JP2011521480A5 - - Google Patents

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Publication number
JP2011521480A5
JP2011521480A5 JP2011510815A JP2011510815A JP2011521480A5 JP 2011521480 A5 JP2011521480 A5 JP 2011521480A5 JP 2011510815 A JP2011510815 A JP 2011510815A JP 2011510815 A JP2011510815 A JP 2011510815A JP 2011521480 A5 JP2011521480 A5 JP 2011521480A5
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JP
Japan
Prior art keywords
semiconductor device
chip
semiconductor
semiconductor chip
transmissive body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011510815A
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English (en)
Japanese (ja)
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JP2011521480A (ja
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Publication date
Priority claimed from DE102008025756.7A external-priority patent/DE102008025756B4/de
Application filed filed Critical
Publication of JP2011521480A publication Critical patent/JP2011521480A/ja
Publication of JP2011521480A5 publication Critical patent/JP2011521480A5/ja
Pending legal-status Critical Current

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JP2011510815A 2008-05-29 2009-04-20 半導体装置 Pending JP2011521480A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008025756.7A DE102008025756B4 (de) 2008-05-29 2008-05-29 Halbleiteranordnung
DE102008025756.7 2008-05-29
PCT/DE2009/000542 WO2009143795A1 (de) 2008-05-29 2009-04-20 Halbleiteranordnung

Publications (2)

Publication Number Publication Date
JP2011521480A JP2011521480A (ja) 2011-07-21
JP2011521480A5 true JP2011521480A5 (cg-RX-API-DMAC7.html) 2012-02-02

Family

ID=41061228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011510815A Pending JP2011521480A (ja) 2008-05-29 2009-04-20 半導体装置

Country Status (7)

Country Link
US (1) US8461616B2 (cg-RX-API-DMAC7.html)
EP (1) EP2281315B1 (cg-RX-API-DMAC7.html)
JP (1) JP2011521480A (cg-RX-API-DMAC7.html)
KR (1) KR101634406B1 (cg-RX-API-DMAC7.html)
CN (1) CN101971376B (cg-RX-API-DMAC7.html)
DE (1) DE102008025756B4 (cg-RX-API-DMAC7.html)
WO (1) WO2009143795A1 (cg-RX-API-DMAC7.html)

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CN109148674B (zh) 2017-06-28 2023-05-16 日亚化学工业株式会社 发光装置
JP6899412B2 (ja) * 2018-07-27 2021-07-07 住友化学株式会社 Ｌｅｄデバイスの製造方法
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