JP2011527758A - 閉ループフィードバックを備えた自動化フィレット検査システム及び使用方法 - Google Patents
閉ループフィードバックを備えた自動化フィレット検査システム及び使用方法 Download PDFInfo
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/732—Location after the connecting process
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- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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Abstract
Description
Claims (20)
- 支持サブストレート上に小出しされた材料を分析する際に用いられる方法であって、
前記材料を小出しシステムにより前記支持サブストレート上に小出しするステップと、
自動化光学検査システムを用いて前記小出しされた材料の測定可能な性質の値を求めるステップと、
前記小出しされた材料の前記測定可能な性質の前記値を前記自動化光学検査システムから前記小出しシステムに伝達するステップと、
前記測定可能な性質の前記値の受け取りに応答して、前記小出しシステムの動作パラメータを自動的に調節するステップとを有する、方法。 - 前記小出しされた材料の前記測定可能な性質の前記値を伝達するステップは、
前記自動化光学検査システムのところに設けられた制御装置を前記小出しシステムのところに設けられた制御装置に接続するフィードバックループにより前記測定可能な性質の前記値を伝達するステップを含む、請求項1記載の方法。 - パッケージ形マイクロ電子デバイスが前記支持サブストレートに取り付けられ、前記動作パラメータを調節する前記ステップは、
前記パッケージ形マイクロ電子デバイスの周縁のところに前記材料によって形成されたフィレットの正しい寸法を維持するステップを含む、請求項1記載の方法。 - パッケージ形マイクロ電子デバイスが前記支持サブストレートに取り付けられ、前記動作パラメータを調節する前記ステップは、
前記パッケージ形マイクロ電子デバイスの周縁のところへの前記材料によるフィレットの形成を阻止するステップを含む、請求項1記載の方法。 - 前記自動化光学検査システムを用いて前記小出しされた材料の前記測定可能な性質の前記値を求める前記ステップは、
材料の画像を捕捉するステップと、
前記画像を分析して前記測定可能な性質の前記値を求めるステップとを含む、請求項1記載の方法。 - パッケージ形マイクロ電子デバイスが前記支持サブストレートに取り付けられ、前記画像を分析する前記ステップは、
画像処理コンピュータを用いて前記パッケージ形マイクロ電子デバイスの周縁のところに前記材料によって形成されたフィレットの1つ又は2つ以上の寸法を評価するステップを含む、請求項5記載の方法。 - 前記フィレットの前記1つ又は2つ以上の寸法を寸法の標準と比較して前記フィレットが正しく寸法決めされているかどうかを判定するステップを更に有する、請求項6記載の方法。
- 前記材料の小出し前に、前記画像処理コンピュータによって用いられるパラメータを定めて前記フィレットが正しく寸法決めされているかどうかを判定するステップを更に有する、請求項7記載の方法。
- 前記フィレットは、フローなしアンダーフィルフィレット、コーナーボンドフィレット、エッジボンドフィレット又は毛管アンダーフィルフィレットのうちの1つを定める、請求項6記載の方法。
- 前記支持サブストレート及び前記小出しされた材料を前記小出しシステムから自動化光学検査システムに移送するステップを更に有する、請求項1記載の方法。
- パッケージ形マイクロ電子デバイスが前記支持サブストレートに取り付けられ、前記支持サブストレート及び前記小出しされた材料を前記小出しシステムから前記自動化光学検査システムに移送する前記ステップは、
前記支持サブストレート、前記パッケージ形マイクロ電子デバイス、及び前記小出しされた材料を組立体として前記小出しシステムから前記自動化光学検査システムに移送するステップを含む、請求項10記載の方法。 - パッケージ形マイクロ電子デバイスが前記支持サブストレートに取り付けられ、前記材料を小出しシステムにより前記支持サブストレート上に小出しする前記ステップは、
前記材料を前記パッケージ形マイクロ電子デバイスの周縁又はかどに隣接して前記支持サブストレート上に小出しするステップを含む、請求項10記載の方法。 - 支持サブストレート上に小出しされた材料を分析する際に用いられる自動化システムであって、
前記材料を前記支持サブストレート上に小出しするよう構成された小出し装置を含む小出しシステムと、
隙間の周縁のところに小出しされた材料の画像を捕捉し、前記画像を分析して前記小出しされた材料の測定可能な性質の値を求めるよう構成された自動化光学検査システムと、
前記自動化光学検査システムを前記小出しシステムに結合するフィードバックループとを有し、
前記自動化光学検査システムは、前記材料の前記測定可能な性質の前記値を前記フィードバックループにより前記小出しシステムに伝達するよう構成されている、システム。 - 前記自動化光学検査システムは、前記画像を捕捉するよう構成された少なくとも1つのカメラと、前記カメラに結合された制御装置とを有し、前記カメラは、前記画像を前記制御装置に伝達するようになっており、前記制御装置は、前記材料の前記測定可能な性質の前記値を求めるために前記画像分析するよう構成されている、請求項13記載のシステム。
- 前記支持サブストレートを運搬すると共に保持するようになったコンベヤサブシステムと、
前記カメラを前記支持サブストレートに対して動かすよう構成された搬送機構体とを更に有する、請求項14記載のシステム。 - 前記材料は、前記支持サブストレートに取り付けられると共に隙間だけ前記支持サブストレートから分離されたパッケージ形マイクロ電子デバイスの周縁のところに小出しされ、前記システムは、
前記パッケージ形マイクロ電子デバイス及び前記支持サブストレートを前記小出しシステムに挿入するよう構成されたローダと、前記パッケージ形マイクロ電子デバイス、前記支持サブストレート、及び前記パッケージ形マイクロ電子デバイスの前記周縁のところに小出しされた前記材料の組立体を前記自動化光学検査システムから取り出すよう構成されたアンローダとを更に有する、請求項13記載のシステム。 - 前記自動化光学検査システムの下流側に設けられたキュア装置を更に有し、前記キュア装置は、前記フィレット材料を硬化するよう構成されている、請求項13記載のシステム。
- 前記小出しシステム及び前記自動化光学検査システムは、オートメーションのアイランド式自動化システムを構成する、請求項13記載のシステム。
- 前記小出しシステム及び前記自動化光学検査システムは、インライン式自動化システムを構成する、請求項13記載のシステム。
- 前記小出しシステムは、前記小出し装置と連絡関係をなして結合された制御装置を有し、前記制御装置は、前記支持サブストレート上への前記材料の小出しを制御するための制御信号を前記小出し装置に送るよう構成され、前記自動化光学検査システムは、カメラ及び前記カメラと連絡関係をなすと共に前記フィードバックループにより前記小出しシステムの前記制御装置と連絡関係をなして結合した制御装置を有し、前記カメラは、前記隙間の周縁のところに小出しされた前記材料の前記画像を捕捉するよう構成され、前記コントローラは、画像を分析して前記小出しされた材料の前記測定可能な性質の値を求めるよう構成されている、請求項13記載のシステム。
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US7954708P | 2008-07-10 | 2008-07-10 | |
US61/079,547 | 2008-07-10 | ||
PCT/US2009/050067 WO2010006141A1 (en) | 2008-07-10 | 2009-07-09 | Automated fillet inspection systems with closed loop feedback and methods of use |
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JP2011527758A true JP2011527758A (ja) | 2011-11-04 |
JP5792063B2 JP5792063B2 (ja) | 2015-10-07 |
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JP (1) | JP5792063B2 (ja) |
KR (1) | KR101600283B1 (ja) |
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US9146196B2 (en) | 2015-09-29 |
US20110063606A1 (en) | 2011-03-17 |
KR101600283B1 (ko) | 2016-03-07 |
CN102047096A (zh) | 2011-05-04 |
KR20110028338A (ko) | 2011-03-17 |
US9466539B2 (en) | 2016-10-11 |
USRE47118E1 (en) | 2018-11-06 |
JP5792063B2 (ja) | 2015-10-07 |
US20150357253A1 (en) | 2015-12-10 |
WO2010006141A1 (en) | 2010-01-14 |
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