions of the recesses of the first and second cases 14 and 15 are, for example, 0.4 mm in length.
It is ˜18 mm, the width is 0.3 to 13 mm, and the depth is 50 μm to 1.5 mm.

  The dimensions of the one and the other recesses 10 to 13 are appropriately set according to the dimensions of the piezoelectric substrate 2, the first and second cases 14 and 15, and the recesses 8 and 9. For example, the dimensions of the piezoelectric substrate 2 are 2 mm in length, 0.5 mm in width, and 0.2 mm in thickness, and the overall dimensions of the first and second cases 14 and 15 are 2.5 mm in length and width. Is 1.3 mm, the thickness is 0.25 mm, the dimensions of the recesses 8 and 9 are 1.8 mm in length, 0.9 mm in width, and 0.15 mm in depth. The dimensions of the recesses 10 to 13 are 0.15 mm in the length direction of the piezoelectric substrate 2, 0.6 mm in the width direction of the piezoelectric substrate 2, and 0.1 mm in the thickness direction of the piezoelectric substrate 2. is there.

  The upper electrode material 16 is formed, for example, by applying a conductive paste made of a thermosetting resin containing a metal filler made of a conductive material and then curing it at a predetermined temperature. Or it forms using the sheet-like electrode material which consists of a resin sheet containing the metal filler which consists of electrically conductive materials. The thickness of the upper electrode material 16 in these cases is preferably in the range of 5 to 50 μm. The metal filler is spherical or needle-shaped, and is made of a metal material such as silver or copper.

Further, the upper electrode material 16 has flexibility and adhesiveness in a state where the piezoelectric electronic component 1 is manufactured, and has elasticity in a state after the piezoelectric electronic component 1 is manufactured. It is preferable that it is a sheet-like electrode material. In such a case, since the upper electrode material 16 has flexibility in the state where the piezoelectric electronic component 1 is manufactured, the surface around the opening of the recess 8 of the first case 14 from the inner surface of the recess. The upper electrode material 16 can be securely adhered to the first case 14 along the step shape provided over a part of the first case 14. In addition, the upper electrode material 16 that is a sheet-like electrode material bonded to the first case 14 is easier to control the thickness than the case where the conductive paste is used, and the fluidity is suppressed. The first of the piezoelectric member 5
It can flow out to the opposing part of the electrode 3 and the 2nd electrode 4, and it can prevent that the characteristic of the piezoelectric member 5 deteriorates. Further, since the sheet-like electrode material can be formed thin, the entire thickness of the piezoelectric electronic component 1 can be reduced. Further, since the sheet-like electrode material has elasticity, it is effective that the impact applied from the outside of the piezoelectric electronic component 1 is transmitted to the piezoelectric member 5 when the piezoelectric electronic component 1 is used as a product. Can be prevented.

  The sheet-like electrode material may be one in which a metal foil, a metal film, or a metal layer made of a metal material such as silver or copper is attached to one surface of the sheet-like resin material. Here, the metal foil is an extension of a metal material, the metal film is a film formed by vapor deposition or the like, and the metal layer is a layer in which a large number of fine particles such as silver or copper are deposited. Show things. When such a sheet-like electrode material is used as the upper electrode material, the surface on which the metal foil, metal film or metal layer is provided is used as the upper electrode material 16 as the first electrode on the upper surface of the piezoelectric member 5. 3 is contacted. Therefore, electrical conduction through the metal foil, metal film, or metal layer can be effectively extracted from the first electrode 3 from the outer surface side of the first case 14.

Examples of dimensions of the upper electrode material 16 are shown below. First, the portion of the surface of the piezoelectric member 5 that is in contact with the upper surface of the one end portion 6 has a length dimension of the piezoelectric substrate 2 of 0.1 mm and a width dimension of the piezoelectric substrate 2 of 0.5 mm. is there. Further, the portion of the surface facing the upper side of the end surface of the one end portion 6 of the piezoelectric member 5 has a dimension in the thickness direction of the piezoelectric substrate 2 of 0.1 mm and a dimension in the width direction of the piezoelectric substrate 2 of 0.5 mm. It is. In addition, a part of the surface around the opening of the recess 8 of the first case 14 has a length dimension of the piezoelectric substrate 2 of 0.2 mm and a width dimension of the piezoelectric substrate 2 of 0.5 mm.

  The upper electrode material 17 is the same as the upper electrode material 16.

  The adhesive 18 may bond the entire surfaces around the openings of the recesses 8 and 9 of the first and second cases 14 and 15, or the adhesives 18 of the recesses 8 and 9 of the first and second cases 14 and 15. Peripheral portions may be bonded to each other among the surfaces around the opening.

  As the material of the adhesive 18, a resin material such as an epoxy resin is used. The thickness of the adhesive 18 is in the range of 5 to 80 μm.

  In addition, the arrangement of the adhesive 18 at one end 6 of the piezoelectric member 5 will be described below with reference to FIGS.

  In the example shown in FIG. 3A, the adhesive 18 is provided so as to sandwich the upper electrode material 16 outside the recesses 10 and 11. With this configuration, even when the upper electrode material 16 is made of a member that does not have adhesive properties such as a metal foil, a part of the surface of the upper electrode material 16 around the opening of the recess 8 of the first case 14 is used. Since the existing portion and the first and second cases 14 and 15 are securely bonded to each other at the boundary surface between them, the outside air is exposed from the boundary surface exposed to the outside of the piezoelectric electronic component 1. Intrusion can be effectively prevented.

As shown in FIG. 3B, the adhesive 218 extends to the inner surface of the one recess 10 of the first case 14, and bonds the upper electrode material 16 and the first case 14 together. Good. In addition, the adhesive 218 extends to the inner surface of one recess 11 of the second case 15, and one end 6 of the piezoelectric member 5.
And the second case 15 may be bonded together. According to this configuration, even if the upper electrode material 16 is made of a member having no adhesive property such as a metal foil, one surface of the upper electrode material 16 around the opening of the recess 8 of the first case 14 is used. Since the first and second cases 14 and 15 are securely bonded to each other at the boundary surface between the first and second cases 14 and 15, the boundary surface exposed to the outside of the piezoelectric electronic component 1. Can effectively prevent outside air from entering.

In the example shown in FIG. 3C, the adhesive 318 includes a portion of the upper electrode member 16 existing on a part of the surface around the opening of the recess 8 of the first case 14 and the first case 14. The two are bonded together. According to this configuration, if the adhesive 318 is provided only on the surface around the opening of the recess 8 of the first case 14 and the upper electrode material 16 is provided thereon, the periphery of the opening of the recess 9 of the second case 15 is provided. Since it is not necessary to provide the adhesive 318 on the surface side, it is possible to reduce the man-hours and increase the productivity in manufacturing the piezoelectric electronic component 1, which is preferable.

  Further, in FIG. 3C, the upper electrode material 16 preferably has adhesiveness. In this case, since the second case 15 is bonded to a portion of the upper electrode material 16 that is present on a part of the surface around the opening of the recess 8 of the first case 14, the upper electrode material 16 And the second case 15 are preferable because they are securely bonded at the boundary surface between them and a gap is hardly formed at the boundary surface, and it is possible to effectively prevent outside air from entering from the boundary surface. In addition, since the upper electrode material 16 having adhesiveness bonds the one end 6 of the piezoelectric member 5 and the first case 14, the piezoelectric member 5 is firmly attached to the first and second cases 14 and 15. Therefore, it is preferable.

Note that, as shown in FIG. 3D, the adhesive 418 extends to the inner surface of one recess 10 of the first case 14 and bonds the first case 14 and the upper electrode material 16 together. Good.

In the example shown in FIG. 3 (e), the adhesive 318 shown in FIG. 3 (c) is disposed below the upper electrode material 16 to form the adhesive 518. According to this configuration, if the adhesive 518 is provided only on the surface around the opening of the recess 9 in the second case 15, the adhesive 518 is provided on the surface around the opening of the recess 8 in the first case 14. Since it is not necessary to provide such a structure, the number of steps can be reduced, and the productivity in manufacturing the piezoelectric electronic component 1 can be increased, which is preferable.

  Furthermore, in FIG. 3E, the upper electrode material 16 preferably has adhesiveness. In this case, since the first case 14 is bonded to a portion of the upper electrode material 16 that is present on a part of the surface around the opening of the recess 8 of the first case 14, the upper electrode material 16. The first case 14 and the first case 14 are preferable because the gap between the first case 14 and the first case 14 is surely adhered to each other so that a gap is hardly formed on the boundary surface, and the outside air can be effectively prevented from entering from the boundary surface. In addition, since the upper electrode material 16 having adhesiveness bonds the one end 6 of the piezoelectric member 5 and the first case 14, the piezoelectric member 5 is firmly attached to the first and second cases 14 and 15. Therefore, it is preferable. Further, the upper electrode material 16 having adhesiveness is preferable because the force for bonding the one end portion 6 of the piezoelectric member 5 and the first case 14 is strengthened.

In the example shown in FIG. 3 (f), the adhesive 418 shown in FIG. 3 (d) is disposed below the upper electrode material 16 to form the adhesive 618. This configuration is preferable because the piezoelectric member 5 is firmly held by the first and second cases 14 and 15.

  Furthermore, it is preferable that the upper electrode material 16 shown in FIG. 3 (f) has adhesiveness as in FIG. 3 (e).

3D shows an example in which the adhesive 418 extends to the inner surface of one of the recesses 10 of the first case 14, but the adhesive 718 is similar to the example shown in FIG. May be provided over the entire surface around the opening of the recess 8 of the first case 14, the inner surfaces of one and the other indentations 10 and 12, and the entire inner surface of the recess 8.

The adhesive 718 may be arranged by applying a resin to the first case 14, or may be arranged by applying an adhesive sheet, but the latter is particularly preferable. In this case, the adhesive sheet 718 can be easily and reliably attached to the entire surface around the opening of the recess 8 of the first case 14 and the inner surfaces of the one and the other indentations 10 and 12. The entire surface around the opening of the recess 8 in the case 14 and the entire surface around the opening in the recess of the second case can be securely bonded, and the inner surfaces of the one and the other indentations 10 and 12 and one of the piezoelectric substrates 2 and The other ends 6 and 7 can be securely bonded. Therefore, the sealing performance of the space provided around the vibration part of the piezoelectric member 5 can be improved.

In the case of this configuration, the entire surface around the opening of the recess 8 of the first case 14, the inner surfaces of the one and the other indentations 10 and 12, and the entire inner surface of the recess 8 are attached. Since this is the adhesive sheet 718, its thickness can be reduced uniformly. Therefore, compared with a normal paste-like adhesive, the amount of application can be precisely controlled, so that it is possible to secure a wide internal space of the concave portion 8 near the vibrating portion of the piezoelectric member 5. It is possible to make it difficult for the adhesive sheet 718 attached to the inner wall 8 to contact the vibrating portion of the piezoelectric member 5.

  Next, a method for manufacturing the piezoelectric electronic component 1 using the first case 14 of the example shown in FIG. 4 will be described with reference to FIG.

First, as shown in FIG. 5A, an adhesive sheet 718 is disposed in the first case 14 so as to cover at least the entire surface around the opening of the recess 8. In this step, for example, the first case 14
The adhesive sheet 718 placed on the plate is softened by pressing it for 10 to 60 seconds at a stress of 0.05 to 1 MPa using a flat plate heated at a temperature of 80 to 150 ° C. It is temporarily bonded to the entire surface around the opening of the 14 recesses 8.

When the adhesive sheet 718 is softened by heating in this way, the resin material constituting the adhesive sheet 718 has fluidity, so that the adhesive sheet 718 is easily deformed excessively, The thickness of the adhesive sheet 718 on the entire surface around the opening of the first case 14 becomes non-uniform, and the sealing performance when the first case 14 and the second case 15 are bonded is lowered. Therefore, it is preferable to adjust the fluidity of the adhesive sheet 718 by including about 2 to 50 mass% of a needle-like or spherical filler made of an inorganic material such as silica or plastic in the resin material of the adhesive sheet 718. As a result, the shape of the adhesive sheet 718 cannot be excessively deformed, and the adhesive sheet 718 and the first case 14 can be securely bonded.

Furthermore, in order to suppress excessive deformation of the adhesive sheet 718 during temporary adhesion, it is particularly preferable to use a prepreg in which a fiber cloth is impregnated with a resin material as the resin material constituting the adhesive sheet 718. In this case, the fluidity of the resin can be effectively suppressed by holding the resin of the adhesive sheet 718 heated and melted by the fiber cloth.

Note that the method of heating and pressurizing the adhesive sheet 718 is not limited to the method of pressing with a heated flat plate, and a method of pressing with a heated roller may be employed.

Next, as shown in FIG. 5B, the upper electrode material 16 is placed on the adhesive sheet 718 around a part of the periphery of the opening of the concave portion 8 of the first case 14 so as to match the position of the one recess 10. Form. In this step, for example, the upper electrode material 16 is formed by transferring a sheet-like resin material containing a silver filler to a predetermined position.

Next, as shown in FIG. 5 (c), the adhesive sheet 718 is bonded to the entire surface around the opening of the recess 8 of the first case 14, the inner surfaces of the one and the other indentations 10 and 12, and the inner surface of the recess 8. Apply throughout. In addition, the code | symbol 21 in FIG.5 (c) has shown the pressing member. The pressing member 21 is made of an elastic body such as rubber, for example. In addition, it is preferable to use a silicone rubber that has low adhesiveness to the adhesive 718. Further, even if it is not made of silicone rubber, it is preferable to perform a surface treatment so that the adhesiveness to the adhesive 718 is lowered. In addition, FIG.
1) indicates that the pressing member 21 is pressed against the bottom surface of the recess 8 and the bottom surfaces of the one and the other indentations 10, 12, so that the pressing member 21 has the bottom surface of the recess 8, or the one and the other indentations 10, A pressing member 21 elastically deformed in a direction parallel to the bottom surface of 12 is shown.

In this step, the pressing member 21 presses the adhesive sheet 718 at a portion not bonded to the first case 14 while the pressing member 21 is pressed against the recess 8 of the first case 14 and the one and the other depressions 10. , 12 should be inserted at the same time.

Before performing this operation, the first case 14 on which the adhesive sheet 718 is disposed is placed on a flat plate heated at a temperature of 80 to 150 ° C. with the surface on which the adhesive sheet 718 is not previously placed as the lower surface. It is good to put it. Thus, the adhesive sheet 718 is passed from the heated flat plate through the first case 14.
Heat is applied to the adhesive sheet 718 so that the adhesive sheet 718 is softened and easily deformed.

Further, the shape of the pressing member 21 is a shape along the inner space of the recess 8 and the recesses 10 and 12 of the first case 14, and the dimensions thereof are such that the pressing member 21 is the recess 8 and the recesses 10 and 12 of the first case 14. When inserted into the inner space, it is preferable that there is a clearance of about 50 μm to 0.2 mm between the inner wall of the recess 8 or the inner walls of the one and the other indentations 10 and 12. With such a dimension, even when the position of the pressing member 21 is slightly shifted when the pressing member 21 is inserted into the internal space of the recess 8 and the recesses 10 and 12, the pressing member 21 has the recess 8 and the recess 10 and Since it falls within the range of the 12 openings, it is possible to prevent the front end of the pressing member 21 from coming into contact with the concave portion 8 of the first case 14 and the surface around the opening of the recesses 10 and 12. 21 can be prevented from being damaged.

  Further, as in the example shown in FIG. 5C, the shape of the tip of the pressing member 21 is preferably a rounded shape with rounded corners. By forming the tip of the pressing member 21 in such a shape, the position of the pressing member 21 when the pressing member 21 is inserted into the inner space of the concave portion 8 and the recesses 10 and 12 is shifted, and the tip of the pressing member 21 becomes the first. Even if the surface around the opening of the recess 8 and the recesses 10 and 12 of the case 14 is slightly in contact, the tip of the pressing member 21 and the periphery of the opening of the recess 8 and the recesses 10 and 12 of the first case 14 It is possible to prevent the first case 14 and the pressing member 21 from being damaged.

When the pressing member 21 is inserted into the inner space of the recess 8 and the recesses 10 and 12 while pressing the adhesive sheet 718 at a portion not bonded to the first case 14 by the pressing member 21 described above, The sheet 718 extends in the depth direction of the recess 8 and the recesses 10 and 12 of the first case 14, and then the adhesive sheet 718 adheres to the bottom surfaces of the recess 8 and the recesses 10 and 12. When the pressing member 21 is pressed against the bottom surface of the recess 8 and the recesses 10 and 12 via the adhesive sheet 718, the pressing member 21 is elastically deformed in a direction parallel to the bottom surface of the recess 8 or the bottom surfaces of the recesses 10 and 12, It is deformed by the clearance dimension described above. In the example shown in FIG. 5C, the pressing member 21 has a shape as indicated by a one-dot chain line in the drawing. As a result, the side surface of the pressing member 21 extends the adhesive sheet 718 in a direction parallel to the bottom surface of the recess 8 or the bottom surfaces of the recesses 10 and 12, and bonds the adhesive sheet 718 to the recess 8 and the side walls of the recesses 10 and 12. It will be.

As described above, the adhesive sheet 718 can be applied to the entire surface around the opening of the recess 8 of the first case 14, the inner surfaces of the one and the other indentations 10 and 12, and the entire inner surface of the recess 8. it can.

At the same time as the adhesive sheet 718 adheres to the first case 14, the upper electrode material 16 also passes through the adhesive sheet 718 from one part of the periphery of the opening of the recess 8 of the first case 14 to the one recess 10. It will be deposited over the inner surface.

Next, as shown in FIG. 5 (d), one end 10 is supported by one recess 10 via an adhesive sheet 718 and the upper electrode material 16, and the other end 7 is supported by the other recess 12. The piezoelectric member 5 is temporarily bonded to the first case 14 so as to be supported via the adhesive sheet 718.

  Then, as shown in FIG. 5 (e), the second case 15 is supported by one end 11 with one end 11, the other end 7 with the other end 13 and the lower electrode member 17 The piezoelectric electronic component 1 is obtained by adhering the entire surface around the opening of the recess 9 to the entire surface around the opening of the recess 8 of the first case 14.

In this step, the first case 14 is heated at a temperature of 120 to 180 ° C. and pressed downward at a pressure of 0.01 to 3 MPa for 15 to 30 minutes, whereby the adhesive sheet 718, the upper electrode material 16 and the lower electrode The resin constituting the material 17 is cured to fix the piezoelectric member 5 to the upper and lower electrode materials 16, 17, and the entire surface around the opening of the recess 8 of the first case 14 and the recess of the second case 15. The entire surface around the opening of 9 is bonded.

(Second Embodiment)
Below, 2nd Embodiment is described using FIG. In addition, the same part as 1st Embodiment attaches | subjects the same code | symbol, abbreviate | omits description and demonstrates only a different part. The different parts are a first electrode 23 and a first lower electrode material 19.

  The first electrode 23 includes a vibrating electrode portion 23a provided at the center portion on the upper surface of the piezoelectric substrate 2, a connection electrode portion 23c extending from the upper surface to the lower surface at one end portion 6 of the piezoelectric substrate 2, The upper surface of the piezoelectric substrate 2 includes a lead electrode portion 23b that connects one of the connection electrode portions 23c and one of the vibration electrode portions 23a.

The dimensions of the vibration electrode portion 23a, the extraction electrode portion 23b, and the connection electrode portion 23c are appropriately set according to the dimensions of the piezoelectric substrate 2. For example, if the dimensions of the piezoelectric substrate 2 are 2 mm in length, 0.5 mm in width, and 0.2 mm in thickness, the following dimensions may be used. The dimensions of the vibrating electrode portion 23a are 1 mm in the length direction of the piezoelectric substrate 2 and 0.5 mm in the width direction of the piezoelectric substrate 2.
And the thickness is 1 μm. As for the dimensions of the extraction electrode portion 23b, the dimension in the length direction of the piezoelectric substrate 2 is 0.3 mm, the dimension in the width direction of the piezoelectric substrate 2 is 0.5 mm, and the thickness is 1 μm. As for the dimensions of the connection electrode portion 23c, the dimension of the piezoelectric substrate 2 in the longitudinal direction is 0.2 mm, the dimension of the piezoelectric substrate 2 in the width direction is 0.5 mm, and the thickness is 1 μm. In addition, the length of the lower surface portion of the piezoelectric substrate 2 is 0.2 mm, the width of the piezoelectric substrate 2 is 0.5 mm, and the thickness is 1 μm. The end surface portion of the piezoelectric substrate 2 has a width direction dimension of the piezoelectric substrate 2 of 0.5 mm, a thickness direction dimension of the piezoelectric substrate 2 of 0.2 mm, and a thickness of 1 μm.

  The piezoelectric substrate 2 on which the first electrode 23 and the second electrode 4 are arranged is referred to as a piezoelectric member 25.

  Further, as shown in FIG. 7, the second electrode 4 is preferably such that the other end 7 side of the piezoelectric substrate 2 extends from the lower surface of the piezoelectric substrate 2 to the upper surface through the end surface. In this case, as compared with the embodiment shown in FIG. 6, the positional relationship between the first electrode 23 and the second electrode 4 is the same between the upper surface and the lower surface of the piezoelectric member 25. Therefore, when arranging the piezoelectric member 25 in the first case 14 or the second case 15, it is not necessary to care about the vertical direction of the piezoelectric member 25, which is preferable because the manufacturing efficiency is improved.

Further, as shown in FIG. 8, the first electrode 23 and part of the second electrode 4 may be provided inside the piezoelectric substrate 2. By adopting such a configuration, compared to the embodiment shown in FIG. 7, for example, it is possible to increase the charge output when the piezoelectric electronic component 21 is used as an acceleration sensor or a piezoelectric power generation component.

  The first lower electrode material 19 is formed on the inner surface of the one recess 11 of the second case 15 from the surface in contact with the lower surface of the one end portion 6 of the piezoelectric member 25 to the one end portion 6 of the piezoelectric member 25. It is provided so as to extend to the outer surface of the second case 15 over the surface facing the lower side of the end surface and part of the surface around the opening of the recess 9 of the second case 15.

  The second lower electrode material 20 is the same as that used in the first embodiment.

  According to such a configuration of the first and second lower electrode materials 19 and 20, the first and second lower electrode materials 19 and 20 are provided in the second case 15 when the piezoelectric electronic component 21 is manufactured. If the adhesive 18 is provided around the opening of the concave portion 9 of the second case 15, the first case 14 is not subjected to any processing, and the periphery of the opening of the concave portion 8 of the first case 14 is The piezoelectric electronic component 21 can be manufactured simply by adhering around the opening of the recess 9 of the two cases 15. Therefore, the productivity at the time of manufacturing the piezoelectric electronic component 21 can be improved.

  The second lower electrode material 20 may or may not be in contact as long as it faces the lower side of the end face of the other end 7 of the piezoelectric member 25. When the second electrode 4 has the configuration shown in FIGS. 7 and 8 in the case of contact, the other end of the piezoelectric member 25 of the second lower electrode material 20 is used. 7 provided on the surface of the second lower electrode material 20 that is in contact with the lower side of the end surface of the other end 7 of the piezoelectric member 25 in addition to the portion provided on the surface that is in contact with the lower surface of 7. The formed portion also comes into contact with the second electrode 4. Therefore, the electrical connection between the second lower electrode member 20 and the second electrode 4 of the piezoelectric member 25 can be made more reliable than the embodiment shown in FIG.

(Third embodiment)
Below, 3rd Embodiment is described using FIG. In addition, the same part as other embodiment attaches | subjects the same code | symbol, abbreviate | omits description and demonstrates only a different part. The different parts are a first case 14, a lower electrode material 17, an upper electrode material 16, and an adhesive material 818.

  The first case 14 has a concave portion 8 that faces the upper surface of the piezoelectric member 5, and a portion of the piezoelectric member 5 on the one end 6 side of the surface around the opening of the concave portion 8 is provided. One end 6 is supported, and the other end 7 of the piezoelectric member 5 is supported by a part of the surface around the opening of the recess 8 on the other end 7 side of the piezoelectric member 5.

The overall dimensions of the first case 14 are, for example, a length of 0.7 to 20 mm, a width of 0.5 to 15 mm, and a thickness of 0.1 mm to 2 mm. Moreover, as for the dimension of the recessed part of the 1st and 2nd cases 14 and 15, length is 0.4-18 mm, width is 0.3-13 mm, and depth is 50 micrometers-1.5 mm, for example.

  The dimension of the other recess 13 in the thickness direction of the piezoelectric substrate 2 is appropriately set according to the thickness of the piezoelectric substrate 2, the thickness of the second case 15, and the depth of the recess 9.

For example, the thickness of the piezoelectric substrate 2 is 0.2 mm, the thickness of the second case 15 is 0.45 mm,
When the depth of the concave portion 9 of the second case 15 is 0.35 mm, the dimension of the other recess 13 in the thickness direction of the piezoelectric substrate 2 is 0.2 mm.

  The dimension of the lower electrode material 17 in the thickness direction of the piezoelectric substrate 2 is appropriately set depending on the thickness of the piezoelectric substrate 2.

For example, when the thickness of the piezoelectric substrate 2 is 0.2 mm, the dimension of the lower electrode material 17 in the thickness direction of the piezoelectric substrate 2 is 0.2 mm.

  The upper electrode material 16 is in contact with the first electrode 3 of the piezoelectric member 5 on a part of the surface around the opening of the recess 8 of the first case 14 on the one end 6 side of the piezoelectric member 5, and It is provided to extend to the outer surface of case 14.

  The material of the upper electrode material 16 is the same as that of the lower electrode material 17. The upper electrode material 16 has, for example, a dimension in the length direction of the piezoelectric substrate 2 of 0.35 mm and a dimension in the width direction of the piezoelectric substrate 2 of 0.5 mm. The upper electrode material 16 has a thickness of 5 to 50 μm.

In addition, the arrangement of the adhesive 818 at the other end 7 of the piezoelectric member 5 will be described below with reference to FIGS.

  In the example shown in FIG. 10A, the adhesive material 18 is provided so as to sandwich the upper electrode material 16 between the first and second cases 14 and 15.

As shown in FIG. 10B, the adhesive 918 extends to the inner surface of the other recess 13 of the second case 15 and bonds the lower electrode material 17 and the second case 15 together. Also good.

  In the example shown in FIG. 10 (c), the adhesive 1018 includes a portion of the lower electrode material 17 existing on a part of the surface around the opening of the recess 9 of the second case 15 and the second case 15. And are bonded together.

  As shown in FIG. 10D, the adhesive 1118 extends to the inner surface of the other recess 13 of the second case 15, and bonds the second case 15 and the lower electrode material 17 together. Also good.

  In the example shown in FIG. 10 (e), the adhesive 1218 includes a portion of the lower electrode member 17 that is present on a part of the surface around the opening of the recess 9 of the second case 15, and the first case 14. And are bonded together.

In addition, the arrangement of the adhesive 818 at one end 6 of the piezoelectric member 5 will be described below with reference to FIGS.

In the example shown in FIG. 11A, the adhesive 818 is provided so as to be sandwiched between the first and second cases 14 and 15.

  As shown in FIG. 11B, the adhesive 1318 extends to the inner surface of one of the recesses 11 of the second case 15, and connects the one end 6 of the piezoelectric member 5 and the second case 15 together. It may be adhered.

  In the example shown in FIG. 11 (c), the adhesive 1418 is interposed between the portion of the upper electrode member 16 on the outer surface side of the first and second cases 14, 15 and the second case 15, and both Is glued.

  As shown in FIG. 11 (d), the adhesive 1518 extends to the inner surface of one recess 11 of the second case 15, and connects the second case 15 and one end 6 of the piezoelectric member 5. It may be adhered.

  In the example shown in FIG. 11 (e), the adhesive 1618 is interposed between the upper electrode material 16 and the first case 14, and bonds them together.

Further, as shown in the example shown in FIG. 4, the adhesive 1118 is formed on the entire surface around the opening of the recess 9 of the second case 15, the inner surfaces of the one and the other indentations 11 and 13, and the entire inner surface of the recess 9. The adhesive sheet 718 may be attached over the entire surface.

(Fourth embodiment)
A fourth embodiment will be described with reference to FIG. In addition, the same part as other embodiment attaches | subjects the same code | symbol, and abbreviate | omits description.

  In the piezoelectric electronic component 41 of the fourth embodiment, the piezoelectric member 25 is sandwiched between the case members 14 and 15 at both ends. Also, the second case 15 is formed with one and the other indentations 11 and 13. In addition, the first and second lower electrode members 19 and 20 are disposed in the one and the other depressions 11 and 13. The first electrode 23 includes a vibration electrode portion 23a, a connection electrode portion 23c, and a connection electrode portion 23c. Further, the first case 14 is provided with a recess 8 and is not provided with a recess.

(Fifth embodiment)
The fifth embodiment will be described below with reference to FIG. In addition, the same part as other embodiment attaches | subjects the same code | symbol, and abbreviate | omits description. The piezoelectric substrate 2 on which the first electrode 3 and the second electrode 34 described above are arranged is referred to as a piezoelectric member 35.

  The difference from the other embodiments is that the electrode members at both ends of the piezoelectric member 35 are both upper electrode members.

  According to such a configuration, the surface on which the first upper electrode material 25 and the second upper electrode material 26 are disposed is a surface around the opening of the recess 8 of the first case 14, and this surface is a plane. . Accordingly, since it is not necessary to form the first upper electrode material 25 and the second upper electrode material 26 in a complicated shape portion such as a recess, the manufacture of the piezoelectric electronic component 51 is facilitated, and the productivity is improved. Can be planned.

(Sixth embodiment)
The sixth embodiment will be described below with reference to FIG. In addition, the same part as other embodiment attaches | subjects the same code | symbol, abbreviate | omits description and demonstrates only a different part. The different parts are a first case 14 and an adhesive 1718.

  The first case 14 supports one end 6 of the piezoelectric member 5 at a part of the lower surface on the one end 6 side of the piezoelectric member 5, and the other end 7 of the piezoelectric member 5 on the lower surface. The other end 7 of the piezoelectric member 5 is supported by a part of the side, and has a rectangular shape.

  The overall dimensions of the first case 14 are, for example, a length of 0.7 to 20 mm, a width of 0.5 to 15 mm, and a thickness of 0.1 mm to 2 mm.

  In addition, the arrangement of the adhesive 1718 at the other end 7 of the piezoelectric member 5 will be described below with reference to FIGS.

  The adhesives 1718, 1818, 2118 shown in FIGS. 15 (a), (b) and (e) are different from the adhesives 818, 918, 1218 shown in FIGS. 10 (a), (b) and (e), It is arranged not on the surface around the opening of the recess 8 but on the peripheral edge of the lower surface of the first case 14.

  The adhesives 1918 and 2018 shown in FIGS. 15C and 15D are the same as the adhesives 1018 and 1118 shown in FIGS. 10C and 10D.

In addition, the arrangement of the adhesive 1718 at one end 6 of the piezoelectric member 5 will be described below with reference to FIGS.

The adhesives 1718, 2218 and 2518 shown in FIGS. 16 (a), (b) and (e) are different from the adhesives 818, 1318 and 1618 shown in FIGS. 11 (a), (b) and (e). It is arranged not on the surface around the opening of the recess 8 but on the peripheral edge of the lower surface of the first case 14.

  The adhesives 2318 and 2418 shown in FIGS. 16C and 16D are the same as the adhesives 1418 and 1518 shown in FIGS. 11C and 11D.

(Seventh embodiment)
A seventh embodiment will be described with reference to FIG. In addition, the same part as other embodiment attaches | subjects the same code | symbol, and abbreviate | omits description.

  In the piezoelectric electronic component 71 of the seventh embodiment, the piezoelectric member 25 is sandwiched between the case members 14 and 15 at both ends. Also, the second case 15 is formed with one and the other indentations 11 and 13. In addition, the first and second lower electrode members 19 and 20 are disposed in the one and the other depressions 11 and 13. The first electrode 23 includes a vibration electrode portion 23a, a connection electrode portion 23c, and a connection electrode portion 23c. Further, the first case 14 is not provided with a recess or a recess.

(Eighth embodiment)
The eighth embodiment will be described with reference to FIG. In addition, the same part as other embodiment attaches | subjects the same code | symbol, and abbreviate | omits description.

  In the piezoelectric electronic component 81 of the eighth embodiment, the piezoelectric member 35 is sandwiched between the case members 14 and 15 at both ends. Also, the second case 15 is formed with one and the other indentations 11 and 13. Further, the first and second upper electrode members 25 and 26 are disposed between the first and second cases 14 and 15. The second electrode 34 includes a vibration electrode portion 34a, a connection electrode portion 34c, and a connection electrode portion 34c. Further, the first case 14 is not provided with a recess or a recess.

  In the piezoelectric electronic component of the first to eighth embodiments, it is preferable that the first case 14 and the second case 15 are made of the same material.

  By adopting such a configuration, for example, it is easy to approximate the thermal expansion coefficients of the first and second cases 14 and 15 as compared with the case where the piezoelectric member and the case member are bonded. Therefore, it is possible to suppress peeling at the boundary between the first and second cases 14 and 15 due to thermal expansion. As a result, a piezoelectric electronic component with high sealing performance can be provided.

  Note that the same type of material means, for example, that the first and second cases 14 and 15 are made of a resin material, are made of the same epoxy resin, and are made of the same type of ceramic material. Means.

  Moreover, in the piezoelectric electronic component of the first to eighth embodiments, the case members 14 and 15 have joint portions that join the first case 14 and the second case 15 along the outer periphery of the case members 14 and 15. ing.

  Furthermore, it is preferable that the joint is located at a height different from the main surfaces of the piezoelectric members 5, 25, and 35. An example of this configuration is the configuration shown in the first and second embodiments, FIG.

With such a configuration, the joint portion between the first and second case cases 14 and 15 and the joint portion between the first and second case cases 14 and 15 and the main surfaces of the piezoelectric members 5, 25, and 35 are used. In between, a joint part in a direction orthogonal to these joint parts is included. Therefore, even if cracks occur at both joints, the extension of cracks can be suppressed at the joints in the orthogonal direction.

  Furthermore, it is preferable to arrange the adhesive and the upper electrode material 16 as shown in FIGS. 3 (b) and 3 (f). In this case, since the piezoelectric member 5 and the case members 14 and 15 can be bonded with a wide bonding area, extension of cracks can be further suppressed.

  Further, in the piezoelectric electronic component of the first and second embodiments, it is preferable that the joint portion between the first and second cases 14 and 15 is located on the side of the piezoelectric members 5, 25 and 35. Examples of this configuration are the first and second embodiments.

  By adopting such a configuration, the first and second cases 14 and 15 having the same shape can be obtained as compared with the case where the joint is located above or below the piezoelectric members 5, 25 and 35. Therefore, manufacturing efficiency can be improved.

  The present invention is not limited to the above-described embodiments, and various changes and improvements can be made without departing from the scope of the invention.

  For example, in the piezoelectric electronic components 1, 31, 61 shown in FIGS. 1, 9, and 14, the piezoelectric member 5 is sandwiched at both ends by the first case 14 and the second case 15, but FIGS. As shown, the piezoelectric member 5 may be held at one end by the first case 14 and the second case 15.

  Note that the first case 14 and the second case 15 shown in FIG. 20 are different from the first case 14 and the second case 15 shown in FIG. The end portion 7 is not clamped.

  The second case 15 shown in FIG. 21 is different from the second case 15 shown in FIG. 9 in that the other recess 13 does not exist and the other end 7 of the piezoelectric member 5 is not sandwiched.

  The second case 15 shown in FIG. 22 is different from the second case 15 shown in FIG. 14 in that the other indentation 13 does not exist and the other end 7 of the piezoelectric member 5 is not sandwiched.

  In the piezoelectric electronic component in which both ends of the piezoelectric member 5 are sandwiched, the vibration region of the piezoelectric member 5 is the central portion of the piezoelectric member 5, but in the piezoelectric electronic component in which one end of the piezoelectric member 5 is sandwiched, It goes without saying that the vibration region of the piezoelectric member 5 is a portion of the piezoelectric member 5 that is not sandwiched.

(Ninth embodiment)
A ninth embodiment will be described with reference to FIG. In addition, the same part as other embodiment attaches | subjects the same code | symbol, and abbreviate | omits description. 23 differs from that shown in FIG. 9 in that the first and second electrodes 3 and 4 of the piezoelectric member 5 are both from one end 6 of the piezoelectric substrate 2 to the other. It is the point extended to the edge part 7 side. Another difference is that one end 6 of the piezoelectric member 5 is sandwiched between the first case 14 and the second case 15. In another different part, an electrode material (first electrode material) 16 connected to the first electrode 3 is drawn out of the case member from the free end side of the piezoelectric member 5, and the second electrode 4. The electrode material (second electrode material) 17 connected to is pulled out from the fixed end side of the piezoelectric member 5 to the outside of the case member.

As shown in FIG. 23 (b), the second electrode material 17 is provided close to one side in the width direction of the piezoelectric member 5 so as not to contact the first electrode 3 and the first electrode material 16. Yes. FIG. 23 (b)
As shown in FIG. 2, the first electrode 3 is partially cut out so as not to contact the second electrode material 17. Further, as shown in FIG. 23C, the first electrode material 16 is provided close to the other side in the width direction of the piezoelectric member 5 so as not to contact the second electrode material 17.

(Tenth embodiment)
A tenth embodiment will be described with reference to FIG. In addition, the same part as other embodiment attaches | subjects the same code | symbol, and abbreviate | omits description.

Of the form of the piezoelectric electronic component 131 shown in FIG. 24, the parts different from those shown in FIG. 9 will be described below. One end 6 of the piezoelectric member 5 is sandwiched between the first case 14 and the second case 15. In addition, a part of the second electrode 4 extends to the upper surface via the end surface on the one end portion 6 side of the piezoelectric substrate 2. The end surface portion and the extending portion of the second electrode 4 are provided close to one side in the width direction of the piezoelectric member 5 so as not to contact the first electrode 3. The second electrode material 17 has a planar shape, and one end is connected to the extending portion of the second electrode 4 and the other end is extended to the outside from the one end portion 6 side. Further, as shown in FIG. 24B, the first electrode 3 has a shape having a notch so that the extending portion of the second electrode 4 does not contact the first electrode 3. Further, as shown in FIG. 24C, the first electrode material 16 and the second electrode material 17 are separated from each other so as not to contact each other, and both are provided in the upper case 14. Therefore, since it is not necessary to provide an electrode material in the lower case 15, if an adhesive is applied in one recess 11 of the lower case 15, the contact between the piezoelectric member 5 and the adhesive in the recess 11 is achieved. Since the area can be increased, the adhesive force to the lower case 15 of the piezoelectric member 5 is preferably increased.

(Eleventh embodiment)
The eleventh embodiment will be described with reference to FIG. In addition, the same part as other embodiment attaches | subjects the same code | symbol, and abbreviate | omits description.

The piezoelectric electronic component 141 shown in FIG. 25 will be described below with respect to parts different from those shown in FIG. One end 6 of the piezoelectric member 5 is sandwiched between the first case 14 and the second case 15. Further, the configurations of the first electrode 3, the second electrode 4, and the second electrode material 17 are the same as those of the other embodiments, but the configuration of the first electrode material 16 is different from that of the other embodiments. The first electrode material 16 has a large thickness only on one end 6 side of the piezoelectric member 5. This is to ensure a vibration region of the piezoelectric member 5 between the upper electrode 14 and the thickness of the first electrode material 16.

(Twelfth embodiment)
A twelfth embodiment will be described with reference to FIG. In addition, the same part as other embodiment attaches | subjects the same code | symbol, and abbreviate | omits description.

The piezoelectric electronic component 151 shown in FIG. 26 is different from the configuration of FIG. 1 in the configuration of the piezoelectric member 35 sandwiched between the case members 14 and 15. The piezoelectric member 35 of the present embodiment refers to a member in which the piezoelectric element 31 is provided on at least one main surface of the shim 29. Further, both end portions of the shim 29 are sandwiched between the first and second cases 14 and 15.

  Further, in the present embodiment, the part different from the form of FIG. 1 is a configuration in which electrical connection is taken out from the piezoelectric member. In the piezoelectric member 35 shown in FIG. 26, the end portion of the first electrode 3 of each piezoelectric element 31 extends to the end portion 6 on one side of the shim 29 through the end face of the piezoelectric substrate 2. The first electrode material 16 is connected to the end of the first electrode 3 and is provided from one of the recesses 10 and 11 to the outside of the case members 14 and 15. Similarly, the end portion of the second electrode 4 of each piezoelectric element 31 also extends to the other end portion 7 of the shim 29. The second electrode material 17 is connected to the end of the second electrode 4 and is provided from the other indentations 12 and 13 to the outside of the case members 14 and 15.

  With such a configuration, the boundary between the piezoelectric member 35 and the case members 14 and 15 is covered with the case members 14 and 15, so that the sealing property of the space provided around the vibrating portion of the piezoelectric member 35 is sealed. Can be improved.

  Further, since the piezoelectric member 35 is not directly sandwiched between the case members 14 and 15, even when a strong impact is applied, the piezoelectric substrate 2 can be prevented from cracking at the sandwiching portion of the case members 14 and 15. Therefore, the highly reliable piezoelectric electronic component 151 can be provided.

In addition, if the effect of preventing cracking of the piezoelectric substrate 2 is improved, the piezoelectric member 35 can be made thinner. Therefore, the amount of displacement of the piezoelectric member 35 with respect to external impact can be increased. Therefore, for example, when the piezoelectric electronic component 151 is used as an acceleration sensor, acceleration detection sensitivity can be increased. Further, when the piezoelectric electronic component 151 is used as a piezoelectric power generation component, the amount of power generation can be increased.

  The case members 14 and 15 of the piezoelectric electronic component 151 may be the case members 14 and 15 shown in FIGS.

The shim 29 is a plate member having flexibility. As the material of the shim 29, a resin, a composite material such as fiber reinforced plastics, or a metal such as SUS is used. In addition, in order to prevent the electrical short circuit of the 1st electrode material 16 and the 2nd electrode material 17, the material of the shim 29 shown to FIGS. 26-28 uses an insulating material. For example, when the piezoelectric electronic component 151 is used as a piezoelectric power generation component, the power generation amount can be set by appropriately selecting the density, elastic modulus, thermal expansion coefficient, and the like of the shim 29. The thickness of the shim 29 is, for example, 50 μm to 0.5 mm.

(13th Embodiment)
A thirteenth embodiment will be described with reference to FIG. In addition, the same part as other embodiment attaches | subjects the same code | symbol, and abbreviate | omits description.

The piezoelectric electronic component 161 shown in FIG. 27 is different from the configuration of FIG. 1 in the configuration of the piezoelectric member 45 sandwiched between the case members 14 and 15. The piezoelectric member 45 of the present embodiment is a member in which the piezoelectric element 31 is provided on at least one main surface of the shim 29. One end of the shim 29 is sandwiched between the first and second cases 14 and 15.

  In the first electrode 3, the portion extending from the end face of the piezoelectric substrate 2 to the end of the shim 29 is provided close to one side in the width direction of the piezoelectric element 31 so as not to contact the second electrode 4. ing.

  Further, the second electrode 4 has a notch in a part so as not to contact the first electrode 3 and is drawn out to the same end 6 where the end of the first electrode 3 extends. Yes.

  The first electrode material 16 and the second electrode material 17 are provided separately on one side and the other side in the width direction of the piezoelectric member 45, and are connected to the end portions of the first electrode 3 and the second electrode 4, respectively. The case members 14 and 15 are drawn out.

  The case members 14 and 15 of the piezoelectric electronic component 161 may be the case members 14 and 15 shown in FIGS.

(14th Embodiment)
A fourteenth embodiment will be described with reference to FIG. In addition, the same part as other embodiment attaches | subjects the same code | symbol, and abbreviate | omits description.

In the piezoelectric electronic component 171 shown in FIG. 28, the basic configuration of the piezoelectric member 55 is the same as that of the other embodiments, but is different from the other embodiments in the configuration of the piezoelectric element 31. The piezoelectric element 31 is that the first electrode 3 and the second electrode 4 are also provided inside the piezoelectric substrate 2. With this configuration, the piezoelectric element 31 has a configuration in which a plurality of first electrodes 3 and second electrodes 4 are alternately stacked. Therefore, when the piezoelectric electronic component 171 is used as an acceleration sensor, it is preferable because the amount of charge that can be extracted increases.

  Further, as shown in FIG. 28B, the first electrode 3 provided inside the piezoelectric substrate 2 has a shape having a notch so as not to contact the second electrode 4. The plurality of first electrodes 3 are connected to each other by electrodes provided on the end surface on the end 6 side. The plurality of first electrodes 3 may be electrically connected to each other by the first electrode material 16. The above configuration is the same for the second electrode 4.

  The case members 14 and 15 of the piezoelectric electronic component 171 may be the case members 14 and 15 shown in FIGS.

  The present invention is not limited to the embodiments described above, and various changes and improvements can be made without departing from the scope of the present invention.

For example, when the piezoelectric electronic components 1 to 171 are used as the acceleration sensor, the piezoelectric members 5 and 25 are used.
, 35, 45, 55 can be fixed so as to be inclined with respect to the horizontal direction, for example, 25 ° to 90 °. This makes it possible to detect not only the vertical direction but also the lateral acceleration.

1, 21, 31, 41, 51, 61, 71, 81, 91, 101, 111: Piezoelectric electronic component 2: Piezoelectric substrate 3, 23: First electrode
23a: Vibration electrode part
23b: Lead electrode part
23c: Connection electrode part 4: Second electrode 5, 25, 35, 45, 55: Piezoelectric member 6: One end part 7: The other end part 8, 9: Recessed part
10, 11: one indentation
12, 13: The other indentation
14: First case
15: Second case
16: Upper electrode material (first electrode material)
17: Lower electrode material (second electrode material)
18, 218-618, 818-2518: Adhesive
718: Adhesive (adhesive sheet)
19: First lower electrode material
20: Second lower electrode material
21: Pressing member
25: First upper electrode material
26: Second upper electrode material
29: Sim
30: Adhesive
31: Piezoelectric element

Claims (6)

  A piezoelectric member having a vibration region, and a case member that houses the piezoelectric member so as to provide a gap between the vibration region of the piezoelectric member, the case member covering an end surface of the piezoelectric member, and A piezoelectric electronic component having a first case and a second case sandwiching an end of the piezoelectric member.   The piezoelectric electronic component according to claim 1, wherein the first case and the second case are made of the same material.   3. The piezoelectric electron according to claim 1, wherein the case member has a joint portion that joins the first case and the second case along an outer periphery of the case member. 4. parts. The joint is
The piezoelectric electronic component according to claim 1, wherein the piezoelectric electronic component is located at a different height from the main surface of the piezoelectric member.   The piezoelectric electronic component according to claim 1, wherein the joining portion is located on a side of the piezoelectric member. The piezoelectric member is provided with a piezoelectric element on at least one main surface of a shim, and an end of the shim is sandwiched between the first case and the second case. 5. The piezoelectric electronic component according to 5.

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